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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com clock generator for audio/video equipment BU2362FV general description BU2362FV is a clock generator ic capable of generating three types of clocks - video, audio and system clocks that are necessary for dvd player systems. it is a single chip solution that uses pll technology. particularly, the audio clock is a dvd - video reference and yet achieves high c/n characteristics that have low level of distortion factor. features connecting a crystal oscillator generates multiple clock signals from a built -i n pll circuit . audio clock of high c/n characteristics providing a low level of distortion factor the audio clock provides switching selection outputs. single power supply of 3.3v applications dvd players key specifications package w (typ) x d(typ) x h(max) typical application circuit (note) we believe that this circuit is to be recommended. however, to use it, make further thorough check for the characteristics. part name bu2 362 fv power sour ce voltage [v] 2.7 to 3.6 reference frequency [mhz] 27.0000 output frequency [mhz ] dvd video 1 27.0000 dvd audio, cd (switching outputs ) 512fs 24.5760 22.5792 other 36.8640 16.9344 system 768 (48k type) 36.8640 768 (44.1k type) 33.8688 384 ( 44.1k type) 16.9344 jitter 1 [psec] 70 long - term - jitter p - p [nsec] 5 .0 o perating temperature range [c] - 2 5 to + 85 1:vdd2 16: clk36m 2:vss2 15:clk33m 3 6.8640 mhz 27.0000mhz 3:clk27m 14:fsel 1 33.8688mhz 4: test 13:clk 16m h:44.1khz mode l:48khz mode 5:avdd 12:dvdd 6:avss 11:dvss 7:xtal out 10:clk512fs1 2 2.5792 mhz or 2 4.5670 mhz 8: xtal in 9:clk a 16.9344 mhz o r 36.8640 mhz bu2 362fv 27.0000mhz 16.9344mhz ssop - b16 5.0 0 mm x 6 . 40mm x 1. 35 mm datashee t datashee t
b u2 362 fv 2 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 pin configuration fsel1 clk512fs clka open 22.5792mhz 16.9344mhz l 24.5760mhz 36.8640mhz pin description s pin no. pin name function 1 vdd2 power supply for clk27 m , clk36m 2 vss2 gnd for clk27 m , clk36m 3 clk27m 27mhz clock output terminal 4 test input pin for test : with pull - down (please set l or open, normally) 5 avdd power supply for analog block 6 avss gnd for analog block 7 xtalout crystal output terminal 8 xtalin crystal input terminal 9 clka clka output terminal (16.9344mhz or 36.8640mhz) 10 clk512fs 512fs clock output terminal (22.5792mhz or 24.5760mhz) 11 dvss power supply for digital block 12 dv dd gnd for digital block 13 clk16m 16.9344mhz clock output terminal 14 fsel1 clka or clk512fs pin output select : with pull - up 15 clk33m 33.8688mhz clock output terminal 16 clk36m 36.8640mhz clock output terminal ( note) basically, mount ics to the pr inted circuit board for use. (if the ics are not mounted to the printed circuit board, the characteristics of ics may not be fully demonstrated.) mount 0.1 f capacitors in the v icinity of the ic pins between pin 1 (vdd 2 ) and pin 2 (vss 2 ), pin 5 (av dd) and pin 6 (avss), pin 11 ( d vss) and pin 12 (dvdd), respectively. for the fine - tuning of frequencies, inser t several numbers of pf in the pin 7 and pin 8 to gnd. depending on the conditions of the printed circuit board, mount an additional electrolytic capacito r between the power supply and gnd terminal. for emi protection, it is effective to put ferrite beads in the origin of power to be supplied to the BU2362FV from the board or to insert a capacitor (of not more than 1 ? b u2 362 fv 3 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 block diagram xtal osc xtalin=27.0000mhz pll1 1/4 8:xtalin 7:xtalout 14 : fsel1 1/6 1/ 4 1/8 1/6 3:clk27m (27.0000mhz) 15:clk33m ( 33.8688 mhz) 13:clk16m (16.9344mhz) 9:clka ( fse=open:16.9344mhz fsel=l :36.8640mhz) 10:clk512fs (fse=open :22.5792mhz fsel=l :24.5760mhz) pll2 16:clk36m (36.8640mhz) b u2 362 fv 4 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 absolute maximu m ratings (ta=25 c ) parameter symbol rating unit supply voltage v dd - 0.5 to +7.0 v input voltage v in - 0.5 to v dd +0.5 v storage temperature range tstg - 3 0 to +125 ? ? b u2 362 fv 5 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves (basic data ) fig ure 2. 33.9mhz period - jitter ( v dd =3.3v, at c l =15pf ) 500psec/div 1.0v/div fig ure 3. 33.9mhz spectrum ( v dd =3.3v, at c l =15pf ) 10khz/div 10db/div rbw=1khz vbw=100hz fig ure 4. 36.9mhz outp ut waveform ( v dd =3.3v, at c l =15pf ) 5.0nsec/div 1.0v/div fig ure 1. 33.9mhz output waveform ( v dd =3.3v, at c l =15pf ) 5.0nsec/div 1.0v/div b u2 362 fv 6 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C b u2 362 fv 7 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C b u2 362 fv 8 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C b u2 362 fv 9 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C b u2 362 fv 10 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature b u2 362 fv 11 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature b u2 362 fv 12 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature b u2 362 fv 13 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] b u2 362 fv 14 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 10 20 30 40 50 -25 0 25 50 75 100 temperature 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature b u2 362 fv 15 / 19 tsz02201 - 0e3e0j500680 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and larg e - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these con ditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling cap acitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards whe n testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may v x e m h f w w k h , & |