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| this is information on a product in full production. december 2014 docid023353 rev 9 1/143 stm32f303xb stm32f303xc arm ? -based cortex ? -m4 32b mcu+fpu, up to 256kb flash+ 48kb sram, 4 adcs, 2 dac ch., 7 co mp, 4 pga, timers, 2.0-3.6 v datasheet - production data features ? core: arm ? cortex ? -m4 32-bit cpu with fpu (72 mhz max), single-cycle multiplication and hw division, 90 dm ips (from ccm), dsp instruction and mpu (memory protection unit) ? operating conditions: ?v dd , v dda voltage range: 2.0 v to 3.6 v ? memories ? 128 to 256 kbytes of flash memory ? up to 40 kbytes of sram, with hw parity check implemented on the first 16 kbytes. ? routine booster: 8 kbytes of sram on instruction and data bus, with hw parity check (ccm) ? crc calculation unit ? reset and supply management ? power-on/power-down reset (por/pdr) ? programmable voltage detector (pvd) ? low power modes: sleep, stop and standby ?v bat supply for rtc and backup registers ? clock management ?4 to 32 mhz crystal oscillator ? 32 khz oscillator for rtc with calibration ? internal 8 mhz rc with x 16 pll option ? intern al 40 khz oscillator ? up to 87 fast i/os ? all mappable on external interrupt vectors ? several 5 v-tolerant ? interconnect matrix ? 12-channel dma controller ? four adcs 0.20 s (up to 39 channels) with selectable resolution of 12/10/8/6 bits, 0 to 3.6 v conversion range, single ended/differential input, separate analog supply from 2 to 3.6 v ? two 12-bit dac channels with analog supply from 2.4 to 3.6 v ? seven fast rail-to-rail analog comparators with analog supply from 2 to 3.6 v ? four operational amplifiers that can be used in pga mode, all terminals accessible with analog supply from 2.4 to 3.6 v ? up to 24 capacitive sensing channels supporting touchkey, linear and rotary touch sensor s ? up to 13 timers ? one 32-bit timer and two 16-bit timers with up to 4 ic/oc/pwm or pulse counter and quadrature (incremental) encoder input ? two 16-bit 6-channel advanced-control timers, with up to 6 pwm channels, deadtime generation and emergency stop ? one 16-bit timer with 2 ic/ocs, 1 ocn/pwm, deadtime generation and emergency stop ? two 16-bit timers with ic/oc/ocn/pwm, deadtime generation and emergency stop ? two watchdog timers (independent, window) ? systick timer: 24-bit downcounter ? two 16-bit basic timers to drive the dac ? calendar rtc with alarm, periodic wakeup from stop/standby ? communication interfaces ? can interface (2.0b active) ?two i 2 c fast mode plus (1 mbit/s) with 20 ma current sink, smbus/pmbus, wakeup from stop ? up to five usart/uarts (iso 7816 interface, lin, irda, modem control) ? up to three spis, two with multiplexed half/full duplex i2s interface, 4 to 16 programmable bit frames ? usb 2.0 full speed interface ? infrared transmitte r ? serial wire debug, cortex ? -m4 with fpu etm, jtag ? 96-bit unique id table 1. device summary reference part number stm32f303xb stm32f303xc stm32f303cb, stm32f303cc, stm32f303rb, stm32f303rc, stm32f303vb, stm32f303vc lqfp64 (10 10 mm) lqfp100 (14 14 mm) lqfp48 (7 7 mm) www.st.com
contents stm32f303xb stm32f303xc 2/143 docid023353 rev 9 contents 1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1 arm ? cortex ? -m4 core with fpu with embedded flash and sram . . . 12 3.2 memory protection unit (mpu) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.3 embedded flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4 embedded sram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.5 boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6 cyclic redundancy check (crc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.7 power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.7.1 power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.7.2 power supply supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.7.3 voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.7.4 low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.8 interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.9 clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.10 general-purpose input/outputs (gpios) . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.11 direct memory access (dma) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.12 interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.12.1 nested vectored interrupt controller (nvic) . . . . . . . . . . . . . . . . . . . . . . 19 3.13 fast analog-to-digital converter (adc) . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.13.1 temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.13.2 internal voltage reference (v refint ) . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.13.3 v bat battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.13.4 opamp reference voltage (vrefopamp) . . . . . . . . . . . . . . . . . . . . . . 21 3.14 digital-to-analog converter (dac) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.15 operational amplifier (opamp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.16 fast comparators (comp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.17 timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.17.1 advanced timers (tim1, tim8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 docid023353 rev 9 3/143 stm32f303xb stm32f303xc contents 4 3.17.2 general-purpose timers (tim2, tim3, tim4, tim15, tim16, tim17) . . 23 3.17.3 basic timers (tim6, tim7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.17.4 independent watchdog (iwdg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.17.5 window watchdog (wwdg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.17.6 systick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.18 real-time clock (rtc) and backup registers . . . . . . . . . . . . . . . . . . . . . . 24 3.19 inter-integrated circuit interface (i 2 c) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.20 universal synchronous/asynchronous re ceiver transmitter (usart) . . . 26 3.21 universal asynchronous receiver transmitter (uart) . . . . . . . . . . . . . . . 26 3.22 serial peripheral interface (spi)/inter-integrated sound interfaces (i2s) . 27 3.23 controller area network (can) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.24 universal serial bus (usb) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 3.25 infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.26 touch sensing controller (tsc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 3.27 development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.27.1 serial wire jtag debug port (swj-dp) . . . . . . . . . . . . . . . . . . . . . . . . . 30 3.27.2 embedded trace macrocell? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 4 pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5 memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 6 electrical characteristi cs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.1 parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.1.1 minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.1.2 typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.1.3 typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.1.4 loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.1.5 pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 6.1.6 power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 6.1.7 current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 6.2 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 6.3 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 6.3.1 general operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 6.3.2 operating conditions at power-up / powe r-down . . . . . . . . . . . . . . . . . . 59 6.3.3 embedded reset and power control bloc k characteristics . . . . . . . . . . . 59 contents stm32f303xb stm32f303xc 4/143 docid023353 rev 9 6.3.4 embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 6.3.5 supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 6.3.6 wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 6.3.7 external clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 6.3.8 internal clock source charac teristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 6.3.9 pll characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 6.3.10 memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 6.3.11 emc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 6.3.12 electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 6.3.13 i/o current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 6.3.14 i/o port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 6.3.15 nrst pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 6.3.16 timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 6.3.17 communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 6.3.18 adc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 6.3.19 dac electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 6.3.20 comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 6.3.21 operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 121 6.3.22 temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 6.3.23 v bat monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 7 package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 7.1 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 7.2 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 7.2.1 reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 7.2.2 selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 136 8 part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 9 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 docid023353 rev 9 5/143 stm32f303xb stm32f303xc list of tables 6 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. stm32f303xb/stm32f303xc family device features and peripheral counts . . . . . . . . . . 10 table 3. external analog supply values for analog peripheral s . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 4. stm32f303xb/stm32f303xc peripheral interconnect matrix . . . . . . . . . . . . . . . . . . . . . 15 table 5. timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 6. comparison of i2c analog and digital filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 7. stm32f303xb/stm32f303xc i 2 c implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 8. usart features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 9. stm32f303xb/stm32f303xc spi/i2s implementation . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 10. capacitive sensing gpios available on stm32f303xb/stm32f303xc devices . . . . . . . 29 table 11. no. of capacitive sensing channels av ailable on stm32f303xb/stm32f303xc devices . 29 table 12. legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 table 13. stm32f303xb/stm32f303xc pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 table 14. alternate functions for port a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 table 15. alternate functions for port b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 table 16. alternate functions for port c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 table 17. alternate functions for port d . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 table 18. alternate functions for port e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 table 19. alternate functions for port f . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 table 20. stm32f303xb/stm32f303xc memory map, pe ripheral register boundary addresses . . 51 table 21. voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 table 22. current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 table 23. thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 table 24. general operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 table 25. operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 table 26. embedded reset and power control block characterist ics. . . . . . . . . . . . . . . . . . . . . . . . . . 59 table 27. programmable voltage detector characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 table 28. embedded internal reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 table 29. internal reference voltage calibration values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 table 30. typical and maximum current consumption from v dd supply at v dd = 3.6v . . . . . . . . . . . 62 table 31. typical and maximum current consumption from the v dda supply . . . . . . . . . . . . . . . . . . 63 table 32. typical and maximum v dd consumption in stop and standby modes. . . . . . . . . . . . . . . . 64 table 33. typical and maximum v dda consumption in stop and standby modes. . . . . . . . . . . . . . . 64 table 34. typical and maximum current consumption from v bat supply. . . . . . . . . . . . . . . . . . . . . . 65 table 35. typical current consumption in run mode, code with data processing running from flash 66 table 36. typical current consumption in sleep mode, code running from flash or ram . . . . . . . . . 67 table 37. switching output i/o current cons umption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 table 38. peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 table 39. low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 table 40. high-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 table 41. low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 table 42. hse oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 table 43. lse oscillator characteristics (f lse = 32.768 khz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 table 44. hsi oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 table 45. lsi oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 table 46. pll characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 table 47. flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 table 48. flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 list of tables stm32f303xb stm32f303xc 6/143 docid023353 rev 9 table 49. ems characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 table 50. emi characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 table 51. esd absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 table 52. electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 table 53. i/o current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85 table 54. i/o static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 table 55. output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 table 56. i/o ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 table 57. nrst pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 table 58. timx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 table 59. iwdg min/max timeout period at 40 khz (lsi) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 table 60. wwdg min-max timeout value @72 mhz (pclk). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 table 61. i2c timings specification (see i2c specification, rev.03, june 2007) . . . . . . . . . . . . . . . . . 94 table 62. i2c analog filter characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 table 63. spi characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 table 64. i 2 s characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 table 65. usb startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 table 66. usb dc electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 table 67. usb: full-speed electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 table 68. adc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 table 69. maximum adc rain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 table 70. adc accuracy - limited te st conditions, 100-pin packages . . . . . . . . . . . . . . . . . . . . . . . 109 table 71. adc accuracy, 100-pin packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 table 72. adc accuracy - limited test conditions, 64-pin pack ages . . . . . . . . . . . . . . . . . . . . . . . . . 113 table 73. adc accuracy, 64-pin packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 table 74. adc accuracy at 1msps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 table 75. dac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 table 76. comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 table 77. operational amplifier characteristic s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 table 78. ts characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 table 79. temperature sensor calibration values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 table 80. v bat monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 table 81. lqpf100 ? 14 x 14 mm, low-profile quad flat package mechanical data. . . . . . . . . . . . . 126 table 82. lqfp64 ? 10 x 10 mm low-profile quad flat package mechanical data . . . . . . . . . . . . . . 129 table 83. lqfp48 ? 7 x 7 mm, 48-pin low-profile quad flat package mechanical data . . . . . . . . . . 132 table 84. package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 table 85. ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 table 86. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139 docid023353 rev 9 7/143 stm32f303xb stm32f303xc list of figures 7 list of figures figure 1. stm32f303xb/stm32f303xc block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 2. clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 3. infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 figure 4. stm32f303xb/stm32f303xc lqfp48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 figure 5. stm32f303xb/stm32f303xc lqfp64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 figure 6. stm32f303xb/stm32f303xc lqfp100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 figure 7. stm32f303xb/stm32f303xc memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 figure 8. pin loading conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 figure 9. pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 figure 10. power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 figure 11. current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 figure 12. typical v bat current consumption (lse and rtc on/lsedrv[1:0] = ?00?) . . . . . . . . . . . 65 figure 13. high-speed external clock source ac timing diagra m . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 figure 14. low-speed external clock source ac timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 figure 15. typical application with an 8 mhz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 figure 16. typical application with a 32.768 khz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 figure 17. hsi oscillator accuracy char acterization results for soldered parts . . . . . . . . . . . . . . . . . . 79 figure 18. tc and tta i/o input characteristics - cmos port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 figure 19. tc and tta i/o input characteri stics - ttl port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 figure 20. five volt tolerant (ft and ftf) i/o input char acteristics - cmos port. . . . . . . . . . . . . . . . . 88 figure 21. five volt tolerant (ft and ftf) i/o input charac teristics - ttl port . . . . . . . . . . . . . . . . . . . 88 figure 22. i/o ac characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 figure 23. recommended nrst pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 figure 24. i 2 c bus ac waveforms and measurement ci rcuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 figure 25. spi timing diagram - slave mode and cpha = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 figure 26. spi timing diagram - slave mode and cpha = 1 (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 figure 27. spi timing diagram - master mode (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 figure 28. i 2 s slave timing diagram (philips protocol) (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 figure 29. i 2 s master timing diag ram (philips protocol) (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 figure 30. usb timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . 103 figure 31. adc typical current consumption on vdda pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 figure 32. adc typical current consumption on vref+ pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 figure 33. adc accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 figure 34. typical connection diagram using the adc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 figure 35. 12-bit buffered /non-buffered dac . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 figure 36. opamp voltage noise versus frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 figure 37. lqfp100 ? 14 x 14 mm, 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . 126 figure 38. lqfp100 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 figure 39. lqfp100 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 figure 40. lqfp64 ? 10 x 10 mm, 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . 129 figure 41. lqfp64 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 0 figure 42. lqfp64 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 figure 43. lqfp48 ? 7 x 7 mm, 48-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 132 figure 44. lqfp48 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3 figure 45. lqfp48 marking (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 introduction stm32f303xb stm32f303xc 8/143 docid023353 rev 9 1 introduction this datasheet provides the ordering informat ion and mechanical devic e characteristics of the stm32f303xb/stm32f303xc microcontrollers. this stm32f303xb/stm32f303xc datasheet should be read in conjunction with the rm0316 stm32f303x, stm32f358xc and stm32f328x4/6/8 reference manual. the reference manual is available from the stmicroelectronics website www.st.com . for information on the cortex ? -m4 core with fpu, please refer to: cortex ? -m4 with fpu technical reference manual , available from arm website www.arm.com. stm32f3xxx and stm32f4xxx cortex ? -m4 programming manual (pm0214) available from our website www.st.com . docid023353 rev 9 9/143 stm32f303xb stm32f303xc description 52 2 description the stm32f303xb/stm32f303xc family is based on the high-performance arm ? cortex ? -m4 32-bit risc core with fpu operating at a frequency of up to 72 mhz, and embedding a floating point unit (fpu), a memory protection unit (mpu) and an embedded trace macrocell (etm). the fam ily incorporates high-speed embedded memories (up to 256 kbytes of flash memory, up to 40 kbytes of sram) and an extensive range of enhanced i/os and peripheral s connected to two apb buses. the devices offer up to four fast 12-bit adcs (5 msps), seven comparators, four operational amplifiers, up to two dac channels, a low-powe r rtc, up to five general-purpose 16-bit timers, one general-purpose 32-bit timer, and two timers dedicated to motor control. they also feature standard and advanced co mmunication interfaces: up to two i 2 cs, up to three spis (two spis are with multiple xed full-duplex i2ss), three u sarts, up to two uarts, can and usb. to achieve audio class accuracy, the i2s peripherals can be clocked via an external pll. the stm32f303xb/stm32f303xc family operates in the -40 to +85 c and -40 to +105 c temperature ranges from a 2.0 to 3.6 v power supply. a comprehensive set of power-saving mode allows the design of low-power applications. the stm32f303xb/stm32f303xc family offers devices in three packages ranging from 48 pins to 100 pins. the set of included peripherals changes with the device chosen. description stm32f303xb stm32f303xc 10/143 docid023353 rev 9 table 2.stm32f303xb/stm32f303xc family device features and peripheral counts peripheral stm32f303cx stm32f303rx stm32f303vx flash (kbytes) 128 256 128 256 128 256 sram (kbytes) on data bus 32 40 32 40 32 40 ccm (core coupled memory) ram (kbytes) 8 timers advanced control 2 (16-bit) general purpose 5 (16-bit) 1 (32-bit) basic 2 (16-bit) pwm channels (all) (1) 1. this total number considers also the pw ms generated on the complementary output channels 31 33 pwm channels (except complementary) 22 24 communication interfaces spi (i2s) (2) 2. the spi interfaces can work in an exclusive way in either the spi mode or the i 2 s audio mode. 3(2) i 2 c2 usart 3 uart 0 2 can 1 usb 1 gpios normal i/os (tc, tta) 20 27 45 5-volt tolerant i/os (ft, ftf) 17 25 42 dma channels 12 capacitive sensing channels 17 18 24 12-bit adcs number of channels 4 15 22 39 12-bit dac channels 2 analog comparator 7 operational amplifiers 4 cpu frequency 72 mhz operating voltage 2.0 to 3.6 v operating temperature ambient operating temper ature: - 40 to 85 c / - 40 to 105 c junction temperature: - 40 to 125 c packages lqfp48 lqfp64 lqfp100 docid023353 rev 9 11/143 stm32f303xb stm32f303xc description 52 figure 1.stm32f303xb/stm32f303xc block diagram 1. af: alternate function on i/o pins. 0 6 9 7 r x f k 6 h q v l q j & r q w u r o o h u 7 , 0 ( 5 & k d q q h o v & r p s & k d q q h o % 5 . d v $ ) 7 , 0 ( 5 7 , 0 ( 5 3 : 0 7 , 0 ( 5 3 : 0 & k d q q h o v & r p s f k d q q h o v ( 7 5 % 5 . d v $ ) 6 3 , 0 2 6 , 0 , 6 2 6 & . 1 6 6 d v $ ) 8 6 $ 5 7 5 ; 7 ; & 7 6 5 7 6 6 p d u w & d u g d v $ ) : l q : $ 7 & + ' 2 * % x v 0 d w u l [ 0 3 8 ) 3 8 & r u w h [ 0 & 3 8 ) p d [ 0 + ] 1 9 , & * 3 ' 0 $ f k d q q h o v & & 0 5 $ 0 . % ) o d v k l q w h u i d f h 2 % / ) / $ 6 + . % e l w v - 7 5 6 7 - 7 ' , - 7 & . 6 : & / . - 7 0 6 6 : ' , 2 - 7 ' 2 $ v $ ) 3 r z h u 9 r o w d j h u h j 9 w r 9 9 ' ' 6 x s s o \ 6 x s h u y l v l r q 3 2 5 3 ' 5 3 9 ' 3 2 5 5 h v h w , q w 9 ' ' , 2 w r 9 9 6 6 1 5 ( 6 ( 7 9 ' ' $ 9 6 6 $ , q g : ' * . 6 w d q g e \ l q w h u i d f h 3 / / # 9 ' ' , 2 # 9 ' ' $ ; 7 $ / 2 6 & 0 + ] 5 h v h w f o r f n f r q w u r o $ + % 3 & / . $ 3 % 3 & / . $ 3 % 3 & / . $ + % $ 3 % $ + % $ 3 % & 5 & $ 3 % ) p d [ 0 + ] $ 3 % i p d [ 0 + ] * 3 , 2 3 2 5 7 $ * 3 , 2 3 2 5 7 % * 3 , 2 3 2 5 7 & * 3 , 2 3 2 5 7 ' * 3 , 2 3 2 5 7 ( 2 6 & b , 1 2 6 & b 2 8 7 6 3 , , 6 6 & / 6 ' $ 6 0 % $ d v $ ) 8 6 $ 5 7 6 & / 6 ' $ 6 0 % $ d v $ ) 8 6 $ 5 7 5 & / 6 7 , 0 ( 5 7 , 0 ( 5 6 3 , , 6 e l w ' $ & , ) # 9 ' ' $ 7 , 0 ( 5 e l w 3 : 0 3 $ > @ 3 % > @ 3 & > @ 0 2 6 , 6 ' 0 , 6 2 h [ w b 6 ' 6 & . & . 1 6 6 : 6 0 & / . d v $ ) & k d q q h o v ( 7 5 d v $ ) 8 6 % b ' 3 8 6 % b ' 0 ' $ & b & + d v $ ) + & / . ) & / . 8 6 $ 5 7 & / . 5 & + 6 0 + ] 6 5 $ 0 . % ( 7 0 7 u d f h 7 u l j 6 : - 7 $ * 7 3 , 8 , e x v 7 5 $ ' ( & / . 7 5 $ & ( ' > @ d v $ ) ' e x v 6 \ v w h p * 3 ' 0 $ f k d q q h o v e l w $ ' & e l w $ ' & , ) 7 h p s v h q v r u 9 5 ( ) 9 5 ( ) 7 , 0 ( 5 ( ; 7 , 7 : . 8 3 ; ; $ ) & k d q q h o & r p s & k d q q h o % 5 . d v $ ) & k d q q h o & r p s & k d q q h o % 5 . d v $ ) & k d q q h o v & r p s f k d q q h o v ( 7 5 % 5 . d v $ ) * 3 , 2 3 2 5 7 ) 3 ' > @ 3 ( > @ 7 , 0 ( 5 8 6 % 6 5 $ 0 % 3 ) > @ e l w $ ' & , ) e l w $ ' & , & & / . $ ' & 6 $ 5 & / . # 9 ' ' , 2 # 9 ' ' $ # 9 6 : ; 7 $ / n + ] 2 6 & b , 1 2 6 & b 2 8 7 9 % $ 7 9 w r 9 5 7 & $ : 8 % d f n x s 5 h j % \ w h % d f n x s l q w h u i d f h $ 1 7 , 7 $ 0 3 7 , 0 ( 5 8 $ 5 7 8 $ 5 7 , & , & e [ & $ 1 % 6 5 $ 0 8 6 % ) 6 ' $ & b & + d v $ ) 2 s $ p s 2 s $ p s 2 s $ p s 2 s $ p s # 9 ' ' $ , 1 [ [ 2 8 7 [ [ , 1 [ [ 2 8 7 [ [ , 1 [ [ 2 8 7 [ [ , 1 [ [ 2 8 7 [ [ , 1 7 ( 5 ) $ & ( 6 < 6 & ) * & 7 / * 3 & r p s d u d w r u s * 3 & r p s d u d w r u * 3 & r p s d u d w r u & $ 1 7 ; & $ 1 5 ; & k d q q h o v ( 7 5 d v $ ) & k d q q h o v ( 7 5 d v $ ) 0 2 6 , 6 ' 0 , 6 2 h [ w b 6 ' 6 & . & . 1 6 6 : 6 0 & / . d v $ ) 5 ; 7 ; & 7 6 5 7 6 d v $ ) 5 ; 7 ; & 7 6 5 7 6 d v $ ) 5 ; 7 ; d v $ ) 5 ; 7 ; d v $ ) # 9 ' ' $ ; [ , q v 2 8 7 v d v $ ) ; ; * u r x s v r i f k d q q h o v d v $ ) $ + % $ + % functional overview stm32f303xb stm32f303xc 12/143 docid023353 rev 9 3 functional overview 3.1 arm ? cortex ? -m4 core with fpu with embedded flash and sram the arm cortex-m4 processor with fpu is the latest generation of arm processors for embedded systems. it was developed to provide a low-cost platform that meets the needs of mcu implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced response to interrupts. the arm cortex-m4 32-bit risc processor with fpu features exceptional code-efficiency, delivering the high-performance expected from an arm core in the memory size usually associated with 8- and 16-bit devices. the processor supports a set of dsp instructions which allow efficient signal processing and complex algorithm execution. its single precision fpu speeds up software development by using metalanguage development tools, while avoiding saturation. with its embedded arm core, the stm32f303x b/stm32f303xc family is compatible with all arm tools and software. figure 1 shows the general block diagram of the stm32f303xb/stm32f303xc family devices. 3.2 memory protection unit (mpu) the memory protection unit (mpu) is used to se parate the processing of tasks from the data protection. the mpu can manage up to 8 protection areas that can all be further divided up into 8 subareas. the protection area sizes are between 32 bytes and the whole 4 gigabytes of addressable memory. the memory protection unit is especially help ful for applications w here some critical or certified code has to be protected against th e misbehavior of other tasks. it is usually managed by an rtos (real-time operating system). if a program accesses a memory location that is prohibited by the mpu, the rt os can detect it and take action. in an rtos environment, the kernel can dynamically update the mpu area setting, based on the process to be executed. the mpu is optional and can be bypassed for applications that do not need it. 3.3 embedded flash memory all stm32f303xb/stm32f303xc devices feature up to 256 kbytes of embedded flash memory available for storing programs and data. the flash memory access time is adjusted to the cpu clock frequency (0 wait state from 0 to 24 mhz, 1 wait state from 24 to 48 mhz and 2 wait states above). docid023353 rev 9 13/143 stm32f303xb stm32f303xc functional overview 52 3.4 embedded sram stm32f303xb/stm32f303xc devices feature up to 48 kbytes of embedded sram with hardware parity check. the memory can be acce ssed in read/write at cpu clock speed with 0 wait states, allowing the cpu to achieve 90 dhrystone mips at 72 mhz (when running code from the ccm (core coupled memory) ram). 8 kbytes of ccm ram mapped on both instruction and data bus, used to execute critical routines or to access data (parity check on all of ccm ram). 40 kbytes of sram mapped on the data bus (p arity check on first 16 kbytes of sram). 3.5 boot modes at startup, boot0 pin and boot1 option bit are used to select one of three boot options: boot from user flash boot from system memory boot from embedded sram the boot loader is located in the system memory . it is used to reprogram the flash memory by using usart1 (pa9/pa10) , usart2 (pd5/pd6) or usb (pa11/pa12) through dfu (device firmware upgrade). 3.6 cyclic redund ancy check (crc) the crc (cyclic redundancy check) calculati on unit is used to get a crc code using a configurable generator polynomial value and size. among other applications, crc-based techniques are used to verify data transmission or storage integrity. in the scope of the en/iec 60335-1 standard, they offer a means of verifying the flash memory integrity. the crc calculation unit helps compute a signature of the software during runtime, to be compar ed with a reference signature generated at linktime and stored at a given memory location. functional overview stm32f303xb stm32f303xc 14/143 docid023353 rev 9 3.7 power management 3.7.1 power supply schemes v ss , v dd = 2.0 to 3.6 v : external power supply for i/os and the internal regulator. it is provided externally through v dd pins. v ssa , v dda = 2.0 to 3.6 v: external analog power supply for adc, dacs, comparators operational amplifiers, reset blocks, rcs an d pll. the minimum voltage to be applied to v dda differs from one analog peripheral to another. table 3 provides the summary of the v dda ranges for analog peripherals. the v dda voltage level must be always greater or equal to the v dd voltage level and must be provided first. v bat = 1.65 to 3.6 v: power supply for rt c, external clock 32 khz oscillator and backup registers (through power switch) when v dd is not present. 3.7.2 power supply supervision the device has an integrated power-on reset (por) and power-down reset (pdr) circuits. they are always active, and ensure proper operation above a threshold of 2 v. the device remains in reset mode when the monitored supply voltage is below a specified threshold, v por/pdr , without the need for an external reset circuit. the por monitors only the v dd supply voltage. during the startup phase it is required that v dda should arrive first and be greater than or equal to v dd . the pdr monitors both the v dd and v dda supply voltages, however the v dda power supply supervisor can be disabled (by programming a dedicated option bit) to reduce the power consumption if the app lication design ensures that v dda is higher than or equal to v dd . the device features an embedded programmable voltage detector (pvd) that monitors the v dd power supply and compares it to the v pvd threshold. an interrupt can be generated when v dd drops below the v pvd threshold and/or when v dd is higher than the v pvd threshold. the interrupt service routine can then generate a warning message and/or put the mcu into a safe state. the pvd is enabled by software. 3.7.3 voltage regulator the regulator has three operation modes: main (mr), low power (lpr), and power-down. the mr mode is used in the nominal regulation mode (run) the lpr mode is used in stop mode. the power-down mode is used in standby mo de: the regulator output is in high impedance, and the kernel circuitry is powered down thus inducing zero consumption. the voltage regulator is always enabled after reset. it is disabled in standby mode. table 3. external analog supply values for analog peripherals analog peripheral minimum v dda supply maximum v dda supply adc / comp 2.0 v 3.6 v dac / opamp 2.4 v 3.6v docid023353 rev 9 15/143 stm32f303xb stm32f303xc functional overview 52 3.7.4 low-power modes the stm32f303xb/stm32f303xc supports three low power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources: sleep mode in sleep mode, only the cpu is stopped. all peripherals continue to operate and can wake up the cpu when an interrupt/event occurs. stop mode stop mode achieves the lowest power consumption while retaining the content of sram and registers. all clocks in the 1.8 v domain are stopped, the pll, the hsi rc and the hse crystal oscillators are disabled . the voltage regulator can also be put either in normal or in low-power mode. the device can be woken up from stop mode by any of the exti line. the exti line source can be one of the 16 external lines, the pvd output, the usb wakeup, the rtc alarm, compx, i2cx or u(s)artx. standby mode the standby mode is used to achieve the lowest power consumption. the internal voltage regulator is switched off so that the entire 1.8 v domain is powered off. the pll, the hsi rc and the hse crystal oscillato rs are also switched off. after entering standby mode, sram and register contents are lost except for registers in the backup domain and standby circuitry. the device exits standby mode when an external reset (nrst pin), an iwdg reset, a rising edge on the wkup pin or an rtc alarm occurs. note: the rtc, the iwdg and the corresponding clock sources are not stopped by entering stop or standby mode. 3.8 interconnect matrix several peripherals have direct connecti ons between them. this allows autonomous communication between peripherals, savi ng cpu resources thus power supply consumption. in addition, these hardware co nnections allow fast and predictable latency. table 4. stm32f303xb/stm32f303xc peripheral interconnect matrix interconnect source interconnect destination interconnect action timx timx timers synchronization or chaining adcx dac1 conversion triggers dma memory to memory transfer trigger compx comparator output blanking compx timx timer input: ocref_clr input, input capture adcx timx timer triggered by analog watchdog functional overview stm32f303xb stm32f303xc 16/143 docid023353 rev 9 note: for more details about the interconnect action s, please refer to the corresponding sections in the reference manual rm0316. gpio rtcclk hse/32 mc0 tim16 clock source used as input channel for hsi and lsi calibration css cpu (hard fault) compx pvd gpio tim1, tim8, tim15, 16, 17 timer break gpio timx external trigger, timer break adcx dac1 conversion external trigger dac1 compx comparator inverting input table 4. stm32f303xb/stm32f303xc peripheral interconnect matrix (continued) interconnect source interconnect destination interconnect action docid023353 rev 9 17/143 stm32f303xb stm32f303xc functional overview 52 3.9 clocks and startup system clock selection is performed on startup, however the internal rc 8 mhz oscillator is selected as default cpu clock on reset. an external 4-32 mhz clock can be selected, in which case it is monitored for fa ilure. if failure is detected, th e system automatically switches back to the internal rc oscillator. a software interrupt is genera ted if enabled. similarly, full interrupt management of the pll clock entry is available when necessary (for example with failure of an indirectly used external oscillator). several prescalers allow to configure the ahb frequency, the high speed apb (apb2) and the low speed apb (apb1) domain s. the maximum fr equency of the ah b and the high speed apb domains is 72 mhz, while the maximum allowe d frequency of the low speed apb domain is 36 mhz. functional overview stm32f303xb stm32f303xc 18/143 docid023353 rev 9 figure 2.clock tree 0 + ] + 6 ( 2 6 & 2 6 & b , 1 2 6 & b 2 8 7 2 6 & b , 1 2 6 & b 2 8 7 0 + ] + 6 , 5 & , : ' * & / . w r , : ' * 3 / / [ [ [ 3 / / 0 8 / $ + % $ 3 % s u h v f d o h u + & / . 3 / / & / . w r $ + % e x v f r u h p h p r u \ d q g ' 0 $ / 6 ( / 6 , + 6 , + 6 , + 6 ( w r 5 7 & 3 / / 6 5 & 6 : 6 < 6 & / . 5 7 & & / . 5 7 & 6 ( / > @ w r 7 , 0 , i $ 3 % s u h v f d o h u [ h o v h [ ) / , 7 ) & / . w r ) o d v k s u r j u d p p l q j l q w h u i d f h w r , & [ [ w r 8 6 $ 5 7 [ [ / 6 ( + 6 , 6 < 6 & / . 3 & / . 6 < 6 & / . + 6 , 3 & / . 0 6 9 w r , 6 [ [ 8 6 % & / . w r 8 6 % l q w h u i d f h w r f r u w h [ 6 \ v w h p w l p h u ) + & / . & r u w h [ i u h h u x q q l q j f o r f n w r $ 3 % s h u l s k h u d o v $ + % s u h v f d o h u & 6 6 / 6 ( 2 6 & n + ] / 6 , 5 & n + ] 8 6 % s u h v f d o h u $ 3 % s u h v f d o h u w r 7 , 0 , i $ 3 % s u h v f d o h u [ h o v h [ w r 8 6 $ 5 7 / 6 ( + 6 , 6 < 6 & / . 3 & / . 3 & / . w r $ 3 % s h u l s k h u d o v 7 , 0 $ ' & 3 u h v f d o h u w r $ ' & [ \ [ \ $ ' & 3 u h v f d o h u , 6 6 5 & 6 < 6 & / . ( [ w f o r f n , 6 b & . , 1 [ 0 & 2 0 d l q f o r f n r x w s x w 3 / / & / . + 6 , + 6 ( 0 & 2 6 < 6 & / . / 6 , docid023353 rev 9 19/143 stm32f303xb stm32f303xc functional overview 52 3.10 general-purpose in put/outputs (gpios) each of the gpio pins can be configured by so ftware as output (push-pull or open-drain), as input (with or without pull-up or pull-down) or as peripheral alternate function. most of the gpio pins are shared with digital or analog alternate functions. all gpios are high current capable except for analog inputs. the i/os alternate function configuration c an be locked if needed following a specific sequence in order to avoid spurious writing to the i/os registers. fast i/o handling allows i/o toggling up to 36 mhz. 3.11 direct memo ry access (dma) the flexible general-purpose dma is able to manage memory-to-memory, peripheral-to- memory and memory-to-peripheral transfers. the dma controller supports circular buffer management, avoiding the generation of interrup ts when the controller reaches the end of the buffer. each of the 12 dma channels is connected to dedicated hardware dma requests, with software trigger support for each channel. configuration is done by software and transfer sizes between source and destination are independent. the dma can be used with the main peripherals: spi, i 2 c, usart, general-purpose timers, dac and adc. 3.12 interrupts and events 3.12.1 nested vectored inte rrupt controller (nvic) the stm32f303xb/stm32f303xc devices embed a nested vectored interrupt controller (nvic) able to handle up to 66 maskable interrupt channels and 16 priority levels. the nvic benefits are the following: closely coupled nvic gives lo w latency interrupt processing interrupt entry vector table address passed directly to the core closely coupled nvic core interface allows early processing of interrupts processing of late arriving higher priority interrupts support for tail chaining processor state automatically saved interrupt entry restored on interrupt exit with no instruction overhead the nvic hardware block provides flexible interrupt management features with minimal interrupt latency. functional overview stm32f303xb stm32f303xc 20/143 docid023353 rev 9 3.13 fast analog-to-digital converter (adc) four fast analog-to-di gital converters 5 msps, with select able resolution between 12 and 6 bit, are embedded in the stm32f303xb/stm32f3 03xc family devices. the adcs have up to 39 external channels. some of the extern al channels are shared between adc1&2 and between adc3&4. channels can be configured to be either single-ended input or differential input. the adcs can perform c onversions in single-shot or scan modes. in scan mode, automatic conversion is performed on a selected group of analog inputs. the adcs have also internal channels: temp erature sensor connected to adc1 channel 16, v bat/2 connected to adc1 channel 17, voltage reference v refint connected to the 4 adcs channel 18, vopamp1 connected to adc1 channel 15, vopamp2 connected to adc2 channel 17, vrefopamp3 connected to adc3 channel 17 and vrefopamp4 connected to adc4 channel 17. additional logic functions embedded in the adc interface allow: simultaneous sample and hold interleaved sample and hold single-shunt phase current reading techniques. the adc can be served by the dma controlle r. 3 analog watchdogs per adc are available. an analog watchdog feature allows very precis e monitoring of the converted voltage of one, some or all selected channels. an interrupt is generated when the converted voltage is outside the programmed thresholds. the events generated by the general-purpose timers and the advan ced-control timers (tim1 and tim8) can be internally connected to the adc start trigger and injection trigger, respectively, to allow the application to synchronize a/d conversion and timers. 3.13.1 temperature sensor the temperature sensor (ts) generates a voltage v sense that varies linearly with temperature. the temperature sensor is internally connec ted to the adc1_in16 input channel which is used to convert the sensor output voltage into a digital value. the sensor provides good linearity but it has to be calibrated to obtain good overall accuracy of the temperature measurement. as the offset of the temperature sensor varies from chip to chip due to process variation, the uncalibrated internal temperature sensor is suitable for applications that detect temperature changes only. to improve the accuracy of the temperature sensor measurement, each device is individually factory-calibrated by st. the te mperature sensor factory calibration data are stored by st in the system memory area, accessible in read-only mode. 3.13.2 internal voltage reference (v refint ) the internal voltage reference (v refint ) provides a stable (bandgap) voltage output for the adc and comparators. v refint is internally connected to the adcx_in18, x=1...4 input channel. the precise voltage of v refint is individually measured for each part by st during production test and stored in the system memo ry area. it is accessible in read-only mode. docid023353 rev 9 21/143 stm32f303xb stm32f303xc functional overview 52 3.13.3 v bat battery voltage monitoring this embedded hardware feature allows the application to measure the v bat battery voltage using the internal adc channel adc1_in17. as the v bat voltage may be higher than v dda , and thus outside the adc input range, the v bat pin is internally connected to a bridge divider by 2. as a consequence, the converted digital value is half the v bat voltage. 3.13.4 opamp reference voltage (vrefopamp) every opamp reference voltage can be measured using a corresponding adc internal channel: vrefopamp1 connected to adc1 channel 15, vrefopamp2 connected to adc2 channel 17, vrefopamp3 connected to adc3 channel 17, vrefopamp4 connected to adc4 channel 17. 3.14 digital-to-analog converter (dac) two 12-bit buffered dac channels can be used to convert digital signals into analog voltage signal outputs. the chosen design structure is composed of integrated resistor strings and an amplifier in inve rting configuration. this digital interface supp orts the following features: two dac output channels 8-bit or 10-bit monotonic output left or right data alignment in 12-bit mode synchronized update capability noise-wave generation triangular-wave generation dual dac channel independent or simultaneous conversions dma capability (for each channel) external triggers for conversion 3.15 operational amplifier (opamp) the stm32f303xb/stm32f303xc embeds four operational amplifiers with external or internal follower rout ing and pga capability (or even amp lifier and filter capability with external components). when an operational amplifier is selected, an external adc channel is used to enable output measurement. the operational amplifier features: 8.2 mhz bandwidth 0.5 ma output capability rail-to-rail input/output in pga mode, the gain can be programmed to be 2, 4, 8 or 16. functional overview stm32f303xb stm32f303xc 22/143 docid023353 rev 9 3.16 fast comparators (comp) the stm32f303xb/stm32f303xc devices embed seven fast rail-to-rail comparators with programmable reference voltage (internal or exte rnal), hysteresis and speed (low speed for low power) and with selectable output polarity. the reference voltage can be one of the following: external i/o dac output pin internal reference voltage or submultiple (1/4, 1/2, 3/4). refer to table 28: embedded internal reference voltage on page 61 for the value and precision of the internal reference voltage. all comparators can wake up from stop mode, generate interrupts and breaks for the timers and can be also combined per pair into a window comparator 3.17 timers and watchdogs the stm32f303xb/stm32f303xc includes two ad vanced control timers, up to six general- purpose timers, two basic timers, two watchdog timers and a systick timer. the table below compares the features of the advanced co ntrol, general purpose and basic timers. note: tim1/8 can have pll as clock source, and therefore can be clocked at 144 mhz. table 5.timer feature comparison timer type timer counter resolution counter type prescaler factor dma request generation capture/ compare channels complementary outputs advanced tim1, tim8 16-bit up, down, up/down any integer between 1 and 65536 yes 4 yes general- purpose tim2 32-bit up, down, up/down any integer between 1 and 65536 yes 4 no general- purpose tim3, tim4 16-bit up, down, up/down any integer between 1 and 65536 yes 4 no general- purpose tim15 16-bit up any integer between 1 and 65536 yes 2 1 general- purpose tim16, tim17 16-bit up any integer between 1 and 65536 yes 1 1 basic tim6, tim7 16-bit up any integer between 1 and 65536 yes 0 no docid023353 rev 9 23/143 stm32f303xb stm32f303xc functional overview 52 3.17.1 advanced time rs (tim1, tim8) the advanced-control timers (tim1 and ti m8) can each be seen as a three-phase pwm multiplexed on six channels. they have complementary pwm outputs with programmable inserted dead-times. they can also be seen as complete general-purpose timers. the four independent channels can be used for: input capture output compare pwm generation (edge or cent er-aligned modes) with full modulation capability (0- 100%) one-pulse mode output in debug mode, the advanced-control timer counter can be frozen and the pwm outputs disabled to turn off any power switches driven by these outputs. many features are shared with those of the general-purpose tim timers (described in section 3.17.2 using the same architecture, so t he advanced-control timers can work together with the tim timers via the timer link feature for synchronization or event chaining. 3.17.2 general-purpose timers (tim2, tim3, tim4, tim15, tim16, tim17) there are up to six synchronizable general-purpose timers embedded in the stm32f303xb/stm32f303xc (see table 5 for differences). each general-purpose timer can be used to generate pwm outputs, or act as a simple time base. tim2, 3, and tim4 these are full-featured general-purpose timers: ? tim2 has a 32-bit auto-reload up/downcounter and 32-bit prescaler ? tim3 and 4 have 16-bit auto-reload up/downcounters and 16-bit prescalers. these timers all feature 4 independent chan nels for input capture/output compare, pwm or one-pulse mode output. they can work together, or with the other general- purpose timers via the timer link featur e for synchronization or event chaining. the counters can be frozen in debug mode. all have independent dma request generat ion and support quadrature encoders. tim15, 16 and 17 these three timers general-purpose timers with mid-range features: they have 16-bit auto-reload upcounters and 16-bit prescalers. ? tim15 has 2 channels and 1 complementary channel ? tim16 and tim17 have 1 channel and 1 complementary channel all channels can be used for input capture/output compare, pwm or one-pulse mode output. the timers can work together via the timer link feature for synchronization or event chaining. the timers have independent dma request generation. the counters can be frozen in debug mode. 3.17.3 basic timers (tim6, tim7) these timers are mainly used for dac trigge r generation. they can also be used as a generic 16-bit time base. functional overview stm32f303xb stm32f303xc 24/143 docid023353 rev 9 3.17.4 independent watchdog (iwdg) the independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. it is clocked from an independent 40 khz internal rc and as it operates independently from the main clock, it can operate in stop and standb y modes. it can be used either as a watchdog to reset the device when a problem occurs, or as a free running timer for application timeout management. it is hardware or software configurable through the option bytes. the counter can be frozen in debug mode. 3.17.5 window watchdog (wwdg) the window watchdog is based on a 7-bit downcounter that can be set as free running. it can be used as a watchdog to reset the device when a problem occurs. it is clocked from the main clock. it has an early warning interrupt capab ility and the counter can be frozen in debug mode. 3.17.6 systick timer this timer is dedicated to real-time operating systems, but could also be used as a standard down counter. it features: a 24-bit down counter autoreload capability maskable system interrupt generation when the counter reaches 0. programmable clock source 3.18 real-time clock (rtc ) and backup registers the rtc and the 16 backup registers are supplied through a switch that takes power from either the v dd supply when present or the v bat pin . the backup registers are sixteen 32-bit registers used to store 64 bytes of user application data when v dd power is not present. they are not reset by a system or power rese t, or when the device wakes up from standby mode. the rtc is an independent bcd timer/counter .it supports the following features: calendar with subsecond, seconds, minutes, hours (12 or 24 format), week day, date, month, year, in bcd (binary-coded decimal) format. reference clock detection: a more precise se cond source clock (50 or 60 hz) can be used to enhance the calendar precision. automatic correction for 28, 29 (leap year), 30 and 31 days of the month. two programmable alarms with wake up fr om stop and standb y mode capability. on-the-fly correction from 1 to 32767 rtc clock pulses. this can be used to synchronize it with a master clock. digital calibration circuit with 1 ppm resolu tion, to compensate for quartz crystal inaccuracy. three anti-tamper detection pins with programmable filter. the mcu can be woken up from stopand standby modes on tamper event detection. timestamp feature which can be used to save the calendar content. this function can be triggered by an event on the timestamp pin, or by a tamper event. the mcu can be woken up from stop and standby modes on timestamp event detection. docid023353 rev 9 25/143 stm32f303xb stm32f303xc functional overview 52 17-bit auto-reload counter for periodic interrupt with wakeup from stop/standby capability. the rtc clock sources can be: a 32.768 khz external crystal a resonator or oscillator the internal low-power rc oscillator (typical frequency of 40 khz) the high-speed external clock divided by 32. 3.19 inter-integrated circuit interface (i 2 c) up to two i 2 c bus interfaces can operate in multim aster and slave modes. they can support standard (up to 100 khz), fast (up to 400 khz) and fast mode + (up to 1 mhz) modes. both support 7-bit and 10-bit addressing modes, multiple 7-bit slave addresses (2 addresses, 1 with configurable mask). they also include programmable analog and digital noise filters. in addition, they provide hard ware support for sm bus 2.0 and pmbus 1.1: arp capability, host notify protocol, hardware crc (pec) gener ation/verification, timeouts verifications and alert protocol management. they also have a clock domain independent from the cpu clock, allowing the i2cx (x=1,2) to wake up the mcu from stop mode on address match. the i2c interfaces can be served by the dma controller. refer to table 7 for the features available in i2c1 and i2c2. table 6.comparison of i2c analog and digital filters analog filter digital filter pulse width of suppressed spikes 3 50 ns programmable length from 1 to 15 i2c peripheral clocks benefits available in stop mode 1. extra filtering capability vs. standard requirements. 2. stable length drawbacks variations depending on temperature, voltage, process wakeup from stop on address match is not available when digital filter is enabled. table 7.stm32f303xb/stm32f303xc i 2 c implementation i2c features (1) i2c1 i2c2 7-bit addressing mode x x 10-bit addressing mode x x standard mode (up to 100 kbit/s) x x fast mode (up to 400 kbit/s) x x fast mode plus with 20ma output drive i/os (up to 1 mbit/s) x x independent clock x x functional overview stm32f303xb stm32f303xc 26/143 docid023353 rev 9 3.20 universal synchronous/asynch ronous receiver transmitter (usart) the stm32f303xb/stm32f303xc devices have three embedded universal synchronous/asynchronous receiver transmitters (usart1, usart2 and usart3). the usart interfaces are able to communicate at speeds of up to 9 mbits/s. they provide hardware management of the ct s and rts signals, they support irda sir endec, the multiprocessor communication mode, the single-wire half-duplex communication mode and have li n master/slave capability. the usart interfaces can be served by the dma controller. 3.21 universal asynchronous receiver transmitter (uart) the stm32f303xb/stm32f303xc devices have 2 embedded universal asynchronous receiver transmitters (uart4, and uart5) . the uart interfaces support irda sir endec, multiprocessor comm unication mode and single-wire half-duplex communication mode. the uart4 interface can be served by the dma controller. refer to table 8 for the features available in all u(s)art interfaces. smbus x x wakeup from stop x x 1. x = supported. table 7.stm32f303xb/stm32f303xc i 2 c implementation (continued) i2c features (1) i2c1 i2c2 table 8.usart features usart modes/features (1) usart1 usart2 usart3 uart4 uart5 hardware flow control for modem x x x - - continuous communication using dma x x x x - multiprocessor communication x x x x x synchronous mode x x x - - smartcard mode x x x - - single-wire half-dupl ex communication x x x x x irda sir endec block x x x x x lin mode x x x x x dual clock domain and wakeup from stop mode x x x x x receiver timeout interrupt x x x x x modbus communication x x x x x auto baud rate detection x x x - - driver enable x x x - - 1. x = supported. docid023353 rev 9 27/143 stm32f303xb stm32f303xc functional overview 52 3.22 serial peripheral interface (spi)/inter-integrated sound interfaces (i2s) up to three spis are able to communicate up to 18 mbits/s in slave and master modes in full-duplex and half-duplex communication mo des. the 3-bit prescaler gives 8 master mode frequencies and the frame size is configurable from 4 bits to 16 bits. two standard i2s interfaces (multiplexed with spi2 and spi3) supporting four different audio standards can operate as master or slave at half-duplex and full duplex communication modes. they can be configured to transfer 16 and 24 or 32 bits with 16-bit or 32-bit data resolution and synchronized by a specific signal. audio sampling frequency from 8 khz up to 192 khz can be set by 8-bit programmable linear prescaler. when operating in master mode it can output a clo ck for an external audio component at 256 times the sampling frequency. refer to table 9 for the features available in spi1, spi2 and spi3. 3.23 controller area network (can) the can is compliant with specif ications 2.0a and b (active) wit h a bit rate up to 1 mbit/s. it can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. it has three transmit mailboxes, two receive fifos with 3 stages and 14 scalable filter banks. 3.24 universal serial bus (usb) the stm32f303xb/stm32f303xc devices embed an usb device peripheral compatible with the usb full-speed 12 mbs. the usb interface implements a full-speed (12 mbit/s) function interface. it has software-configurable endpoint setting and suspend/resume support. the dedicated 48 mhz clock is gener ated from the internal main pll (the clock source must use a hse crystal oscillator) . the usb has a dedicated 512-bytes sram memory for data transmission and reception. table 9.stm32f303xb/stm32f303xc spi/i2s implementation spi features (1) 1. x = supported. spi1 spi2 spi3 hardware crc calculation x x x rx/tx fifo x x x nss pulse mode x x x i2s mode - x x ti mode xxx functional overview stm32f303xb stm32f303xc 28/143 docid023353 rev 9 3.25 infrared transmitter the stm32f303xb/stm32f303xc devices provide an infrared transmitter solution. the solution is based on internal connections between tim16 and ti m17 as shown in the figure below. tim17 is used to provide the carrier frequenc y and tim16 provides the main signal to be sent. the infrared output signal is available on pb9 or pa13. to generate the infrared remote control sign als, tim16 channel 1 and tim17 channel 1 must be properly configured to generate correct waveforms. all standard ir pulse modulation modes can be obtained by programming t he two timers output compare channels. figure 3.infrar ed transmitter 3.26 touch sensing controller (tsc) the stm32f303xb/stm32f303xc devices provide a simple solution for adding capacitive sensing functionality to any application. thes e devices offer up to 24 capacitive sensing channels distributed over 8 analog i/o groups. capacitive sensing technology is able to detect the presence of a finger near a sensor which is protected from direct touch by a dielectric (glass, plastic, ...). the capacitive variation introduced by the finger (or any conduct ive object) is measured using a proven implementation based on a surface charge transfer acquisition principle. it consists of charging the sensor capacitance and then transferring a part of the accumulated charges into a sampling capacitor unt il the voltage across this capa citor has reached a specific threshold. to limit the cpu bandwidth usage th is acquisition is dire ctly managed by the hardware touch sensing controller and only r equires few external components to operate. the touch sensing controller is fully supported by the stmtouch touch sensing firmware library which is free to use and allows touch se nsing functionality to be implemented reliably in the end application. 7 , 0 ( 5 i r u h q y h o r s 7 , 0 ( 5 i r u f d u u l h u 2 & 2 & 3 % 3 $ 0 6 y 9 docid023353 rev 9 29/143 stm32f303xb stm32f303xc functional overview 52 table 10.capacitive sensing gpios available on stm32f303xb/stm32f303xc devices group capacitive sensing signal name pin name group capacitive sensing signal name pin name 1 tsc_g1_io1 pa0 5 tsc_g5_io1 pb3 tsc_g1_io2 pa1 tsc_g5_io2 pb4 tsc_g1_io3 pa2 tsc_g5_io3 pb6 tsc_g1_io4 pa3 tsc_g5_io4 pb7 2 tsc_g2_io1 pa4 6 tsc_g6_io1 pb11 tsc_g2_io2 pa5 tsc_g6_io2 pb12 tsc_g2_io3 pa6 tsc_g6_io3 pb13 tsc_g2_io4 pa7 tsc_g6_io4 pb14 3 tsc_g3_io1 pc5 7 tsc_g7_io1 pe2 tsc_g3_io2 pb0 tsc_g7_io2 pe3 tsc_g3_io3 pb1 tsc_g7_io3 pe4 tsc_g3_io4 pb2 tsc_g7_io4 pe5 4 tsc_g4_io1 pa9 8 tsc_g8_io1 pd12 tsc_g4_io2 pa10 tsc_g8_io2 pd13 tsc_g4_io3 pa13 tsc_g8_io3 pd14 tsc_g4_io4 pa14 tsc_g8_io4 pd15 table 11.no. of capacitive sensing channels available on stm32f303xb/stm32f303xc devices analog i/o group number of capacitive sensing channels stm32f303vx stm32f303rx stm32f303cx g1 3 3 3 g2 3 3 3 g3 3 3 2 g4 3 3 3 g5 3 3 3 g6 3 3 3 g7 3 0 0 g8 3 0 0 number of capacitive sensing channels 24 18 17 functional overview stm32f303xb stm32f303xc 30/143 docid023353 rev 9 3.27 development support 3.27.1 serial wire jt ag debug port (swj-dp) the arm swj-dp interface is embedded, and is a combined jtag and serial wire debug port that enables either a serial wire debug or a jtag probe to be connected to the target. the jtag tms and tck pins are shared re spectively with swdio and swclk and a specific sequence on the tms pin is us ed to switch between jtag-dp and sw-dp. 3.27.2 embedded trace macrocell? the arm embedded trace ma crocell provides a greater visib ility of the instruction and data flow inside the cpu core by streaming compressed data at a very high rate from the stm32f303xb/stm32f303xc through a small number of etm pins to an external hardware trace port analyzer (tpa) device. the tpa is connected to a host computer using a high-speed channel. real-time instruction a nd data flow activity can be recorded and then formatted for display on the host computer running debugger software. tpa hardware is commercially available from common development tool vendors. it operates with third party debugger software tools. docid023353 rev 9 31/143 stm32f303xb stm32f303xc pinouts and pin description 52 4 pinouts and pin description figure 4.stm32f303xb/stm32f303xc lqfp48 pinout 9 % $ 7 3 & 2 6 & b , 1 3 & 2 6 & b 2 8 7 1 5 6 7 9 6 6 $ 9 5 ( ) 9 ' ' $ 9 5 ( ) 3 $ 3 $ 3 $ 9 ' ' b 9 6 6 b 3 % 3 % % 2 2 7 3 % 3 % 3 % 3 % 3 % 3 $ 3 $ 9 ' ' b 9 6 6 b 3 $ 3 $ 3 $ 3 $ 3 $ 3 $ 3 % 3 % 3 % 3 % 3 $ 3 $ 3 $ 3 $ 3 $ 3 % 3 % 3 % 3 % 9 6 6 b 3 % 9 ' ' b 3 ) 2 6 & b , 1 3 ) 2 6 & b 2 8 7 3 & . 4 7 , 1 & 0 pinouts and pin description stm32f303xb stm32f303xc 32/143 docid023353 rev 9 figure 5.stm32f303xb/stm32f303xc lqfp64 pinout 9 % $ 7 3 & 2 6 & b , 1 3 & 2 6 & b 2 8 7 1 5 6 7 3 & 3 & 3 & 3 & 9 6 6 $ 9 5 ( ) 9 ' ' $ 3 $ 3 $ 3 $ 9 ' ' b 3 % 3 % % 2 2 7 3 % 3 % 3 % 3 % 3 % 3 ' 3 & 3 & 3 & 3 $ 3 $ 9 ' ' b 9 6 6 b 3 $ 3 $ 3 $ 3 $ 3 $ 3 $ 3 & 3 & 3 & 3 & 3 % 3 % 3 % 3 % 3 ) 3 $ 9 ' ' b 3 $ 3 $ 3 $ 3 $ 3 & 3 & 3 % 3 % 3 % 3 % 3 ) 2 6 & b 2 8 7 3 ) 2 6 & b , 1 3 & 9 6 6 b 3 % 9 6 6 b 9 ' ' b , 1 & 0 a i 6 docid023353 rev 9 33/143 stm32f303xb stm32f303xc pinouts and pin description 52 figure 6.stm32f303xb/stm32f303xc lqfp100 pinout 0 % 0 % 0 % 0 % 0 % 6 " ! 4 0 # / 3 # ? ) . 0 # / 3 # ? / 5 4 0 & 0 & 0 & / 3 # ? ) . . 2 3 4 0 # 0 # 0 # 0 # 0 & 6 3 3 ! 6 2 % & 6 2 % & 6 $ $ ! 0 ! 0 ! 0 ! 6 $ $ ? 6 3 3 ? 0 & 0 ! 0 ! 0 ! 0 ! 0 ! 0 ! 0 # 0 # 0 # 0 # 0 $ 0 $ 0 $ 0 $ 0 $ 0 $ 0 $ 0 $ 0 " 0 " 0 " 0 " 0 ! 0 & 6 $ $ ? 0 ! 0 ! 0 ! 0 ! 0 # 0 # 0 " 0 " 0 " 0 % 0 % 0 % 0 % 0 % 0 % 0 % 0 % 0 % 0 " 6 3 3 ? 6 $ $ ? 6 $ $ ? 6 3 3 ? 0 % 0 % 0 " 0 " " / / 4 0 " 0 " 0 " 0 " 0 " 0 $ 0 $ 0 $ 0 $ 0 $ 0 $ 0 $ 0 $ 0 # 0 # 0 # 0 ! 0 ! a i 6 , 1 & 0 0 # 0 & / 3 # ? / 5 4 0 " pinouts and pin description stm32f303xb stm32f303xc 34/143 docid023353 rev 9 table 12.legend/abbreviations used in the pinout table name abbreviation definition pin name unless otherwise specified in brackets below the pin name, the pin function during and after reset is the same as the actual pin name pin type s supply pin i input only pin i/o input / output pin i/o structure ft 5 v tolerant i/o ftf 5 v tolerant i/o, fm+ capable tta 3.3 v tolerant i/o directly connected to adc tc standard 3.3v i/o b dedicated boot0 pin rst bidirectional reset pin with embedded weak pull-up resistor notes unless otherwise specified by a note, all i/os are set as floating inputs during and after reset pin functions alternate functions functions selected through gpiox_afr registers additional functions functions directly selected/enabl ed through peripheral registers docid023353 rev 9 35/143 stm32f303xb stm32f303xc pinouts and pin description 52 table 13.stm32f303xb/stm32f303xc pin definitions pin number pin name (function after reset) pin type i/o structure notes pin functions lqfp100 lqfp64 lqfp48 alternate functions additional functions 1 - - pe2 i/o ft (1) traceck, tim3_ch1, tsc_g7_io1, eventout - 2 - - pe3 i/o ft (1) traced0, tim3_ch2, tsc_g7_io2, eventout - 3 - - pe4 i/o ft (1) traced1, tim3_ch3, tsc_g7_io3, eventout - 4 - - pe5 i/o ft (1) traced2, tim3_ch4, tsc_g7_io4, eventout - 5 - - pe6 i/o ft (1) traced3, eventout wkup3, rtc_tamp3 611 v bat s - - backup power supply 722pc13 (2) i/o tc - tim1_ch1n wkup2, rtc_tamp1, rtc_ts, rtc_out 833 pc14 (2) osc32_in (pc14) i/o tc - - osc32_in 944 pc15 (2) osc32_ out (pc15) i/o tc - - osc32_out 10 - - pf9 i/o ft (1) tim15_ch1, spi2_sck, eventout - 11 - - pf10 i/o ft (1) tim15_ch2, spi2_sck, eventout - 12 5 5 pf0- osc_in (pf0) i/o ftf - tim1_ch3n, i2c2_sda, osc_in 13 6 6 pf1- osc_out (pf1) i/o ftf - i2c2_scl osc_out 14 7 7 nrst i/o rst device reset input / internal reset output (active low) 15 8 - pc0 i/o tta (1) eventout adc12_in6, comp7_inm 16 9 - pc1 i/o tta (1) eventout adc12_in7, comp7_inp 17 10 - pc2 i/o tta (1) comp7_out, eventout adc12_in8 18 11 - pc3 i/o tta (1) tim1_bkin2, eventout adc12_in9 19 - - pf2 i/o tta (1) eventout adc12_in10 20 12 8 vssa/ vref- s - - analog ground/negative reference voltage 21 - - vref+ (3) s - - positive reference voltage 22 - - vdda s - - analog power supply -139 vdda/ vref+ s - - analog power supply/positive reference voltage pinouts and pin description stm32f303xb stm32f303xc 36/143 docid023353 rev 9 23 14 10 pa0 i/o tta - usart2_cts, tim2_ch1_etr,tim8_bkin, tim8_etr,tsc_g1_io1, comp1_out, eventout adc1_in1, comp1_inm, rtc_ tamp2, wkup1, comp7_inp 24 15 11 pa1 i/o tta - usart2_rts_de, tim2_ch2, tsc_g1_io2, tim15_ch1n, rtc_refin, eventout adc1_in2, comp1_inp, opamp1_vinp, opamp3_vinp 25 16 12 pa2 i/o tta (4) usart2_tx, tim2_ch3, tim15_ch1, tsc_g1_io3, comp2_out, eventout adc1_in3, comp2_inm, opamp1_vout 26 17 13 pa3 i/o tta - usart2_rx, tim2_ch4, tim15_ch2, tsc_g1_io4, eventout adc1_in4, opamp1_vinp, comp2_inp, opamp1_vinm 27 18 - pf4 i/o tta (1) comp1_out, eventout adc1_in5 28 19 - vdd_4 s -- -- 29 20 14 pa4 i/o tta (4) spi1_nss, spi3_nss,i2s3_ws, usart2_ck, tsc_g2_io1, tim3_ch2, eventout adc2_in1, dac1_out1, opamp4_vinp, comp1_inm, comp2_inm, comp3_inmcomp4_inm, comp5_inmcomp6_inm,co mp7_inm 30 21 15 pa5 i/o tta (4) spi1_sck, tim2_ch1_etr, tsc_g2_io2, eventout adc2_in2, dac1_out2 opamp1_vinp, opamp2_vinm, opamp3_vinp comp1_inm, comp2_inm, comp3_inmcomp4_inm,co mp5_inmcomp6_inm, comp7_inm 31 22 16 pa6 i/o tta (4) spi1_miso, tim3_ch1, tim8_bkin, tim1_bkin, tim16_ch1, comp1_out, tsc_g2_io3, eventout adc2_in3, opamp2_vout 32 23 17 pa7 i/o tta - spi1_mosi, tim3_ch2, tim17_ch1, tim1_ch1n, tim8_ch1ntsc_g2_io4, comp2_out, eventout adc2_in4, comp2_inp, opamp2_vinp, opamp1_vinp 33 24 - pc4 i/o tta (1) usart1_tx, eventout adc2_in5 34 25 - pc5 i/o tta (1) usart1_rx, tsc_g3_io1, eventout adc2_in11, opamp2_vinm, opamp1_vinm 35 26 18 pb0 i/o tta - tim3_ch3, tim1_ch2n, tim8_ch2n,tsc_g3_io2, eventout adc3_in12, comp4_inp, opamp3_vinpopamp2_vinp table 13.stm32f303xb/stm32f303x c pin definitions (continued) pin number pin name (function after reset) pin type i/o structure notes pin functions lqfp100 lqfp64 lqfp48 alternate functions additional functions docid023353 rev 9 37/143 stm32f303xb stm32f303xc pinouts and pin description 52 36 27 19 pb1 i/o tta (4) tim3_ch4, tim1_ch3n, tim8_ch3n , comp4_out, tsc_g3_io3, eventout adc3_in1, opamp3_vout- 37 28 20 pb2 i/o tta - tsc_g3_io4, eventout adc2_in12, comp4_inm, opamp3_vinm 38 - - pe7 i/o tta (1) tim1_etr, eventout adc3_in13, comp4_inp 39 - - pe8 i/o tta (1) tim1_ch1n, eventout comp4_inm, adc34_in6 40 - - pe9 i/o tta (1) tim1_ch1, eventout adc3_in2 41 - - pe10 i/o tta (1) tim1_ch2n, eventout adc3_in14 42 - - pe11 i/o tta (1) tim1_ch2, eventout adc3_in15 43 - - pe12 i/o tta (1) tim1_ch3n, eventout adc3_in16 44 - - pe13 i/o tta (1) tim1_ch3, eventout adc3_in3 45 - - pe14 i/o tta (1) tim1_ch4, tim1_bkin2, eventout adc4_in1 46 - - pe15 i/o tta (1) usart3_rx, tim1_bkin, eventout adc4_in2 47 29 21 pb10 i/o tta - usart3_tx, tim2_ch3, tsc_sync, eventout comp5_inm,opamp4_vinm, opamp3_vinm 48 30 22 pb11 i/o tta - usart3_rx, tim2_ch4, tsc_g6_io1, eventout comp6_inp, opamp4_vinp 49 31 23 vss_2 s - - digital ground 50 32 24 vdd_2 s - - digital power supply 51 33 25 pb12 i/o tta (4) spi2_nss,i2s2_ws,i2c2_s mba, usart3_ck, tim1_bkin, tsc_g6_io2, eventout adc4_in3, comp3_inm,opamp4_vout 52 34 26 pb13 i/o tta - spi2_sck,i2s2_ck,usart 3_cts, tim1_ch1n, tsc_g6_io3, eventout adc3_in5, comp5_inp,opamp4_vinp, opamp3_vinp 53 35 27 pb14 i/o tta - spi2_miso,i2s2ext_sd, usart3_rts_de, tim1_ch2n, tim15_ch1, tsc_g6_io4, eventout comp3_inp,adc4_in4, opamp2_vinp 54 36 28 pb15 i/o tta - spi2_mosi, i2s2_sd, tim1_ch3n, rtc_refin, tim15_ch1n, tim15_ch2, eventout adc4_in5, comp6_inm 55 - - pd8 i/o tta (1) usart3_tx, eventout adc4_in12, opamp4_vinm 56 - - pd9 i/o tta (1) usart3_rx, eventout adc4_in13 57 - - pd10 i/o tta (1) usart3_ck, eventout adc34_in7, comp6_inm table 13.stm32f303xb/stm32f303x c pin definitions (continued) pin number pin name (function after reset) pin type i/o structure notes pin functions lqfp100 lqfp64 lqfp48 alternate functions additional functions pinouts and pin description stm32f303xb stm32f303xc 38/143 docid023353 rev 9 58 - - pd11 i/o tta (1) usart3_cts, eventout adc34_in8, comp6_inp, opamp4_vinp 59 - - pd12 i/o tta (1) usart3_rts_de, tim4_ch1, tsc_g8_io1, eventout adc34_in9, comp5_inp 60 - - pd13 i/o tta (1) tim4_ch2, tsc_g8_io2, eventout adc34_in10,comp5_inm 61 - - pd14 i/o tta (1) tim4_ch3, tsc_g8_io3, eventout comp3_inp,adc34_in11,opa mp2_vinp 62 - - pd15 i/o tta (1) spi2_nss, tim4_ch4, tsc_g8_io4, eventout comp3_inm 63 37 - pc6 i/o ft (1) i2s2_mck, comp6_out, tim8_ch1, tim3_ch1, eventout - 64 38 - pc7 i/o ft (1) i2s3_mck, tim8_ch2, tim3_ch2, comp5_out, eventout - 65 39 - pc8 i/o ft (1) tim8_ch3, tim3_ch3, comp3_out, eventout - 66 40 - pc9 i/o ft (1) tim8_ch4, tim8_bkin2,tim3_ch4, i2s_ckin, eventout - 67 41 29 pa8 i/o ft - i2c2_smba,i2s2_mck, usart1_ck, tim1_ch1, tim4_etr, mco, comp3_out, eventout - 68 42 30 pa9 i/o ftf - i2c2_scl,i2s3_mck, usart1_tx, tim1_ch2, tim2_ch3, tim15_bkin, tsc_g4_io1, comp5_out, eventout - 69 43 31 pa10 i/o ftf - i2c2_sda, usart1_rx, tim1_ch3, tim2_ch4, tim8_bkin, tim17_bkin, tsc_g4_io2, comp6_out, eventout - 70 44 32 pa11 i/o ft - usart1_cts, usb_dm, can_rx, tim1_ch1n, tim1_ch4, tim1_bkin2, tim4_ch1, comp1_out, eventout - table 13.stm32f303xb/stm32f303x c pin definitions (continued) pin number pin name (function after reset) pin type i/o structure notes pin functions lqfp100 lqfp64 lqfp48 alternate functions additional functions docid023353 rev 9 39/143 stm32f303xb stm32f303xc pinouts and pin description 52 71 45 33 pa12 i/o ft - usart1_rts_de, usb_dp, can_tx, tim1_ch2n, tim1_etr, tim4_ch2, tim16_ch1, comp2_out, eventout - 72 46 34 pa13 i/o ft - usart3_cts, tim4_ch3, tim16_ch1n, tsc_g4_io3, ir_out, swdio-jtms, eventout - 73 - - pf6 i/o ftf (1) i2c2_scl, usart3_rts_de, tim4_ch4, eventout - 74 47 35 vss_3 s - -ground 75 48 36 vdd_3 s - - digital power supply 76 49 37 pa14 i/o ftf - i2c1_sda, usart2_tx, tim8_ch2,tim1_bkin, tsc_g4_io4, swclk-jtck, eventout - 77 50 38 pa15 i/o ftf - i2c1_scl, spi1_nss, spi3_nss, i2s3 _ws, jtdi, usart2_rx, tim1_bkin, tim2_ch1_etr, tim8_ch1, eventout - 78 51 - pc10 i/o ft (1) spi3_sck, i2s3_ck, usart3_tx, uart4_tx, tim8_ch1n, eventout - 79 52 - pc11 i/o ft (1) spi3_miso, i2s3ext_sd, usart3_rx, uart4_rx, tim8_ch2n, eventout - 80 53 - pc12 i/o ft (1) spi3_mosi, i2s3_sd, usart3_ck, uart5_tx, tim8_ch3n, eventout - 81 - - pd0 i/o ft (1) can_rx, eventout - 82 - - pd1 i/o ft (1) can_tx, tim8_ch4, tim8_bkin2,eventout - 83 54 - pd2 i/o ft (1) uart5_rx, tim3_etr, tim8_bkin, eventout - 84 - - pd3 i/o ft (1) usart2_cts, tim2_ch1_etr, eventout - 85 - - pd4 i/o ft (1) usart2_rts_de, tim2_ch2, eventout - 86 - - pd5 i/o ft (1) usart2_tx, eventout - table 13.stm32f303xb/stm32f303x c pin definitions (continued) pin number pin name (function after reset) pin type i/o structure notes pin functions lqfp100 lqfp64 lqfp48 alternate functions additional functions pinouts and pin description stm32f303xb stm32f303xc 40/143 docid023353 rev 9 87 - - pd6 i/o ft (1) usart2_rx, tim2_ch4, eventout - 88 - - pd7 i/o ft (1) usart2_ck, tim2_ch3, eventout - 89 55 39 pb3 i/o ft - spi3_sck, i2s3_ck, spi1_sck, usart2_tx, tim2_ch2, tim3_etr, tim4_etr, tim8_ch1n, tsc_g5_io1, jtdo- traceswo, eventout - 90 56 40 pb4 i/o ft - spi3_miso, i2s3ext_sd, spi1_miso, usart2_rx, tim3_ch1, tim16_ch1, tim17_bkin, tim8_ch2n, tsc_g5_io2, njtrst, eventout - 91 57 41 pb5 i/o ft - spi3_mosi, spi1_mosi, i2s3_sd, i2c1_smba, usart2_ck, tim16_bkin, tim3_ch2, tim8_ch3n, tim17_ch1, eventout - 92 58 42 pb6 i/o ftf - i2c1_scl, usart1_tx, tim16_ch1n, tim4_ch1, tim8_ch1,tsc_g5_io3, tim8_etr, tim8_bkin2, eventout - 93 59 43 pb7 i/o ftf - i2c1_sda, usart1_rx, tim3_ch4, tim4_ch2, tim17_ch1n, tim8_bkin, tsc_g5_io4, eventout - 94 60 44 boot0 i b - boot memory selection 95 61 45 pb8 i/o ftf - i2c1_scl, can_rx, tim16_ch1, tim4_ch3, tim8_ch2, tim1_bkin, tsc_sync, comp1_out, eventout - 96 62 46 pb9 i/o ftf - i2c1_sda, can_tx, tim17_ch1, tim4_ch4, tim8_ch3, ir_out, comp2_out, eventout - 97 - - pe0 i/o ft (1) usart1_tx, tim4_etr, tim16_ch1, eventout - 98 - - pe1 i/o ft (1) usart1_rx, tim17_ch1, eventout - table 13.stm32f303xb/stm32f303x c pin definitions (continued) pin number pin name (function after reset) pin type i/o structure notes pin functions lqfp100 lqfp64 lqfp48 alternate functions additional functions docid023353 rev 9 41/143 stm32f303xb stm32f303xc pinouts and pin description 52 99 63 47 vss_1 s - - ground 100 64 48 vdd_1 s - - digital power supply 1. function availability depends on the chosen device. when using the small packages (48 and 64 pin packa ges), the gpio pins which are not present on these packages, must not be configured in analog mode. 2. pc13, pc14 and pc15 are supplied through the power swit ch. since the switch sinks only a limited amount of current (3 ma), the use of gpio pc13 to pc15 in output mode is limited: - the speed should not exceed 2 mhz with a maximum load of 30 pf - these gpios must not be used as cu rrent sources (e.g. to drive an led). after the first backup domain power-up, pc13, pc14 and pc15 operate as gpios. their function then depends on the content of the backup re gisters which is not reset by the main reset. for details on how to manage these gpios, refer to the battery backup doma in and bkp register description sections in the rm0316 reference manual. 3. the vref+ functionality is available only on the 100 pin package. on the 64-pin and 48-pin packages, the vref+ is internally connected to vdda. 4. these gpios offer a reduced touch sensi ng sensitivity. it is thus recommended to use them as sampling capacitor i/o. table 13.stm32f303xb/stm32f303x c pin definitions (continued) pin number pin name (function after reset) pin type i/o structure notes pin functions lqfp100 lqfp64 lqfp48 alternate functions additional functions pinouts and pin description stm32f303xb stm32f303xc 42/143 docid023353 rev 9 table 14.alternate functions for port a port & pin name af0 af1 af2 af3 af4 af5 af6 af7 af8 af9 af10 af11 af12 af14 af15 pa0 - tim2_ ch1_ etr - tsc_ g1_io1 -- - usart2_ cts comp1 _out tim8_ bkin tim8_ etr --- event out pa1 rtc_ refin tim2_ ch2 - tsc_ g1_io2 -- - usart2_ rts_de tim15_ ch1n ---- event out pa2 - tim2_ ch3 - tsc_ g1_io3 -- - usart2_ tx comp2 _out tim15_ ch1 ---- event out pa3 - tim2_ ch4 - tsc_ g1_io4 -- - usart2_ rx - tim15_ ch2 ---- event out pa4 - - tim3_ ch2 tsc_ g2_io1 - spi1_ nss spi3_nss, i2s3_ws usart2_ ck --- - -- event out pa5 - tim2_ ch1_ etr - tsc_ g2_io2 - spi1_ sck -------- event out pa6 - tim16_ ch1 tim3_ ch1 tsc_ g2_io3 tim8_ bkin spi1_ miso tim1_bkin - comp1 _out -- - -- event out pa7 - tim17_ ch1 tim3_ ch2 tsc_ g2_io4 tim8_ ch1n spi1_ mosi tim1_ch1n - comp2 _out -- - -- event out pa8 mco - - - i2c2_ smba i2s2_ mck tim1_ch1 usart1_ ck comp3 _out - tim4_ etr --- event out pa9 - - - tsc_ g4_io1 i2c2_ scl i2s3_ mck tim1_ch2 usart1_ tx comp5 _out tim15_ bkin tim2_ ch3 --- event out pa10 - tim17_ bkin - tsc_ g4_io2 i2c2_ sda - tim1_ch3 usart1_ rx comp6 _out - tim2_ ch4 tim8_bkin - - event out pa11 - - - - - - tim1_ch1n usart1_ cts comp1 _out can_rx tim4_ ch1 tim1_ch4 tim1_ bkin2 usb_ dm event out stm32f303xb stm32f303xc pinouts and pin description docid023353 rev 9 43/143 pa12 - tim16_ ch1 - - - - tim1_ch2n usart1_ rts_de comp2 _out can_tx tim4_ ch2 tim1_etr - usb_ dp event out pa13 swdio -jtms tim16_ ch1n - tsc_ g4_io3 - ir_ out - usart3_ cts -- tim4_ ch3 --- event out pa14 swclk -jtck -- tsc_ g4_io4 i2c1_ sda tim8_ ch2 tim1_bkin usart2_ tx --- - -- event out pa15 jtdi tim2_ ch1_ etr tim8_ ch1 - i2c1_ scl spi1_ nss spi3_nss, i2s3_ws usart2_ rx - tim1_ bkin ---- event out table 14.alternate functions for port a (continued) port & pin name af0 af1 af2 af3 af4 af5 af6 af7 af8 af9 af10 af11 af12 af14 af15 pinouts and pin description stm32f303xb stm32f303xc 44/143 docid023353 rev 9 table 15.alternate functions for port b port & pin name af0 af1 af2 af3 af4 af5 af6 af7 af8 af9 af10 af12 af15 pb0 - - tim3_ ch3 tsc_ g3_io2 tim8_ ch2n - tim1_ch2n - - - - - event out pb1 - - tim3_ ch4 tsc_ g3_io3 tim8_ ch3n - tim1_ch3n - comp4_ out - - - event out pb2 - - - tsc_ g3_io4 - - - - - - - - event out pb3 jtdo- traces wo tim2_ ch2 tim4_ etr tsc_ g5_io1 tim8_ ch1n spi1_ sck spi3_sck, i2s3_ck usart2_ tx - - tim3_ etr - event out pb4 njtrst tim16_ ch1 tim3_ ch1 tsc_ g5_io2 tim8_ ch2n spi1_ miso spi3_miso, i2s3ext_sd usart2_ rx - - tim17_ bkin - event out pb5 - tim16_ bkin tim3_ ch2 tim8_ ch3n i2c1_ smba spi1_ mosi spi3_mosi, i2s3_sd usart2_ ck - - tim17_ ch1 - event out pb6 - tim16_ ch1n tim4_ ch1 tsc_ g5_io3 i2c1_scl tim8_ch1 tim8_ etr usart1_ tx - - tim8_ bkin2 - event out pb7 - tim17_ ch1n tim4_ ch2 tsc_ g5_io4 i2c1_ sda tim8_ bkin - usart1_ rx - - tim3_ ch4 - event out pb8 - tim16_ ch1 tim4_ ch3 tsc_ sync i2c1_scl - - - comp1_ out can_rx tim8_ ch2 tim1_ bkin event out pb9 - tim17_ ch1 tim4_ ch4 i2c1_ sda - ir_out - comp2_ out can_tx tim8_ ch3 - event out pb10 - tim2_ ch3 - tsc_ sync - - - usart3_ tx - - - - event out pb11 - tim2_ ch4 - tsc_ g6_io1 - - - usart3_ rx - - - - event out pb12 - - - tsc_ g6_io2 i2c2_ smba spi2_nss, i2s2_ws tim1_ bkin usart3_ ck - - - - event out stm32f303xb stm32f303xc pinouts and pin description docid023353 rev 9 45/143 pb13 - - - tsc_ g6_io3 - spi2_sck, i2s2_ck tim1_ ch1n usart3_ cts - - - - event out pb14 - tim15_ ch1 - tsc_ g6_io4 - spi2_miso, i2s2ext_sd tim1_ ch2n usart3_ rts_de - - - - event out pb15 rtc_ refin tim15_ ch2 tim15_ ch1n - tim1_ ch3n spi2_mosi, i2s2_sd - - - - - - event out table 15.alternate functions for port b (continued) port & pin name af0 af1 af2 af3 af4 af5 af6 af7 af8 af9 af10 af12 af15 pinouts and pin description stm32f303xb stm32f303xc 46/143 docid023353 rev 9 table 16.alternate functions for port c port & pin name af1 af2 af3 af4 af5 af6 af7 pc0 eventout - - - - - - pc1 eventout - - - - - - pc2 eventout - comp7_out - - - - pc3 eventout - - - - tim1_bkin2 - pc4 eventout - - - - - usart1_tx pc5 eventout - tsc_g3_io1 - - - usart1_rx pc6 eventout tim3_ch1 - tim8_ch1 - i2s2_mck comp6_out pc7 eventout tim3_ch2 - tim8_ch2 - i2s3_mck comp5_out pc8 eventout tim3_ch3 - tim8_ch3 - - comp3_out pc9 eventout tim3_ch4 - tim8_ch4 i2s_ckin tim8_bkin2 - pc10 eventout - - tim8_ch1n uart4_tx spi3_sck, i2s3_ck usart3_tx pc11 eventout - - tim8_ch2n uart4_rx spi3_miso, i2s3ext_sd usart3_rx pc12 eventout - - tim8_ch3n uart5_tx spi3_mosi, i2s3_sd usart3_ck pc13 - - - tim1_ch1n - - - pc14 - - - - - - - pc15 - - - - - - - stm32f303xb stm32f303xc pinouts and pin description docid023353 rev 9 47/143 table 17.alternate functions for port d port & pin name af1 af2 af3 af4 af5 af6 af7 pd0 eventout - - - - - can_rx pd1 eventout - - tim8_ch4 - tim8_bkin2 can_tx pd2 eventout tim3_etr - tim8_bkin uart5_rx - - pd3 eventout tim2_ch1_etr - - - - usart2_cts pd4 eventout tim2_ch2 - - - - usart2_rts_de pd5 eventout - - - - - usart2_tx pd6 eventout tim2_ch4 - - - - usart2_rx pd7 eventout tim2_ch3 - - - - usart2_ck pd8 eventout - - - - - usart3_tx pd9 eventout - - - - - usart3_rx pd10 eventout - - - - - usart3_ck pd11 eventout - - - - - usart3_cts pd12 eventout tim4_ch1 tsc_g8_io1 - - - usart3_rts_de pd13 eventout tim4_ch2 tsc_g8_io2 - - - - pd14 eventout tim4_ch3 tsc_g8_io3 - - - - pd15 eventout tim4_ch4 tsc_g8_io4 - - spi2_nss - pinouts and pin description stm32f303xb stm32f303xc 48/143 docid023353 rev 9 table 18.alternate functions for port e port & pin name af0 af1 af2 af3 af4 af6 af7 pe0 - eventout tim4_etr - tim16_ch1 - usart1_tx pe1 - eventout - - tim17_ch1 - usart1_rx pe2 traceck eventout tim3_ch1 tsc_g7_io1 - - - pe3 traced0 eventout tim3_ch2 tsc_g7_io2 - - - pe4 traced1 eventout tim3_ch3 tsc_g7_io3 - - - pe5 traced2 eventout tim3_ch4 tsc_g7_io4 - - - pe6 traced3 eventout - - - - pe7 - eventout tim1_etr - - - - pe8 - eventout tim1_ch1n - - - - pe9 - eventout tim1_ch1 - - - - pe10 - eventout tim1_ch2n - - - - pe11 - eventout tim1_ch2 - - - - pe12 - eventout tim1_ch3n - - - - pe13 - eventout tim1_ch3 - - - - pe14 - eventout tim1_ch4 - - tim1_bkin2 - pe15 - eventout tim1_bkin - - - usart3_rx stm32f303xb stm32f303xc pinouts and pin description docid023353 rev 9 49/143 table 19.alternate functions for port f port & pin name af1 af2 af3 af4 af5 af6 af7 pf0 - - - i2c2_sda - tim1_ch3n - pf1 - - - i2c2_scl - - - pf2 eventout - - - - - - pf4 eventout comp1_out - - - - - pf6 eventout tim4_ch4 - i2c2_scl - - usart3_rts_de pf9 eventout - tim15_ch1 - spi2_sck - - pf10 eventout - tim15_ch2 - spi2_sck - - memory mapping stm32f303xb stm32f303xc 50/143 docid023353 rev 9 5 memory mapping figure 7.stm32f303xb/stm32f303xc memory map [ ) ) ) ) ) ) ) ) [ ( [ & [ $ [ [ [ [ [ & r u w h [ 0 z l w k ) 3 8 , q w h u q d o 3 h u l s k h u d o v 3 h u l s k h u d o v 6 5 $ 0 & 2 ' ( 2 s w l r q e \ w h v 6 \ v w h p p h p r u \ & & 0 5 $ 0 ) o d v k p h p r u \ ) o d v k v \ v w h p p h p r u \ r u 6 5 $ 0 g h s h q g l q j r q % 2 2 7 f r q i l j x u d w l r q $ + % $ + % $ 3 % $ 3 % [ [ [ [ ) ) [ [ & [ [ $ [ [ ) ) ) ) ) ) ) [ ) ) ) ) [ ) ) ) ' [ [ [ [ [ [ 5 h v h u y h g 0 6 y 9 $ + % [ ) ) 5 h v h u y h g 5 h v h u y h g 5 h v h u y h g 5 h v h u y h g 5 h v h u y h g 5 h v h u y h g 5 h v h u y h g docid023353 rev 9 51/143 stm32f303xb stm32f303xc memory mapping 52 table 20.stm32f303xb/stm32f303xc memory map, peripheral register boundary addresses bus boundary address size (bytes) peripheral ahb3 0x5000 0400 - 0x5000 07ff 1 k adc3 - adc4 0x5000 0000 - 0x5000 03ff 1 k adc1 - adc2 0x4800 1800 - 0x4fff ffff ~132 m reserved ahb2 0x4800 1400 - 0x4800 17ff 1 k gpiof 0x4800 1000 - 0x4800 13ff 1 k gpioe 0x4800 0c00 - 0x4800 0fff 1 k gpiod 0x4800 0800 - 0x4800 0bff 1 k gpioc 0x4800 0400 - 0x4800 07ff 1 k gpiob 0x4800 0000 - 0x4800 03ff 1 k gpioa 0x4002 4400 - 0x47ff ffff ~128 m reserved ahb1 0x4002 4000 - 0x4002 43ff 1 k tsc 0x4002 3400 - 0x4002 3fff 3 k reserved 0x4002 3000 - 0x4002 33ff 1 k crc 0x4002 2400 - 0x4002 2fff 3 k reserved 0x4002 2000 - 0x4002 23ff 1 k flash interface 0x4002 1400 - 0x4002 1fff 3 k reserved 0x4002 1000 - 0x4002 13ff 1 k rcc 0x4002 0800 - 0x4002 0fff 2 k reserved 0x4002 0400 - 0x4002 07ff 1 k dma2 0x4002 0000 - 0x4002 03ff 1 k dma1 0x4001 8000 - 0x4001 ffff 32 k reserved apb2 0x4001 4c00 - 0x4001 7fff 13 k reserved 0x4001 4800 - 0x4001 4bff 1 k tim17 0x4001 4400 - 0x4001 47ff 1 k tim16 0x4001 4000 - 0x4001 43ff 1 k tim15 0x4001 3c00 - 0x4001 3fff 1 k reserved 0x4001 3800 - 0x4001 3bff 1 k usart1 0x4001 3400 - 0x4001 37ff 1 k tim8 0x4001 3000 - 0x4001 33ff 1 k spi1 0x4001 2c00 - 0x4001 2fff 1 k tim1 0x4001 0800 - 0x4001 2bff 9 k reserved 0x4001 0400 - 0x4001 07ff 1 k exti 0x4001 0000 - 0x4001 03ff 1 k syscfg + comp + opamp memory mapping stm32f303xb stm32f303xc 52/143 docid023353 rev 9 0x4000 8000 - 0x4000 ffff 32 k reserved apb1 0x4000 7800 - 0x4000 7fff 2 k reserved 0x4000 7400 - 0x4000 77ff 1 k dac (dual) 0x4000 7000 - 0x4000 73ff 1 k pwr 0x4000 6800 - 0x4000 6fff 2 k reserved 0x4000 6400 - 0x4000 67ff 1 k bxcan 0x4000 6000 - 0x4000 63ff 1 k usb sram 512 bytes 0x4000 5c00 - 0x4000 5fff 1 k usb device fs 0x4000 5800 - 0x4000 5bff 1 k i2c2 0x4000 5400 - 0x4000 57ff 1 k i2c1 0x4000 5000 - 0x4000 53ff 1 k uart5 0x4000 4c00 - 0x4000 4fff 1 k uart4 0x4000 4800 - 0x4000 4bff 1 k usart3 0x4000 4400 - 0x4000 47ff 1 k usart2 0x4000 4000 - 0x4000 43ff 1 k i2s3ext 0x4000 3c00 - 0x4000 3fff 1 k spi3/i2s3 0x4000 3800 - 0x4000 3bff 1 k spi2/i2s2 0x4000 3400 - 0x4000 37ff 1 k i2s2ext 0x4000 3000 - 0x4000 33ff 1 k iwdg 0x4000 2c00 - 0x4000 2fff 1 k wwdg 0x4000 2800 - 0x4000 2bff 1 k rtc 0x4000 1800 - 0x4000 27ff 4 k reserved 0x4000 1400 - 0x4000 17ff 1 k tim7 0x4000 1000 - 0x4000 13ff 1 k tim6 0x4000 0c00 - 0x4000 0fff 1 k reserved 0x4000 0800 - 0x4000 0bff 1 k tim4 0x4000 0400 - 0x4000 07ff 1 k tim3 0x4000 0000 - 0x4000 03ff 1 k tim2 table 20.stm32f303xb/stm32f303xc memory map, peripheral register boundary addresses (continued) bus boundary address size (bytes) peripheral docid023353 rev 9 53/143 stm32f303xb stm32f303xc electrical characteristics 124 6 electrical characteristics 6.1 parameter conditions unless otherwise specified, all voltages are referenced to v ss . 6.1.1 minimum and maximum values unless otherwise specified, the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at t a = 25 c and t a = t a max (given by the selected temperature range). data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean3 ). 6.1.2 typical values unless otherwise specified, typical data are based on t a = 25 c, v dd = v dda = 3.3 v. they are given only as design guidelines and are not tested. typical adc accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean2 ) . 6.1.3 typical curves unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 6.1.4 loading capacitor the loading conditions used for pin parameter measurement are shown in figure 8 . 6.1.5 pin input voltage the input voltage measurement on a pin of the device is described in figure 9 . figure 8. pin loading conditions figure 9. pin input voltage - 3 6 & s ) - # 5 p i n - 3 6 - # 5 p i n 6 ) . electrical characteristics stm32f303xb stm32f303xc 54/143 docid023353 rev 9 6.1.6 power supply scheme figure 10. power supply scheme 1. dotted lines represent the internal connections on low pin count packages, joining the dedicated supply pins. caution: each power supply pair (v dd /v ss , v dda /v ssa etc..) must be decoupled with filtering ceramic capacitors as shown above. these capa citors must be placed as close as possible to, or below the appropriate pins on the underside of the pcb to ensure the good functionality of the device. 0 6 9 3 r z h u v z l w f k 9 % $ 7 * 3 , 2 v 2 8 7 , 1 . h u q h o o r j l f & 3 8 ' l j l w d o 0 h p r u l h v % d f n x s f l u f x l w u \ / 6 ( 5 7 & % d f n x s u h j l v w h u v : d n h x s o r j l f q ) ? ? ) 9 5 h j x o d w r u 9 ' ' $ 9 6 6 $ $ ' & ' $ & / h y h o v k l i w h u , 2 / r j l f 9 ' ' q ) ? ) 9 ' ' $ 9 5 ( ) 9 5 ( ) 9 ' ' 9 6 6 ? ? 9 5 ( ) q ) ? ) ? ! n a l o g 2 # s 0 , , c o m p a r a t o r s / 0 ! - 0 docid023353 rev 9 55/143 stm32f303xb stm32f303xc electrical characteristics 124 6.1.7 current consumption measurement figure 11. current consumption measurement scheme - 3 6 6 " ! 4 6 $ $ 6 $ $ ! ) $ $ ? 6 " ! 4 ) $ $ ) $ $ ! electrical characteristics stm32f303xb stm32f303xc 56/143 docid023353 rev 9 6.2 absolute maximum ratings stresses above the absolute maximum ratings listed in table 21: voltage characteristics , table 22: current characteristics , and table 23: thermal characteristics may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these conditions is not implied. exposure to maximum rating conditions for extended periods may af fect device reliability. table 21. voltage characteristics (1) symbol ratings min max unit v dd ?v ss external main supply voltage (including v dda, v bat and v dd ) -0.3 4.0 v v dd ?v dda allowed voltage difference for v dd > v dda -0.4 v ref+ ?v dda (2) allowed voltage difference for v ref+ > v dda -0.4 v in (3) input voltage on ft and ftf pins v ss ? 0.3 v dd + 4.0 input voltage on tta pins v ss ? 0.3 4.0 input voltage on any other pin v ss ? 0.3 4.0 input voltage on boot0 pin 0 9 | v ddx | variations between different v dd power pins - 50 mv |v ssx ? v ss | variations between all the different ground pins - 50 v esd(hbm) electrostatic discharge voltage (human body model) see section 6.3.12: electrical sensitivity characteristics - 1. all main power (v dd , v dda ) and ground (v ss , v ssa ) pins must always be connected to the external power supply, in the permitted range. the following relationship must be respected between v dda and v dd : v dda must power on before or at the same time as v dd in the power up sequence. v dda must be greater than or equal to v dd . 2. v ref+ must be always lower or equal than v dda (v ref+ v dda) . if unused then it must be connected to v dda . 3. v in maximum must always be respected. refer to table 22: current characteristics for the maximum allowed injected current values. docid023353 rev 9 57/143 stm32f303xb stm32f303xc electrical characteristics 124 table 22. current characteristics symbol ratings max. unit i vdd total current into sum of all vdd_x power lines (source) 160 ma i vss total current out of sum of all vss_x ground lines (sink) ? 160 i vdd maximum current into each v dd_x power line (source) (1) 100 i vss maximum current out of each v ss _x ground line (sink) (1) ? 100 i io(pin) output current sunk by any i/o and control pin 25 output current source by any i/o and control pin ? 25 i io(pin) total output current sunk by sum of all ios and control pins (2) 80 total output current sourced by sum of all ios and control pins (2) ? 80 i inj(pin) injected current on ft, ftf and b pins (3) -5/+0 injected current on tc and rst pin (4) 5 injected current on tta pins (5) 5 i inj(pin) total injected current (sum of all i/o and control pins) (6) 25 1. all main power (v dd , v dda ) and ground (v ss and v ssa ) pins must always be connected to the external power supply, in the permitted range. 2. this current consumption must be correctly distributed over all i/os and control pins.the total output current must not be sunk/sourced between two c onsecutive power supply pins referrin g to high pin count lqfp packages. 3. positive injection is not possible on these i/os and does not occur for input voltages lower than the specified maximum value. 4. a positive injection is induced by v in > v dd while a negative injection is induced by v in < v ss . i inj(pin) must never be exceeded. refer to table 21: voltage characteristics for the maximum allowed input voltage values. 5. a positive injection is induced by v in > v dda while a negative injection is induced by v in < v ss . i inj (pin) must never be exceeded. refer also to table 21: voltage characteristics for the maximum allowed input voltage values. negative injection disturbs the analog performance of the device. see note (2) below table 70 . 6. when several inputs are submitted to a current injection, the maximum i inj(pin) is the absolute sum of the positive and negative injected currents (instantaneous values). table 23. thermal characteristics symbol ratings value unit t stg storage temperature range ?65 to +150 c t j maximum junction temperature 150 c electrical characteristics stm32f303xb stm32f303xc 58/143 docid023353 rev 9 6.3 operating conditions 6.3.1 general operating conditions table 24. general operating conditions symbol parameter conditions min max unit f hclk internal ahb clock frequency - 0 72 mhz f pclk1 internal apb1 clock frequency - 0 36 f pclk2 internal apb2 clock frequency - 0 72 v dd standard operating voltage - 2 3.6 v v dda analog operating voltage (opamp and dac not used) must have a potential equal to or higher than v dd 23.6 v analog operating voltage (opamp and dac used) 2.4 3.6 v bat backup operating voltage - 1.65 3.6 v v in i/o input voltage tc i/o ?0.3 v dd +0.3 v tta i/o ?0.3 v dda +0.3 ft and ftf i/o (1) 1. to sustain a voltage higher than v dd +0.3 v, the internal pull-up/pull-down resistors must be disabled. ?0.3 5.5 boot0 0 5.5 p d power dissipation at t a = 85 c for suffix 6 or t a = 105 c for suffix 7 (2) 2. if t a is lower, higher p d values are allowed as long as t j does not exceed t jmax (see section 7.2: thermal characteristics ). lqfp100 - 488 mw lqfp64 - 444 lqfp48 - 364 t a ambient temperature for 6 suffix version maximum power dissipation ?40 85 c low power dissipation (3) 3. in low power dissipation state, t a can be extended to this range as long as t j does not exceed t jmax (see section 7.2: thermal characteristics ). ?40 105 ambient temperature for 7 suffix version maximum power dissipation ?40 105 c low power dissipation (3) ?40 125 t j junction temperature range 6 suffix version ?40 105 c 7 suffix version ?40 125 docid023353 rev 9 59/143 stm32f303xb stm32f303xc electrical characteristics 124 6.3.2 operating conditions at power-up / power-down the parameters given in table 25 are derived from tests performed under the ambient temperature condition summarized in table 24 . 6.3.3 embedded reset and power control block characteristics the parameters given in table 26 are derived from tests performed under ambient temperature and v dd supply voltage conditions summarized in table 24 . table 25. operating conditions at power-up / power-down symbol parameter conditions min max unit t vdd v dd rise time rate - 0 s/v v dd fall time rate 20 t vdda v dda rise time rate - 0 v dda fall time rate 20 table 26. embedded reset and power control block characteristics symbol parameter conditions min typ max unit v por/pdr (1) 1. the pdr detector monitors v dd and also v dda (if kept enabled in the option bytes). the por detector monitors only v dd . power on/power down reset threshold falling edge 1.8 (2) 2. the product behavior is guaranteed by design down to the minimum v por/pdr value. 1.88 1.96 v rising edge 1.84 1.92 2.0 v v pdrhyst (1) pdr hysteresis - - 40 - mv t rsttempo (3) 3. guaranteed by design, not tested in production. por reset temporization - 1.5 2.5 4.5 ms electrical characteristics stm32f303xb stm32f303xc 60/143 docid023353 rev 9 table 27. programmable voltage detector characteristics symbol parameter conditions min (1) 1. data based on characterization results only, not tested in production. typ max (1) unit v pvd0 pvd threshold 0 rising edge 2.1 2.18 2.26 v falling edge 2 2.08 2.16 v pvd1 pvd threshold 1 rising edge 2.19 2.28 2.37 falling edge 2.09 2.18 2.27 v pvd2 pvd threshold 2 rising edge 2.28 2.38 2.48 falling edge 2.18 2.28 2.38 v pvd3 pvd threshold 3 rising edge 2.38 2.48 2.58 falling edge 2.28 2.38 2.48 v pvd4 pvd threshold 4 rising edge 2.47 2.58 2.69 falling edge 2.37 2.48 2.59 v pvd5 pvd threshold 5 rising edge 2.57 2.68 2.79 falling edge 2.47 2.58 2.69 v pvd6 pvd threshold 6 rising edge 2.66 2.78 2.9 falling edge 2.56 2.68 2.8 v pvd7 pvd threshold 7 rising edge 2.76 2.88 3 falling edge 2.66 2.78 2.9 v pvdhyst (2) 2. guaranteed by design, not tested in production. pvd hysteresis - - 100 - mv idd(pvd) pvd current consumption - - 0.15 0.26 a docid023353 rev 9 61/143 stm32f303xb stm32f303xc electrical characteristics 124 6.3.4 embedded reference voltage the parameters given in table 28 are derived from tests performed under ambient temperature and v dd supply voltage conditions summarized in table 24 . 6.3.5 supply current characteristics the current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, i/o pi n loading, device software configuration, operating frequencies, i/o pin switching rate, program location in memory and executed binary code. the current consumption is measured as described in figure 11: current consumption measurement scheme . all run-mode current consumption measurements given in this section are performed with a reduced code that gives a consumption equivalent to coremark code. typical and maximum current consumption the mcu is placed under the following conditions: ? all i/o pins are in input mode with a static value at v dd or v ss (no load) ? all peripherals are disabled ex cept when explicitly mentioned ? the flash memory access time is adjusted to the f hclk frequency (0 wait state from 0 to 24 mhz,1 wait state from 24 to 48 mhz and 2 wait states from 48 to 72 mhz) ? prefetch in on (reminder: this bit must be set before clock setting and bus prescaling) ? when the peripherals are enabled f pclk2 = f hclk and f pclk1 = f hclk/2 ? when f hclk > 8 mhz, the pll is on and the pll input is equal to hsi/2 (4 mhz) or hse (8 mhz) in bypass mode. table 28. embedded internal reference voltage symbol parameter conditions min typ max unit v refint internal reference voltage ?40 c < t a < +105 c 1.16 1.2 1.25 v ?40 c < t a < +85 c 1.16 1.2 1.24 (1) 1. data based on characterization results, not tested in production. v t s_vrefint adc sampling time when reading the internal reference voltage -2.2--s v rerint internal reference voltage spread over the temperature range v dd = 3 v 10 mv - - 10 (2) 2. guaranteed by design, not tested in production. mv t coeff temperature coefficient - - - 100 (2) ppm/c table 29. internal reference voltage calibration values calibration value name description memory address v refint_cal raw data acquired at temperature of 30 c v dda = 3.3 v 0x1fff f7ba - 0x1fff f7bb electrical characteristics stm32f303xb stm32f303xc 62/143 docid023353 rev 9 the parameters given in table 30 to table 34 are derived from tests performed under ambient temperature and supply voltage conditions summarized in table 24 . table 30. typical and maximum current consumption from v dd supply at v dd = 3.6v symbol parameter conditions f hclk all peripherals enabled all peripherals disabled unit typ max @ t a (1) typ max @ t a (1) 25 c 85 c 105 c 25 c 85 c 105 c i dd supply current in run mode, executing from flash external clock (hse bypass) 72 mhz 61.2 65.8 67.6 68.5 27.8 30.3 30.7 31.5 ma 64 mhz 54.7 59.1 60.2 61.1 24.6 27.2 27.6 28.3 48 mhz 41.7 45.1 46.2 47.2 19.2 21.1 21.4 21.8 32 mhz 28.1 31.5 32.5 32.7 12.9 14.6 14.8 15.3 24 mhz 21.4 23.7 24.4 25.2 10.0 11.4 11.4 12.1 8 mhz 7.4 8.4 8.6 9.4 3.6 4.1 4.4 5.0 1 mhz 1.3 1.6 1.8 2.6 0.8 1.0 1.2 2.1 internal clock (hsi) 64 mhz 49.7 54.4 55.4 56.3 24.5 27.2 27.4 28.1 48 mhz 37.9 42.2 43.0 43.5 18.9 21.4 21.5 21.6 32 mhz 25.8 29.2 29.2 30.0 12.7 14.2 14.6 15.2 24 mhz 19.7 22.3 22.6 23.2 6.7 7.7 7.9 8.5 8 mhz 6.9 7.8 8.3 8.8 3.5 4.0 4.4 5.0 supply current in run mode, executing from ram external clock (hse bypass) 72 mhz 60.8 66.2 (2) 69.7 70.4 (2) 27.4 31.7 (2) 32.2 32.5 (2) 64 mhz 54.3 59.1 62.2 63.3 24.3 28.3 28.7 28.8 48 mhz 41.0 45.6 47.3 47.9 18.3 21.6 21.9 22.1 32 mhz 27.6 32.4 32.4 32.9 12.3 15.0 15.2 15.4 24 mhz 20.8 23.9 24.3 25.0 9.3 11.3 11.4 12.0 8 mhz 6.9 7.8 8.7 9.0 3.1 3.7 4.2 4.9 1 mhz 0.9 1.2 1.5 2.3 0.4 0.6 1.0 1.8 internal clock (hsi) 64 mhz 49.2 53.9 55.2 57.4 23.9 27.8 28.2 28.4 48 mhz 37.3 40.8 41.4 44.1 18.2 21.0 21.6 21.9 32 mhz 25.1 27.6 29.1 30.1 12.0 14.0 14.5 15.1 24 mhz 19.0 21.6 22.1 22.9 6.3 7.2 7.7 8.1 8 mhz 6.4 7.3 7.9 8.4 3.0 3.5 4.0 4.7 docid023353 rev 9 63/143 stm32f303xb stm32f303xc electrical characteristics 124 i dd supply current in sleep mode, executing from flash or ram external clock (hse bypass) 72 mhz 44.0 48.4 49.4 50.5 6.6 7.5 7.9 8.7 ma 64 mhz 39.2 43.3 44.0 45.2 6.0 6.8 7.2 7.9 48 mhz 29.6 32.7 33.3 34.3 4.5 5.2 5.6 6.3 32 mhz 19.7 23.3 23.3 23.5 3.1 3.5 4.0 4.8 24 mhz 14.9 17.6 17.8 18.3 2.4 2.8 3.3 3.9 8 mhz 4.9 5.7 6.1 6.9 0.8 1.0 1.4 2.2 1 mhz 0.6 0.9 1.2 2.1 0.1 0.3 0.6 1.5 internal clock (hsi) 64 mhz 34.2 38.1 39.2 40.3 5.7 6.3 6.8 7.5 48 mhz 25.8 28.7 29.6 30.3 4.3 4.8 5.2 5.9 32 mhz 17.4 19.4 19.9 20.7 2.9 3.2 3.7 4.5 24 mhz 13.2 15.1 15.6 15.9 1.5 1.8 2.2 2.9 8 mhz 4.5 5.0 5.6 6.2 0.7 0.9 1.2 2.1 1. data based on characterization results, not tested in production unless otherwise specified. 2. data based on characterization results and test ed in production with code executing from ram. table 30. typical and maximum current consumption from v dd supply at v dd = 3.6v (continued) symbol parameter conditions f hclk all peripherals enabled all peripherals disabled unit typ max @ t a (1) typ max @ t a (1) 25 c 85 c 105 c 25 c 85 c 105 c table 31. typical and maximum current consumption from the v dda supply symbol parameter conditions (1) f hclk v dda = 2.4 v v dda = 3.6 v unit typ max @ t a (2) typ max @ t a (2) 25 c 85 c 105 c 25 c 85 c 105 c i dda supply current in run/sleep mode, code executing from flash or ram hse bypass 72 mhz 225 276 289 297 245 302 319 329 a 64 mhz 198 249 261 268 216 270 284 293 48 mhz 149 195 204 211 159 209 222 230 32 mhz 102 145 152 157 110 154 162 169 24 mhz 80 119 124 128 86 126 131 135 8 mhz 2 3 4 6 3 4 5 9 1 mhz 2 3 5 7 3 4 6 9 hsi clock 64 mhz 270 323 337 344 299 354 371 381 48 mhz 220 269 280 286 244 293 309 318 32 mhz 173 218 228 233 193 239 251 257 24 mhz 151 194 200 204 169 211 219 225 8 mhz 73 97 99 103 88 105 110 116 1. current consumption from the v dda supply is independent of whether the peripherals are on or off. furthermore when the pll is off, i dda is independent from the frequency. 2. data based on characterization results, not tested in production. electrical characteristics stm32f303xb stm32f303xc 64/143 docid023353 rev 9 table 32. typical and maximum v dd consumption in stop and standby modes symbol parameter conditions typ @v dd (v dd =v dda )max (1) unit 2.0 v 2.4 v 2.7 v 3.0 v 3.3 v 3.6 v t a = 25 c t a = 85 c t a = 105 c i dd supply current in stop mode regulator in run mode, all oscillators off 20.05 20.33 20.42 20.50 20.67 20.80 44.2 (2) 350 735 (2) a regulator in low-power mode, all oscillators off 7.63 7.77 7.90 8.07 8.17 8.33 30.6 (2) 335 720 (2) supply current in standby mode lsi on and iwdg on 0.80 0.96 1.09 1.23 1.37 1.51 - - - lsi off and iwdg off 0.60 0.74 0.83 0.93 1.02 1.11 5.0 (2) 7.8 13.3 (2) 1. data based on characterization results, not te sted in production unless otherwise specified. 2. data based on characterization re sults and tested in production. table 33. typical and maximum v dda consumption in stop and standby modes symbol parameter conditions typ @v dd (v dd = v dda )max (1) unit 2.0 v 2.4 v 2.7 v 3.0 v 3.3 v 3.6 v t a = 25 c t a = 85 c t a = 105 c i dda supply current in stop mode v dda monitoring on regulator in run mode, all oscillators off 1.81 1.95 2.07 2.20 2. 35 2.52 3.7 5.5 8.8 a regulator in low-power mode, all oscillators off 1.81 1.95 2.07 2.20 2. 35 2.52 3.7 5.5 8.8 supply current in standby mode lsi on and iwdg on 2.22 2.42 2.59 2.78 3.0 3.24 - - - lsi off and iwdg off 1.69 1.82 1.94 2.08 2. 23 2.40 3.5 5.4 9.2 supply current in stop mode v dda monitoring off regulator in run mode, all oscillators off 1.05 1.08 1.10 1.15 1.22 1.29 - - - regulator in low-power mode, all oscillators off 1.05 1.08 1.10 1.15 1.22 1.29 - - - supply current in standby mode lsi on and iwdg on 1.44 1.52 1.60 1.71 1.84 1.98 - - - lsi off and iwdg off 0.93 0.95 0.98 1.02 1.08 1.15 - - - 1. data based on characterization results, not tested in production. note: the total consumption is the sum of idd and idda. docid023353 rev 9 65/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 12. typical v bat current consumption (lse and rtc on/lsedrv[1:0] = ?00?) table 34. typical and maximum current consumption from v bat supply symbol para meter conditions (1) typ @v bat max @v bat = 3.6 v (2) unit 1.65v 1.8v 2v 2.4v 2.7v 3v 3.3v 3.6v t a = 25c t a = 85c t a = 105c i dd_vbat backup domain supply current lse & rtc on; "xtal mode" lower driving capability; lsedrv[1: 0] = '00' 0.48 0.50 0.52 0.58 0.65 0. 72 0.80 0.90 1.1 1.5 2.0 a lse & rtc on; "xtal mode" higher driving capability; lsedrv[1: 0] = '11' 0.83 0.86 0.90 0.98 1.03 1. 10 1.20 1.30 1.5 2.2 2.9 1. crystal used: abracon abs07-120-32.768 khz-t with a cl of 6 pf for typical values. 2. data based on characterization re sults, not tested in production. ? # ? # ? # ? # 6 6 6 6 6 6 6 6 4 ! ? # ? ! ) 6 " ! 4 - 3 6 electrical characteristics stm32f303xb stm32f303xc 66/143 docid023353 rev 9 typical current consumption the mcu is placed under the following conditions: ? v dd = v dda = 3.3 v ? all i/o pins available on each packag e are in analog input configuration ? the flash access time is adjusted to f hclk frequency (0 wait states from 0 to 24 mhz, 1 wait state from 24 to 48 mhz and 2 wait states from 48 mhz to 72 mhz), and flash prefetch is on ? when the peripherals are enabled, f apb1 = f ahb/2 , f apb2 = f ahb ? pll is used for frequencies greater than 8 mhz ? ahb prescaler of 2, 4, 8,16 and 64 is used for the frequencies 4 mhz, 2 mhz, 1 mhz, 500 khz and 125 khz respectively. table 35. typical current consumption in run m ode, code with data processing running from flash symbol parameter conditions f hclk typ unit peripherals enabled peripherals disabled i dd supply current in run mode from v dd supply running from hse crystal clock 8 mhz, code executing from flash 72 mhz 61.3 28.0 ma 64 mhz 54.8 25.4 48 mhz 41.9 19.3 32 mhz 28.5 13.3 24 mhz 21.8 10.4 16 mhz 14.9 7.2 8 mhz 7.7 3.9 4 mhz 4.5 2.5 2 mhz 2.8 1.7 1 mhz 1.9 1.3 500 khz 1.4 1.1 125 khz 1.1 0.9 i dda (1) (2) supply current in run mode from v dda supply 72 mhz 240.3 239.5 a 64 mhz 210.9 210.3 48 mhz 155.8 155.6 32 mhz 105.7 105.6 24 mhz 82.1 82.0 16 mhz 58.8 58.8 8 mhz 2.4 2.4 4 mhz 2.4 2.4 2 mhz 2.4 2.4 1 mhz 2.4 2.4 500 khz 2.4 2.4 125 khz 2.4 2.4 1. v dda monitoring is on. 2. when peripherals are enabled, the power consumption of the anal og part of peripherals such as adc, dac, comparators, opamp etc. is not included. refer to the tables of characteristics in the subsequent sections. docid023353 rev 9 67/143 stm32f303xb stm32f303xc electrical characteristics 124 table 36. typical current consumption in sleep mode, code running from flash or ram symbol parameter conditions f hclk typ unit peripherals enabled peripherals disabled i dd supply current in sleep mode from v dd supply running from hse crystal clock 8 mhz, code executing from flash or ram 72 mhz 44.1 7.0 ma 64 mhz 39.7 6.3 48 mhz 30.3 4.9 32 mhz 20.5 3.5 24 mhz 15.4 2.8 16 mhz 10.6 2.0 8 mhz 5.4 1.1 4 mhz 3.2 1.0 2 mhz 2.1 0.9 1 mhz 1.5 0.8 500 khz 1.2 0.8 125 khz 1.0 0.8 i dda (1) (2) supply current in sleep mode from v dda supply 72 mhz 239.7 238.5 a 64 mhz 210.5 209.6 48 mhz 155.0 155.6 32 mhz 105.3 105.2 24 mhz 81.9 81.8 16 mhz 58.7 58.6 8 mhz 2.4 2.4 4 mhz 2.4 2.4 2 mhz 2.4 2.4 1 mhz 2.4 2.4 500 khz 2.4 2.4 125 khz 2.4 2.4 1. v dda monitoring is on. 2. when peripherals are enabled, the power consumption of the anal og part of peripherals such as adc, dac, comparators, opamp etc. is not included. refer to the tables of characteristics in the subsequent sections. electrical characteristics stm32f303xb stm32f303xc 68/143 docid023353 rev 9 i/o system current consumption the current consumption of the i/o system has two components: static and dynamic. i/o static current consumption all the i/os used as inputs with pull-up ge nerate current consumpt ion when the pin is externally held low. the value of this current consumption can be simply computed by using the pull-up/pull-down resi stors values given in table 54: i/o static characteristics . for the output pins, any external pull-down or external load must also be considered to estimate the current consumption. additional i/o current consumption is due to i/os configured as inputs if an intermediate voltage level is externally applie d. this current consumption is caused by the input schmitt trigger circuits used to discriminate the input va lue. unless this spec ific configuration is required by the application, this supply curr ent consumption can be avoided by configuring these i/os in analog mode. this is notably the case of adc input pins which should be configured as analog inputs. caution: any floating input pin can also settle to an in termediate voltage level or switch inadvertently, as a result of external electromagnetic nois e. to avoid current consumption related to floating pins, they must either be configured in analog mode, or forced internally to a definite digital value. this can be done either by usin g pull-up/down resistors or by configuring the pins in output mode. i/o dynamic current consumption in addition to the internal peripheral current consumption (see table 38: peripheral current consumption ), the i/os used by an application also contribute to the current consumption. when an i/o pin switches, it uses the current from the mcu supply voltage to supply the i/o pin circuitry and to charge/discharge the capaci tive load (internal or external) connected to the pin: where i sw is the current sunk by a switching i/ o to charge/discharge the capacitive load v dd is the mcu supply voltage f sw is the i/o switching frequency c is the total capacitance seen by the i/o pin: c = c int + c ext +c s the test pin is configured in push-pull output mode and is toggled by software at a fixed frequency. i sw v dd f sw c = docid023353 rev 9 69/143 stm32f303xb stm32f303xc electrical characteristics 124 table 37. switching output i/o current consumption symbol parameter conditions (1) 1. cs = 5 pf (estimated value). i/o toggling frequency (f sw ) typ unit i sw i/o current consumption v dd = 3.3 v c ext = 0 pf c = c int + c ext + c s 2 mhz 0.90 ma 4 mhz 0.93 8 mhz 1.16 18 mhz 1.60 36 mhz 2.51 48 mhz 2.97 v dd = 3.3 v c ext = 10 pf c = c int + c ext +c s 2 mhz 0.93 4 mhz 1.06 8 mhz 1.47 18 mhz 2.26 36 mhz 3.39 48 mhz 5.99 v dd = 3.3 v c ext = 22 pf c = c int + c ext +c s 2 mhz 1.03 4 mhz 1.30 8 mhz 1.79 18 mhz 3.01 36 mhz 5.99 v dd = 3.3 v c ext = 33 pf c = c int + c ext + c s 2 mhz 1.10 4 mhz 1.31 8 mhz 2.06 18 mhz 3.47 36 mhz 8.35 v dd = 3.3 v c ext = 47 pf c = c int + c ext + c s 2 mhz 1.20 4 mhz 1.54 8 mhz 2.46 18 mhz 4.51 36 mhz 9.98 electrical characteristics stm32f303xb stm32f303xc 70/143 docid023353 rev 9 on-chip peripheral current consumption the mcu is placed under the following conditions: ? all i/o pins are in analog input configuration ? all peripherals are disabled unless otherwise mentioned ? the given value is calculated by measuring the current consumption ? with all peripherals clocked off ? with only one peripheral clocked on ? ambient operating temperature at 25c and v dd = v dda = 3.3 v. table 38. peripheral current consumption peripheral typical consumption (1) unit i dd busmatrix (2) 12.6 a/mhz dma1 7.6 dma2 6.1 crc 2.1 gpioa 10.0 gpiob 10.3 gpioc 2.2 gpiod 8.8 gpioe 3.3 gpiof 3.0 tsc 5.5 adc1&2 17.3 adc3&4 18.8 apb2-bridge (3) 3.6 syscfg 7.3 tim1 40.0 spi1 8.8 tim8 36.4 usart1 23.3 tim15 17.1 tim16 10.1 tim17 11.0 apb1-bridge (3) 6.1 tim2 49.1 tim3 38.8 tim4 38.3 docid023353 rev 9 71/143 stm32f303xb stm32f303xc electrical characteristics 124 tim6 9.7 a/mhz tim7 12.1 wwdg 6.4 spi2 40.4 spi3 40.0 usart2 41.9 usart3 40.2 uart4 36.5 uart5 30.8 i2c1 10.5 i2c2 10.4 usb 26.2 can 33.4 pwr 5.7 dac 15.4 1. the power consumption of the analog part (i dda ) of peripherals such as adc, dac, comparators, opamp etc. is not included. refer to the tables of characteristics in the subsequent sections. 2. busmatrix is automatically active when at least one master is on (cpu, dma1 or dma2). 3. the apbx bridge is automatically active when at least one peripheral is on on the same bus. table 38. peripheral current consumption (continued) peripheral typical consumption (1) unit i dd electrical characteristics stm32f303xb stm32f303xc 72/143 docid023353 rev 9 6.3.6 wakeup time from low-power mode the wakeup times given in table 39 are measured starting from the wakeup event trigger up to the first instruction executed by the cpu: ? for stop or sleep mode: the wakeup event is wfe. ? wkup1 (pa0) pin is used to wakeup from standby, stop and sleep modes. all timings are derived from tests performed under ambient temperature and v dd supply voltage conditions summarized in table 24 . table 39. low-power mode wakeup timings symbol parameter conditions typ @v dd, v dd = v dda max unit 2.0 v 2.4 v 2.7 v 3 v 3.3 v 3.6 v t wustop wakeup from stop mode regulator in run mode 4.1 3.9 3.8 3.7 3.6 3.5 4.5 s regulator in low power mode 7.9 6.7 6.1 5.7 5.4 5.2 9 t wustandby (1) wakeup from standby mode lsi and iwdg off 69.2 60.3 56.4 53.7 51.7 50 100 t wusleep wakeup from sleep mode -6- cpu clock cycles 1. data based on characterization re sults, not tested in production. docid023353 rev 9 73/143 stm32f303xb stm32f303xc electrical characteristics 124 6.3.7 external clock source characteristics high-speed external user clock generated from an external source in bypass mode the hse oscillato r is switched off and the inpu t pin is a standard gpio. the external clock signal has to re spect the i/o characteristics in section 6.3.14 . however, the recommended clock input waveform is shown in figure 13 . figure 13. high-speed external clock source ac timing diagram table 40. high-speed external user clock characteristics symbol parameter condi tions min typ max unit f hse_ext user external clock source frequency (1) 1. guaranteed by design, not tested in production. - 1832mhz v hseh osc_in input pin high level voltage 0.7v dd -v dd v v hsel osc_in input pin low level voltage v ss -0.3v dd t w(hseh) t w(hsel) osc_in high or low time (1) 15 - - ns t r(hse) t f(hse) osc_in rise or fall time (1) --20 - 3 6 6 ( 3 % ( t f ( 3 % 4 ( 3 % t t r ( 3 % 6 ( 3 % , t 7 ( 3 % ( t 7 ( 3 % , electrical characteristics stm32f303xb stm32f303xc 74/143 docid023353 rev 9 low-speed external user clock generated from an external source in bypass mode the lse oscillator is switched off and the input pin is a standard gpio. the external clock signal has to re spect the i/o characteristics in section 6.3.14 . however, the recommended clock input waveform is shown in figure 14 figure 14. low-speed external clock source ac timing diagram table 41. low-speed external user clock characteristics symbol parameter conditions min typ max unit f lse_ext user external clock source frequency (1) 1. guaranteed by design, not tested in production. - - 32.768 1000 khz v lseh osc32_in input pin high level voltage 0.7v dd -v dd v v lsel osc32_in input pin low level voltage v ss -0.3v dd t w(lseh) t w(lsel) osc32_in high or low time (1) 450 - - ns t r(lse) t f(lse) osc32_in rise or fall time (1) --50 - 3 6 6 , 3 % ( t f , 3 % 4 , 3 % t t r , 3 % 6 , 3 % , t 7 , 3 % ( t 7 , 3 % , docid023353 rev 9 75/143 stm32f303xb stm32f303xc electrical characteristics 124 high-speed external clock generated from a crystal/ceramic resonator the high-speed external (hse) clock can be supplied with a 4 to 32 mhz crystal/ceramic resonator oscillator. all the information given in this pa ragraph are bas ed on design simulation results obtained with typical external components specified in table 42 . in the application, the resonator and the load capacito rs have to be placed as close as possible to the oscillator pins in order to minimize outpu t distortion and startup stabilization time. refer to the crystal resonator manufacturer for more details on the resonator characteristics (frequency, pack age, accuracy). table 42. hse oscilla tor characteristics symbol parameter conditions (1) 1. resonator characteristics given by the crystal/ceramic resonator manufacturer. min (2) 2. guaranteed by design, not tested in production. typ max (2) unit f osc_in oscillator frequency - 4 8 32 mhz r f feedback resistor - - 200 k i dd hse current consumption during startup (3) 3. this consumption level occurs during the first 2/3 of the t su(hse) startup time. --8.5 ma v dd =3.3 v, rm= 30 , cl=10 pf@8 mhz -0.4- v dd =3.3 v, rm= 45 , cl=10 pf@8 mhz -0.5- v dd =3.3 v, rm= 30 , cl=10 pf@32 mhz -0.8- v dd =3.3 v, rm= 30 , cl=10 pf@32 mhz -1- v dd =3.3 v, rm= 30 , cl=10 pf@32 mhz -1.5- g m oscillator transconductance startup 10 - - ma/v t su(hse) (4) 4. t su(hse) is the startup time measured from the moment it is enabled (by software) to a stabilized 8 mhz oscillation is reached. this value is measured for a standard crystal res onator and it can vary significantly with the crystal manufacturer. startup time v dd is stabilized - 2 - ms electrical characteristics stm32f303xb stm32f303xc 76/143 docid023353 rev 9 for c l1 and c l2 , it is recommended to use high-quality external ceramic capacitors in the 5 pf to 25 pf range (typ.), designed for high-freque ncy applications, and selected to match the requirements of the crystal or resonator (see figure 15 ). c l1 and c l2 are usually the same size. the crystal manufacturer typically specifies a load capacitance which is the series combination of c l1 and c l2 . pcb and mcu pin capacitance must be included (10 pf can be used as a rough estimate of the comb ined pin and board capacitance) when sizing c l1 and c l2 . note: for information on selecting the crystal, refer to the application note an2867 ?oscillator design guide for st microcontrollers? available from the st website www.st.com . figure 15. typical application with an 8 mhz crystal 1. r ext value depends on the cr ystal characteristics. - 3 6 / 3 # ? / 5 4 / 3 # ? ) . f ( 3 % # , 2 & - ( z r e s o n a t o r 2 % 8 4 # , 2 e s o n a t o r w i t h i n t e g r a t e d c a p a c i t o r s " i a s c o n t r o l l e d g a i n docid023353 rev 9 77/143 stm32f303xb stm32f303xc electrical characteristics 124 low-speed external clock generated from a crystal/ceramic resonator the low-speed external (lse) clock can be supplied with a 32.768 khz crystal/ceramic resonator oscillator. all the information given in this pa ragraph are bas ed on design simulation results obtained with typical external components specified in table 43 . in the application, the resonator and the load capacito rs have to be placed as close as possible to the oscillator pins in order to minimize outpu t distortion and startup stabilization time. refer to the crystal resonator manufacturer for more details on the resonator characteristics (frequency, pack age, accuracy). note: for information on selecting the crystal, refer to the application note an2867 ?oscillator design guide for st microcontrollers? available from the st website www.st.com . table 43. lse oscillator characteristics (f lse = 32.768 khz) symbol parameter conditions (1) min (2) typ max (2) unit i dd lse current consumption lsedrv[1:0]=00 lower driving capability -0.50.9 a lsedrv[1:0]=01 medium low driving capability --1 lsedrv[1:0]=10 medium high driving capability --1.3 lsedrv[1:0]=11 higher driving capability --1.6 g m oscillator transconductance lsedrv[1:0]=00 lower driving capability 5- - a/v lsedrv[1:0]=01 medium low driving capability 8- - lsedrv[1:0]=10 medium high driving capability 15 - - lsedrv[1:0]=11 higher driving capability 25 - - t su(lse) (3) startup time v dd is stabilized - 2 - s 1. refer to the note and caution paragraphs below the table, and to the application note an2867 ?oscillator design guide for st microcontrollers?. 2. guaranteed by design, not tested in production. 3. t su(lse) is the startup time measured from the moment it is ena bled (by software) to a stabili zed 32.768 khz oscillation is reached. this value is measured for a standard crystal and it can vary significantly with the crystal manufacturer. electrical characteristics stm32f303xb stm32f303xc 78/143 docid023353 rev 9 figure 16. typical applicati on with a 32.768 khz crystal note: an external resistor is not required between osc32_in and osc32_out and it is forbidden to add one. - 3 6 / 3 # ? / 5 4 / 3 # ? ) . f , 3 % # , k ( z r e s o n a t o r # , 2 e s o n a t o r w i t h i n t e g r a t e d c a p a c i t o r s $ r i v e p r o g r a m m a b l e a m p l i f i e r docid023353 rev 9 79/143 stm32f303xb stm32f303xc electrical characteristics 124 6.3.8 internal clock source characteristics the parameters given in table 44 are derived from tests performed under ambient temperature and supply voltage conditions summarized in table 24 . high-speed internal (hsi) rc oscillator figure 17. hsi oscillator accuracy characterization results for soldered parts table 44. hsi oscillator characteristics (1) 1. v dda = 3.3 v, t a = ?40 to 105 c unless otherwise specified. symbol parameter conditions min typ max unit f hsi frequency - - 8 - mhz trim hsi user trimming step - - - 1 (2) 2. guaranteed by design, not tested in production. % ducy (hsi) duty cycle - 45 (2) -55 (2) % acc hsi accuracy of the hsi oscillator t a = -40 to 105c -2.8 (3) 3. data based on characterization results, not tested in production. -3.8 (3) % t a = -10 to 85c -1.9 (3) -2.3 (3) t a = 0 to 85c -1.9 (3) -2 (3) t a = 0 to 70c -1.3 (3) -2 (3) t a = 0 to 55c -1 (3) -2 (3) t a = 25c (4) 4. factory calibrated, parts not soldered. -1 - 1 t su(hsi) hsi oscillator startup time - 1 (2) -2 (2) s i dda(hsi) hsi oscillator power consumption - - 80 100 (2) a 0 6 9 5 < ? $ > " . " 9 . * / electrical characteristics stm32f303xb stm32f303xc 80/143 docid023353 rev 9 low-speed internal (lsi) rc oscillator 6.3.9 pll characteristics the parameters given in table 46 are derived from tests performed under ambient temperature and supply voltage conditions summarized in table 24 . table 45. lsi oscillator characteristics (1) 1. v dda = 3.3 v, t a = ?40 to 105 c unless otherwise specified. symbol parameter min typ max unit f lsi frequency 30 40 50 khz t su(lsi) (2) 2. guaranteed by design, not tested in production. lsi oscillator startup time - - 85 s i dd(lsi) (2) lsi oscillator power consumption - 0.75 1.2 a table 46. pll characteristics symbol parameter value unit min typ max f pll_in pll input clock (1) 1. take care of using the appropriate multiplier factors so as to have pll input clock values compatible with the range defined by f pll_out . 1 (2) -24 (2) mhz pll input clock duty cycle 40 (2) -60 (2) % f pll_out pll multiplier output clock 16 (2) -72mhz t lock pll lock time - - 200 (2) s jitter cycle-to-cycle jitter - - 300 (2) 2. guaranteed by design, not tested in production. ps docid023353 rev 9 81/143 stm32f303xb stm32f303xc electrical characteristics 124 6.3.10 memory characteristics flash memory the characteristics are given at t a = ?40 to 105 c unless otherwise specified. table 47. flash memory characteristics symbol parameter conditions min typ max (1) 1. guaranteed by design, not tested in production. unit t prog 16-bit programming time t a = ?40 to +105 c 40 53.5 60 s t erase page (2 kb) erase time t a = ?40 to +105 c 20 - 40 ms t me mass erase time t a = ?40 to +105 c 20 - 40 ms i dd supply current write mode - - 10 ma erase mode - - 12 ma table 48. flash memory endurance and data retention symbol parameter conditions value unit min (1) 1. data based on characterization results, not tested in production. n end endurance t a = ?40 to +85 c (6 suffix versions) t a = ?40 to +105 c (7 suffix versions) 10 kcycles t ret data retention 1 kcycle (2) at t a = 85 c 2. cycling performed over the whole temperature range. 30 years 1 kcycle (2) at t a = 105 c 10 10 kcycles (2) at t a = 55 c 20 electrical characteristics stm32f303xb stm32f303xc 82/143 docid023353 rev 9 6.3.11 emc characteristics susceptibility tests are perf ormed on a sample basis duri ng device characterization. functional ems (electromagnetic susceptibility) while a simple application is executed on t he device (toggling 2 leds through i/o ports). the device is stressed by two electromagnetic events until a failure o ccurs. the failure is indicated by the leds: ? electrostatic discharge (esd) (positive and negative) is applied to all device pins until a functional disturbance occurs. this test is compliant with the iec 61000-4-2 standard. ? ftb : a burst of fast transient voltage (positive and negative) is applied to v dd and v ss through a 100 pf capacitor, until a func tional disturbance occurs. this test is compliant with the iec 61000-4-4 standard. a device reset allows normal operations to be resumed. the test results are given in table 49 . they are based on the ems levels and classes defined in application note an1709. designing hardened software to avoid noise problems emc characterization and optimization are per formed at component level with a typical application environment and simplified mcu soft ware. it should be noted that good emc performance is highly dependent on the user application and the software in particular. therefore it is recommended that the user applies emc software optimization and prequalification tests in re lation with the emc level requested for his application. software recommendations the software flowchart must include the m anagement of runaway conditions such as: ? corrupted program counter ? unexpected reset ? critical data corruption (control registers...) table 49. ems characteristics symbol parameter conditions level/ class v fesd voltage limits to be applied on any i/o pin to induce a functional disturbance v dd = 3.3 v, lqfp100, t a = +25c, f hclk = 72 mhz conforms to iec 61000-4-2 3b v eftb fast transient voltage burst limits to be applied through 100 pf on v dd and v ss pins to induce a functional disturbance v dd = 3.3 v, lqfp100, t a = +25c, f hclk = 72 mhz conforms to iec 61000-4-4 4a docid023353 rev 9 83/143 stm32f303xb stm32f303xc electrical characteristics 124 prequalification trials most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forci ng a low state on the nrst pin or the oscillator pins for 1 second. to complete these trials, esd stress can be applie d directly on the device, over the range of specification values. when unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note an1015). electromagnetic interference (emi) the electromagnetic field emitted by the device are monitored while a simple application is executed (toggling 2 leds through the i/o por ts). this emission test is compliant with iec 61967-2 standard which specifies the test board and the pin loading. 6.3.12 electrical sens itivity characteristics based on three different tests (esd, lu) using specific measurement methods, the device is stressed in order to determ ine its performance in terms of electrical sensitivity. electrostatic discharge (esd) electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combinati on. the sample size depends on the number of supply pins in the device (3 parts (n+1) supply pins). this test conforms to the jesd22-a114/c101 standard. table 50. emi characteristics symbol parameter conditions monitored frequency band max vs. [f hse /f hclk ] unit 8/72 mhz s emi peak level v dd = 3.6 v, t a = 25 c, lqfp100 package compliant with iec 61967-2 0.1 to 30 mhz 7 dbv 30 to 130 mhz 20 130 mhz to 1ghz 27 sae emi level 4 - table 51. esd absolute maximum ratings symbol ratings conditions class maximum value (1) 1. data based on characterization results, not tested in production. unit v esd(hbm) electrostatic discharge voltage (human body model) t a = +25 c, conforming to jesd22-a114 22000 v v esd(cdm) electrostatic discharge voltage (charge device model) t a = +25 c, conforming to ansi/esd stm5.3.1 ii 500 electrical characteristics stm32f303xb stm32f303xc 84/143 docid023353 rev 9 static latch-up two complementary static te sts are required on six pa rts to assess the latch-up performance: ? a supply overvoltage is applied to each power supply pin ? a current injection is applied to each input, output and configurable i/o pin these tests are compliant with eia/jesd 78a ic latch-up standard. 6.3.13 i/o current in jection characteristics as a general rule, current injection to the i/o pins, due to external voltage below v ss or above v dd (for standard, 3 v-capable i/o pins) should be avoided during normal product operation. however, in order to give an indica tion of the robustness of the microcontroller in cases when abnormal injection ac cidentally happens, susceptib ility tests are pe rformed on a sample basis during device characterization. functional susceptibility to i/o current injection while a simple application is executed on the device, the device is stressed by injecting current into the i/o pins programmed in floating input mode . while current is injected into the i/o pin, one at a time, the device is checked for functional failures. the failure is indicated by an out of range parameter: adc error above a certain limit (higher than 5 lsb tue), out of conventional limits of induced leakage current on adjacent pins (out of ?5 a/+0 a range), or other functional failu re (for example reset occurrence or oscillator frequency deviation). the test results are given in table 53 . table 52. electrical sensitivities symbol parameter conditions class lu static latch-up class t a = +105 c conforming to jesd78a ii level a docid023353 rev 9 85/143 stm32f303xb stm32f303xc electrical characteristics 124 note: it is recommended to add a schottky diode (pin to ground) to analog pins which may potentially inject negative currents. table 53. i/o current injection susceptibility symbol description functional susceptibility unit negative injection positive injection i inj injected current on boot0 ? 0 na ma injected current on pc0, pc1, pc2, pc3, pf2, pa0, pa1, pa2, pa3, pf4, pa4, pa5, pa6, pa7, pc4, pc5, pb2 with induced leakage current on other pins from this group less than -50 a ? 5 - injected current on pb0, pb1, pe7, pe8, pe9, pe10, pe11, pe12, pe13, pe14, pe15, pb12, pb13, pb14, pb15, pd8, pd9, pd10, pd11 , pd12, pd13, pd14 with induced leakage current on other pins from this group less than -50 a ? 5 - injected current on pc0, pc1, pc2, pc3, pf2, pa0, pa1, pa2, pa3, pf4, pa4, pa5, pa6, pa7, pc4, pc5, pb2, pb0, pb1, pe7, pe8, pe 9, pe10, pe11, pe12, pe13, pe14, pe15, pb12, pb13, pb14, pb15, pd8, pd9, pd10, pd11, pd12, pd13, pd14 with induced leakage current on other pins from this group less than 400 a -+5 injected current on any other ft and ftf pins ? 5 na injected current on any other pins ? 5 +5 electrical characteristics stm32f303xb stm32f303xc 86/143 docid023353 rev 9 6.3.14 i/o port characteristics general input/output characteristics unless otherwise specified, the parameters given in table 54 are derived from tests performed under the conditions summarized in table 24 . all i/os are cmos and ttl compliant. table 54. i/o static characteristics symbol parameter conditions min typ max unit v il low level input voltage tc and tta i/o - - 0.3 v dd +0.07 (1) v ft and ftf i/o - - 0.475 v dd -0.2 (1) boot0 - - 0.3 v dd ?0.3 (1) all i/os except boot0 - - 0.3 v dd (2) v ih high level input voltage tc and tta i/o 0.445 v dd +0.398 (1) -- ft and ftf i/o 0.5 v dd +0.2 (1) -- boot0 0.2 v dd +0.95 (1) -- all i/os except boot0 0.7 v dd (2) -- v hys schmitt trigger hysteresis tc and tta i/o - 200 (1) - mv ft and ftf i/o - 100 (1) - boot0 - 300 (1) - i lkg input leakage current (3) tc, ft and ftf i/o tta i/o in digital mode v ss v in v dd --0.1 a tta i/o in digital mode v dd v in v dda --1 tta i/o in analog mode v ss v in v dda --0.2 ft and ftf i/o (4) v dd v in 5 v --10 r pu weak pull-up equivalent resistor (5) v in = v ss 25 40 55 k r pd weak pull-down equivalent resistor (5) v in = v dd 25 40 55 k c io i/o pin capacitance - - 5 - pf 1. data based on design simulation. 2. tested in production. 3. leakage could be higher than the maximum value. if n egative current is injected on adjacent pins. refer to table 53: i/o current injection susceptibility . 4. to sustain a voltage higher than v dd +0.3 v, the internal pull-up/pull-down resistors must be disabled. 5. pull-up and pull-down resistors are designed with a true re sistance in series with a switchable pmos/nmos. this pmos/nmos contribution to the series resistance is minimum (~10% order). docid023353 rev 9 87/143 stm32f303xb stm32f303xc electrical characteristics 124 all i/os are cmos and ttl compliant (no software configuration required). their characteristics cover more than the strict cmos-technology or ttl parameters. the coverage of these requirements is shown in figure 18 and figure 19 for standard i/os. figure 18. tc and tta i/o input characteristics - cmos port figure 19. tc and tta i/o input characteristics - ttl port 0 6 9 9 ' ' 9 9 , + p l q 9 , / p d [ 9 , / 9 , + 9 9 , / p d [ 9 ' ' & 0 2 6 v w d q g d u g u h t x l u h p h q w v 9 , / p d [ 9 ' ' 9 , + p l q 9 ' ' $ u h d q r w g h w h u p l q h g 7 h v w h g l q s u r g x f w l r q 7 h v w h g l q s u r g x f w l r q % d v h g r q g h v l j q v l p x o d w l r q v % d v h g r q g h v l j q v l p x o d w l r q v & 0 2 6 v w d q g d u g u h t x l u h p h q w v 9 , + p l q 9 ' ' 0 6 9 9 ' ' 9 9 , + p l q 9 , / p d [ 9 , / 9 , + 9 7 7 / v w d q g d u g u h t x l u h p h q w v 9 , + p l q 9 9 , / p d [ 9 ' ' 7 7 / v w d q g d u g u h t x l u h p h q w v 9 , / p d [ 9 9 , + p l q 9 ' ' $ u h d q r w g h w h u p l q h g % d v h g r q g h v l j q v l p x o d w l r q v % d v h g r q g h v l j q v l p x o d w l r q v electrical characteristics stm32f303xb stm32f303xc 88/143 docid023353 rev 9 figure 20. five volt tolerant (ft and ftf ) i/o input characteristics - cmos port figure 21. five volt tolerant (ft and ftf) i/o input characteristics - ttl port 0 6 9 9 ' ' 9 9 , / 9 , + 9 9 , / p d [ 9 ' ' & 0 2 6 v w d q g d u g u h t x l u h p h q w v 9 , / p d [ 9 ' ' 9 , + p l q 9 ' ' $ u h d q r w g h w h u p l q h g % d v h g r q g h v l j q v l p x o d w l r q v % d v h g r q g h v l j q v l p x o d w l r q v 7 h v w h g l q s u r g x f w l r q & 0 2 6 v w d q g d u g u h t x l u h p h q w v 9 , + p l q 9 ' ' 7 h v w h g l q s u r g x f w l r q 0 6 9 9 ' ' 9 9 , / 9 , + 9 9 , / p l q 9 ' ' 9 , + p l q 9 ' ' $ u h d q r w g h w h u p l q h g 7 7 / v w d q g d u g u h t x l u h p h q w v 9 , + p l q 9 7 7 / v w d q g d u g u h t x l u h p h q w v 9 , / p d [ 9 % d v h g r q g h v l j q v l p x o d w l r q v % d v h g r q g h v l j q v l p x o d w l r q v docid023353 rev 9 89/143 stm32f303xb stm32f303xc electrical characteristics 124 output driving current the gpios (general purpose input/outputs) can sink or source up to +/-8 ma, and sink or source up to +/- 20 ma (with a relaxed v ol/ v oh ). in the user application, the number of i/o pi ns which can drive curr ent must be limited to respect the absolute maximum rating specified in section 6.2 : ? the sum of the currents sourced by all the i/os on v dd, plus the maximum run consumption of the mcu sourced on v dd, cannot exceed the absolute maximum rating i vdd (see table 22 ). ? the sum of the currents sunk by all the i/os on v ss plus the maximum run consumption of the mcu sunk on v ss cannot exceed the absolute maximum rating i vss (see table 22 ). output voltage levels unless otherwise specified, the parameters given in table 55 are derived from tests performed under ambient temperature and v dd supply voltage conditions summarized in table 24 . all i/os (ft, tta and tc unless otherwise specified) are cmos and ttl compliant. table 55. output voltage characteristics symbol parameter conditions min max unit v ol (1) output low level voltage for an i/o pin cmos port (2) i io = +8 ma 2.7 v < v dd < 3.6 v -0.4 v v oh (3) output high level voltage for an i/o pin v dd ?0.4 - v ol (1) output low level voltage for an i/o pin ttl port (2) i io = +8 ma 2.7 v < v dd < 3.6 v -0.4 v oh (3) output high level voltage for an i/o pin 2.4 - v ol (1)(4) output low level voltage for an i/o pin i io = +20 ma 2.7 v < v dd < 3.6 v -1.3 v oh (3)(4) output high level voltage for an i/o pin v dd ?1.3 - v ol (1)(4) output low level voltage for an i/o pin i io = +6 ma 2 v < v dd < 2.7 v -0.4 v oh (3)(4) output high level voltage for an i/o pin v dd ?0.4 - v olfm+ (1)(4) output low level voltage for an ftf i/o pin in fm+ mode i io = +20 ma 2.7 v < v dd < 3.6 v -0.4 1. the i io current sunk by the device must always res pect the absolute maximum rating specified in table 22 and the sum of i io (i/o ports and control pins) must not exceed i io(pin) . 2. ttl and cmos outputs are compatible with jedec standards jesd36 and jesd52. 3. the i io current sourced by the device must always re spect the absolute maximu m rating specified in table 22 and the sum of i io (i/o ports and control pins) must not exceed i io(pin) . 4. data based on design simulation. electrical characteristics stm32f303xb stm32f303xc 90/143 docid023353 rev 9 input/output ac characteristics the definition and values of input/output ac characteristics are given in figure 22 and table 56 , respectively. unless otherwise specified, th e parameters given are derived from tests performed under ambient temperature and v dd supply voltage condit ions summarized in table 24 . table 56. i/o ac characteristics (1) ospeedry [1:0] value (1) symbol parameter conditions min max unit x0 f max(io)out maximum frequency (2) c l = 50 pf, v dd = 2 v to 3.6 v -2 (3) mhz t f(io)out output high to low level fall time c l = 50 pf, v dd = 2 v to 3.6 v - 125 (3) ns t r(io)out output low to high level rise time - 125 (3) 01 f max(io)out maximum frequency (2) c l = 50 pf, v dd = 2 v to 3.6 v -10 (3) mhz t f(io)out output high to low level fall time c l = 50 pf, v dd = 2 v to 3.6 v -25 (3) ns t r(io)out output low to high level rise time -25 (3) 11 f max(io)out maximum frequency (2) c l = 30 pf, v dd = 2.7 v to 3.6 v -50 (3) mhz c l = 50 pf, v dd = 2.7 v to 3.6 v -30 (3) mhz c l = 50 pf, v dd = 2 v to 2.7 v -20 (3) mhz t f(io)out output high to low level fall time c l = 30 pf, v dd = 2.7 v to 3.6 v -5 (3) ns c l = 50 pf, v dd = 2.7 v to 3.6 v -8 (3) c l = 50 pf, v dd = 2 v to 2.7 v -12 (3) t r(io)out output low to high level rise time c l = 30 pf, v dd = 2.7 v to 3.6 v -5 (3) c l = 50 pf, v dd = 2.7 v to 3.6 v -8 (3) c l = 50 pf, v dd = 2 v to 2.7 v -12 (3) fm+ configuration (4) f max(io)out maximum frequency (2) c l = 50 pf, v dd = 2 v to 3.6 v -2 (4) mhz t f(io)out output high to low level fall time -12 (4) ns t r(io)out output low to high level rise time -34 (4) -t extipw pulse width of external signals detected by the exti controller - 10 (3) -ns 1. the i/o speed is configured using the ospeedrx[1:0] bits. refer to the rm0316 reference manual for a description of gpio port configuration register. 2. the maximum frequency is defined in figure 22 . 3. guaranteed by design, not tested in production. 4. the i/o speed configuration is bypassed in fm+ i/o mode. refer to the stm32f303x stm32f313x reference manual rm0316 for a description of fm+ i/o mode configuration. docid023353 rev 9 91/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 22. i/o ac charac teristics definition 6.3.15 nrst pin characteristics the nrst pin input driver uses cmos technology. it is connected to a permanent pull-up resistor, r pu (see table 54 ). unless otherwise specified, the parameters given in table 57 are derived from tests performed under ambient temperature and v dd supply voltage conditions summarized in table 24 . a i c t r ) / o u t / 5 4 0 5 4 % 8 4 % 2 . ! , / . p & - a x i m u m f r e q u e n c y i s a c h i e v e d i f t r t f ? 4 a n d i f t h e d u t y c y c l e i s w h e n l o a d e d b y p & 4 t f ) / o u t table 57. nrst pin characteristics symbol parameter conditions min typ max unit v il(nrst) (1) nrst input low level voltage - - - 0.3v dd + 0.07 (1) v v ih(nrst) (1) nrst input high level voltage - 0.445v dd + 0.398 (1) -- v hys(nrst) nrst schmitt trigger voltage hysteresis - - 200 - mv r pu weak pull-up equivalent resistor (2) v in = v ss 25 40 55 k v f(nrst) (1) nrst input filtered pulse - - - 100 (1) ns v nf(nrst) (1) nrst input not filtered pulse - 500 (1) --ns 1. guaranteed by design, not tested in production. 2. the pull-up is designed with a true resistance in se ries with a switchable pmos. this pmos contribution to the series resistance must be minimum (~10% order) . electrical characteristics stm32f303xb stm32f303xc 92/143 docid023353 rev 9 figure 23. recommended nrst pin protection 1. the reset network protects t he device against par asitic resets. 2. the user must ensure that the level on the nrst pin can go below the v il(nrst) max level specified in table 57 . otherwise the reset will not be taken into account by the device. 6.3.16 timer characteristics the parameters given in table 58 are guaranteed by design. refer to section 6.3.14: i/o port characteristics for details on the input/output alternate function characteristics (output compare, i nput capture, external clock, pwm output). - 3 6 2 0 5 . 2 3 4 6 $ $ & i l t e r ) n t e r n a l 2 e s e t ? & % x t e r n a l r e s e t c i r c u i t table 58. timx (1)(2) characteristics 1. timx is used as a general term to refer to the tim1, tim2, tim3, tim4, tim8, tim15, tim16 and tim17 timers. 2. guaranteed by design, not tested in production. symbol parameter conditions min max unit t res(tim) timer resolution time -1- t timxclk f timxclk = 72 mhz 13.9 - ns f timxclk = 144 mhz x=1.8 6.95 - ns f ext timer external clock frequency on ch1 to ch4 -0 f timxclk /2 mhz f timxclk = 72 mhz 0 36 mhz res tim timer resolution timx (except tim2) - 16 bit tim2 - 32 t counter 16-bit counter clock period - 1 65536 t timxclk f timxclk = 72 mhz 0.0139 910 s f timxclk = 144 mhz x=1.8 0.0069 455 s t max_count maximum possible count with 32-bit counter - - 65536 65536 t timxclk f timxclk = 72 mhz - 59.65 s f timxclk = 144 mhz x=1.8 - 29.825 s docid023353 rev 9 93/143 stm32f303xb stm32f303xc electrical characteristics 124 table 59. iwdg min/max timeout period at 40 khz (lsi) (1) 1. these timings are given for a 40 kh z clock but the microcontroller?s in ternal rc frequency can vary from 30 to 60 khz. moreover, given an exact rc oscillator frequency, the exact timings still depend on the phasing of the apb interface clock versus the lsi clock so t hat there is always a full rc period of uncertainty. prescaler divider pr[2:0] bits min timeout (ms) rl[11:0]= 0x000 max timeout (ms) rl[11:0]= 0xfff /4 0 0.1 409.6 /8 1 0.2 819.2 /16 2 0.4 1638.4 /32 3 0.8 3276.8 /64 4 1.6 6553.6 /128 5 3.2 13107.2 /256 7 6.4 26214.4 table 60. wwdg min-max timeout value @72 mhz (pclk) (1) 1. guaranteed by design, not tested in production. prescaler wdgtb min timeout value max timeout value 1 0 0.05687 3.6409 2 1 0.1137 7.2817 4 2 0.2275 14.564 8 3 0.4551 29.127 electrical characteristics stm32f303xb stm32f303xc 94/143 docid023353 rev 9 6.3.17 communications interfaces i 2 c interface characteristics the i 2 c interface meets the timings requirements of the i 2 c-bus specification and user manual rev.03 for: ? standard-mode (sm) : with a bit rate up to 100 kbits/s ? fast-mode (fm) : with a bit rate up to 400 kbits/s ? fast-mode plus (fm+) : with a bit rate up to 1mbits/s the i 2 c timings requirements are guaranteed by design when the i 2 c peripheral is properly configured (refer to reference manual). the sda and scl i/o requirements are met with the following restrictions: the sda and scl i/o pins are ?true? open-drain. when conf igured as open-drain, the pmos connected between the i/o pin and vddiox is disabled, but is still pr esent. only ftf i/o pins support fm+ low level output current maximum requirement. refer to section 6.3.14: i/o port characteristics . all i 2 c i/os embed an analog filter. refer to the table 62: i2c analog filter characteristics . table 61. i2c timings specification (see i2c specification, rev.03, june 2007) (1) symbol parameter standard mode fast mode fast mode plus unit min max min max min max f scl scl clock frequency 0 100 0 400 0 1000 khz t low low period of the scl clock 4.7 - 1.3 - 0.5 - s t high high period of the scl clock 4 0.6 0.26 - s t r rise time of both sda and scl signals - 1000 - 300 - 120 ns t f fall time of both sda and scl signals - 300 - 300 - 120 ns t hd;dat data hold time 0 - 0 - 0 - s t vd;dat data valid time - 3.45 (2) -0.9 (2) -0.45 (2) s t vd;ack data valid acknowledge time - 3.45 (2) -0.9 (2) -0.45 (2) s t su;dat data setup time 250 - 100 - 50 - ns t hd:sta hold time (repeated) start condition 4.0 - 0.6 - 0.26 - s t su:sta set-up time for a repeated start condition 4.7 - 0.6 - 0.26 s t su:sto set-up time for stop condition 4.0 - 0.6 - 0.26 - s t buf bus free time between a stop and start condition 4.7 - 1.3 - 0.5 - s c b capacitive load for each bus line - 400 - 400 - 550 pf t sp pulse width of spikes that are suppressed by the analog filter for standard and fast mode 050 (3) 050 (3) --ns docid023353 rev 9 95/143 stm32f303xb stm32f303xc electrical characteristics 124 1. the i2c characteristics are the requirements from i2c bus specification rev03. th ey are guaranteed by design when i2cx_timing register is correctly programmed (refer to the rm0316 reference manual). these characteristics are not tested in production. 2. the maximum thd;dat could be 3.45 s , 0.9 s and 0.45 s for standard mode, fast mode and fast mode plus, but must be less than the maximum of tvd;dat or tvd;ack by a transition time. 3. the minimum width of the spikes fi ltered by the analog filter is above t sp (max). electrical characteristics stm32f303xb stm32f303xc 96/143 docid023353 rev 9 figure 24. i 2 c bus ac waveforms and measurement circuit 1. rs: series protection resistors, rp: pu ll-up resistors, vdd_i2c: i2c bus supply. table 62. i2c analog filter characteristics (1) 1. guaranteed by design, not tested in production. symbol parameter min max unit t af pulse width of spikes that are suppressed by the analog filter 50 260 ns 0 6 9 5 v , & e x v 5 s 5 v 9 ' ' b , & 0 & 8 6 ' $ 6 & / 5 s 9 ' ' b , & d p o u j o v f e d p o u j o v f e 4 % " 4 $ - 4 % " 4 $ - u g u g u s u s u 4 6 % " 5 u ) % % " 5 u ) * ( ) u 7 % % " 5 u g 4 $ - u - 0 8 u i d m p d l t u d m p d l d z d m f u 4 6 4 5 " u ) % 4 5 " u 4 1 u 7 % " $ , u 4 6 4 5 0 u # 6 ' u i d m p d l 4 s 4 1 4 ) % 4 5 " docid023353 rev 9 97/143 stm32f303xb stm32f303xc electrical characteristics 124 spi/i 2 s characteristics unless otherwise specified, the parameters given in table 63 for spi or in table 64 for i 2 s are derived from tests performed under ambient temperature, f pclkx frequency and v dd supply voltage conditions summarized in table 24 . refer to section 6.3.14: i/o port characteristics for more details on the input/output alternate function characteristics (n ss, sck, mosi, miso for spi and ws, ck, sd for i 2 s). table 63. spi characteristics (1) symbol parameter conditions min typ max unit f sck 1/t c(sck) spi clock frequency master mode, spi1 2.7 docid023353 rev 9 99/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 27. spi timing diagram - master mode (1) 1. measurement points are done at 0.5v dd and with external c l = 30 pf. a i 6 3 # + / u t p u t # 0 ( ! - / 3 ) / 5 4 0 5 4 - ) 3 / ) . 0 5 4 # 0 ( ! - 3 " ) . - 3 " / 5 4 " ) 4 ) . , 3 " / 5 4 , 3 " ) . # 0 / , # 0 / , " ) 4 / 5 4 . 3 3 i n p u t t c 3 # + t w 3 # + ( t w 3 # + , t r 3 # + t f 3 # + t h - ) ( i g h 3 # + / u t p u t # 0 ( ! # 0 ( ! # 0 / , # 0 / , t s u - ) t v - / t h - / electrical characteristics stm32f303xb stm32f303xc 100/143 docid023353 rev 9 table 64. i 2 s characteristics (1) 1. data based on characterization results, not tested in production. symbol parameter conditions min max unit f ck 1/t c(ck) i 2 s clock frequency master data: 16 bits, audio freq=48 khz 1.496 1.503 mhz slave 0 12.288 t r(ck) t f(ck) i 2 s clock rise and fall time capacitive load c l = 30 pf -8 ns t w(ckh) i 2 s clock high time master f pclk = 36 mhz, audio frequency = 48 khz 331 - t w(ckl) i 2 s clock low time 332 - t v(ws) ws valid time master mode 4 - t h(ws) ws hold time master mode 4 - t su(ws) ws setup time slave mode 4 - t h(ws) ws hold time slave mode 0 - duty cycle i 2 s slave input clock duty cycle slave mode 30 70 % t su(sd_mr) data input setup ti me master receiver 9 - ns t su(sd_sr) data input setup time slave receiver 2 - t h(sd_mr) data input hold time master receiver 0 - t h(sd_sr) slave receiver 0 - t v(sd_st) data output valid time slave transmitter (after enable edge) -29 t h(sd_st) data output hold time slave transmitter (after enable edge) 12 - t v(sd_mt) data output valid time master transmitter (after enable edge) -3 t h(sd_mt) data output hold time master transmitter (after enable edge) 2- docid023353 rev 9 101/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 28. i 2 s slave timing diagram (philips protocol) (1) 1. measurement points are done at 0.5v dd and with external c l =30 pf. 2. lsb transmit/receive of the previ ously transmitted byte. no lsb transmi t/receive is sent before the first byte. figure 29. i 2 s master timing diagram (philips protocol) (1) 1. measurement points are done at 0.5v dd and with external c l =30 pf. 2. lsb transmit/receive of the previ ously transmitted byte. no lsb transmi t/receive is sent before the first byte. & . , q s x w & 3 2 / & 3 2 / w f & . : 6 l q s x w 6 ' w u d q v p l w 6 ' u h f h l y h w z & . + w z & . / w v x : 6 w y 6 ' b 6 7 w k 6 ' b 6 7 w k : 6 w v x 6 ' b 6 5 w k 6 ' b 6 5 0 6 % u h f h l y h % l w q u h f h l y h / 6 % u h f h l y h 0 6 % w u d q v p l w % l w q w u d q v p l w / 6 % w u d q v p l w d l e / 6 % u h f h l y h / 6 % w u d q v p l w # + o u t p u t # 0 / , # 0 / , t c # + 7 3 o u t p u t 3 $ r e c e i v e 3 $ t r a n s m i t t w # + ( t w # + , t s u 3 $ ? - 2 t v 3 $ ? - 4 t h 3 $ ? - 4 t h 7 3 t h 3 $ ? - 2 - 3 " r e c e i v e " i t n r e c e i v e , 3 " r e c e i v e - 3 " t r a n s m i t " i t n t r a n s m i t , 3 " t r a n s m i t a i b t f # + t r # + t v 7 3 , 3 " r e c e i v e , 3 " t r a n s m i t electrical characteristics stm32f303xb stm32f303xc 102/143 docid023353 rev 9 usb characteristics table 65. usb startup time symbol parameter max unit t startup (1) 1. guaranteed by design, not tested in production. usb transceiver startup time 1 s docid023353 rev 9 103/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 30. usb timings: definition of data signal rise and fall time table 66. usb dc electrical characteristics symbol parameter conditions min. (1) 1. all the voltages are measured from the local ground potential. max. (1) unit input levels v dd usb operating voltage (2) 2. to be compliant with the usb 2.0 full-speed electrical specification, the usb_dp (d+) pin should be pulled up with a 1.5 k resistor to a 3.0-to-3.6 v voltage range. -3.0 (3) 3. the stm32f303xb/stm32f303xc usb functionality is ensured down to 2.7 v but not the full usb electrical characterist ics which are degraded in the 2.7-to-3.0 v v dd voltage range. 3.6 v v di (4) 4. guaranteed by design, not tested in production. differential input sensitivity i(usb_dp, usb_dm) 0.2 - v v cm (4) differential common mode range includes v di range 0.8 2.5 v se (4) single ended receiver threshold - 1.3 2.0 output levels v ol static output level low r l of 1.5 k to 3.6 v (5) 5. r l is the load connected on the usb drivers. -0.3 v v oh static output level high r l of 15 k to v ss (5) 2.8 3.6 d l w i 6 6 w u 9 & 5 6 9 ' l i i h u h q w l d o g d w d o l q h v & u r v v r y h u s r l q w v electrical characteristics stm32f303xb stm32f303xc 104/143 docid023353 rev 9 can (controller area network) interface refer to section 6.3.14: i/o port characteristics for more details on the input/output alternate function characteristics (can_tx and can_rx). table 67. usb: full-speed electrical characteristics (1) symbol parameter conditions min typ max unit driver characteristics t r rise time (2) c l = 50 pf 4 - 20 ns t f fall time (2) c l = 50 pf 4 - 20 ns t rfm rise/ fall time matching t r /t f 90 - 110 % v crs output signal crossover voltage - 1.3 - 2.0 v output driver impedance (3) z drv driving high and low 28 40 44 1. guaranteed by design, not tested in production. 2. measured from 10% to 90% of the data signal. for more detaile d informations, please refer to usb specification - chapter 7 (version 2.0). 3. no external termination series resistors are required on usb_dp (d+) and usb_dm (d-), the matching impedance is already included in the embedded driver. docid023353 rev 9 105/143 stm32f303xb stm32f303xc electrical characteristics 124 6.3.18 adc characteristics unless otherwise specified, the parameters given in table 68 to table 70 are guaranteed by design, with conditio ns summarized in table 24 . table 68. adc characteristics symbol parameter conditions min typ max unit v dda analog supply voltage for adc -2-3.6v i dda adc current consumption on vdda pin (see figure 31 ) single-ended mode, 5 msps -9071033.0 a single-ended mode, 1 msps - 194 285.5 single-ended mode, 200 ksps - 51.5 70 differential mode, 5 msps - 887.5 1009 differential mode, 1 msps - 212 285 differential mode, 200 ksps -5169.5 v ref+ positive reference voltage - 2 - v dda v i ref adc current consumption on vref+ pin (see figure 32 ) single-ended mode, 5 msps - 104 139 a single-ended mode, 1 msps - 20.4 37 single-ended mode, 200 ksps - 3.3 11.3 differential mode, 5 msps - 174 235 differential mode, 1 msps - 34.6 52.6 differential mode, 200 ksps -613.6 f adc adc clock frequency - 0.14 - 72 mhz f s (1) sampling rate resolution = 12 bits, fast channel 0.01 - 5.14 msps resolution = 10 bits, fast channel 0.012 - 6 resolution = 8 bits, fast channel 0.014 - 7.2 resolution = 6 bits, fast channel 0.0175 - 9 f trig (1) external trigger frequency f adc = 72 mhz resolution = 12 bits - - 5.14 mhz resolution = 12 bits - - 14 1/f adc electrical characteristics stm32f303xb stm32f303xc 106/143 docid023353 rev 9 v ain conversion voltage range (2) -0-v ref+ v r ain (1) external input impedance - - - 100 k c adc (1) internal sample and hold capacitor --5-pf t stab (1) power-up time - 0 0 1 s t cal (1) calibration time f adc = 72 mhz 1.56 s - 112 1/f adc t latr (1) trigger conversion latency regular and injected channels without conversion abort ckmode = 00 1.5 2 2.5 1/f adc ckmode = 01 - - 2 1/f adc ckmode = 10 - - 2.25 1/f adc ckmode = 11 - - 2.125 1/f adc t latrinj (1) trigger conversion latency injected channels aborting a regular conversion ckmode = 00 2.5 3 3.5 1/f adc ckmode = 01 - - 3 1/f adc ckmode = 10 - - 3.25 1/f adc ckmode = 11 - - 3.125 1/f adc t s (1) sampling time f adc = 72 mhz 0.021 - 8.35 s - 1.5 - 601.5 1/f adc t adcvreg _stup (1) adc voltage regulator start-up time ---10s t conv (1) total conversion time (including sampling time) f adc = 72 mhz resolution = 12 bits 0.19 - 8.52 s resolution = 12 bits 14 to 614 (t s for sampling + 12.5 for successive approximation) 1/f adc 1. data guaranteed by design, not tested in production. 2. v ref+ can be internally connected to v dda and v ref- can be internally connected to v ssa , depending on the package. refer to section 4: pinouts and pin description for further details. table 68. adc characteristics (continued) symbol parameter conditions min typ max unit docid023353 rev 9 107/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 31. adc typical current consumption on vdda pin figure 32. adc typical current consumption on vref+ pin & o r f n i u h t x h q f \ 0 6 3 6 $ ' & f x u u h q w f r q v x p s w l r q ? $ 0 6 9 ' l i i h u h q w l d o p r g h 6 l q j o h h q g h g p r g h & o r f n i u h t x h q f \ 0 6 3 6 $ ' & f x u u h q w f r q v x p s w l r q ? $ 0 6 9 6 l q j o h h q g h g p r g h ' l i i h u h q w l d o p r g h electrical characteristics stm32f303xb stm32f303xc 108/143 docid023353 rev 9 table 69. maximum adc r ain (1) resolution sampling cycle @ 72 mhz sampling time [ns] @ 72 mhz r ain max (k ) fast channels (2) slow channels other channels (3) 12 bits 1.5 20.83 0.018 na na 2.5 34.72 0.150 na 0.022 4.5 62.50 0.470 0.220 0.180 7.5 104.17 0.820 0.560 0.470 19.5 270.83 2.70 1.80 1.50 61.5 854.17 8.20 6.80 4.70 181.5 2520.83 22.0 18.0 15.0 601.5 8354.17 82.0 68.0 47.0 10 bits 1.5 20.83 0.082 na na 2.5 34.72 0.270 0.082 0.100 4.5 62.50 0.560 0.390 0.330 7.5 104.17 1.20 0.82 0.68 19.5 270.83 3.30 2.70 2.20 61.5 854.17 10.0 8.2 6.8 181.5 2520.83 33.0 27.0 22.0 601.5 8354.17 100.0 82.0 68.0 8 bits 1.5 20.83 0.150 na 0.039 2.5 34.72 0.390 0.180 0.180 4.5 62.50 0.820 0.560 0.470 7.5 104.17 1.50 1.20 1.00 19.5 270.83 3.90 3.30 2.70 61.5 854.17 12.00 12.00 8.20 181.5 2520.83 39.00 33.00 27.00 601.5 8354.17 100.00 100.00 82.00 6 bits 1.5 20.83 0.270 0.100 0.150 2.5 34.72 0.560 0.390 0.330 4.5 62.50 1.200 0.820 0.820 7.5 104.17 2.20 1.80 1.50 19.5 270.83 5.60 4.70 3.90 61.5 854.17 18.0 15.0 12.0 181.5 2520.83 56.0 47.0 39.0 601.5 8354.17 100.00 100.0 100.0 1. data based on characterization results, not tested in production. docid023353 rev 9 109/143 stm32f303xb stm32f303xc electrical characteristics 124 2. all fast channels, expect channels on pa2, pa6, pb1, pb12. 3. channels available on pa2, pa6, pb1, pb12. table 70. adc accuracy - limited test conditions, 100-pin packages (1)(2) symbol parameter conditions min (3) typ max (3) unit et to ta l unadjusted error adc clock freq. 72 mhz sampling freq. 5 msps v dda = v ref+ = 3.3 v 25c 100-pin package single ended fast channel 5.1 ms - 3.5 4.5 lsb slow channel 4.8 ms - 4 4.5 differential fast channel 5.1 ms - 3 3 slow channel 4.8 ms - 3 3 eo offset error single ended fast channel 5.1 ms - 1 1.5 slow channel 4.8 ms - 1 2.5 differential fast channel 5.1 ms - 1 1.5 slow channel 4.8 ms - 1 1.5 eg gain error single ended fast channel 5.1 ms - 3 4 slow channel 4.8 ms - 3.5 4 differential fast channel 5.1 ms - 1.5 2.5 slow channel 4.8 ms - 2 2.5 ed differential linearity error single ended fast channel 5.1 ms - 1 1.5 slow channel 4.8 ms - 1 1.5 differential fast channel 5.1 ms - 1 1 slow channel 4.8 ms - 1 1 el integral linearity error single ended fast channel 5.1 ms - 1.5 2 slow channel 4.8 ms - 1.5 3 differential fast channel 5.1 ms - 1 1.5 slow channel 4.8 ms - 1 1.5 enob (4) effective number of bits single ended fast channel 5.1 ms 10.7 10.8 - bits slow channel 4.8 ms 10.7 10.8 - differential fast channel 5.1 ms 11.2 11.3 - slow channel 4.8 ms 11.1 11.3 - sinad (4) signal-to- noise and distortion ratio single ended fast channel 5.1 ms 66 67 - db slow channel 4.8 ms 66 67 - differential fast channel 5.1 ms 69 70 - slow channel 4.8 ms 69 70 - electrical characteristics stm32f303xb stm32f303xc 110/143 docid023353 rev 9 snr (4) signal-to- noise ratio adc clock freq. 72 mhz sampling freq 5 msps v dda = v ref+ = 3.3 v 25c 100-pin package single ended fast channel 5.1 ms 66 67 - db slow channel 4.8 ms 66 67 - differential fast channel 5.1 ms 69 70 - slow channel 4.8 ms 69 70 - thd (4) to ta l harmonic distortion single ended fast channel 5.1 ms - -76 -76 slow channel 4.8 ms - -76 -76 differential fast channel 5.1 ms - -80 -80 slow channel 4.8 ms - -80 -80 1. adc dc accuracy values are measured after internal calibration. 2. adc accuracy vs. negative injection current: injecting negative cu rrent on any analog input pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog input. it is recommended to add a schottky diode (pin to ground) to analog pins wh ich may potentially inject negative current. any positive injection current within the limits specified for i inj(pin) and i inj(pin) in section 6.3.14 does not affect the adc accuracy. 3. data based on characterization re sults, not tested in production. 4. value measured with a -0.5 db full scale 50 khz sine wave input signal. table 70. adc accuracy - limited te st conditions, 100-pin packages (1)(2) (continued) symbol parameter conditions min (3) typ max (3) unit docid023353 rev 9 111/143 stm32f303xb stm32f303xc electrical characteristics 124 table 71. adc accuracy, 100-pin packages (1)(2)(3) symbol parameter conditions min (4) max (4) unit et to ta l unadjusted error adc clock freq. 72 mhz, sampling freq. 5 msps 2 v v dda , v ref+ 3.6 v 100-pin package single ended fast channel 5.1 ms - 6.5 lsb slow channel 4.8 ms - 6.5 differential fast channel 5.1 ms - 4 slow channel 4.8 ms - 4 eo offset error single ended fast channel 5.1 ms - 3 slow channel 4.8 ms - 3 differential fast channel 5.1 ms - 2 slow channel 4.8 ms - 2 eg gain error single ended fast channel 5.1 ms - 6 slow channel 4.8 ms - 6 differential fast channel 5.1 ms - 3 slow channel 4.8 ms - 3 ed differential linearity error single ended fast channel 5.1 ms - 1.5 slow channel 4.8 ms - 1.5 differential fast channel 5.1 ms - 1.5 slow channel 4.8 ms - 1.5 el integral linearity error single ended fast channel 5.1 ms - 2 slow channel 4.8 ms - 3 differential fast channel 5.1 ms - 2 slow channel 4.8 ms - 2 enob (5) effective number of bits single ended fast channel 5.1 ms 10.4 - bits slow channel 4.8 ms 10.2 - differential fast channel 5.1 ms 10.8 - slow channel 4.8 ms 10.8 - electrical characteristics stm32f303xb stm32f303xc 112/143 docid023353 rev 9 sinad (5) signal-to- noise and distortion ratio adc clock freq. 72 mhz, sampling freq. 5 msps, 2 v v dda , v ref+ 3.6 v 100-pin package single ended fast channel 5.1 ms 64 - db slow channel 4.8 ms 63 - differential fast channel 5.1 ms 67 - slow channel 4.8 ms 67 - snr (5) signal-to- noise ratio single ended fast channel 5.1 ms 64 - slow channel 4.8 ms 64 - differential fast channel 5.1 ms 67 - slow channel 4.8 ms 67 - thd (5) to ta l harmonic distortion single ended fast channel 5.1 ms - -74 slow channel 4.8 ms - -74 differential fast channel 5.1 ms - -78 slow channel 4.8 ms - -76 1. adc dc accuracy values are meas ured after internal calibration. 2. adc accuracy vs. negative injection current: injecting negat ive current on any analog input pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog input. it is recommended to add a schottky diode (pin to ground) to analog pins wh ich may potentially inject negative current. any positive injection current within the limits specified for i inj(pin) and i inj(pin) in section 6.3.14 does not affect the adc accuracy. 3. better performance may be achieved in restricted v dda , frequency and temperature ranges. 4. data based on characterization results, not tested in production. 5. value measured with a -0.5 db full scale 50 khz sine wave input signal. table 71. adc accuracy, 100-pin packages (1)(2)(3) symbol parameter conditions min (4) max (4) unit docid023353 rev 9 113/143 stm32f303xb stm32f303xc electrical characteristics 124 table 72. adc accuracy - limited test conditions, 64-pin packages (1)(2) symbol parameter conditions min (3) typ max (3) unit et to ta l unadjusted error adc clock freq. 72 mhz sampling freq. 5 msps v dda = 3.3 v 25c 64-pin package single ended fast channel 5.1 ms - 4 4.5 lsb slow channel 4.8 ms - 5.5 6 differential fast channel 5.1 ms - 3.5 4 slow channel 4.8 ms - 3.5 4 eo offset error single ended fast channel 5.1 ms - 2 2 slow channel 4.8 ms - 1.5 2 differential fast channel 5.1 ms - 1.5 2 slow channel 4.8 ms - 1.5 2 eg gain error single ended fast channel 5.1 ms - 3 4 slow channel 4.8 ms - 5 5.5 differential fast channel 5.1 ms - 3 3 slow channel 4.8 ms - 3 3.5 ed differential linearity error single ended fast channel 5.1 ms - 1 1 slow channel 4.8 ms - 1 1 differential fast channel 5.1 ms - 1 1 slow channel 4.8 ms - 1 1 el integral linearity error single ended fast channel 5.1 ms - 1.5 2 slow channel 4.8 ms - 2 3 differential fast channel 5.1 ms - 1.5 1.5 slow channel 4.8 ms - 1.5 2 enob (4) effective number of bits single ended fast channel 5.1 ms 10.8 10.8 - bit slow channel 4.8 ms 10.8 10.8 - differential fast channel 5.1 ms 11.2 11.3 - slow channel 4.8 ms 11.2 11.3 - sinad (4) signal-to- noise and distortion ratio single ended fast channel 5.1 ms 66 67 - db slow channel 4.8 ms 66 67 - differential fast channel 5.1 ms 69 70 - slow channel 4.8 ms 69 70 - electrical characteristics stm32f303xb stm32f303xc 114/143 docid023353 rev 9 snr (4) signal-to- noise ratio adc clock freq. 72 mhz sampling freq 5 msps v dda = 3.3 v 25c 64-pin package single ended fast channel 5.1 ms 66 67 - db slow channel 4.8 ms 66 67 - differential fast channel 5.1 ms 69 70 - slow channel 4.8 ms 69 70 - thd (4) to ta l harmonic distortion single ended fast channel 5.1 ms - -80 -80 slow channel 4.8 ms - -78 -77 differential fast channel 5.1 ms - -83 -82 slow channel 4.8 ms - -81 -80 1. adc dc accuracy values are measured after internal calibration. 2. adc accuracy vs. negative injection current: injecting negative current on any analog input pi ns should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog input. it is recommended to add a schottky diode (pin to ground) to analog pins wh ich may potentially inject negative current. any positive injection current wi thin the limits specified for i inj(pin) and i inj(pin) in section 6.3.14 does not affect the adc accuracy. 3. data based on characterization re sults, not tested in production. 4. value measured with a -0.5 db full scale 50 khz sine wave input signal. table 72. adc accuracy - limited test conditions, 64-pin packages (1)(2) (continued) symbol parameter conditions min (3) typ max (3) unit docid023353 rev 9 115/143 stm32f303xb stm32f303xc electrical characteristics 124 table 73. adc accuracy, 64-pin packages (1)(2)(3) symbol parameter conditions min (4) max (4) unit et to ta l unadjusted error adc clock freq. 72 mhz, sampling freq. 5 msps 2.0 v v dda 3.6 v 64-pin package single ended fast channel 5.1 ms - 6.5 lsb slow channel 4.8 ms - 6.5 differential fast channel 5.1 ms - 4 slow channel 4.8 ms - 4.5 eo offset error single ended fast channel 5.1 ms - 3 slow channel 4.8 ms - 3 differential fast channel 5.1 ms - 2.5 slow channel 4.8 ms - 2.5 eg gain error single ended fast channel 5.1 ms - 6 slow channel 4.8 ms - 6 differential fast channel 5.1 ms - 3.5 slow channel 4.8 ms - 4 ed differential linearity error single ended fast channel 5.1 ms - 1.5 slow channel 4.8 ms - 1.5 differential fast channel 5.1 ms - 1.5 slow channel 4.8 ms - 1.5 el integral linearity error single ended fast channel 5.1 ms - 3 slow channel 4.8 ms - 3.5 differential fast channel 5.1 ms - 2 slow channel 4.8 ms - 2.5 enob (5) effective number of bits single ended fast channel 5.1 ms 10.4 - bits slow channel 4.8 ms 10.4 - differential fast channel 5.1 ms 10.8 - slow channel 4.8 ms 10.8 - sinad (5) signal-to- noise and distortion ratio single ended fast channel 5.1 ms 64 - db slow channel 4.8 ms 63 - differential fast channel 5.1 ms 67 - slow channel 4.8 ms 67 - electrical characteristics stm32f303xb stm32f303xc 116/143 docid023353 rev 9 snr (5) signal-to- noise ratio adc clock freq. 72 mhz, sampling freq 5 msps, 2 v v dda 3.6 v 64-pin package single ended fast channel 5.1 ms 64 - db slow channel 4.8 ms 64 - differential fast channel 5.1 ms 67 - slow channel 4.8 ms 67 - thd (5) to ta l harmonic distortion single ended fast channel 5.1 ms - -75 slow channel 4.8 ms - -75 differential fast channel 5.1 ms - -79 slow channel 4.8 ms - -78 1. adc dc accuracy values are m easured after internal calibration. 2. adc accuracy vs. negative injection current: injecting negative current on any analog input pins should be avoided as this significantly reduces the ac curacy of the conversion being performed on another analog input. it is recommended to add a schottky diode (pin to ground) to analog pins which may potentially inject negative current. any positive injection current wi thin the limits specified for i inj(pin) and i inj(pin) in section 6.3.14 does not affect the adc accuracy. 3. better performance may be achieved in restricted v dda , frequency and temperature ranges. 4. data based on characterization results, not tested in production. 5. value measured with a -0.5 db full scale 50 khz sine wave input signal. table 73. adc accuracy, 64-pin packages (1)(2)(3) (continued) symbol parameter conditions min (4) max (4) unit table 74. adc accuracy at 1msps (1)(2) symbol parameter test conditions typ max (3) unit et total unadjusted error adc freq 72 mhz sampling freq 1msps 2.4 v v dda = v ref+ 3.6 v single-ended mode fast channel 2.5 5 lsb slow channel 3.5 5 eo offset error fast channel 1 2.5 slow channel 1.5 2.5 eg gain error fast channel 2 3 slow channel 3 4 ed differential linearity error fast channel 0.7 2 slow channel 0.7 2 el integral linearity error fast channel 1 3 slow channel 1.2 3 1. adc dc accuracy values are measured after internal calibration. 2. adc accuracy vs. negative injection current: injecting negativ e current on any analog input pi ns should be avoided as this significantly reduces the ac curacy of the conversion being performed on another analog input. it is recommended to add a schottky diode (pin to ground) to analog pins which may potentia lly inject negative current.. any positive injection current within the limits specified for iinj(pin) and iinj(pin) in section 6.3.14: i/o port characteristics does not affect the adc accuracy. 3. data based on characterization results, not tested in production. docid023353 rev 9 117/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 33. adc accuracy characteristics figure 34. typical connecti on diagram using the adc 1. refer to table 68 for the values of r ain . 2. c parasitic represents the capacitance of the pcb (dependent on soldering and pcb layout quality) plus the pad capacitance (roughly 7 pf). a high c parasitic value will downgrade conversion accuracy. to remedy this, f adc should be reduced. general pcb design guidelines power supply decoupling should be performed as shown in figure 10 . the 10 nf capacitor should be ceramic (good quality) and it should be placed as close as possible to the chip. ( 2 ( * / 6 % , ' ( $ / ( [ d p s o h r i d q d f w x d o w u d q v i h u f x u y h 7 k h l g h d o w u d q v i h u f x u y h ( q g s r l q w f r u u h o d w l r q o l q h ( 7 7 r w d o x q d m x v w h g h u u r u p d [ l p x p g h y l d w l r q e h w z h h q w k h d f w x d o d q g w k h l g h d o w u d q i h u f x u y h v ( 2 2 i i v h w h u u r u g h y l d w l r q e h w z h h q w k h i l u v w d f w x d o w u d q v l v l w r q d q g w k h i l u v w l g h d o r q h ( * * d l q h u r u g h y l d w l r q e h w z h h q w k h o d v w l g h d o w u d q v l w l r q d q g w k h o d v w d f w x d o r q h ( ' ' l i i h u h q w l d o o l q h d u l w \ h u u r u p d [ l p x p g h y l d w l r q e h w z h h q d f w x d o v w h s v d q g l g h d o r q h ( / , q w h j u d o o l q h d u l w \ h u u r u p d [ l p x p g h y l d w l r q e h w z h h q d q \ d f w x d o w u d q v l w l r q d q g w k h h q g s r l q w f r u u h o d w l r q r q h ( 7 ( ' ( / 9 ' ' $ 9 6 6 $ d l e 9 5 ( ) r u g h s h q g l q j r q s d f n d j h @ 9 ' ' $ > / 6 % , ' ( $ / 0 6 9 9 ' ' $ , 1 [ , / ? ? $ 9 9 7 5 $ , 1 & s d u d v l w l f 9 $ , 1 9 9 7 5 $ ' & & $ ' & c j u d p o w f s u f s 4 b n q m f b o e i p m e " % $ d p o w f s u f s electrical characteristics stm32f303xb stm32f303xc 118/143 docid023353 rev 9 6.3.19 dac electri cal specifications table 75. dac characteristics symbol parameter conditions min typ max unit v dda analog supply voltage dac output buffer on 2.4 - 3.6 v r load (1) resistive load dac output buffer on 5 - - k r o (1) output impedance dac output buffer on - - 15 k c load (1) capacitive load dac output buffer on - - 50 pf v dac_out (1) voltage on dac_out output corresponds to 12-bit input code (0x0e0) to (0xf1c) at v dda = 3.6 v and (0x155) and (0xeab) at v dda = 2.4 v dac output buffer on. 0.2 - v dda ? 0.2 v dac output buffer off - 0.5 v dda - 1lsb mv i dda (3) dac dc current consumption in quiescent mode (standby mode) (2) with no load, middle code (0x800) on the input. - - 380 a with no load, worst code (0xf1c) on the input. - - 480 a dnl (3) differential non linearity difference between two consecutive code-1lsb) given for a 10-bit input code - - 0.5 lsb given for a 12-bit input code - - 2 lsb inl (3) integral non linearity (difference between measured value at code i and the value at code i on a line drawn between code 0 and last code 4095) given for a 10-bit input code - - 1 lsb given for a 12-bit input code - - 4 lsb offset (3) offset error (difference between measured value at code (0x800) and the ideal value = v dda /2) ---10mv given for a 10-bit input code at v dda = 3.6 v -- 3 lsb given for a 12-bit input code at v dda = 3.6 v -- 12lsb gain error (3) gain error given for a 12-bit input code - - 0.5 % t settling (3) settling time (full scale: for a 12-bit input code transition between the lowest and the highest input codes when dac_out reaches final value 1lsb c load 50 pf, r load 5 k -3 4 s update rate (3) max frequency for a correct dac_out change when small variation in the input code (from code i to i+1lsb) c load 50 pf, r load 5 k -- 1 ms/s docid023353 rev 9 119/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 35. 12-bit buffered /non-buffered dac 1. the dac integrates an output buffer that can be used to r educe the output impedance and to dr ive external loads directly without the use of an external operational amplifier. the buffer can be bypassed by configuring the boffx bit in the dac_cr register. 6.3.20 comparator characteristics t wakeup (3) wakeup time from off state (setting the enx bit in the dac control register) c load 50 pf, r load 5 k -6.5 10 s psrr+ (1) power supply rejection ratio (to v dda ) (static dc measurement c load = 50 pf, no r load 5 k , - ?67 ?40 db 1. guaranteed by design, not tested in production. 2. quiescent mode refers to the state of the dac a keeping steady value on the output, so no dynamic consumption is involved. 3. data based on characterization results, not tested in production. table 75. dac characteristics (continued) symbol parameter conditions min typ max unit 5 / & / % x i i h u h g 1 r q e x i i h u h g ' $ & ' $ & b 2 8 7 [ % x i i h u e l w g l j l w d o w r d q d o r j f r q y h u w h u a i 6 table 76. comparator characteristics (1) symbol parameter conditions min typ max unit v dda analog supply voltage - 2 - 3.6 v v in comparator input voltage range -0-v dda v bg scaler input voltage - - 1.2 - v sc scaler offset voltage - - 5 10 mv t s_sc scaler startup time from power down ---0.1ms t start comparator startup time startup time to reach propagation delay specification - - 60 s electrical characteristics stm32f303xb stm32f303xc 120/143 docid023353 rev 9 t d propagation delay for 200 mv step with 100 mv overdrive ultra-low power mode - 2 4.5 s low power mode - 0.7 1.5 medium power mode - 0.3 0.6 high speed mode v dda 2.7 v - 50 100 ns v dda < 2.7 v - 100 240 propagation delay for full range step with 100 mv overdrive ultra-low power mode - 2 7 s low power mode - 0.7 2.1 medium power mode - 0.3 1.2 high speed mode v dda 2.7 v - 90 180 ns v dda < 2.7 v - 110 300 v offset comparator offset error - - 4 10 mv dv offset /dt offset error temperature coefficient --18- v/ c i dd(comp) comp current consumption ultra-low power mode - 1.2 1.5 a low power mode - 3 5 medium power mode - 10 15 high speed mode - 75 100 v hys comparator hysteresis no hysteresis (compxhyst[1:0]=00) --0- mv low hysteresis (compxhyst[1:0]=01) high speed mode 3 8 13 all other power modes 510 medium hysteresis (compxhyst[1:0]=10) high speed mode 7 15 26 all other power modes 919 high hysteresis (compxhyst[1:0]=11) high speed mode 18 31 49 all other power modes 19 40 1. data guaranteed by design, not tested in production. table 76. comparator characteristics (1) (continued) symbol parameter conditions min typ max unit docid023353 rev 9 121/143 stm32f303xb stm32f303xc electrical characteristics 124 6.3.21 operational am plifier char acteristics table 77. operational amplifier characteristics (1) symbol parameter condition min typ max unit v dda analog supply voltage - 2.4 - 3.6 v cmir common mode input range - 0 - v dda v vi offset input offset voltage maximum calibration range 25c, no load on output. --4 mv all voltage/temp. --6 after offset calibration 25c, no load on output. --1.6 all voltage/temp. --3 vi offset input offset voltage drift - - 5 - v/c i load drive current - - - 500 a iddopamp consumption no load, quiescent mode - 690 1450 a ts_opamp_vout adc sampling time when reading the opamp output. - 400 - - ns cmrr common mode rejection ratio - - 90 - db psrr power supply rejection ratio dc 73 117 - db gbw bandwidth - - 8.2 - mhz sr slew rate - - 4.7 - v/s r load resistive load - 4 - - k c load capacitive load - - - 50 pf voh sat high saturation voltage r load = min, input at v dda . - - 100 mv r load = 20k, input at v dda . --20 vol sat low saturation voltage rload = min, input at 0v - - 100 rload = 20k, input at 0v. --20 ? m phase margin - - 62 - t offtrim offset trim time: during calibration, minimum time needed between two steps to have 1 mv accuracy ---2ms t wakeup wake up time from off state. c load 50 pf, r load 4 k , follower configuration -2.85s electrical characteristics stm32f303xb stm32f303xc 122/143 docid023353 rev 9 pga gain non inverting gain value - -2-- -4-- -8-- -16-- r network r2/r1 internal resistance values in pga mode (2) gain=2 - 5.4/5.4 - k gain=4 - 16.2/5.4 - gain=8 - 37.8/5.4 - gain=16 - 40.5/2.7 - pga gain error pga gain error - -1% - 1% i bias opamp input bias current - - - 0.2 (3) a pga bw pga bandwidth for different non inverting gain pga gain = 2, cload = 50pf, rload = 4 k -4- mhz pga gain = 4, cload = 50pf, rload = 4 k -2- pga gain = 8, cload = 50pf, rload = 4 k -1- pga gain = 16, cload = 50pf, rload = 4 k -0.5- en voltage noise density @ 1khz, output loaded with 4 k -109- @ 10khz, output loaded with 4 k -43- 1. guaranteed by design, not tested in production. 2. r2 is the internal resistance between opamp output and opamp inverting input. r1 is the internal resistance between opamp inverting input and ground. the pga gain =1+r2/r1 3. mostly tta i/o leakage, when used in analog mode. table 77. operational amplifier characteristics (1) (continued) symbol parameter condition min typ max unit nv hz ----------- docid023353 rev 9 123/143 stm32f303xb stm32f303xc electrical characteristics 124 figure 36. opamp voltage noise versus frequency electrical characteristics stm32f303xb stm32f303xc 124/143 docid023353 rev 9 6.3.22 temperature sensor characteristics 6.3.23 v bat monitoring characteristics table 78. ts characteristics symbol parameter min typ max unit t l (1) 1. guaranteed by design, not tested in production. v sense linearity with temperature - 1 2c avg_slope (1) average slope 4.0 4.3 4.6 mv/c v 25 voltage at 25 c 1.34 1.43 1.52 v t start (1) startup time 4 - 10 s t s_temp (1)(2) 2. shortest sampling time can be determined in the application by multiple iterations. adc sampling time when reading the temperature 2.2 - - s table 79. temperature sensor calibration values calibration value name description memory address ts_cal1 ts adc raw data acquired at temperature of 30 c, v dda = 3.3 v 0x1fff f7b8 - 0x1fff f7b9 ts_cal2 ts adc raw data acquired at temperature of 110 c v dda = 3.3 v 0x1fff f7c2 - 0x1fff f7c3 table 80. v bat monitoring characteristics symbol parameter min typ max unit r resistor bridge for v bat -50-k q ratio on v bat measurement -2- er (1) 1. guaranteed by design, not tested in production. error on q -1 - +1 % t s_vbat (1)(2) 2. shortest sampling time can be determined in the application by multiple iterations. adc sampling time when reading the v bat 1mv accuracy 2.2 - - s docid023353 rev 9 125/143 stm32f303xb stm32f303xc package characteristics 138 7 package characteristics 7.1 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. package characteristics stm32f303xb stm32f303xc 126/143 docid023353 rev 9 figure 37. lqfp100 ? 14 x 14 mm, 100-pin low-profile quad flat package outline 1. drawing is not to scale. e ) $ % . 4 ) & ) # ! 4 ) / . 0 ) . ' ! 5 ' % 0 , ! . % m m 3 % ! 4 ) . ' 0 , ! . % $ $ $ % % % + c c c # # , ? - % ? 6 ! ! ! , , c b ! table 81. lqpf100 ? 14 x 14 mm, low-profile quad flat package mechanical data symbol millimeters inches (1) min typ max min typ max a - - 1.60 - - 0.063 a1 0.05 - 0.15 0.002 - 0.0059 a2 1.35 1.40 1.45 0.0531 0.0551 0.0571 b 0.17 0.22 0.27 0.0067 0.0087 0.0106 c 0.09 - 0.2 0.0035 - 0.0079 d 15.80 16.00 16.2 0.622 0.6299 0.6378 d1 13.80 14.00 14.2 0.5433 0.5512 0.5591 d3 - 12.00 - - 0.4724 - e 15.80 16.00 16.2 0.622 0.6299 0.6378 e1 13.80 14.00 14.2 0.5433 0.5512 0.5591 e3 - 12.00 - - 0.4724 - e - 0.50 - - 0.0197 - docid023353 rev 9 127/143 stm32f303xb stm32f303xc package characteristics 138 figure 38. lqfp100 recommended footprint 1. dimensions are in millimeters. l 0.45 0.60 0.75 0.0177 0.0236 0.0295 l1 - 1.00 - - 0.0394 - k 03.57 03.57 ccc - - 0.08 - - 0.0031 1. values in inches are converted fr om mm and rounded to 4 decimal digits. table 81. lqpf100 ? 14 x 14 mm, low-profile quad flat package mechanical data (continued) symbol millimeters inches (1) min typ max min typ max a i c package characteristics stm32f303xb stm32f303xc 128/143 docid023353 rev 9 device marking figure 39. lqfp100 marking (package top view) 1. parts marked as ?es?, ?e? or accompanied by an engineering sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at st charge. in no event, st will be liable for any customer usage of these engineering samples in production. st quality has to be cont acted prior to any decisi on to use these engineering samples to run qualification activity. 0 6 y 9 5 h y l v l r q f r g h 3 u r g x f w l g h q w l i l f d w l r q ' d w h f r g h 3 l q l q g h q w l i l h u 6 7 0 ) 9 & 7 5 < : : 2 s w l r q d o j d w h p d u n docid023353 rev 9 129/143 stm32f303xb stm32f303xc package characteristics 138 figure 40. lqfp64 ? 10 x 10 mm, 64 pin low-profile quad flat package outline 1. drawing is not to scale. : b 0 ( b 9 $ $ $ 6 ( $ 7 , 1 * 3 / $ 1 ( f f f & e & f $ / / . , ' ( 1 7 , ) , & $ 7 , 2 1 3 , 1 ' ' ' h ( ( ( * $ 8 * ( 3 / $ 1 ( p p table 82. lqfp64 ? 10 x 10 mm low-profile quad flat package mechanical data symbol millimeters inches (1) min typ max min typ max a - - 1.60 - - 0.0630 a1 0.05 - 0.15 0.0020 - 0.0059 a2 1.350 1.40 1.45 0.0531 0.0551 0.0571 b 0.17 0.22 0.27 0.0067 0.0087 0.0106 c 0.09 - 0.20 0.0035 0.0079 d 11.80 12.00 12.20 0.4646 0.4724 0.4803 d1 9.80 10.00 10.20 0.3858 0.3937 0.4016 d3 - 7.50 - - 0.2953 - e 11.80 12.00 12.20 0.4646 0.4724 0.4803 package characteristics stm32f303xb stm32f303xc 130/143 docid023353 rev 9 figure 41. lqfp64 recommended footprint 1. dimensions are in millimeters. e1 9.80 10.00 10.20 0.3858 0.3937 0.4016 e3 - 7.50 - - 0.2953 - e - 0.50 - - 0.0197 - l 0.45 0.60 0.75 0.0177 0.0236 0.0295 l1 - 1.00 - - 0.0394 - k 03.57 03.57 ccc - - 0.08 - - 0.0031 1. values in inches are converted from mm and rounded to 4 decimal digits. table 82. lqfp64 ? 10 x 10 mm low-profile quad flat package mechanical data (continued) symbol millimeters inches (1) min typ max min typ max a i b docid023353 rev 9 131/143 stm32f303xb stm32f303xc package characteristics 138 device marking figure 42. lqfp64 marking (package top view) 1. parts marked as ?es?, ?e? or accompanied by an engineering sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at st charge. in no event, st will be liable for any customer usage of these engineering samples in production. st quality has to be cont acted prior to any decisi on to use these engineering samples to run qualification activity. 0 6 y 9 5 h y l v l r q f r g h 6 7 0 ) 3 u r g x f w l g h q w l i l f d w l r q ' d w h f r g h < : : 3 l q l q g h q w l i l h u 5 & 7 5 package characteristics stm32f303xb stm32f303xc 132/143 docid023353 rev 9 figure 43. lqfp48 ? 7 x 7 mm, 48-pin low-profile quad flat package outline 1. drawing is not to scale. " ? - % ? 6 0 ) . ) $ % . 4 ) & ) # ! 4 ) / . c c c # # $ m m ' ! 5 ' % 0 , ! . % b ! ! ! c ! , , $ $ % % % e 3 % ! 4 ) . ' 0 , ! . % + table 83. lqfp48 ? 7 x 7 mm, 48-pin low-profile quad flat package mechanical data symbol millimeters inches (1) min typ max min typ max a - - 1.60 - - 0.0630 a1 0.05 - 0.15 0.0020 - 0.0059 a2 1.35 1.40 1.45 0. 0531 0.0551 0.0571 b 0.17 0.22 0.27 0.0067 0.0087 0.0106 c 0.09 - 0.20 0.0035 - 0.0079 d 8.80 9.00 9.20 0.3465 0.3543 0.3622 d1 6.80 7.00 7.20 0. 2677 0.2756 0.2835 d3 - 5.50 - - 0.2165 - e 8.80 9.00 9.20 0.3465 0.3543 0.3622 e1 6.80 7.00 7.20 0. 2677 0.2756 0.2835 e3 - 5.50 - - 0.2165 - e - 0.50 - - 0.0197 - docid023353 rev 9 133/143 stm32f303xb stm32f303xc package characteristics 138 figure 44. lqfp48 recommended footprint 1. dimensions are in millimeters. l 0.45 0.60 0.75 0.0177 0.0236 0.0295 l1 - 1.00 - - 0.0394 - k03.57 03.57 ccc - - 0.08 - - 0.0031 1. values in inches are converted from mm and rounded to 4 decimal digits. table 83. lqfp48 ? 7 x 7 mm, 48-pin low-profile quad flat package mechanical data (continued) symbol millimeters inches (1) min typ max min typ max a i d package characteristics stm32f303xb stm32f303xc 134/143 docid023353 rev 9 device marking figure 45. lqfp48 marking (package top view) 1. parts marked as ?es?, ?e? or accompanied by an engineering sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at st charge. in no event, st will be liable for any customer usage of these engineering samples in production. st quality has to be cont acted prior to any decisi on to use these engineering samples to run qualification activity. 3 u r g x f w l g h q w l i l f d w l r q 4 5 . ' $ $ 5 3 : 8 8 3 l q l g h q w l i l f d w l r q 5 h y l v l r q f r g h ' d w h f r g h 0 6 9 docid023353 rev 9 135/143 stm32f303xb stm32f303xc package characteristics 138 7.2 thermal characteristics the maximum chip junction temperature (t j max) must never exceed the values given in table 24: general operating conditions on page 58 . the maximum chip-junction temperature, t j max, in degrees celsius, may be calculated using the following equation: t j max = t a max + (p d max x ja ) where: ? t a max is the maximum ambient temperature in c, ? ja is the package junction-to-ambient thermal resistance, in c/w, ? p d max is the sum of p int max and p i/o max (p d max = p int max + p i/o max), ? p int max is the product of i dd and v dd , expressed in watts. th is is the maximum chip internal power. p i/o max represents the maximum power dissipation on output pins where: p i/o max = (v ol i ol ) + ((v dd ? v oh ) i oh ), taking into account the actual v ol / i ol and v oh / i oh of the i/os at low and high level in the application. 7.2.1 reference document jesd51-2 integrated circuits thermal test method environment conditions - natural convection (still air). available from www.jedec.org table 84. package thermal characteristics symbol parameter value unit ja thermal resistance junction-ambient lqfp64 - 10 10 mm / 0.5 mm pitch 45 c/w thermal resistance junction-ambient lqfp48 - 7 7 mm 55 thermal resistance junction-ambient lqfp100 - 14 14 mm / 0.5 mm pitch 41 package characteristics stm32f303xb stm32f303xc 136/143 docid023353 rev 9 7.2.2 selecting the product temperature range when ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in section 8: part numbering . each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and, to a spec ific maximum junction temperature. as applications do not commonly use the stm32f303xb/stm32f303xc at maximum dissipation, it is useful to calculate the exact power consumption and junction temperature to determine which temper ature range will be best su ited to the application. the following examples show how to calculat e the temperature range needed for a given application. example 1: high-performance application assuming the following ap plication conditions: maximum ambient temperature t amax = 82 c (measured according to jesd51-2), i ddmax = 50 ma, v dd = 3.5 v, maximum 3 i/os used at the same time in output at low level with i ol = 8 ma, v ol = 0.4 v and maximum 2 i/os used at the same time in output at low level with i ol = 20 ma, v ol = 1.3 v p intmax = 50 ma 3.5 v= 175 mw p iomax = 3 8 ma 0.4 v + 2 20 ma 1.3 v = 61.6 mw this gives: p intmax = 175 mw and p iomax = 61.6 mw: p dmax = 175 + 61.6 = 236.6 mw thus: p dmax = 236.6 mw using the values obtained in table 84 t jmax is calculated as follows: ? for lqfp64, 45c/w t jmax = 82 c + (45c/w 236.6 mw) = 82 c + 10.65 c = 92.65 c this is within the range of the suffix 6 version parts (?40 < t j < 105 c). in this case, parts must be ordered at leas t with the temperature range suffix 6 (see section 8: part numbering ). docid023353 rev 9 137/143 stm32f303xb stm32f303xc package characteristics 138 example 2: high-temperature application using the same rules, it is possible to address applications that run at high ambient temperatures with a low dissipation, as long as junction temperature t j remains within the specified range. assuming the following ap plication conditions: maximum ambient temperature t amax = 115 c (measured according to jesd51-2), i ddmax = 20 ma, v dd = 3.5 v, maximum 9 i/os used at the same time in output at low level with i ol = 8 ma, v ol = 0.4 v p intmax = 20 ma 3.5 v= 70 mw p iomax = 9 8 ma 0.4 v = 28.8 mw this gives: p intmax = 70 mw and p iomax = 28.8 mw: p dmax = 70 + 28.8 = 98.8 mw thus: p dmax = 98.8 mw using the values obtained in table 84 t jmax is calculated as follows: ? for lqfp100, 41c/w t jmax = 115 c + (41c/w 98.8 mw) = 115 c + 4.05 c = 119.05 c this is within the range of the suffix 7 version parts (?40 < t j < 125 c). in this case, parts must be ordered at leas t with the temperature range suffix 7 (see section 8: part numbering ). part numbering stm32f303xb stm32f303xc 138/143 docid023353 rev 9 8 part numbering table 85. ordering information scheme example: stm32f303 r b t 6 xxx device family stm32 = arm-based 32-bit microcontroller product type f = general-purpose device subfamily 303 = stm32f303xx pin count c = 48 pins r = 64 pins v = 100 pins flash memory size b = 128 kbytes of flash memory c = 256 kbytes of flash memory package t = lqfp temperature range 6 = industrial temperature range, ?40 to 85 c 7 = industrial temperature range, ?40 to 105 c options xxx = programmed parts tr = tape and reel docid023353 rev 9 139/143 stm32f303xb stm32f303xc revision history 142 9 revision history table 86. document revision history date revision changes 22-jun-2012 1 initial release 07-sep-2012 2 modified features on cover page. modified table 2: stm32f301xx family device features and peripheral counts added clock tree to section 3.9: clocks and startup added table 7: stm32f303xb/stm32f303xc i2c implementation added table 8: usart features added table 9: stm32f303xb/stm32f303xc spi/i2s implementation modified table 10: capacitive sensing gpios available on stm32f303xb/stm32f303xc devices modified figure 4 , figure 5 and figure 6: stm32f303xb/stm32f303xc lqfp100 pinout modified table 13: stm32f303xb/stm32f303xc pin definitions modified figure 10: power supply scheme modified table 21: voltage characteristics modified table 22: current characteristics modified table 25: operating conditions at power-up / power-down added footnote to table 31: typical and maximum current consumption from the vdda supply added footnote to table 35 and table 36: typical current consumption in sleep mode, code running from flash or ram removed table ?switching output i/ o current consumption? and table ?peripheral current consumption? added note under figure 16: typical application with a 32.768 khz crystal updated table 49: hsi oscillator characteristics updated wakeup time from low-power mode and table 39: low-power mode wakeup timings updated table 47: flash memory characteristics updated table 52: electrical sensitivities updated table 53: i/o current injection susceptibility updated table 54: i/o static characteristics updated table 55: output voltage characteristics updated table 57: nrst pin characteristics updated table 63: spi characteristics updated table 64: i2s characteristics corrected lqfp100 in section 7.2.3: selecting the product temperature range 21-sep-2012 3 updated table 63: spi characteristics revision history stm32f303xb stm32f303xc 140/143 docid023353 rev 9 05-dec-2012 4 updated first page removed references to vddsdx and vsssd added reference to pm0214 in section 1 moved temp. sensor calibartion values to table 79 and vref calibration values to table 29 updated table 3: stm32f303xx family device features and peripheral counts updated section 3.4: embedded sram updated section 3.2: memory protection unit (mpu) updated section 3.24: universal serial bus (usb) modified section 3.26: touch sens ing controller (tsc) updated heading of table 8: usart features updated table 13: stm32f303xb/stm32f303xc pin definitions added notes to pc13, pc14 and pc15 in table 13: stm32f303xb/stm32f303xc pin definitions updated figure 10: power supply scheme modified table 21: voltage characteristics modified table 22: current characteristics modified table 24: general operating conditions modified figure 12: typical vbat current consumption (lse and rtc on/lsedrv[1:0] = ?00?) updated section 6.3.14: i/o port characteristics updated table 30: typical and maximum current consumption from vdd supply at vdd = 3.6v and table 31: typical and maximum current consumption from the vdda supply updated table 32: typical and maximum vdd consumption in stop and standby modes and table 33: typical and maximum vdda consumption in stop and standby modes updated table 34: typical and maximum current consumption from vbat supply added figure 12: typical vbat current consumption (lse and rtc on/lsedrv[1:0] = ?00?) updated table 35: typical current consum ption in run mode, code with data processing running from flash and table 36: typical current consumption in sleep mode, code running from flash or ram added table 38: peripheral current consumption added table 37: switching output i/o current consumption updated section 6.3.6: wakeup time from low-power mode modified esd absolute maximum ratings modified table 55: output voltage characteristics updated emi characteristics updated table 56: i/o ac characteristics updated table 53: i/o current injection susceptibility updated table 58: timx characteristics updated section 7.2: thermal characteristics added table 69: maximum adc rain added table 70: adc accuracy - limited test conditions, 100-pin packages updated table 64: adc accuracy - limited test conditions 2) updated table 75: dac characteristics updated table 77: operational amplifier characteristics updated figures and tables in section 7: package characteristics table 86. document revision history (continued) date revision changes docid023353 rev 9 141/143 stm32f303xb stm32f303xc revision history 142 08-jan-2013 5 updated v hys and i lkg in table 54: i/o static characteristics . updated v il(nrst) , v ih(nrst) , and v nf(nrst) in table 57: nrst pin characteristics . updated table 70: adc accuracy - limited test conditions, 100-pin packages and table 64: adc accuracy - limited test conditions 2) . 24-jun-2013 6 replaced cortex-m4f with cortex m4 with fpu updated core, memories and spi bullet points in features removed 8kb ccm sram from stm32f302xx devices, updated figure 1: stm32f303xb/stm32f303xc block diagram and table 3: stm32f303xx family device features and peripheral counts updated section 3.4: embedded sram added vref+ in section 3.14: digital-to-analog converter (dac) removed dma support for uart5 in table 8: usart features added ?reference clock detection? bullet in section 3.18: real-time clock (rtc) and backup registers added paragraph ?the touch sensing controller is fully...? in section 3.26: touch sensing controller (tsc) updated comparison of i2c analog and digital filters updated section 3.10: general-purpo se input/outputs (gpios) added ?eventout? in table 13: stm32f303xb/stm32f303xc pin definitions and added note to ?vref+? pin updated i vdd in table 22: current characteristics and output driving current updated table 61: i2c timings specification (see i2c specification, rev.03, june 2007) and figure 24: i2c bus ac waveforms and measurement circuit added vref+ row to table 68: adc characteristics , replaced vdda with vref+, updated t conv and added note to ?conversion voltage range added vref+ row to table 75: dac characteristics and replaced vdda with vref+ added ?pga bw? and ?en? in table 77: operational amplifier characteristics 13-nov-2013 7 removed stm32f302xb/stm32f302xc products (now in a separate datasheet). added i2s feature for spi2 and spi3 added t sp to table 61: i2c timings specification (see i2c specification, rev.03, june 2007) . renamed t sp to t an in table 62: i2c analog filter characteristics . added t stab in table 68: adc characteristics renamed v opampx to vrefopampx updated table 71: adc accuracy, 100-pin packages . updated adc channel names in section 3.13.1 , section 3.13.2 and section 3.13.3 . table 86. document revision history (continued) date revision changes revision history stm32f303xb stm32f303xc 142/143 docid023353 rev 9 18-apr-2014 8 updated table 50: emi characteristics conditions :3.3v replaced by 3.6v. updated section 6.3.17: communications interfaces i 2 c interface. updated table 77: operational amplifier characteristics adding ts_opamp_vout row. updated section 3.13: fast analog-to-digital converter (adc) . updated arm and cortex trademark. updated table 32: typical and maximum vdd consumption in stop and standby modes with max value at 85c and 105c. updated table 70: adc accuracy - limited test conditions, 100-pin packages and table 71: adc accuracy, 100-pin packages for 100-pin package. added table 72: adc accuracy - limited test conditions, 64-pin packages and table 73: adc accuracy, 64-pin packages for 64-pin package. added table 74: adc accuracy at 1msps for 1msps sampling frequency. updated table 63: spi characteristics . updated table 75: dac characteristics . 09-dec-2014 9 updated core description in cover page. updated hsi characteristics table 44: hsi oscillator characteristics and figure 17: hsi oscillator accuracy characterization results for soldered parts . updated table 58: timx characteristics . updated table 13: stm32f303xb/stm32f303xc pin definitions adding note for i/os featuring an analog output function (dac_out,opamp_out). updated table 68: adc characteristics adding idda & iref consumptions. added figure 31: adc typical current consumption on vdda pin and figure 32: adc typical current consumption on vref+ pin . added section 3.8: interconnect matrix . updated figure 2: clock tree . added note after table 32: typical and maximum vdd consumption in stop and standby modes . updated section 7.1: package mechanical data with new lqfp100, lqfp64, lqfp48 package marking. updated table 13: stm32f303xb/stm32f303xc pin definitions and alternate functions tables replacing usart_rts by usart_rts_de. table 86. document revision history (continued) date revision changes docid023353 rev 9 143/143 stm32f303xb stm32f303xc 143 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 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