aug . 20 1 4 . ver. 0.1 magnachip semiconductor ltd . 1 m d u1532s C single n - channel trench mos fet 30 v 7.9 absolute maximum ratings (ta = 25 o c) characteristics symbol rating unit drain - source voltage v dss 30 v gate - source voltage v gss 20 v continuous drain current (1) t c =25 o c (silicon limited) i d 1 05 a t c =25 o c (package limited) 32 t a =25 o c 29.5 t a = 70 o c 23.7 pulsed drain current i dm 128 power dissipation t c =25 o c p d 69 w t a =25 o c 5.5 single pulse avalanche energy ( 2 ) e as 20 mj junction and storage temperature range t j , t stg - 55~150 o c thermal characteristics characteristics symbol rating unit thermal resistance, junction - to - ambient (1) r ja 22.7 o c/w thermal resistance, junction - to - case r jc 1.8 mdu 1532s sing le n - channel trench mosfet 30 v features ? v ds = 30 v ? i d = 32 a @v gs = 10v ? r ds(on) < 4. 2 m @v gs = 10v < 5.3 m @v gs = 4.5 v ? 100% uil tested ? 100% rg tested ? sbd built in general description the md u1532s uses advanced magnachip s mosfet technology, which provides high performance in on - state resistance, fast switching performance and excellent quality . mdu 1532s is suitable device for dc/dc converter and general purpose applications. s s s g g s s s d d d d d d d d pdfn 56 d g s
aug . 20 1 4 . ver. 0.1 magnachip semiconductor ltd . 2 m d u1532s C single n - channel trench mos fet 30 v ordering information part number temp. range package packing ro hs status mdu 1532 s u rh - 55~150 o c p dfn56 tape & reel halogen free electrical characteristics (t j =25 o c) characteristics symbol test condition min typ . max unit static characteristics drain - source breakdown voltage bv dss i d = 1 0 m a, v gs = 0v 30 - - v gate threshold voltage v gs(th) v ds = v gs , i d = 250 a 1 .0 1. 8 3 .0 drain cut - off current i dss v ds = 24 v, v gs = 0v - - 0.5 ma gate leakage current i gss v gs = 20v, v ds = 0v - - 100 na drain - source on resistance r ds(on) v gs = 10v, i d = 2 0 a - 3. 6 4. 2 m v gs = 4.5 v , i d = 2 0 a - 4. 5 5. 3 forward trans conductance g fs v ds = 5v, i d = 2 0 a - 85 - s dynamic characteristics total gate charge q g( 10 v) v dd = 15 v, i d = 2 0 a, v gs = 10 v - 42.1 58 nc total gate charge q g( 4.5 v) 18.0 25 gate - source charge q gs - 8.4 - gate - drain charge q gd - 3.6 - input capacitance c iss v ds = 15 v, v gs = 0v, f = 1.0mhz - 2 900 - pf reverse transfer capacitance c rss - 8 9 - output capacitance c oss - 910 - turn - on delay time t d(on) v gs = 1 0 v, v d s = 1 5 .0v, i d = 20 a , r g = 3 - 14.4 - ns rise time t r - 12.3 - turn - off delay time t d(off) - 43.2 - fall time t f - 7.1 - gate resistance r g f=1 mhz 0.5 1.1 1.5 drain - source body diode characteristics source - drain diode forward voltage v sd i s = 1a, v gs = 0v - 0.4 1.0 v body diode reverse recovery time t rr i f = 2 0 a, dl/dt = 1 0 0a/s - 43 - ns body diode reverse recovery charge q rr - 48 - nc note : 1. surface mounted fr - 4 board by jedec (jesd51 - 7). continuous current at t c =25 is silicon limited 2. e as is tested at starting t j = 25 , l = 0.1 mh, i as = 20 a , v dd = 27v, v gs = 10v .
aug . 20 1 4 . ver. 0.1 magnachip semiconductor ltd . 3 m d u1532s C single n - channel trench mos fet 30 v fig.5 transfer characteristics fig.1 on - region characteristics fig.2 on - resistance variation with drain current and gate voltage fig.3 on - resistance variation with temperature fig.4 on - resistance variation with gate to source voltage fig.6 body diode forward voltage variation with source current and temperature -50 -25 0 25 50 75 100 125 150 0.6 0.8 1.0 1.2 1.4 1.6 1.8 notes : 1. v gs = 10 v 2. i d = 20 a r ds(on) , (normalized) drain-source on-resistance t j , junction temperature [ o c] 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 notes : i d = 20.0a r ds(on) [m ], drain-source on-resistance v gs , gate to source volatge [v] 0.0 0.2 0.4 0.6 0.8 1.0 0 10 20 30 40 50 3.0v 4.0v 6.0v v gs = 10v 8.0v 4.5v i d , drain current [a] v ds , drain-source voltage [v] 0 2 4 6 0 5 10 15 20 25 30 v gs , gate-source voltage [v] notes : v ds = 5v i d , drain current [a] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.1 1 10 notes : v gs = 0v i dr , reverse drain current [a] v sd , source-drain voltage [v] 0 10 20 30 40 50 0 2 4 6 8 10 v gs = 10v v gs = 4.5v drain-source on-resistance [m ? ] i d , drain current [a]
aug . 20 1 4 . ver. 0.1 magnachip semiconductor ltd . 4 m d u1532s C single n - channel trench mos fet 30 v fig.7 gate charge characteristics fig.8 capacitance characteristics fig.9 maximum safe operating area fig.10 maximum drain current v s. case temperature fig.11 transient thermal response curve 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 10 -3 10 -2 10 -1 10 0 10 1 notes : duty factor, d=t 1 /t 2 peak t j = p dm * z jc * r jc (t) + t c single pulse d=0.5 0.02 0.2 0.05 0.1 0.01 z jc (t), thermal response t 1 , rectangular pulse duration [sec] 0 10 20 30 40 50 0 2 4 6 8 10 v ds = 15v note : i d = 20a v gs , gate-source voltage [v] q g , total gate charge [nc] 25 50 75 100 125 150 0 20 40 60 80 100 120 140 limited by package i d , drain current [a] t c , case temperature [ ] 10 -1 10 0 10 1 10 2 10 -1 10 0 10 1 10 2 10 3 10 s 100 s 1 s 100 ms dc 10 ms operation in this area is limited by r ds(on) single pulse t j =max rated t c =25 i d , drain current [a] v ds , drain-source voltage [v] 0 5 10 15 20 25 30 0 1000 2000 3000 4000 5000 c iss = c gs + c gd (c ds = shorted) c oss = c ds + c gd c rss = c gd notes ; 1. v gs = 0 v 2. f = 1 mhz c rss c oss c iss capacitance [pf] v ds , drain-source voltage [v]
aug . 20 1 4 . ver. 0.1 magnachip semiconductor ltd . 5 m d u1532s C single n - channel trench mos fet 30 v package dimension p dfn56 (5x6mm) d imensions are in millimeters, unless otherwise specified dimension millimeters min max a 0.90 1.10 b 0.33 0.51 c 0.20 0.34 d1 4.50 5.10 d2 - 4.22 e 5.90 6.30 e1 5.50 6.10 e2 - 4.30 e 1.27bsc h 0.41 0.71 k 0.20 - l 0.51 0.71 0 12
aug . 20 1 4 . ver. 0.1 magnachip semiconductor ltd . 6 m d u1532s C single n - channel trench mos fet 30 v disclaimer: the products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power generation, medical appliances, and devices or systems in which malfunction of any product can reasonably be expected to result in a personal injury. sellers customers using or selling sellers products for use in such applications do so at their own risk and agree to fully defend and indemnify seller. magnachip reserves the right to change the specifications and circuitry without notice a t any time. magnachip does not consider responsibility for use of any circuitry other than circuitry entirely included in a magnachip product. is a registered trademark of magnachip semiconductor ltd.
|
