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product structure : silicon integrated circuit this product has no designed protection against radioactive rays 1/ 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com 1ch gate driver providing galvanic isolation 2500vrms isolation voltage BM60051FV-C general description the bm60051 fv -c is a gate driver with an isolation voltage of 2500vrms, i/o delay time of 26 0ns, minimum input pulse width of 180ns, and incorporates the fault signal output function, under voltage lockout (uvlo) function, short circuit protection (scp) function, active miller clamping function, temperature monitoring function, switching controller function and output state feedback function. features ? fault signal output function ? under voltage lockout function ? short circuit protection function ? active miller clamping ? temperature monitor ? switching controller ? output state feedback function ? ul 1577 recognized:file no. e356010 ? aec -q100 qualified (note 1) (note 1:grade1 ) applications ? automotive isolated igbt/mosfet inverter gate drive. ? automotive dc-dc converter. ? industrial inverters system. ? ups system. key specifications ? isolation voltage: 2500 [vrms] (max) ? maximum gate drive voltage: 24 [v] (max) ? i/o delay time: 26 0 [ns] (max) ? minimum input pulse width: 180 [ns] (max) packages w(typ) x d(typ) x h(max) ssop-b28w 9.2mm x 10.4mm x 2. 4 mm typical application circuit figure 1. typical application circuit vcc2 vcc2 gnd1 flt dis ina osfb sensor vcc1 fb comp v_batt vreg fet_g sense gnd1 gnd2 out2 nc out1 vcc2 proout tc to2 to1 scpin3 scpin2 scpin1 uvloin gnd2 q s r - + + dac slope - + osc flt osc osc uvlo1 - + - + edge - + - + osc flt filter filter ecu rectifier / ripple f ilter rectifier / ripple f ilter snubber vcc1 v_ba tt gnd2 gnd1 gnd2 gnd1 regulator - + current source - + predriver logic uvlo_batt timer osfb osc q s r q s r logic max.duty rese t rst uvlo1 uvlo_ba tt filter - + - + datashee t
2 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c recommended range of external constants pin con f iguration pin name symbol recommended value unit min typ max tc (note 2 ) r tc 1.25 - 50 k tc (note3 ) r tc 0.1 1 10 m vbatt c vbatt 3 - - f vcc1 c vcc1 0.2 - - f vcc2 c vcc2 0.4 - - f vreg c vreg 0.1 1 10 f (note2 ) use temperature monitor (note3 ) no use temperature monitor pin descriptio n s pin no. pin name function 1 gnd2 output - side ground pin 2 uvloin output - side uvlo setting pin 3 scpin1 short circuit current detection pin 1 4 scpin2 short circuit current detection pin 2 5 scpin3 short circuit current detection pin 3 6 to1 constant current output pin / sensor voltage input pin 1 7 to2 constant current output pin / sensor voltage input pin 2 8 tc constant current setting resistor connection pin 9 proout soft turn - off pin / gate voltage input pin 10 vcc2 output - side power supply pin 11 out1 output pin 12 nc no connect 13 out2 output pin for miller clamp 14 gnd2 output - side ground pin 15 gnd1 input - side ground pin 16 flt fault output pin 17 dis input enabling signal input pin 18 ina control input pin 19 osfb output state feedback output pin 20 sensor temperature information output pin 21 vcc1 input - side power supply pin 22 fb error amplifier inverting input pin for switching controller 23 comp error amplifier output pin for switching controller 24 v_batt main power supply pin 25 vreg power supply pin for driving mos fet for switching controller 26 fet_g mos fet control pin for switching controller 27 sense current feedback resistor connection pin fo r switching c o ntroller 28 gnd1 input - side ground pin (top view) gnd1 28 sense 27 fet_g 26 vreg 25 v_batt 24 comp 23 fb 22 vcc1 sensor 20 osfb 19 9 21 ina 18 dis 17 flt 16 gnd1 15 gnd2 1 uvloin 2 scpin1 3 scpin2 4 scpin3 5 to1 6 to2 7 tc 8 proout 9 vcc2 1 0 out1 1 4 1 nc 1 2 out2 1 3 gnd2 1 4 figure 2. pin configuration 3 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c absolute maximum ratings (note 4 ) relative to gnd1 (note 5 ) relative to gnd2 (note 6 ) should not exceed pd and tj=150 ? c (note 7 ) derate above ta=25 ? c at a rate of 9.0 mw/ ? c. mounted on a glass epoxy of 114.3 mm ? 7 6.2 mm ? 1.6 mm. caution : operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol min max units main power supply voltage v batt (note 8 ) 4.5 24.0 v input - side control block supply voltage v cc1 (note 8 ) 4.5 5.5 v output - side supply voltage v cc2 (note 9 ) 9 24 v output side uvlo voltage v uv2th (note 9 ) 6 - v (note 8 ) gnd1 reference (note 9 ) gnd2 reference insulation related characteristics parameter symbol characteristic unit insulation resistance (v io =500v) r s >10 9 insulation withstand voltage / 1min v iso 2500 vrms insulation test voltage / 1sec v iso 3000 vrms parameter symbol rating unit main power supply voltage v battmax - 0.3 to +40.0 (note 4 ) v input - side control block supply voltage v cc1max - 0.3 to +7.0 (note 4 ) v output - side supply voltage v cc2max - 0.3 to +30.0 (note 5 ) v ina, dis pin input voltage v inmax - 0.3 to +v cc1 +0.3v or + 7.0v (note 4 ) v flt, osfb pin input voltage v fltmax - 0.3 to + 7.0v (note 4 ) v flt pin , osfb pin output current i flt 10 ma sensor pin output current i sensor 10 ma fb pin input voltage v fbmax - 0.3 to +v cc1 +0.3v or + 7.0v (note 4 ) v fed _ g pin output current (peak5s) i fet_gpeak 1000 ma scpin1 pin, scpin2 pin, scpin3 pin input voltage v scpinmax - 0.3 to +6.0 (note 5 ) v uvloin pin input voltage v uvloinmax - 0.3 to v cc2 +0.3 (note 5 ) v to1 pin, to2 pin input voltage v tomax - 0.3 to v cc2 +0.3 (note 5 ) v to1 pin , to2 pin output current i tomax 8 ma out1 pin output current (peak 5s out1peak 5000 (note 6 ) ma out2 pin output current (peak 5s out2peak 5000 (note 6 ) ma proout pin output current (peak 5s prooutpeak5 2500 (note 6 ) ma proout pin output current (peak 10s prooutpeak10 1000 (note 6 ) ma power dissipation pd 1.12 (note 7 ) w operating temperature range t opr - 40 to +125 c storage temperature range t stg - 55 to +150 c junction temperature tjmax +150 c 4 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c electrical characteristics ( unless otherwise specified ta= - 40c to125c, v batt =5v to 24v, v cc1 =4.5v to 5.5v, v cc2 = 9 v to 24v) parameter symbol min typ max unit conditions general main power supply circuit current 1 i batt1 0.37 0.84 1.47 ma fet_g pin switching operating main power supply circuit current 2 i batt2 0.34 0.77 1.35 ma fet_g pin no switching input side circuit current 1 i cc11 0.13 0.31 0.49 ma out=l input side circuit current 2 i cc12 0.13 0.31 0.49 ma out=h input side circuit current 3 i cc13 0.25 0.42 0.59 ma ina =10khz, duty=50% input side circuit current 4 i cc14 0.31 0.53 0.74 ma ina =20khz, duty=50% output side circuit current i cc2 2.7 4.7 7.1 ma r tc =10k switching power supply controller fet_g output voltage h1 v fetgh1 4.5 5.0 5.5 v i out =0a(open) fet_g output voltage h2 v fetgh2 4.0 4.5 - v v_batt=4.5v i out =0a(open) fet_g output voltage l v fetgl 0 - 0.3 v i out =0a(open) fet_g on - resistance (source - side) r ongh 3 6 12 ongl 0.3 0.6 1.3 osc_sw 80 100 120 khz soft - start time t ss - - 50 ms fb pin threshold voltage v fb 1.47 1.50 1.53 v fb pin input current i fb - 0.8 0 + 0.8 a comp pin sink current i compsink - 160 - 80 - 40 a comp pin source current i compsource 40 80 160 a v _batt uvlo off voltage v uvlobatth 4.05 4.25 4.45 v v _batt uvlo o n voltage v uvlobattl 3.95 4.15 4.35 v maximum on d uty d onmax 75 85 95 % logic block logic high level input voltage v inh 0.7 v cc1 - v cc1 v ina inl 0 - 0.3 cc1 v ina ind 25 50 100 k inu 25 50 100 k infil 80 130 180 ns ina dis input filtering time t disfil 4 10 20 s dis input delay time t ddis 4 10 20 s output out1 on - resistance (source - side) r onh 0.2 0.55 1.3 out =40ma out1 on - resistance (sink - side) r onl 0.2 0.55 1.3 out =40ma out1 maximum current i outmax 5.0 - - a v cc2 =15v guaranteed by design proout on - resistance r onpro 0.5 1.2 2.7 proout =40 m a turn on time t pon 140 200 260 ns turn off time t poff 140 200 260 ns propagation distortion t pdist - 60 0 + 60 ns t poff - t pon rise time t rise - 30 50 ns load=1nf fall time t fall - 30 50 ns load=1nf out2 on - resistance r on2 0.4 0.9 2.0 out =40ma out2 on threshold voltage v out2on 1.8 2.0 2.2 v out2 output delay time t out2on - 15 50 ns common mode transient immunity cm 100 - - kv/ s design assurance 5 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c electrical characteristics - continued ( unless otherwise specified ta= - 40c to125c, v batt =5v to 24v, v cc1 =4.5v to 5.5v, v cc2 =8v to 24v) parameter symbol min typ max unit conditions temperature monitor tc pin voltage v tc 0.975 1.000 1.025 v tox pin output current i to 0.97 1.00 1.03 ma r tc =1 0k osc_to 8 10 14 khz sensor output duty 1 d sensor1 87 90 93 % v tox =1.35v sensor output duty 2 d sensor2 47 50.0 53 % v t o x =2.59v sensor output duty 3 d sensor3 5 10 15 % v t o x =3.84v t o x pin d isconnect detection voltage v toh 7 8 9 v sensor on resistance (source - side) r sensorh - 60 160 sensor =5ma sensor on resistance (sink - side) r sensorl - 60 160 sensor =5ma protection functions input - side uvlo off voltage v uvlo1h 4.05 4.25 4.45 v input - side uvlo on voltage v uvlo1l 3.95 4.15 4.35 v input - side uvlo filtering time t uvlo1fil 2 10 30 s input - side uvlo delay time (out) t duvlo1out 2 10 30 s input - side uvlo delay time (flt) t duvlo1flt 2 10 30 s output - side uvlo off threshold voltage v uvlo2h 0.95 1.00 1.05 v output - side uvlo on threshold voltage v uvlo2l 0.85 0.90 0.95 v output - side uvlo filtering time t uvlo2fil 2 10 30 s output - side uvlo delay time (out) t duvlo2out 2 10 30 s output - side uvlo delay time (flt) t duvlo2flt 3 - 65 s short current detection voltage v scdet 0.67 0.70 0.73 v short current detection filtering time t scpfil 0.15 0.30 0.45 s short current detection delay time (out) t dscpout 0.16 0.33 0.50 s out1=30k dscppro 0.17 0.35 0.53 s proout=30k pull up dscpflt 1 - 35 s soft turn off release time t scpoff 30 - 110 s out1=30k fltl - 30 80 flt =5ma fault output holding time t fltrls 20 40 60 ms gate state h detection threshold voltage v osfbh 4.5 5.0 5.5 v gate state l detection threshold voltage v osfbl 4.0 4.5 5.0 v osfb output filtering time t osfbfil 1.5 2.0 2.5 s osfb output on - resistance r osfb - 30 80 osfb =5ma osfb output holding time t osfbrls 20 40 60 ms 6 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c typical performance curves figure 4. main power supplycircuit current 1 (fet_g pin switching operating ) figure 6. main power supply circuit current 2 (fet_g pin no switching ) figure 5. main power supply circuit current 2 (fet_g pin no switching ) figure 3. main power supplycircuit current 1 (fet_g pin switching operating ) - 40 c 25 c 125 c v batt =4.5v v batt =14v v batt =24v - 40 c 25 c 125 c v batt =4.5v v batt =14v v batt =24v 0.37 0.57 0.77 0.97 1.17 1.37 4.5 9 13.5 18 22.5 v batt [v] i batt1 [ma] 0.34 0.54 0.74 0.94 1.14 1.34 -40 0 40 80 120 ta [c] i batt2 [ma] 0.34 0.54 0.74 0.94 1.14 1.34 4.5 9 13.5 18 22.5 v batt [v] i batt2 [ma] 0.37 0.57 0.77 0.97 1.17 1.37 -40 0 40 80 120 ta [c] i batt1 [ma] 7 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 8. input side circuit current 1 (out1=l) figure 9. input side circuit current 2 (out1=h) figure 7. input side circuit current 1 (out1=l) figure 10. input side circuit current 2 (out1=h) - 40 c 25 c 125 c v cc1 =4.5v v cc1 =5.0v v cc1 =5.5v - 40 c 25 c 125 c v cc1 =4.5v v cc1 =5.0v v cc1 =5.5v 0.13 0.18 0.23 0.28 0.33 0.38 0.43 0.48 4.5 4.75 5 5.25 5.5 v cc1 [v] i cc11 [ma] 0.13 0.18 0.23 0.28 0.33 0.38 0.43 0.48 -40 0 40 80 120 ta [c] i cc12 [ma] 0.13 0.18 0.23 0.28 0.33 0.38 0.43 0.48 4.5 4.75 5 5.25 5.5 v cc1 [v] i cc12 [ma] 0.13 0.18 0.23 0.28 0.33 0.38 0.43 0.48 -40 0 40 80 120 t a [c] i cc11 [ma] 8 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 14. input side circuit current 4 (ina=20khz, duty=50%) figure 12. input s ide circuit current 3 (ina=10khz, duty=50%) figure 13. input side circuit current 4 (ina=20khz, duty=50%) figure 11. input side circuit current 3 (ina=10khz, duty=50%) - 40 c 25 c 125 c v cc1 =4.5v v cc1 =5.0v v cc1 =5.5v - 40 c 25 c 125 c v cc1 =4.5v v cc1 =5.0v v cc1 =5.5v 0.25 0.3 0.35 0.4 0.45 0.5 0.55 4.5 4.75 5 5.25 5.5 v cc1 [v] i cc13 [ma] 0.31 0.36 0.41 0.46 0.51 0.56 0.61 0.66 0.71 -40 0 40 80 120 ta [c] i cc14 [ma] 0.31 0.36 0.41 0.46 0.51 0.56 0.61 0.66 0.71 4.5 4.75 5 5.25 5.5 v cc1 [v] i cc14 [ma] 0.25 0.3 0.35 0.4 0.45 0.5 0.55 -40 0 40 80 120 ta [c] i cc13 [ma] 9 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 16. output side circuit current (out=l, r tc =10k ) figure 18. output side circuit current (out=h, r tc =10k ) figure 17. output side circuit current (out=h, r tc =10k ) figure 15. output side circuit current (out=l, r tc =10k ) - 40 c 25 c 125 c v cc2 =9v v cc2 =15v v cc2 =24v v cc2 =9v v cc2 =15v v cc2 =24v - 40 c 25 c 125 c 2.7 3.2 3.7 4.2 4.7 5.2 5.7 6.2 6.7 9 12 15 18 21 24 v cc2 [v] i cc2 [ma] 2.7 3.2 3.7 4.2 4.7 5.2 5.7 6.2 6.7 -40 0 40 80 120 ta [c] i cc2 [ma] 2.7 3.2 3.7 4.2 4.7 5.2 5.7 6.2 6.7 -40 0 40 80 120 ta [c] i cc2 [ma] 2.7 3.2 3.7 4.2 4.7 5.2 5.7 6.2 6.7 9 12 15 18 21 24 v cc2 [v] i cc2 [ma] 10 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 20. fet_g output voltage l figure 22. fet_g on - resistance (sink - side) figure 21. fet_g on - resistance (source - side) figure 19. fet_g output voltage h1 /h2 - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c 4 4.25 4.5 4.75 5 5.25 5.5 4.5 9 13.5 18 22.5 v batt [v] v fetgh [v] -0.3 -0.2 -0.1 0 0.1 0.2 0.3 4.5 9 13.5 18 22.5 v batt [v] v fetgl [v] 0.3 0.5 0.7 0.9 1.1 1.3 4.5 9 13.5 18 22.5 v batt [v] r ongl [] 3 6 9 12 4.5 9 13.5 18 22.5 v batt [v] r ongh [] 11 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 24. soft - start time figure 25. fb pin threshold voltage figure 23. oscillation frequency figure 26. fb pin input current - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c -0.8 -0.4 0 0.4 0.8 4.5 9 13.5 18 22.5 v batt [v] i fb [a] 1.47 1.48 1.49 1.5 1.51 1.52 1.53 4.5 9 13.5 18 22.5 v batt [v] v fb [v] 0 10 20 30 40 50 4.5 9 13.5 18 22.5 v batt [v] t ss [ms] 80 90 100 110 120 4.5 9 13.5 18 22.5 v batt [v] f osc_sw [khz] 12 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 28. comp pin source current figure 29. v_batt uvlo on/offvoltage figure 27. comp comp pin sink current figure 30. maximum on d uty - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c 75 80 85 90 95 4.5 9 13.5 18 22.5 v batt [v] d onmax [%] 0 2 4 6 3.95 4.05 4.15 4.25 4.35 4.45 v batt [v] v flt [v] 40 60 80 100 120 140 160 4.5 9 13.5 18 22.5 v batt [v] i compsource [a] -160 -140 -120 -100 -80 -60 -40 4.5 9 13.5 18 22.5 v batt [v] i compsink [a] 13 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 31. logic high / low level input voltage (ina, dis) figure 33. logic input filtering time (l pulse) figure 34. logic input filtering time (h pulse) figure 32. logic pull - down resistance (ina) pull - up resistance (dis) - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c l ? h ? 80 105 130 155 180 4.5 4.75 5 5.25 5.5 v cc1 [v] t infil [ns] 80 105 130 155 180 4.5 4.75 5 5.25 5.5 v cc1 [v] t infil [ns] 25 40 55 70 85 100 4.5 4.75 5 5.25 5.5 v cc1 [v] r ind /r inu [k] 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 4.5 4.75 5 5.25 5.5 v cc1 [v] v inh / v inl [v] 14 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 35. dis input filtering time figure 36. dis input delay time figure 37. out1 on - resistance(source - side) (i out1 =40ma) figure 38. out1 on - resistance (sink - side) (i out1 =40ma) - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c 25 c - 40 c 125 c 0.2 0.4 0.6 0.8 1 1.2 9 12 15 18 21 24 v cc2 [v] r onl [] 0.2 0.4 0.6 0.8 1 1.2 9 12 15 18 21 24 v cc2 [v] r onh [] 4 8 12 16 20 4.5 4.75 5 5.25 5.5 v cc1 [v] t ddis [s] 4 8 12 16 20 4.5 4.75 5 5.25 5.5 v cc1 [v] t disfil [s] 15 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 39. turn on time figure 40. turn off time figure 41. rise time figure 42. fall time - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c 0 10 20 30 40 50 9 12 15 18 21 24 v cc2 [v] t fall [ns] 0 10 20 30 40 50 9 12 15 18 21 24 v cc2 [v] t rise [ns] 140 170 200 230 260 9 12 15 18 21 24 v cc2 [v] t poff [ns] 140 170 200 230 260 9 12 15 18 21 24 v cc2 [v] t pon [ns] 16 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 43. proout o n - resistance (i proout =40ma) figure 44. out2 o n - resistance (i out2 =40ma) figure 45. out2 on threshold voltage figure 46. out2 output delay time - 40 c 25 c 125 c 125 c - 40 c 25 c - 40 c 25 c 125 c - 40 c 25 c 125 c 0 10 20 30 40 50 9 12 15 18 21 24 v cc2 [v] t out2on [ns] 1.8 1.9 2 2.1 2.2 9 12 15 18 21 24 v cc2 [v] v out2on [v] 0.4 0.8 1.2 1.6 2 9 12 15 18 21 24 v cc2 [v] r on2 [] 0.5 0.9 1.3 1.7 2.1 2.5 9 12 15 18 21 24 v cc2 [v] r onpro [] 17 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c 0.1 1 10 1 10 100 i to [ma] rtc [k ] figure 47. tc pin voltage figure 48. tox pin output current (rtc=10k ) figure 49. tox pin output current figure 50. sensor output frequency - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c 8 9 10 11 12 13 14 9 12 15 18 21 24 v cc2 [v] f osc_to [khz] 0.97 0.98 0.99 1 1.01 1.02 1.03 9 12 15 18 21 24 v cc2 [v] i to [ma] 0.975 0.985 0.995 1.005 1.015 1.025 9 12 15 18 21 24 v cc2 [v] v tc [v] 18 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 51. sensor output duty figure 52. sensor output duty 1 (vtox=1.35v) figure 53. sensor output duty 2 (vtox=2.59v) figure 54. sensor output duty 3 (vtox=3.84v) - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c 5 7 9 11 13 15 9 12 15 18 21 24 v cc2 [v] d sensor3 [%] 47 48 49 50 51 52 53 9 12 15 18 21 24 v cc2 [v] d sensor2 [%] 87 88 89 90 91 92 93 9 12 15 18 21 24 v cc2 [v] d sensor1 [%] 0 10 20 30 40 50 60 70 80 90 100 1 1.5 2 2.5 3 3.5 4 v tox [v] d sensor [%] 19 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 55. t o x pin d isconnect detection voltage figure 56. sensor o n resistance(source - side) (i sebsor =5ma) figure 57. sensor o n resistance (sink - side) (i sensor =5ma) figure 58. input - side uvlo on/off voltage - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c 0 2 4 6 3.95 4.05 4.15 4.25 4.35 4.45 v cc1 [v] v flt [v] 10 35 60 85 110 135 160 4.5 4.75 5 5.25 5.5 v cc1 [v] r sensorl [] 10 35 60 85 110 135 160 4.5 4.75 5 5.25 5.5 v cc1 [v] r sensorh [] 7 7.5 8 8.5 9 9 12 15 18 21 24 v cc2 [v] v toh [v] 20 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c 2 6 10 14 18 22 26 30 - 40 0 40 80 120 t duvlo1flt [s] ta [ c] 2 6 10 14 18 22 26 30 - 40 0 40 80 120 t duvlo1out [s] ta [ c] 2 6 10 14 18 22 26 30 - 40 0 40 80 120 t uvlo1fil [s] ta [ c] figure 60. input - side uvlo delay time (out1) figure 61. input - side uvlo delay time (flt) figure 62. output - side uvlo on / off threshold voltage figure 59. input - side uvlo filtering time - 40 c 25 c 125 c 0 2 4 6 0.85 0.9 0.95 1 1.05 v uvloin [v] v flt [v] 21 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c 3 13 23 33 43 53 63 - 40 0 40 80 120 t duvlo2flt [s] ta [ c] 2 6 10 14 18 22 26 30 - 40 0 40 80 120 t duvlo2out [v] ta [ c] 2 6 10 14 18 22 26 30 - 40 0 40 80 120 t uvlo2fil [s] ta [ c] figure . uvlo ??rg figure 64. output - side uvlo delay time figure 65. output - side uvlo delay time (flt) figure 66. short current detection voltage figure 63. output - side uvlo filtering time - 40 c 25 c 125 c figure 64. output - side uvlo delay time (out1) 0.67 0.68 0.69 0.7 0.71 0.72 0.73 9 12 15 18 21 24 v cc2 [v] v scdet [v] 22 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 67. short current detection filtering time figure 68. short current detection delay time (out1) figure 69. short current detection delay time (proout) figure 70. short current detection delay time (flt) - 40 c 25 c 125 c - 40 c 25 c 125 c - 40 c 25 c 125 c maximum minimum - 40 c 25 c 125 c - 40 c 25 c 125 c 0.15 0.2 0.25 0.3 0.35 0.4 0.45 9 12 15 18 21 24 v cc2 [v] t scpfil [s] 1 6 11 16 21 26 31 9 12 15 18 21 24 v cc2 [v] t dscpflt [s] 0.17 0.23 0.29 0.35 0.41 0.47 0.53 9 12 15 18 21 24 v cc2 [v] t dscppro [s] 0.16 0.22 0.28 0.34 0.4 0.46 9 12 15 18 21 24 v cc2 [v] t dscpout [s] 23 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 71. soft turn off release time figure 72. flt output on - resistance (i flt =5ma) figure 73. fault output holding time figure 74. gate state h /l detection threshold voltage - 40 c 25 c 125 c - 40 c 25 c 125 c h ? l ? - 40 c 25 c 125 c 125 c 25 c - 40 c - 40 c 25 c 125 c - 40 c 25 c 125 c maximum minimum 4 4.25 4.5 4.75 5 5.25 5.5 9 12 15 18 21 24 v cc2 [v] v osfb [v] 20 30 40 50 60 4.5 4.75 5 5.25 5.5 v cc1 [v] t fltrls [ms] 10 20 30 40 50 60 70 80 4.5 4.75 5 5.25 5.5 v cc1 [v] r fltl [] 30 50 70 90 110 9 12 15 18 21 24 v cc2 [v] t scpoff [s] 24 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c figure 75. osfb output filtering time figure 76. osfb output on - resistance (i osfb =5ma) figure 77. osfb output holding time - 40 c 25 c 125 c 125 c 25 c - 40 c - 40 c 25 c 125 c 20 30 40 50 60 4.5 4.75 5 5.25 5.5 v cc1 [v] t osfbrls [ms] 10 20 30 40 50 60 70 80 4.5 4.75 5 5.25 5.5 v cc1 [v] r osfbl [] 1.5 1.7 1.9 2.1 2.3 2.5 4.5 4.75 5 5.25 5.5 v cc1 [v] t osfbfil [us] 25 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c description of pins and cautions on layout of board 1. v_batt (main power supply pin) this is the main power supply pin. connect a bypass capacitor between v_batt and gnd1 in order to suppress voltage variation s . be sure to apply a power supply even when the switching power supply is not used, since the internal reference voltage of the input side chi p is generated from this power supply. 2. vcc1 (input - side power supply pin) the vcc1 pin is a power supply pin on the input side. to suppress voltage fluctuations due to the driving current of the internal transformer, connect a bypass capacitor between th e vcc1 and the gnd1 pins. 3. gnd1 (input - side ground pin) the gnd1 pin is a ground pin on the input side. 4. vcc2 (output - side positive power supply pin) the vcc2 pin is a positive power supply pin on the output side. to reduce voltage fluctuations due to the driving current of the internal transformer and output current, connect a bypass capacitor between the vcc2 and the gnd2 pins. 5. gnd2 (output - side ground pin) the gnd2 pin is a ground pin on the output side. connect th e gnd2 pin to the emitter / source of o utput device . 6. ina , dis (c ontrol input pin, input enabling signal input pin) they are pins for deciding the output logic. dis ina out1 h x l l l l l h h x: don't care 7. flt (fault output pin) the flt pin is an open drain pin that outputs a fault signal when a fault occurs (i.e., when the under voltage lockout function (uvlo) or short circuit protection function (scp) is activated ). state flt while in normal operation hi - z when a fault occurs (uvlo / scp) l 8. osfb (output pin for monitoring gate condition) this is an open drain pin which compares gate logic of the output element monitored with proout pin and dis /in a pin input logic , and outputs l when they disaccord. stat us dis ina proout (input) osfb normal operation h x h l h x l hi - z l l h l l l l hi - z l h h hi - z l h l l fault x x x hi - z x: don't care 9. sensor (temperature information output pin) this is a pin which outputs the voltage of either to1 or to2 , whichever is lower, converted to duty cycle . 10. fb ( e rror amplifier inverting input pin for switching controller ) this is a voltage feedback pin of the switching controller . connect it to vcc1 when the switching controller is not used. 11. comp ( e rror amplifier output pin for switching controller ) this is the gain control pin of the switching controller . connect a phase compensation capacitor and resist or . when the switching controller is not used, connect it to gnd1. 12. vreg ( power supply pin for the dri ving mos fet of the switching controller) this is the power supply pin for the driving mosfet of the switching controller transformer drive. b e sure to connect a capacitor between vreg an d gnd1 even when the switching controller is not used, in order to prevent oscillation and suppress voltage variation due to fet_g output current. 26 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c description of pins and cautions on layout of board C continued 13. fet_g ( mos fet control pin for switching controller ) this is a mosfet control pin for the switching controller transformer drive. leave it unconnected when the switching controller is not used. 14. sense ( connection to the c urrent feedback resistor of the switching controller ) this is a pin connected to the resist or of the switching controller current feedback. fet_g pin output duty is controlled by the voltage value of this pin. connect it to vcc1 when switch ing controller is not used. 15. out (output pin) the out pin is a gate driving pin. 16. out2 (miller clamp pin) this is the miller clamp pin for preventing a rise of gate voltage due to miller current of output element connected to out1. out2 should be unconnected when miller clamp function is not used. 17. proout (soft turn - off pin) this is a pin for soft turn - off of output pin when short - circuit protection is in action. it also functions as a pin for monitoring gate voltage for miller clamp function and output state feedback function. 18. scpin1 , scpin2 , scpin3 (short circuit current detection pin) these are the pin s used to detect current for short circuit protection. when the scpin 1 pin , scpin2 pin or scpin3 pin voltage exceeds the voltage set with the v scdet parameter, the scp function will be activated , t his will make the ic function in an open state . t o avoid such trouble , c onnect a resistor between the scpin and the gn d2 or short the scpin pin to gnd2 when the scp function is not used. 19. tc (resistor connection pin for setting constant current source output ) the tc pin is a resistor connection pin for setting the constant current output. if an arbitrary resistance value is connected between tc and gnd2, it is possible to set the constant current value output from to. 20. to1 , to2 (constant current output / sensor voltage input pin) the to1 pin and the to2 pin are cons tant current output / voltage input pin s . it can be used as a sensor input by connecting an element with arbitrary impedance between tox pin and gnd. furthermore , the to x pin disconnect detection function is built - in. 21. uvloin ( output - side uvlo setting input pin) the uvloin pin is a pin for deciding uvlo setting value of vcc2. the threshold value of uvlo can be set by dividing the resistance voltage of vcc2 and inputting such value. 27 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c description of functions and examples of constant setting 1. fault status output this function is used to output a fault signal from the flt pin when a fault occurs (i.e., when the under voltage lockout function (uvlo) or short circuit protection function (scp) is activated) and hold the fault signal until fault output holding time ( t fltrls ) is completed. 2. under voltage lockout ( uvlo ) function the bm60051fv - c incorporates the under voltage lockout (uvlo) function on v_batt, vcc1 and vcc2 . when the power supply voltage drops to the uvlo on voltage, the out pin and the flt pin will both output the l signal. when the power supply voltage rises to the uvlo off voltage, these pins will be reset. however, during the fault output holding time set in fault status output section, the out pin and the flt pin will hold the l signal. in addition, to prevent m is - triggers due to noise, mask time t uvlo1fil and t uvlo2fil are set on both low and high voltage sides. status flt pin normal hi - z fault occurs l flt hi - z l out l h status fault occurs (uvlo or scp ) fault output holding time ( t fltrls ) fltrls ina h v_batt l v uvlobatth v uvlobattl flt hi - z l out1 h l fet_g h l v uvlo1l ina h vcc1 l v uvlo1h flt hi - z l out1 h l fet_g h l ina h uvloin l v uvlo2h v uvlo2l flt hi - z l out1 h l fet_g h l 28 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c description of functions and examples of constant setting - continued 3. short circuit protection (scp) function when the scpin pin voltage exceeds a voltage set with the v scdet parameter, the scp function will be activated. when the scp function is activated, the out pin voltage will be set to the hi - z level and the proout pin voltage wi ll go to the l level first (soft turn - off ).next, when the short - circuit current falls below the threshold value and after t scpoff has passed , out pin and proout pin become l. finally, when the fault output holding time is completed, the scp function will be released. hi - z l hi - z l scpmsk ? v scdet l hi - z h v vtlto h l figure 82 . scp operation timing chart t scpfil fault output holding time flt proout scpmsk i nternal voltage scpinx out gate voltage in hi - z l hi - z l scp filter threshold v scdet l hi - z h h l t scpfil fault output holding time figur e 83 . scp operation status transition diagram t scpoff t scpoff v scpin >v scdet yes no start out=hi - z proout=l flt=l out=h exceed filter time yes no exceed t fltrls yes no in=h yes no v scpin 30 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c description of functions and examples of constant setting - continued 5. temperature monitor function c onstant current is supplied from tox pins from the built - in constant current circuit . this current value can be adjusted in accordance with the resistance value connected between tc and gnd2. further more , to x pin has voltage input function, and outputs signal of tox pin voltage converted to duty from sensor pin . when voltage of either one of to x pin s is no less than disconnect detection voltage v toh , sensor pin outputs l. therefore, when only one of the to x pin s i s used, connect a resist or between the other to pin s and gnd2 to keep pin voltage at no more than v toh . figure 86 . block diagram of temperature monitor function figure 87 . timing chart of temperature monitor function constant current value vcc2 sensor gnd2 r tc tc to osc z v toh tox pin voltage toy pin voltage sensor pin output 4.1v 1.1v tc tc r 10 v ? ? r tc to vcc2 tc z osc gnd2 sensor 10 sensorpin output tox pin voltage toy pin voltage 1.1v 4.1v when voltage is no more than v toh , either one of to1 and to2 terminals with lower voltage has precedence. v toh 31 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c description of functions and examples of constant setting - continued 6. switching regulator (1) basic action this ic has a built - in switching power supply controller which repeats on/off synchronizing with internal clock. when vbatt voltage is suppl ied (vbatt > v uvlobatth ), fte_g pin starts switching by soft - start. output voltage is determined by the following equation by external resistance and winding ratio n of flyback transformer (n= v out2 side winding number / v out1 side winding number) (2) max du ty when, for example, output load is large, and voltage level of sense pin does not reach current detection level, output is forcibly turned off by maximum on duty (d onmax ). (3) p in conditions when the switching power supply controller is not used i mplement pin treatment as shown below when switching power supply is not used . pin number pin name treatment method 22 fb connect to vcc1 23 comp connect to gnd1 24 v_batt connect power supply 25 vreg connect capacitor 26 fet_g no connection 27 sense connect to vcc1 7. gate state monitoring function when g ate logic and input logic of output device monitored with proout pin are compared, a logic l is output from osfb pin when they disaccord. in order to prevent the detection error due to delay of input and output, osfb filter time t osfbon is provided. ? ? ? ? ? ? v n r / r r v v 2 2 1 fb 2 out ? ? ? ? 32 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c description of functions and examples of constant setting - continued 8. i/o condition table no. status input output vcc1 uvloin vbatt s c p i n x d i s i n a p r o o u t o u t 1 o u t 2 p r o o u t f l t o s f b 1 scp : vcc1 > uvlo, x: don't care, z: hi - z 33 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c description of functions and examples of constant setting - continued 9. power supply startup / shutoff sequence figure 88 . power supply startup / shutoff sequence : since the vcc2 to gnd2 pin voltage is low and the output mos does not turn on, the output pins become hi - z conditions. : since the vcc1 pin voltage is low and the flt output mos does not turn on, the output pins become hi - z conditions. out1 proout flt v _batt vcc 1 v cc 2 in a h l h l hi - z l hi - z l hi - z v uvlo 1 h v uvlo batt l v uvlo 1 l v uvlo 2 h v uvlo 1 l v uvlo 2 h 0 v 0 v 0 v out2 l h i - z out1 proout flt v _batt vcc 1 v cc 2 in a h l h l hi - z l hi - z l hi - z v uvlo 1 h v uvlo 2 l v uvlo 1 h v uvlo 2 l v uvlo 1 l v uvlo batt h 0 v 0 v 0 v out2 l h i - z l h l l 0 v 0 v l out1 proout flt v _batt vcc 1 v cc 2 in a h hi - z hi - z l hi - z v uvlo 1 l v uvlo batt h v uvlo2l v uvlo batt h v uvlo2l v uvlo batt h 0 v out2 h i - z out1 proout flt v _batt vcc 1 v cc 2 in a h l h l hi - z l hi - z l hi - z v uvlo2h v uvlo batt l v uvlo2h v uvlo batt l v uvlo 1 h v uvlo batt l out2 l h i - z 0 v 0 v 0 v 34 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c selection of components externally connected figure 89. for using switching power supply controller figure 90 . for no using switching power supply controller recommended sumida ceeh139c ceer117 vcc2 vcc2 gnd1 flt dis ina osfb sensor vcc1 fb comp v_batt vreg fet_g sense gnd1 gnd2 out2 nc out1 vcc2 proout tc to2 to1 scpin3 scpin2 scpin1 uvloin gnd2 q s r - + + dac slope - + osc flt osc osc uvlo1 - + - + edge - + - + osc flt filter filter ecu rectifier / ripple f ilter rectifier / ripple f ilter snubber vcc1 v_ba tt gnd2 gnd1 gnd2 gnd1 regulator - + current source - + predriver logic uvlo_batt t imer osfb osc q s r q s r logic max.duty rese t rst uvlo1 uvlo_ba tt filter - + - + recommended rohm mcr100jzh mcr18ezp recommended rohm mcr03ezp recommended rohm mcr100jzh recommended rohm mcr03ezp recommended rohm ltr18ezp recommended rohm mcr03ezp recommended rohm rb168m150 recommended rohm mcr03ezp mcr18ezp vcc2 gnd1 flt dis ina osfb sensor vcc1 fb comp v_batt vreg fet_g sense gnd1 gnd2 out2 nc out1 vcc2 proout tc to2 to1 scpin3 scpin2 scpin1 uvloin gnd2 q s r - + + dac slope - + osc flt osc osc uvlo1 - + - + edge - + - + osc flt filter filter ecu vcc1 gnd2 gnd1 regulator - + current source - + predriver logic uvlo_batt t imer osfb osc q s r q s r logic max.duty rese t rst uvlo1 uvlo_ba tt filter - + - + recommended rohm mcr03ezp mcr100jzh mcr18ezp recommended rohm mcr03ezp mc r03ezp recommended rohm mcr03ezp mc r100jzh recommended rohm mcr03ezp mc r03ezp recommended rohm mcr03ezp gnd1 gnd1 35 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c power dissipation thermal design please make sure that the ic s chip temperature tj is not over 150 c , while considering the ic s power consumption (w), package power (pd) and ambient temperature (ta). when tj=150 c is exceeded , the ic may mal functions or some problems (ex. a bnormal operation of various parasitic elements and increasing of leak current) may occur. constant use under these circumstances leads to deterioration and eventually ic may destruct. tjmax=150 c must be strictly obeyed under all circumstances. figure 91. ssop - b28w power dissipation curve (pd - ta curve) 0 0.25 0.5 0.75 1 1.25 1.5 0 25 50 75 100 125 150 175 power dissiqation : pd [w] ambient temperature : ta [] measurement machine kuwano electric measurement condition rohm board board size 3 1 - layer board ja =111.1 36 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c i/o equivalent circuit pin no. pin name input output equivalent circuit diagram pin function 2 uvloin output - side uvlo setting pin 3 scpin1 short circuit current detection pin 1 4 scpin2 short circuit current detection pin 2 5 s cpin3 short circuit current detection pin 3 6 to1 constant current output pin / sensor voltage input pin 1 7 to2 constant current output pin / sensor voltage input pin 2 8 tc constant current setting resistor connection pin uvloin gnd2 vcc2 internal pow er supply scpin1 scpin2 scpin3 gnd2 vcc2 internal pow er supply tc to1 to2 gnd2 vcc2 internal pow er supply 37 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c i/o equivalent circuit - continued pin no. pin name input output equivalent circuit diagram pin function 11 out1 output pin 9 proout soft turn - off pin /gate voltage input pin 13 out2 output pin for miller clamp 16 flt fault output pin 19 osfb output state feedback output pin 20 sensor temperature information output pin out1 gnd2 vcc2 proout gnd2 vcc2 inter nal power suppl y inter nal power suppl y out2 gnd2 vcc2 flt osfb gnd1 sensor gnd1 vcc1 38 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c i/o equivalent circuit - continued pin no. pin name input output equivalent circuit diagram pin function 17 dis input enabling signal input pin 18 ina control input pin 22 fb error amplifier inverting input pin for switching controller 23 comp error amplifier output pin for switching controller dis gnd1 vcc1 ina gnd1 vcc1 fb gnd1 v_batt internal pow er supply comp gnd1 v_batt internal pow er supply 39 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c i/o equivalent circuit - continued pin no. pin name input output equivalent circuit diagram pin function 25 vreg power supply pin for driving mos fet of switching controller 26 fet_g mos fet control pin for switching controller 27 sense current feedback resistor connection pin fo r switching controller gnd1 v_batt fet_g vreg internal pow er supply sense gnd1 v_batt internal pow er supply 40 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic s power supply terminal s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large cur rents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipat ion rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. i n case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be ap proximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspect ion process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on th e pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid e nvironment) and unintentional solder bridge deposited in between pins during assembly to name a few. 41 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c operational notes C continued 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual inte rference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 24. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s 42 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c ordering information b m 6 0 0 5 1 f v - c e 2 part n umber package fv : ssop - b28w product class c : for automotive applications packaging and forming specification e2 : embossed tape and reel (ssop - b28w) marking diagram ssop - b28w ( top view) b m 6 0 0 5 1 part number marking lot number 1pin mark 43 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c physical dimension , tape and reel information package name ssop - b28 w (max 9.55 (include.burr)) 44 / 44 tsz02201 - 0818abh00010 - 1 - 2 ? 20 13 rohm co., ltd. all rights reserved. 20.may.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bm60051fv - c revision history date revision changes 25 . apr .201 4 001 new release 13 . may .2015 002 p .1 features adding item (ul1577 recognized) p.21,22 typical performance curves corre cting mistakes datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. |
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