creat by art - glass passivated junction - ideal for automated placement - reliable low cost construction utilizing molded plastic technique - high surge current capability - ul recognized file # e-326854 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 part no. with suffix "h" means aec-q101 qualified packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test symbol ABS2 abs4 abs6 abs8 abs10 unit v rrm 200 400 600 800 1000 v v rms 140 280 420 560 700 v v dc 200 400 600 800 1000 v i 2 ta 2 s t j c t stg c document number: ds_d1410049 version: l15 t j =25c t j =125c a bs2 - abs10 taiwan semiconductor 1a, 200v - 1000v glass passivated brid g e rectifiers features moisture sensitivity level: level 1, per j-std-020 polarity: polarity as marked on the body weight: 0.12 g (approximately) maximum ratings and electrical characteristics (t a =25c unless otherwise noted) parameter - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data case: molded plastic body maximum dc blocking voltage peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 30 maximum repetitive peak reverse voltage maximum rms voltage rating for fusing (t<8.3ms) 3.74 a maximum instantaneous forward voltage (note 1) i f = 0.4 a v f v r jl r ja 25 80 c/w operating junction temperature range - 55 to +150 i r 10 150 a maximum reverse current @ rated v r storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle abs maximum average forward rectified current on glass-epoxy on aluminum substrate i f(av) 0.8 1.0 a 0.95 typical thermal resistance
part no. note 2: whole series with green compound part no. (t a =25c unless otherwise noted) document number: ds_d1410049 version: l15 1,000 / 7" plastic reel packing aec-q101 qualified green compound description part no. suffix packing code packing code suffix hre g h re g abs rg abs 5,000 / 13" paper reel abs8hreg abs8 absxx (note 1, 2) packing code packing code suffix package ratings and characteristics curves a bs2 - abs10 taiwan semiconductor note 1: "xx" defines voltage from 200v (ABS2) to 1000v (abs10) example preferred p/n ordering information part no. suffix 0 0.2 0.4 0.6 0.8 1 1.2 0 306090120150 average forward current (a) ambient temperature ( o c) fig.1 maximum forward current derating curve 0 10 20 30 40 50 110100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine-wave 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage(%) fig. 2 typical reverse characteristics t j =25 c t j =75 c t j =100 c 0.1 1 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 instantaneous forward current (a) forward voltage (v) fig. 4 typical forward characteristic
min max min max b 4.30 4.50 0.169 0.177 c 6.25 6.65 0.246 0.262 d 0.60 0.70 0.024 0.028 e 3.90 4.10 0.154 0.161 f 4.90 5.10 0.193 0.200 g 1.40 1.60 0.055 0.063 h 1.35 1.45 0.053 0.057 i 0.05 0.15 0.002 0.006 j 0.30 0.70 0.012 0.028 k 0.15 0.25 0.006 0.010 p/n = specific device code yw = date code f = factory code document number: ds_d1410049 version: l15 abs 0.284 0.081 0.225 suggested pad layout symbol unit (mm) a 1.5 0.059 marking diagram a bs2 - abs10 taiwan semiconductor c4.22 d package outline dimensions dim. 0.035 f5.72 2.05 unit (mm) unit (inch) 7.22 e b0.9 unit (inch) 0.166 10 100 1000 0.1 1 10 100 1000 junction capacitance (pf) a reverse voltage (v) fig. 5 typical junction capacitance f=1mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1410049 version: l15 a bs2 - abs10 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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