1 ? ha-2515 12mhz, high input impedance, operational amplifier ha-2515 is a high performance operational amplifier which sets the standards for maximum slew rate, highest accuracy and widest bandwidths for internally compensated devices. in addition to excellent dynamic characteristics, this dielectrically isolated amplifier also offers low offset current and high input impedance. the 60v/ s slew rate and 250ns (0.1%) settling time of this amplifier is ideally suited for high speed d/a, a/d, and pulse amplification designs. ha-2515?s superior 12mhz gain bandwidth and 1000khz power bandwidth is extremely useful in rf and video applications. for accurate signal conditioning this amplifier also provides 1 0na offset current, coupled with 100m ? input impedance, and offset trim capability. pinout ha-2515 (pdip) top view features ? slew rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60v/ s ? fast settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns ? full power bandwidth . . . . . . . . . . . . . . . . . . . . . . . 1mhz ? gain bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . 12mhz ? high input impedance . . . . . . . . . . . . . . . . . . . . . . 100m ? ? low offset current . . . . . . . . . . . . . . . . . . . . . . . . . . .10na ? internally compensated for unity gain stability applications ? data acquisition systems ?rf amplifiers ? video amplifiers ? signal generators ? pulse amplification bal -in +in v- 1 2 3 4 8 7 6 5 comp v+ out bal - + part number information part number temp. range ( o c) package pkg. no. HA3-2515-5 0 to 75 8 ld pdip e8.3 data sheet may 2003 fn2893.5 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 321-724-7143 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2003. all rights reserved all other trademarks mentioned are the property of their respective owners. o b s o l e t e p r o d u c t p o s s i b l e s u b s t i t u t e p r o d u c t h a - 2 5 2 5
2 absolute maximum rati ngs thermal information voltage between v+ and v- terminals . . . . . . . . . . . . . . . . . . . 40v differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15v peak output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50ma operating conditions temperature range ha-2515-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 o c to 75 o c thermal resistance (typical, note 1) ja ( o c/w) jc ( o c/w) pdip package . . . . . . . . . . . . . . . . . . . 120 n/a maximum junction temperature (plastic package) . . . . . . . 150 o c maximum storage temperature range . . . . . . . . . -65 o c to 150 o c maximum lead temperature (soldering 10s) . . . . . . . . . . . . 300 o c caution: stresses above those listed in ?abs olute maximum ratings? may cause permanent dam age to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. note: 1. ja is measured with the component mounted on a low effective thermal conductivity test board in free air. see tech brief tb379 for details. electrical specifications v supply = 15v parameter temp ( o c) min typ max units input characteristics offset voltage 25 - 5 10 mv full - - 14 mv offset voltage average drift full - 30 - v/ o c bias current 25 - 125 250 na full - - 500 na offset current 25 - 20 50 na full - - 100 na input resistance (note 2) 25 40 100 - m ? common mode range full 10.0 - - v transfer characteristics large signal voltage gain (notes 3, 6) 25 7.5 15 - kv/v full 5 - - kv/v common mode rejection ratio (note 4) full 74 90 - db gain bandwidth product (note 5) 25 - 12 - mhz output characteristics output voltage swing (note 3) full 10.0 12.0 - v output current (note 6) 25 10 20 - ma full power bandwidth (notes 6, 11) 25 600 1000 - khz transient response rise time (notes 3, 7, 8, 9) 25 - 25 50 ns overshoot (notes 3, 7, 8, 9) 25 - 25 50 % slew rate (notes 3, 7, 9, 12) 25 40 60 - v/ s settling time to 0.1% (notes 3, 7, 9, 12) 25 - 0.25 - s power supply characteristics supply current 25 - 4 6 ma power supply rejection ratio (note 10) full 74 90 - db notes: 2. this parameter value is ba sed on design calculations. 3. r l = 2k ? . 4. v cm = 10v 5. a v >10. 6. v o = 10v. 7. c l = 50pf. 8. v o = 200mv. 9. see transient response test circuits and waveforms. 10. ? v = 5v. 11. full power bandwidth guaranteed based on slew rate measurement using: fpbw = slew rate/2 v peak . 12. v out = 5v. ha-2515
3 test circuits and waveforms figure 1. slew rate and settling time note: measured on both positive and negative transitions from 0v to +200mv and 0v to -200mv at the output. figure 2. transient response figure 3. slew rate and transient response figure 4. voltage follower pulse response notes: 13. a v = -1. 14. feedback and summing resistor ratios should be 0.1% matched. 15. clipping diodes cr 1 and cr 2 are optional. hp5082-2810 recommended. figure 5. settling time test circuit note: tested offset adjustment range is ivos + 1mvi minimum referred to output. typical ranges are 6mv with r t = 20k ? . figure 6. suggested v os adjustment and compensation hook up +5v input +5v 75% output 25% error band 10mv from final value ? t slew = ? v/ ? t -5v settling time ? v -5v rate input 90% output 10% 0mv rise time +200mv 0mv +200mv overshoot out in + 2k ? 50pf - r l = 2k ? , c l = 50pf upper trace: input lower trace: output vertical = 5v/div. horizontal = 200ns/div. t a = 25 o c, v s = 15v output input + 2k ? 5k ? 2 3 4 6 7 50pf v+ v- d g s 2n4416 cr 1 cr 2 settling time test point 1 f 0.01 f 1 f 0.01 f 2k ? 5k ? 2k ? - out in bal. v- v+ 20k ? comp c c r t ha-2515
4 schematic q 37 q 28 r 26 q 32 q 35 q 4 q 2 q 34 q 33 q 24 q 23 q 22 q 19 q 13 q 25 q 20 -in r 2 2k q 1 q 27 q 18 q 21 r 15 740 r 16 1.48k r 17 1.48k r 18 1.48k q 3 comp q 6 q 8 q 7 q 9 q 40 q 39 q 38 1.68k 1.68k r 25 q 29 q 26 q 30 q 31 q 36 r 4 11.13k r 20 3.0k r 23 3.0k r 22 240 ? r 14 30 q 12 q 15 q 17 r 10 1.8k r 7 1.8k 200 r 9 200 r 6 q 16 r 12 1.1k q 14 q 11 r 13 30 c 1 10pf 2.7pf c 2 q10 r 11 2k r 1 4k 200 r 5 200 r 8 +in r 3 960 q 5 r 19 6.3k bal bal v- v+ out ha-2515
5 typical performance curves figure 7. power supply current vs temperature figure 8. input bias and offset current vs temperature figure 9. equivalent input noise vs bandwidth (with 10hz high pass filter) figure 10. normalized ac parameters vs temperature figure 11. open loop gain and phase response figure 12. normalized ac parameters vs supply voltage at 25 o c temperature ( o c) -50 -25 0 25 50 75 100 125 3.2 3.4 3.6 3.8 4.0 4.2 4.4 supply current (ma) v supply = 20v v supply = 15v v supply = 10v temperature ( o c) -20 0 20 40 60 80 100 current (na) bias current offset current -50 -25 0 25 50 75 100 125 frequency (hz) 100 10 1.0 0.1 100hz 1khz 10khz 100khz 1mhz equivalent input noise ( v rms ) thermal noise of 10k resistor 10k source resistance 0k source resistance temperature ( o c) 0.8 0.9 1.0 1.1 bandwidth slew rate -50 -25 0 25 50 75 100 125 bandwidth slew rate normalized parameters referred to values at 25 o c frequency (hz) 120 0 100 10k 1m 10m 100m open loop voltage gain (db) 100 80 60 40 20 -20 10 100k 1k 180 30 60 90 120 150 phase gain 0 phase (degrees) supply voltage (v) 0.8 0.9 1.0 1.1 bandwidth slew rate 20 bandwidth slew rate normalized parameters referred to values at 15v 15 10 ha-2515
6 figure 13. open loop gain response for various values of capacitors from compensation pin to ground figure 14. open loop voltage gain vs temperature figure 15. output voltage swing vs frequency typical performance curves (continued) frequency (hz) -20 80 100 120 0pf 100m open loop voltage gain (db) 10m 1m 100k 10k 1k 100 10 60 40 20 0 30pf 100pf 300pf 1000pf temperature ( o c) -50 -25 0 25 50 75 100 125 75 80 85 90 gain (db) v supply = 20v v supply = 15v v supply = 10v 0 10k 100k 1meg 10meg frequency (hz) 5 15 20 25 30 35 10 output voltage swing (v p-p ) v supply = 20v v supply = 15v v supply = 10v t a = 25 o c ha-2515
7 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality ce rtifications can be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corporation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that da ta sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com die characteristics die dimensions: 65 mils x 57 mils x 19 mils 1650 m x 1450 m x 483 m metallization: type: al, 1% cu thickness: 16k ? 2k ? passivation: type: nitride (si 3 n 4 ) over silox (sio 2 , 5% phos.) silox thickness: 12k? 2k? nitride thickness: 3.5k? 1.5k? substrate potential (powered up): unbiased transistor count: 40 process: bipolar dielectric isolation metallization mask layout ha-2515 v- +in out bal -in v+ comp bal ha-2515
8 fn dual-in-line plastic packages (pdip) c l e e a c e b e c -b- e1 index 12 3 n/2 n area seating base plane plane -c- d1 b1 b e d d1 a a2 l a 1 -a- 0.010 (0.25) c a m bs notes: 1. controlling dimensions: inch. in case of conflict between english and metric dimensions, the inch dimensions control. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. symbols are defined in the ?mo se ries symbol list? in section 2.2 of publication no. 95. 4. dimensions a, a1 and l are m easured with the package seated in jedec seating plane gauge gs - 3. 5. d, d1, and e1 dimensions do not include mold flash or protru- sions. mold flash or protrusi ons shall not exceed 0.010 inch (0.25mm). 6. e and are measured with the leads constrained to be per- pendicular to datum . 7. e b and e c are measured at the lead tips with the leads uncon- strained. e c must be zero or greater. 8. b1 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. n is the maximum number of terminal positions. 10. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- e8.3 (jedec ms-001-ba issue d) 8 lead dual-in-line plastic package symbol inches millimeters notes min max min max a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.15 1.77 8, 10 c 0.008 0.014 0.204 0.355 - d 0.355 0.400 9.01 10.16 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n8 89 rev. 0 12/93 ha-2515
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