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product structure : silicon integrated circuit this product has no designed protection against radioactive rays . 1/ 20 tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 16 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 ? 14 ? 001 tsz22111 ? 14 ? 001 2016.09.21 rev. 001 2ch digital isolator isolation voltage 2500 vrms bi - direction 2ch high s peed digital isolator bm67421fv - c general description t he bm67421fv - c is a high - speed isolator ic. this ic features dielectric strength of 2500 vrms between i/o. max imum propagation delay time is 40ns . features ? dielectric strength of 2500 vrms between i/o ? a vailable with 5v signal transmissions ? maximum propagation delay time of 40ns ? built - in 2ch bi - directional propagation ? aec - q100 qualified (note1) ( note 1 :grade1) applications ? p ropagation of logic signal within electric and hybrid vehicles ? propagation of logic signal within industrial devices key specification ? supply voltage range: 4.5 v to 5.5v ? propagation delay: 40ns (max) ? operating temperature range: -40 to +125 package w(typ) x d(typ) x h(max) ssop - b10w 3.50mm x 10.2mm x 1.90mm block diagram/typical application circuit vcc1 gnd1 lvg (note 2 ) uvlo uvlo 7 8 9 6 10 1 5 4 3 2 gnd2 out1 in2 in1 out2 vcc2 hvg (note2) note 2 please connect bypass capacitor (0.1 f or more) directly to the ic pin. ssop - b10w datashee t
2 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 contents general description ................................ ................................ ................................ ................................ ................................ ........ 1 features ................................ ................................ ................................ ................................ ................................ .......................... 1 applications ................................ ................................ ................................ ................................ ................................ .................... 1 key specification ................................ ................................ ................................ ................................ ................................ ............ 1 block diagram/typical application circuit ................................ ................................ ................................ ................................ ......... 1 recommended range of external constants ................................ ................................ ................................ ................................ . 3 pin configura tions ................................ ................................ ................................ ................................ ................................ .......... 3 pin description ................................ ................................ ................................ ................................ ................................ ................ 3 description of operation ................................ ................................ ................................ ................................ ................................ . 4 timing char t ................................ ................................ ................................ ................................ ................................ .................... 5 absolute maximum ratings ................................ ................................ ................................ ................................ ............................ 6 thermal resistance (note 6) ................................ ................................ ................................ ................................ ............................... 7 insu lation related characteristics ................................ ................................ ................................ ................................ .................. 7 physical dimension, tape and reel information ................................ ................................ ................................ ........................... 19 revision history ................................ ................................ ................................ ................................ ................................ ............ 20
3 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 recommended r ange of e xternal c onstants pin name symbol recommended value unit min typ max vcc1 c vcc1 0.1 ( note 3 ) 1.0 - f vcc2 c vcc2 0.1 (note 3 ) 1.0 - f (note 3 ) the temperature characteristic capacitance of the capacitor, dc bias chara cteristics, please be set so that it does not fall below th e minimum value in consideration of the like. pin con f iguration s pin description no. pin name function no. pin name function 1 gnd1 ground 1 10 gnd 2 ground 2 2 vcc1 power supply 1 9 vcc2 power supply 2 3 out2 output 2 8 in2 input 2 4 in1 input 1 7 out1 output 1 5 gnd1 ground 6 gnd 2 ground 2 gnd 2 gnd 1 1 0 1 9 2 8 3 7 4 vcc2 vcc1 6 5 in2 out2 out1 in1 gnd 1 gnd 2 (top view)
4 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 description of operation 1) input/output logic the input/output logic levels for the bm67421fv - c are as shown in the table below : no. vcc1 vcc2 in1 in2 out1 out2 1 uvlo uvlo x x h h 2 uvlo x x x h h 3 x uvlo x x h h 4 active active l l l l 5 active active l h l h 6 active active h l h l 7 active active h h h h since pull up/pull down resistor has n ot been connected to in1 and in2 pins, it is necessary to connect external resistor to in1 and in2 pins depending on the application. 2 ) output pin voltage logic levels for out1 and out2 pins are indicated in the truth table. however, it may be assumed th at such logic levels disable the output circuit to fully turn on at a low voltage when turning on or off the power supply, thus putting the output pin into the high impedance state. 3) power supply monitoring function this ic has a built - in power supply m onitoring function which monitors vcc2 (vcc1) from vcc1 (vcc2). it is assumed that an abnormal state occurs when vcc2 (vcc1) is controlled by the uvlo function for the period of time longer than the power supply monitoring time (40 sec (typ)), and then out 2 (out1) ehfrphv h . while power on, after the control of the uvlo function is reset as well as vcc1 and vcc2 and the power monitoring time (40 sec (typ)) has passed, the logic of in1 and in2 is reflected to both out1 and out2. until the logic of in1 and i n2 is reflected to out1 and out2, they remain 3 h . 4) under voltage lock out (uvlo) function masking time this ic provides masking time for the uvlo function to prevent the function from malfunctioning with noises. the masking time is set to 2.5 sec (typ ). the masking time is applied when the uvlo function is on. it is not applied when the uvlo function is off. 5) under voltage lock out (uvlo) function this ic has a built - in uvlo function to prevent the ic from malfunctioning whenever the power supply vo ltage drops. it triggers the uvlo state when vcc1 pin and vcc2 pin are changed to 4.0 v (typ) or less and becomes in operational state when changed to 4.2 v (typ) or more. when vcc2 is 4.2 v (typ) or more and vcc1 pin voltage drops below 4.0 v (typ),the output logic of out2 pin becomes 3 h and the output logic of out1 pin becomes 3 h after the power supply monitoring time has passed. when vcc1 is 4.2 v (typ) or more and vcc 2 pin voltage drops below 4.0 v (typ), the output logic of out1 pin becomes 3 h and the output logic of out2 pin becomes 3 h after the power supply monitoring time has passed. when vcc1 pin voltage is 4.2 v (typ) or more and vcc2 pin voltage changes from 4 .0 v (typ) or less to 4.2 v (typ) or more, the output logic of out2 pin changes according to the input logic of input in2 pin, and the output logic of out1 pin changes according to the input logic of input in1 pin. when vcc2 pin voltage is 4.2 v (typ) or mo re and vcc2 pin voltage changes from 4.0 v (typ) or less to 4.2 v (typ) or more, the output logic of out1 pin changes according to the input logic of input in1, and the output logic of out2 pin changes according to the input logic of input in 2 pin.
5 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 timin g chart figure 1 . vcc1 vcc2 at start, vcc1 vcc2 at stop figure 2 . vcc1 vcc2 at start, vcc2 vcc1 at stop in2 in 1 power supply monitoring time ( typ10 s) power supply monitoring time ( typ30 s) mask time ( typ 2.5 s) vcc1 vcc 2 out1 out2 uvlo off uvlo uvlo off uvlo in2 in 1 in 1 in 2 in2 in2 in 1 power supply monitoring time ( typ10 s) power supply monitoring time ( typ30 s) mask time ( typ 2.5 s) vcc1 vcc 2 out1 out2 uvlo off uvlo uvlo off uvlo
6 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 timing chart figure 3 . vcc2 vcc1 at start, vcc1 vcc2 at stop figure 4 . vcc2 vcc1 at start, vcc2 vcc1 at stop power supply monitoring time ( typ30 s) mask t ime ( typ 2.5 s) uvlo off uvlo uvlo off uvlo in2 in2 in 1 vcc1 vcc 2 out1 out2 power supply monitoring time ( typ10 s) in2 in 1 vcc1 vcc 2 out1 out2 uvlo off uvlo uvlo off uvlo power supply monitoring time ( typ10 s) power supply monitoring time ( typ30 s) mask t ime ( typ 2.5 s)
7 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 absolute maximum ratings parameter symbol rating unit power supply voltage 1 v cc1 7.0 (note 4 ) v power supply voltage 2 v cc2 7.0 (note 5 ) v in1 pin volta ge v in1 - 0.3 ~ 7.0 (note 4 ) v in2 pin voltage v in2 - 0.3 ~ 7.0 (note 5 ) v out1 pin voltage v out1 - 0.3 ~ 7.0 (note 5 ) v out2 pin voltage v out2 - 0.3 ~ 7.0 (note 4 ) v output current i omax 10 (note 6 ) ma operating temperature range t opr - 40 ~ 125 c storage t e mperature range t stg - 55 ~ 150 c maximum junction temperature t jmax 150 c (note 4 ) reference to gnd1 (note 5 ) reference to gnd2 (note 6 ) should not exceed pd and aso . caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ra tings. thermal resistance ( note 7 ) parameter symbol thermal resistance (typ) unit 1s ( note 8 ) 2s2p ( note 9 ) junction to ambient j a 180.2 108.9 c /w junction to top characterization parameter ( note 10 ) jt 82 60 c /w (note 7 ) based on jesd 51 - 2a ( still - air) (note 8 ) using a pcb board based on jesd 51 - 3. (note 9 ) using a pcb board based on jesd 51 - 7. (note 10 ) the thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surfa ce of the component package. recommended operating ratings parameter symbol rating unit power supply voltage 1 v cc1 (note 11 ) 4.5 ~ 5.5 v power supply voltage 2 v cc2 (note 12 ) 4.5 ~ 5.5 v (note 11 ) reference to gnd1 (note 12 ) reference to gnd2 insulat ion related characteristics parameter symbol characteristic unit insulation resistance (v io =500v) r s >10 9 insulation withstand voltage (1min.) v iso 2500 vrms insulation test voltage (1s) v iso 3000 vrms
8 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 electrical characteristics (all values at ta= - 40 c to 125 c and vcc1=vcc2=4.5v to 5.5v, unless otherwise specified) parameter symbol limit unit conditions min typ max vcc1 power supply current , dc i cc1q - 0. 3 5 0. 8 0 ma v in = 0 or vcc vcc2 power supply current , dc i cc2q - 0. 3 5 0. 8 0 ma v in = 0 or vcc vcc1 power supply current , 500k bps i cc 50 0k1 - 0.6 1.8 ma f in : 250 khz vcc2 power supply current , 50 0k bps i cc 50 0k2 - 0.6 1.8 ma f in : 250 khz high - level output voltage v oh v cc - 0. 4 v cc - 0. 2 vcc v i o = - 4 ma low - level ou tput voltage v ol 0 0.2 0.4 v i o = 4 ma input current i in - 0 10 a v in =vcc high - level input threshold v inh v cc 0.7 - v cc v low - level input threshold v i nl 0 - v cc 0.3 v propagation delay (l ow to high ) t plh - 25 40 ns propagation delay (h igh to low ) t phl - 25 40 ns propagation distortion |t plh - t phl | - 0 10 ns m aximum data rate f in 10 - - mbps rise time t r - 2.5 - ns fall time t f - 2.5 - ns common - mode transient immunity cm ac 25 35 - kv /s input/output timing figure 5 . input/output timing chart in1, in2 out1, out2 10% 90% 90% 10% 50% 50% tr tplh tphl tf 50% 50%
9 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 typical performance curve (reference data) figure 8 . circuit current vs supply voltage figure 9 . circuit current vs supply voltage (vcc 2 power supply current, dc (vcc 2 power supply current, dc in1=gnd1, in2=gnd2) in1 =vcc1, in2=vcc2) figure 6 . circuit current vs supply voltage figure 7 . circuit current vs supply voltage (vcc1 power supply current, dc ( vcc 1 power supply current, dc in1=gnd1, in2=gnd2) in1=vcc1, in2=vcc2) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 4.50 4.75 5.00 5.25 5.50 supply voltage : vcc [v] circuit current : icc [ma] 125c 25c -40c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 4.50 4.75 5.00 5.25 5.50 supply voltage : vcc [v] circuit current : icc [ma] 125c 25c -40c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 4.50 4.75 5.00 5.25 5.50 supply voltage : vcc [v] circuit current : icc [ma] 125c 25c -40c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 4.50 4.75 5.00 5.25 5.50 supply voltage : vcc [v] circuit current : icc [ma] 125c 25c -40c
10 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 typical performance curve (reference data) figure 1 0 . circuit current vs supply voltage figure 1 1 . circuit current vs supply voltage (vcc1 power supp ly current, vcc1,vcc2 >; 4.5v ) (vcc1 power supply current, vcc1,vcc2 >; 5 .0 v ) figure 1 2 . circuit current vs supply voltage figure 1 3 . circuit current vs supply voltage (vcc1 power supply current, vcc1,vcc2 >; 5.5v ) (vcc 2 power supply current, vcc1,vcc2 >; 4.5v ) 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current : icc[ma] 25c -40c 125c 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current :icc[ma] 25c -40c 125c 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency :[mbps] circuit current :icc[ma] 25c -40c 125c 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current : icc[ma] 25c -40c 125c
11 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 typical performance curve (reference data)) fig .13 vcc1 7 ;7v @dc figure 1 4 . circuit current vs supply voltage figure 1 5 . circuit current vs supply voltage (vcc2 power suppl y current, vcc1,vcc2 >; 5 .0 v ) (vcc 2 power supply current, vcc1,vcc2 >; 5.5v ) figure 1 6 . output voltage vs output current figure 1 7 . output voltage vs output current (high - level output voltage, vcc1,vcc2 >; 4.5v) (high - level output voltage, vcc1,vcc2 >; 5 .0 v) 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current icc[ma] 25c -40c 125c 0.0 0.5 1.0 1.5 2.0 0.0 0.2 0.4 0.6 0.8 1.0 input frequency : [mbps] circuit current : icc[ma] 25c -40c 125c 4.0 4.2 4.4 4.6 4.8 5.0 0 2 4 6 8 10 output current : l o [ma] output voltage : v oh [v] 25c -40c 125c 3.5 3.7 3.9 4.1 4.3 4.5 0 2 4 6 8 10 output current : l o [ma] output voltage : v oh [v] 25c -40c 125c
12 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 typical performance curve (reference data) figure 18 . output voltage vs output current figure 19 . output voltage vs output current (high - level output voltage, vcc1,vcc2 >; 5.5v) (low - level output voltage, vcc1,vcc2 >; 4.5v) figure 2 0 . output voltage vs output current figure 2 1 . output voltage vs output current (low - level output voltage, vcc1,vcc2 >; 5 .0 v) (low - level output voltage, vcc1,vcc2 >; 5.5v) 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 output current : l o [ma] output voltage : v ol [v] 25c -40c 125c 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 output current : l o [ma] output voltage : v ol [v] 25c -40c 125c 0.0 0.2 0.4 0.6 0.8 1.0 0 2 4 6 8 10 output current : l o [ma] output voltage : v ol [v] 25c -40c 125c 4.5 4.7 4.9 5.1 5.3 5.5 0 2 4 6 8 10 output current : l o [ma] output voltage : v oh [v] 25c -40c 125c
13 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 typical performance curve (reference data) figure 2 2 . input current vs input voltage figure 2 3 . output voltage vs input voltage (input current at input pin) (high - /low - level input threshold, vcc1,vcc2 >; 4.5v) figure 2 4 . output voltage vs input voltage figure 2 5 . output voltage vs input voltage (high - /low - level input threshold, vcc1,vcc2 >; 5 .0 v) (high - /low - level input threshold, vcc1,vcc2 >; 5 .5v) -0.5 0.5 1.5 2.5 3.5 4.5 5.5 0 1 2 3 4 5 input voltage : v in [v] output voltage : [v] 125c -40c 25c 125c 25c -40c -2 0 2 4 6 8 10 0 1 2 3 4 5 input voltage : v in [v] input current : [a] 125c 25c -40c -0.5 0.5 1.5 2.5 3.5 4.5 5.5 0 1 2 3 4 5 input voltage : v in [v] output voltage : [v] 125c 25c -40c 125c 25c -40c -0.5 0.5 1.5 2.5 3.5 4.5 5.5 0 1 2 3 4 5 input voltage : v in [v] output voltage : [v] 125c 25c -40c 125c 25c -40c
14 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 typical performance curve (reference data) figure 2 6 . propagation delay vs temperature figure 2 7 . propagation delay vs temperature ( vcc1, vcc 2 = 4.5v) ( vcc1, vcc 2 = 5.0v) figure 28 . propagation delay vs temperature ( vcc1, vcc 2 = 5.5v) 20 25 30 35 40 -50 -25 0 25 50 75 100 125 150 temperature : [ 20 25 30 35 40 -50 -25 0 25 50 75 100 125 150 temperature : [ 20 25 30 35 40 -50 -25 0 25 50 75 100 125 150 temperature : [
15 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 i/o equivalent circ uit figure 29 . in1, in2 figure 3 0 . out1, out2 in1 in2 vcc1 vcc2 out 2 gnd 1 vcc 1 gnd 1 gnd 2 vcc2 out1 gnd 2
16 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ec autions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensur e that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the maximum junction temperature ra ting be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction t emperature rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush c urrent when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefo re, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the i c to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ,&?vsrzhuvxsso\ should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transpor t and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , po wer supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pin s input p in s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is e nough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pin s should be connected to the power supply or ground line.
17 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 operational notes 12. regard ing the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occu r in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gn d voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 31 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with tempera ture and the decrease in nominal capacitance due to dc bias and others. n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
18 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 ordering information b m 6 7 4 2 1 f v - ce 2 part number package fv : ssop - b 10w packaging and forming specification e2: embossed tape a nd reel marking diagram ssop - b10w(top view) b m 6 7 4 2 1 part number marking lot number 1pin mark
19 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 physical dimension , tape and reel information package name ssop - b10w
20 / 20 bm67421fv - c tsz02201 - 0 81 8a bg 0001 0 - 1 - 2 ? 20 1 6 rohm co., ltd. all rights reserved. www.rohm.co.jp tsz22111 15 001 2016.09.21 rev. 001 revision history date revision changes 21 . sep .201 6 001 new release
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. ( n ote1) m edical equipment classifica tion of the specific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a cert ain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the f ollowing are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any specia l or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our products in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cle aning residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proof design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation o f performance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under de viant condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products, please consult with th e rohm representative in advance. for details , please refer to rohm mounting specification
notice - p a a - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin con sidering variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contain ed in this document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contain ed in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive pr oduct, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condi tion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connecti ons may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are e xposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaut ion for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all informa tion and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third pa rty regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or impli ed, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the pr oducts may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated com panies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bm67421fv-c package ssop-b10w unit quantity 1500 minimum package quantity 1500 packing type taping constitution materials list inquiry rohs yes bm67421fv-c - web page

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