RCLAMP3552T final datasheet rev 4.0 revision date 10/5/2016 1 of 9 semtech features ? high esd withstand voltage: +/-17kv (contact) & +/-20kv(air) per iec 61000-4-2 ? very small pcb area: 0.6 mm 2 ? protects up to two data lines ? low esd clamping voltage ? working voltage: 3.5 v ? low capacitance: 0.40pf maximum ? low dynamic resistance: 0.30 ohms typical ? solid-state silicon-avalanche technology mechanical characteristics ? slp1006n3t package ? pb-free, halogen free, rohs/weee compliant ? nominal dimensions: 1.0 x 0.6 x 0.40 mm ? lead finish: nipdau ? molding compound fammability rating: ul 94v-0 ? marking: marking code + dot matrix date code ? packaging: tape and reel applications ? usb 3.0 ? v-by-one ? lvds ? mipi/mddi ? mydp ? audio ports RCLAMP3552T low voltage railclamp? 2-line esd protection description rclamp?3552t is a low voltage railclamp which can provide esd protection to iec 61000-4-2 on highspeed ports. it is manufactured using semtechs proprietary low voltage technology, designed to minimize both the esd peak clamping and tlp clampingvoltage. these devices snap-back to a low on-state voltage when the breakdown voltage of the device is exceeded. this has the advantage of lowering the overall esd clamping voltage. when the device is in the on-state, the dynamic resistance is typically 0.30 ohms, further minimizing the esd clamping. maximum capacitance is only 0.40pf allowing the RCLAMP3552T to be used in applications operating in excess of 6ghz without appreciable signal attenuation. each device will protect two lines operating at 3.5 volts. RCLAMP3552T is in a 3-pin slp1006n3t package. it measures 1.0 x 0.6 mm with a nominal height of only 0.4mm. the leads are fnished with lead-free nipdau. the combination of low peak esd clamping, low dynamic resistance, and low capacitance makes this device suitable for applications such as usb 3.0, lvds, audio, and v-by-one interfaces. 1.00 0.40 0 . 60 1 2 3 1 2 3 package dimension schematic & pin confguration slp1006n3t (bottom view) protection products www.semtech.com
RCLAMP3552T final datasheet rev 4.0 revision date 10/5/2016 2 of 9 semtech absolute maximum rating rating symbol value units peak pulse current (tp = 8/20s) i pp 4 a esd per iec 61000-4-2 (air) (1) esd per iec 61000-4-2 (contact) (1) v esd 20 17 kv operating temperature t j -40 to +125 o c storage temperature t stg -55 to +150 o c electrical characteristics (t=25 o c unless otherwise specifed) parameter symbol conditions min. typ. max. units reverse stand-of voltage v rwm pin 1 or 2 to pin3 3.5 v reverse breakdown voltage v br i br = 10a, pin 1 or 2 to pin3 7.5 8.8 9.8 v reverse leakage current i r v rwm = 3.5v, pin 1 or 2 to pin3 0.01 0.05 a clamping voltage v c t p = 8/20s, pin 1 or 2 to pin3 i pp = 1a 3.5 5 v i pp = 4a 5 6.5 esd clamping voltage 2 v c t p = 0.2/100ns, pin 1 or 2 to pin3 i pp = 16a 9.5 v i pp = -16a -9.5 dynamic resistance 2,3 (positive) r dyn t p = 0.2/100ns, pin 1 or 2 to pin3 0.30 dynamic resistance 2,3 (negative) r dyn t p = 0.2/100ns, pin 1 or 2 to pin3 0.30 junction capacitance c j v r = 0v, f = 1mhz, pin 1 or 2 to pin3 0.30 0.40 pf notes 1) measured with a 40db attenuator, 50 ohm scope input impedance, 2ghz bandwidth. esd gun return path connected to esd ground plane. 2) transmission line pulse test (tlp) settings: tp = 100ns, tr = 0.2ns, i tlp and v tlp averaging window: t1 = 70ns to t2 = 90ns. 3) dynamic resistance calculated from i tlp = 4a to i tlp = 16a www.semtech.com
RCLAMP3552T final datasheet rev 4.0 revision date 10/5/2016 3 of 9 semtech typical characteristics clamping voltage vs. peak pulse current (tp=8/20s) (between any i/o and ground) junction capacitance vs. reverse voltage (between any i/o and ground) esd clamping (+8kv contact per iec 61000-4-2) (between any i/o and ground) tlp characteristic (positive) -10 0 10 20 30 40 50 60 70 80 -10 0 10 20 30 40 50 60 70 80 90 clamping voltage - v c (v) time (ns) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 20db attenuator. esd gun return path connected to esd ground plane. -5 0 5 10 15 20 25 30 0 5 10 15 20 tlp current (a) tlp voltage (v) transmission line pulse test (tlp) settings: t p =100ns, t r =0.2ns, i tlp and v tlp averaging window: t 1 =70ns to t 2 =90ns -80 -70 -60 -50 -40 -30 -20 -10 0 10 -10 0 10 20 30 40 50 60 70 80 90 clamping voltage - v c (v) time (ns) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 20db attenuator. esd gun return path connected to esd ground plane. -30 -25 -20 -15 -10 -5 0 5 -20 -15 -10 -5 0 tlp current (a) tlp voltage (v) transmission line pulse test (tlp) settings: t p =100ns, t r =0.2ns, i tlp and v tlp averaging window: t 1 =70ns to t 2 =90ns 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0.0 1.0 2.0 3.0 4.0 5.0 clamping voltage - v c (v) peak pulse current - i pp (a) waveform parameters: tr = 8s td = 20s 0 0.1 0.2 0.3 0.4 0.5 0.6 0.0 1.0 2.0 3.0 4.0 capacitance - c j (pf) reverse voltage - v r (v) f = 1 mhz t=25 o c esd clamping (-8kv contact per iec 61000-4-2) (between any i/o and ground) tlp characteristic (negative) www.semtech.com
RCLAMP3552T final datasheet rev 4.0 revision date 10/5/2016 4 of 9 semtech typical characteristics (continued) typical insertion loss - s21 analog crosstalk -12 -10 -8 -6 -4 -2 0 0.01 0.1 1 10 insertion loss (db) frequency (ghz) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1.00e+07 1.00e+08 1.00e+09 cross talk (db) frequency (hz) www.semtech.com
RCLAMP3552T final datasheet rev 4.0 revision date 10/5/2016 5 of 9 semtech device operation this device utilizes a multi-junction structure that is designed to switch to a low voltage state when triggered by esd, eos, or other transient events. during normal operation, the device will present a high impedance to the circuit for voltage up to the working voltage (v rwm ) of the device. when the voltage across the device terminals exceeds the breakdown voltage(v br ), avalanche breakdown occurs in the blocking junction causing the device to snap-back or switch to a low impedance on-state. this has the advantage of lowering the overall clamping voltage (v c ) as esd peak pulse current (i pp ) fows through the device. once the current subsides, the device will return to a highimpedance of-state. since this device is bidirectional, it will behave the same way for positive or negative polarity transient events. applications information v rwm v br i r i pp v c snap -back symbol parameter v rwm maximum working voltage v trig trigger voltage v c clamping voltage i r reverse leakage current i pp peak pulse currrent characterisitic curve www.semtech.com
RCLAMP3552T final datasheet rev 4.0 revision date 10/5/2016 6 of 9 semtech assembly guidelines the small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. the fgure at the right details semtechs recommended mounting pattern. recommended assembly guidelines are shown in table 2. note that these are only recommendations and should serve only as a starting point for design since there are many factors that afect the assembly process. exact manufacturing parameters will require some experimentation to get the desired solder application. semtechs recommended mounting pattern is based on the following design guidelines: land pattern the recommended land pattern follows ipc standards and is designed for maximum solder coverage. detailed dimensions are shown elsewhere in this document. solder stencil stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. the area ratio of the stencil aperture will determine how well the stencil will print. the area ratio takes into account the aperture shape, aperture size, and stencil thickness. an area ratio of 0.70 C 0.75 is preferred for the subject package. the area ratio of a rectangular aperture is given as: area ratio = (l * w )/ (2 * (l + w) * t) where: l = aperture length w = aperture width t = stencil thickness semtech recommends a stencil thickness of 0.100mm for this device. the stencil should be laser cut with electro- polished fnish. the stencil should have a positive taper of approximately 5 degrees. electro polishing and tapering the walls results in reduced surface friction and better paste release. due to the small aperture size, a solder paste with type 4 or smaller particles are recommended. assuming a 100um thick stencil, the aperture dimensions shown will yield an area ratio of approximately 0.75. recommended mounting pattern stencil opening (220x460 mm) land pad (200x400 mm) all dimensions are in mm. land pad. stencil opening component 1.000 .850 table 2 - recommended assembly guidelines assembly parameter recommendation solder stencil design laser cut, electro-polished aperture shape rectangular solder stencil thickness 0.100mm (0.004) solder paste type type 4 size sphere or smaller solder refow profle per jedec j-std-020 pcb solder pad design non-solder mask defned pcb pad finish osp or niau applications information www.semtech.com
RCLAMP3552T final datasheet rev 4.0 revision date 10/5/2016 7 of 9 semtech outline drawing - slp1006n3t land pattern - slp1006n3t b bbb aaa n e d dim a 1 a 2 a 0 .195 0.145 0.17 0.08 0.10 3 1.00 0.68 bsc millimeters max 0.05 0.43 dimensions min 0.00 nom 0.37 0.02 ( 0 .13) 0 .40 controlling dimensions are in millimeters ( angles in degrees). notes : 1. 0.60 e 1 .10 0.90 0.50 0.70 pin 1 indicator (laser mark ) seating plane l 0.225 0.25 0.275 1 n 2 d e bbb c a b a1 a c a 2 aaa c b a bbb c a b b 1 0 .225 0.175 0.20 e e / 2 bxn b 1 xn lxn e/2 d/ 2 r0 . 05 this land pattern is for reference purposes only . consult your manufacturing group to ensure your notes: 2. company 's manufacturing guidelines are met. 1 . controlling dimensions are in millimeters (angles in degrees ). dim x y g c millimeters (0.45) 0. 20 0 . 40 0.05 dimensions 0 . 85 z p 0 . 68 p /2 p y z g (c ) x r 0.05 www.semtech.com
RCLAMP3552T final datasheet rev 4.0 revision date 10/5/2016 8 of 9 semtech marking code 35 tape and reel specifcation ordering information part number qty per reel reel size RCLAMP3552T.tnt 10,000 7 pin 1 location (towards sprocket holes) 35 35 35 35 35 www.semtech.com
RCLAMP3552T final datasheet 4.0 revision date 10/5/2016 9 of 9 semtech contactfinformation semtechfcorporation 200fflynnfroad,fcamarillo,fcaf93012 phone:f(805)f498-2111,ffax:f(805)f498-3804 www.semtech.com importantfnotice informationfrelatingftofthisfproductfandfthefapplicationforfdesignfdescribedfhereinfisfbelievedftofbefreliable,fhoweverfsuchfinformationfisfprovidedfasfaf guidefonlyfandfsemtechfassumesfnofliabilityfforfanyferrorsfinfthisfdocument,forfforfthefapplicationforfdesignfdescribedfherein.fsemtechfreservesfthefrightf tofmakefchangesftofthefproductforfthisfdocumentfatfanyftimefwithoutfnotice.fbuyersfshouldfobtainftheflatestfrelevantfinformationfbeforefplacingfordersf andfshouldfverifyfthatfsuchfinformationfisfcurrentfandfcomplete.fsemtechfwarrantsfperformancefoffitsfproductsftofthefspecifcationsfapplicablefatftheftimef offsale,fandfallfsalesfarefmadefinfaccordancefwithfsemtechsfstandardftermsfandfconditionsfoffsale.f semtechfproductsfarefnotfdesigned,fintended,fauthorizedforfwarrantedftofbefsuitablefforfusefinflife-supportfapplications,fdevicesf orfsystems,forfinfnuclearfapplicationsfinfwhichftheffailurefcouldfbefreasonablyfexpectedftofresultfinfpersonalfinjury,flossfofflifef orfseverefpropertyforfenvironmentalfdamage.ffinclusionfoffsemtechfproductsfinfsuchfapplicationsfisfunderstoodftofbefundertakenf solelyfatfthefcustomersfownfrisk.fshouldfafcustomerfpurchaseforfusefsemtechfproductsfforfanyfsuchfunauthorizedfapplication,fthefcustomerfshallf indemnifyfandfholdfsemtechfandfitsfofcers,femployees,fsubsidiaries,fafliates,fandfdistributorsfharmlessfagainstfallfclaims,fcostsfdamagesfandfattorneyf feesfwhichfcouldfarise. thefsemtechfnamefandflogofarefregisteredftrademarksfoffthefsemtechfcorporation.fallfotherftrademarksfandftradefnamesfmentionedfmayfbefmarksfandf namesfoffsemtechforftheirfrespectivefcompanies.fsemtechfreservesfthefrightftofmakefchangesfto,forfdiscontinuefanyfproductsfdescribedfinfthisfdocumentf withoutffurtherfnotice.fsemtechfmakesfnofwarranty,frepresentationforfguarantee,fexpressforfimplied,fregardingfthefsuitabilityfoffitsfproductsfforfanyf particularfpurpose.fallfrightsfreserved. ?fsemtechf2015
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