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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 19 ? 2017 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 600v high voltage high & low-side, gate driver bs 2114 f general description the bs21 14 f is a monolithic high and low side gate drive ic, which can drive high speed power mosfet and igbt driver with bootstrap operation. the floating channel can be used to drive an n-channel power mosfet or igbt in the high side configuration which operates up to 600v. the logic inputs can be used 3.3v and 5.0v. the under voltage lockout (uvlo) circuit prevents malfunction when vcc and vbs are lower than the specified threshold voltage. features ? floating channels for bootstrap operation to +600v ? gate drive supply range from 10v to 20 v ? built-in under voltage lockout for both channels ? 3.3v and 5.0v input logic compatible ? output in phase with in put applications ? mosfet and igbt high side driver applications key specifications ? high-side floating supply voltage: 600v ? output voltage range: 10v to 20 v ? min output current io+/ io -: 500ma/500ma ? turn-on/off time: 25 0ns(typ) ? dead time: 16 0ns(typ) ? delay matching: 50ns (max) ? offset supply leakage current: 50a (max) ? operating temperature range: - 40 c to + 125 c package w(typ) x d(typ) x h(max ) sop-8 5.00mm x 6.20mm x 1. 71 mm typical application circuits lin hin vcc com vb ho vs lo to lord vcc hin lin up to 600v figure 1. typical application circuit to load
2/ 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 hin hv level shifter pulse filter uv detect r r s q vb ho vs delay vcclo com drv drv uv detect lin shoot- through prevention pulse generator pin configuration pin description pin no. symbol function 1 lin logic input for low side gate driver output 2 hin logic input for high side gate driver output 3 vcc low side supply voltage 4 com low side return 5 lo low side gate drive output 6 vs high side floating supply return 7 ho high side gate drive output 8 vb high side floating supply block diagram figure 2. pin configuration (top view) vb ho lo lin hin vcc com vs 7 8 6 5 3 4 2 1 figure 3. functional block diagram
3/ 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 absolute maximum ratings parameter symbol min max unit high side offset voltage v s v b -25 v b +0.3 v high side floating supply voltage v b -0.3 +625 v high side floating output voltage ho v ho v s -0.3 v b +0.3 v low side and logic fixed supply voltage v cc -0.3 +25 v low side output voltage lo v lo -0.3 v cc +0.3 v logic input voltage (hin, lin) v in -0.3 v cc +0.3 v logic ground com v cc -25 v cc +0.3 v allowable offset voltage slew rate dv s /dt - 50 v/ns junction temperature tjmax - 150 c storage temperature tstg -55 + 150 c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. thermal resistance (note 1) parameter symbol thermal resistance (typ) unit 1s (note 3) 2s2p ( note 4) sop-8 junction to ambient ja 197.4 109.8 c /w junction to top characterization parameter (note 2) jt 21 19 c /w (note 1) based on jesd 51 -2a(still-air) (note 2) the thermal characterization parameter to report the differe nce between junction temperature and the temperature at the top center of the outside surface of the component package. (note 3) using a pcb board based on jesd 51 - 3. layer number of measurement board material bo ard size single fr -4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and traces 70 m (note 4) using a pcb board based on jesd 51 - 7. layer number of measurement board material board size 4 layers fr -4 114.3mm x 76.2mm x 1.6mmt top 2 internal layers bottom copper pattern thickness copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2 mm 35 m 74.2mm x 74.2 mm 70 m
4/ 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 recommended operating ratings parameter symbol min max unit high side floating supply voltage v b v s +10 v s + 20 v high side floating supply offset voltage v s - 600 v high side (ho) output voltage v ho v s v b v low side (lo) output voltage v lo com v cc v logic input voltage (hin, lin) v in com v cc v low side supply voltage v cc 10 20 v ambient temperature t a - 40 + 125 c
5/ 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 dc operation electrical characteristics (unless otherwise specif ied : ta=25c, v cc =15v,v bs =15v,v s =com,c l = 1000pf ) parameter symbol limits unit conditions min typ max v cc and v bs supply undervoltage positive going threshold v ccuv+ v bsuv+ 8 8.9 9.8 v v cc and v bs supply undervoltage negative going threshold v ccuv - v bsuv- 7.4 8.2 9 v cc and v bs supply undervoltage lockout hysteresis v ccuvh v bsuvh 0.3 0.7 - offset supply leakage current i lk - - 50 a v b = v s = 600v quiescent v bs supply current i qbs 20 60 150 v in = 0v or 5v quiescent v cc supply current i qcc 50 120 240 v in = 0v or 5v logic 1 input voltage v ih 2.6 - - v logic 0 input voltage v il - - 0.8 high level output voltage, v cc (v bs ) - v o v oh - - 0.5 i o = 20ma low level output voltage, v o v ol - - 0.5 logic 1 input bias current i in+ - 50 80 a v in = 5v logic 0 input bias current i in - - 1.0 2.0 v in = 0v output high short circuit pulse current i o+ - 500 - ma v o = 0v pulse width 10s output low short circuit pulsed current i o- - 500 - v o = 15 v pulse width 10s ac operation electrical characteristics (unless otherwise specified: ta=25c, v cc =15v,v bs =15v,v s =com,c l =1000pf) parameter symbol limits unit conditions min typ max turn-on propagation delay t on 1 50 2 50 3 70 ns v s = 0v turn-off propagation delay t off 1 50 250 370 v s = 0v or 600v turn-on rise time t r - 30 70 turn-off fall time t f - 30 70 dead time dt 80 160 24 0 delay matching, hs & ls turn-on/off mt - - 50
6/ 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 typical performance curves (unless otherwise specified: ta=25c, v cc =15v,v bs =15v,v s =com,c l = 1000p f) figure 4. v cc uvlo - ta figure 5. v bs uvlo - ta figure 6. offset supply leakage current - v s (v b =v s ) figure 7. offset supply leakage current C ta (v b =v s =6 00v ) 6 7 8 9 10 11 12 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] v bs [v] 6 7 8 9 10 11 12 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] v cc [v] v cc uv+ v ccuv - v bs uv - v bs uv+ 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 100 200 300 400 500 600 700 vs [v] i vs [a] ta= 150 c 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] i vs [a]
7/ 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 typical performance curves (unless otherwise specified: ta=25c, v cc =15v,v bs =15v,v s =com,c l = 1000pf ) figure 8. quiescent v cc supply current - v cc figure 9. quiescent v cc supply current C ta (v cc = 15 v) figure 10. quiescent v bs supply current - v bs figure 11. quiescent v bs supply current C ta (v bs = 15 v) 0 1 2 3 4 5 6 0 1 2 3 4 5 6 input voltage v in [v] output voltage v out [v] 0 50 100 150 200 250 300 0 2 4 6 8 10 12 14 16 18 20 vcc [v] i qcc [a] 0 50 100 150 200 250 300 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] i qcc [a] 0 50 100 150 200 250 300 0 2 4 6 8 10 12 14 16 18 20 vbs [v] i qbs [a] 0 50 100 150 200 250 300 -40 -20 0 20 40 60 80 100 120 140 ambient temperture [c] i qbs [a]
8/ 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 typical performance curves (unless otherwise specified: ta=25c, v cc =15v,v bs =15v,v s =com,c l = 1000pf ) figure 12. hin input threshold voltage - ta figure 13. lin input threshold voltage - ta figure 14. high level output voltage C ta (i o =20ma) figure 15. low level output voltage C ta (i o =20ma) 0 1 2 3 4 5 6 0 1 2 3 4 5 6 input voltage v in [v] output voltage v out [v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] hin [v] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] lin [v] vil vih vih vil 0.0 0.2 0.4 0.6 0.8 1.0 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] vcc(vb)-v lo (v ho ) [v] 0.0 0.2 0.4 0.6 0.8 1.0 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] v lo (v ho )-com(vs) [v]
9/ 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 typical performance curves (unless otherwise specified: ta=25c, v cc =15v,v bs =15v,v s =com,c l = 1000pf ) figure 16. input bias current - vin figure 17. input bias current C ta (vin=5v) figure 18. dead time - ta (lo off - ho on) figure 19. dead time - ta (ho off - lo on) 0 1 2 3 4 5 6 0 1 2 3 4 5 6 input voltage v in [v] output voltage v out [v] 0 50 100 150 200 250 300 0 2 4 6 8 10 12 14 16 18 20 vin [v] i in [a] 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] i in [a] 0 50 100 150 200 250 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] dead time [ns] 0 50 100 150 200 250 -40 -20 0 20 40 60 80 100 120 140 ambient temperture [c] dead time [ns]
10 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 typical performance curves (unless otherwise specified: ta=25c, v cc =15v,v bs =15v,v s =com,c l = 1000pf ) figure 20. lo rise/fall time C load capacitance figure 21.lo turn on/off propagation delay - ta figure 22. ho rise/fall time C load capacitance figure 23. .ho turn on/off propagation delay - ta 0 1 2 3 4 5 6 0 1 2 3 4 5 6 input voltage v in [v] output voltage v out [v] fall rise 0 100 200 300 400 500 0 2500 5000 7500 10000 cl [pf] rise(fall) time [ns] 100 160 220 280 340 400 -40 -20 0 20 40 60 80 100 120 140 ambient temperature [c] delay time [ns] turn on turn off 0 100 200 300 400 500 0 2500 5000 7500 10000 cl [pf] rise(fall) time [ns] 100 160 220 280 340 400 -40 -20 0 20 40 60 80 100 120 140 ambient temperture [c] time [ns] fall rise turn on turn off
11 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 hin lin 50% 10% 90% 10% lo ho 90% dt dt 50% 50% 50% hin lin ho lo t on t r t off t f 90% 10% 90% 10% internal deadtime hin lin ho lo timing chart figure 24. timing chart figure 25. detail timeing chart
12 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 figure 27. gate charge transfer characteristics v ds v gs i d dvs/ dt t sw application components selection method (1) gate resistor the gate resistor r g(on/off) is selected to control the switching speed of the output transistor. the switching time (t sw ) is defined as the time spent to reach the end of the plateau voltage, so the turn on gate resistor r g(on) can be calculated using the following formulas. sw gd gs g t q q i ? ? (1) g th gs bs on g pon on total i v v r r r )( )( )( ? ? ? ? (2) ) ( ) )( ( )( )( th gs bs on g pon gd gs g gd gs sw v v r r q q i q q t ? ? ? ? ? ? (3) turn on gate resistor value can be changed to control output slope (dvs/dt). while the output voltage is non-linear, the maximum output slope should have a value near that of the following formula: rss g c i dt dvs ? (4) where: c rss is the feedback capacitance. substituting the value of i g from equation (2) into equation (4) yields the following formulas. dt dvs c v v r r r rss th gs bs on g pon on total ? ? ? ? ? )( )( )( (5) pon rss th gs bs on g r dt dvs c v v r ? ? ? ? )( )( (6) when the gate driver output is in off state, other dvs/dt m ay induce a drop in the gate voltage of the mosfet, causi ng self-turn- on . to prevent this, please set up the turn off resistor (r g(off) ) that satisfies the following formulas. dt dvs c ) r r( i) r r( v gd )off(g noff g )off(g noff ) th ( gs ? ? ? ? ? ? (7) noff gd ) th ( gs )off(g r dt dvs c v r ? ? (8) figure 26. gate driver equivalent circuit vs vb ho r g ( of f ) r g ( on ) r p on r n of f c gs c gd bs 21 14 f
13 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 (2) bootstrap capacitor c bs to reduce ripple voltage, ceramic capacitors with low esr value are rec ommended for use in the bootstrap circuit. the maximum voltage drop ( v bs ) that we have to guarantee when the high-side switch is in on st ate must be: ol gsmin bs v v vf vcc v ? ? ? ? ? (9) where: vcc is the gate driver supply voltage, vf is the bootstrap diode forward voltage drop, and v gsmin is the minimum gate - source voltag e, v ol is the low-side switch drain - source voltage the total charge supplied (q total ) by the bootstrap capacitor should have a value near the follo wing formulas. hon qbs lkdio lk lkgs g total t i i i i q q ? ? ? ? ? ? ) ( (10) where: q g is the total gate charge, i lkgs is the switch ga te - source leakage current, i lkdio is the bootstrap diode leakage current, i lk is the level shifter circuit leakage current, i qbs is the quiescent current, and t hon is the high-side switch on time. the bootstrap capacitor value should satisfy the following for mula. bs total bs v q c ? ? (11) however, BS2114F has a bstuvlo function to prevent malfunction at lo w voltage between vb and vs. please ensure sufficient capacitor margin to prevent bstuvlo malfunct ion. it is not able to keep turning- on the same way as the high side switch driver because of t he specifications of the bootstrap circuits. in addition, it is recommended to insert a 1 f ceramic capacitor between vb and vs. this capacitor should be plac ed as close as possible to these pins for noise reduction. vcc com vs vb vcc c bs vf v gs v ol (3) input capacitor mount a low-esr ceramic input capacitor near the vcc pin to reduce in put ripple. for bs21 14 f, it is recommended to use a capacitor value two times larger t han that of the bootstrap capacitor or more. figure 28. bootstrap power supply circuit
14 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 lin(hin) hin(lin) lo(ho) ho(lo) 90% 10% 10% S t in t f t off t on t dead 50% 50% (4) input signals differential t in the minimum differential of input signals (t in(min) ) to prevent shoot-through of the mosfets can be calculated using the following formula. ) ( ) ( f off in on dead t t t t t ? ? ?? ? (12) ). ln . (ln 90 10 ? ? ?? ? f t (13) l g non c r r ? ? ? ) ( ? (14) t on : turn-on propagation delay t off : turn-off propagation delay t f : turn-off fall time r non : on -resistance of nch mosfet constituting the final stage inverter r g : gate resistor c l : load capacitor please set up t in that satisfies the following formulas. 0 ? dead t (15) 0 ) ( ) ( ? ? ? ?? f off in on t t t t (16) f on off in t t t t ? ? ? ? ) ( (17) ). ln . (ln ) ( ) ( (max) (min) (max) (min) 90 10 ? ? ? ? ? ? ? ? l g non on off in c r r t t t (18) figure 29 . shoot-through prevention timing chart
15 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 i/o equivalence circuits pin.no pin name pin equivalent circuit pin.no pin name pin equivalent circuit 1 lin 1k 100k lin vcc com 2 hin 1k 100k hin vcc com 5 lo lo vcc com 7 ho ho vb vs com figure 30. i/o equivalent circuit
16 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitanc e value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pi n at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short a nd thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . th e electrical characteristics are guaranteed under the conditio ns of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may sub ject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused inpu t pins should be connected to the power supply or ground line. 12. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 13. area of safe operation (aso) operate the ic such that the output voltage, output current, a nd the maximum junction temperature rating are all within the area of safe operation (aso).
17 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 ordering information b s 2 1 1 4 f e 2 part number package f:sop-8 packaging and forming specification e2: embossed tape and reel marking diagrams sop-8(top view) s 2 1 1 4 part number marking lot number 1pin mark
18 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 physical dimension, tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr))
19 / 19 ? 2017 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BS2114F tsz02201-0252abz00070-1-2 26.jan.2017 rev.001 revision history date revision changes 26.jun.2017 001 new release
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BS2114F package sop-8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BS2114F - web page

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