? semiconductor components industries, llc, 2016 november, 2016 ? rev. 2 1 publication order number: ntsaf345/d ntsaf345, nrvtsaf345 trench-based schottky rectifier features ? fine lithography t rench?based schottky technology for very low forward voltage and low leakage ? fast switching with exceptional temperature stability ? low power loss and lower operating temperature ? higher efficiency for achieving regulatory compliance ? high surge capability ? nrv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant typical applications ? switching power supplies including tablet adapters, and flat panel display ? high frequency and dc?dc converters ? freewheeling and or?ing diodes ? reverse battery protection ? instrumentation mechanical characteristics: ? case: epoxy, molded ? epoxy meets flammability rating ul 94?0 @ 0.125 in. ? lead finish: 100% matte sn (tin) ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl 1 requirements ? weight: 95 mg (approximately) device package shipping ? ordering information sma?fl case 403aa style 6 trench schottky rectifier 3.0 ampere 45 volts www. onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. ntsaf345t3g sma?fl (pb?free) 5000 / tape & reel 3ar = specific device code a = assembly location y = year ww = work week = pb?free package marking diagram NRVTSAF345T3G sma?fl (pb?free) 5000 / tape & reel 3ar ayww
ntsaf345, nrvtsaf345 www. onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 45 v average rectified forward current (t l = 112 c) i o 3.0 a peak repetitive forward current (rated v r , square wave, 20 khz) t l = 103 c i frm 6.0 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 100 a storage temperature range t stg ?65 to +150 c operating junction temperature (note 1) t j ?65 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. the heat generated must be less than the thermal conductivity from junction?to?ambient: dp d /dt j < 1/r ja . thermal characteristics characteristic symbol value unit thermal resistance, junction?to?lead (note 2) jcl 25 c/w thermal resistance, junction?to?ambient (note 2) r ja 90 c/w 2. 1 inch square pad size (1 0.5 inch) for each lead on fr4 board. electrical characteristics rating symbol typ max unit instantaneous forward voltage (note 3) (i f = 3 a, t j = 25 c) (i f = 3 a, t j = 125 c) v f 0.482 0.4 0.63 0.55 v instantaneous reverse current (note 3) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 125 c) i r 1.75 1.45 7.5 3 a ma product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 3. pulse test: pulse width 380 s, duty cycle 2.0%.
ntsaf345, nrvtsaf345 www. onsemi.com 3 typical characteristics figure 1. typical instantaneous forward characteristics figure 2. maximum instantaneous forward characteristics v f , instantaneous forward voltage (v) v f , instantaneous forward voltage (v) 0.6 0.4 0.2 0.1 1 10 100 0.9 0.6 0.5 0.3 0.2 0.1 0.1 1 10 100 figure 3. typical reverse characteristics figure 4. maximum reverse characteristics v r , instantaneous reverse voltage (v) v r , instantaneous reverse voltage (v) 40 30 25 20 15 10 5 45 35 30 15 10 5 figure 5. typical junction capacitance v r , reverse voltage (v) 0.1 100 1000 i f , instantaneous forward current (a) i r , instantaneous reverse current (a) c, junction capacitance (pf) i f , instantaneous forward current (a) 35 45 1.e?07 1.e?06 1.e?05 1.e?04 1.e?03 1.e?01 20 25 1.e?07 1.e?04 1.e?03 1.e+00 i r , instantaneous reverse current (a) 10 t a = 125 c t a = ?55 c t a = 25 c t a = 150 c t a = 125 c t a = ?55 c t a = 25 c t a = 125 c t a = 25 c figure 6. current derating per device t c , case temperature ( c) 80 60 140 120 20 0 0 1 2 i f(av) , average forward current (a) 6 40 100 square wave dc r jc = 26.9 c/w t j = 25 c 0.4 0.7 40 t a = 150 c t a = 150 c 1 0.8 0.5 0.3 0.1 t a = 125 c t a = 25 c t a = 150 c 1.e?06 1.e?02 1.e?05 1.e?02 1.e?01 3 4 5 0.7 0.8
ntsaf345, nrvtsaf345 www. onsemi.com 4 typical characteristics figure 7. forward power dissipation i f(av) , average forward current (a) 0 0 2 10 p f(av) , average forward power dissipation (w) 24 i pk /i av = 5 13 4 6 8 square wave i pk /i av = 10 dc i pk /i av = 20 0.01 0.1 1 10 100 0.000001 0.00001 0.0001 1000 0.001 0.01 0.1 1 10 100 figure 8. typical thermal characteristics t, pulse time (s) r (t) , typical transient thermal resistance ( c/w) 50% duty cycle 20% 10% 5% 2% 1% single pulse assumes 25 c ambient and soldered to a 600 mm 2 ? oz copper pad on pcb 0.01 0.1 1 10 0.000001 0.00001 0.0001 1000 0.001 0.01 0.1 1 10 100 figure 9. typical transient thermal response characteristics, junction?to?case t, pulse time (s) r (t) , typical transient thermal resistance ( c/w) 50% duty cycle 20% 10% 5% 2% 1% single pulse
ntsaf345, nrvtsaf345 www. onsemi.com 5 package dimensions sma?fl case 403aa issue o d e b l c solder footprint* dimensions: millimeters 5.56 1.76 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1.30 recommended notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. dim min max millimeters a 0.90 1.10 b 1.25 1.65 c 0.15 0.30 d 2.40 2.80 top view e1 bottom view 2x 2x side view a c seating plane e 4.80 5.40 e1 4.00 4.60 l 0.70 1.10 p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ntsaf345/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. ?
|
