datasheet www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. ? features ? outline ? size 1006 (0402) 1.00.6mm (t=0.2mm) ? dimensions ? recommended solder pattern ? specifications typ. i f max. v r min.* 2 typ. max.* 2 i f min. typ. i f (v) (ma) ( ? a) (v) (nm) (nm) (nm) (ma) (mcd) (mcd) (ma) sml-d12y3w 578 581 584 16 40 SML-D12FW 563 564.5 566 14 18 ? 1 : duty 1/10, 1khz ? 2 : reference 20 part no. 2.2 20 10 5 luminous intensity i v 20 original device te chnology enables hi gh brightness and high reliability. green color i fp (ma) current v r (v) voltage dissipation current p d (mw) i f (ma) topr(oc) tstg(oc) operating temp. storage temp. forward voltag v f reverse current i r dominant wavelength ? d emitting power forward peak forward reverse sml-d12y3w / fw ? 40 to ? 85 ? 40 to ? 100 5 yellow 54 20 100* 1 5 67 25 100* 1 aigainp on gaas chip structure absolute maximum ratings (ta=25oc) electrical and optical characteristics (ta=25oc) (unit : mm) tolerance : ? 0.1 (unit : mm) 1608 (0603) 1.6 0.8mm (t=0.55mm) y color type f 1/7 2016.03 - rev.c downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet sml-d12y3w / fw ? electrical characteristics curves 1 10 100 1.0 1.5 2.0 2.5 3.0 sml-d12y3w SML-D12FW 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -40-20 0 20406080100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 5 10 15 20 0 10 20 30 -40-20 0 20406080100 fig.1 forward current - forward voltages forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current relative luminous intensity [a.u.] forward current : i f [ma] fig.4 derating maximum forward current : [ma] ambient temperature : ta [oc] ta=25oc ta=25oc i f =20ma sml-d12y3w SML-D12FW sml-d12y3w SML-D12FW sml-d12y3w SML-D12FW reference 2/7 2016.03 - rev.c downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet sml-d12y3w / fw ? viewing angle ? rank reference of brightness scanning angle (deg) relative intensity scanning angle (deg) relative intensity 10 10 20 20 40 50 70 80 40 50 70 80 05 01 0 0 50 100 0 30 60 90 30 60 90 scanning direction y x 10 10 20 20 40 50 70 80 40 50 70 80 05 01 0 0 50 100 0 30 60 90 30 60 90 scanning direction y x yellow(y) ( ta=25oc, i f 20ma) rank h j k l m n p q r s t u iv (mcd) 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 sml-d12y 3w green(f) ( ta=25oc, i f 20ma) rank l1 l2 m1 m2 n1 n2 p1 p2 q1 q2 r1 r2 iv (mcd) 5.6 to 7.1 7.1 to 9 9 to 11 11 to 14 14 to 18 18 to 22 22 to 28 28 to 36 36 to 45 45 to 56 56 to 71 71 to 90 SML-D12FW reference 3/7 2016.03 - rev.c downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet sml-d12y3w / fw ? taping ? part no. construction ? packing specification rohm led products are being shipped with desiccant (silica gel) concluded in moisture-proof bags. pasting the moisture sensitive label on the outer surface of t he moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request. please contact the nearest sales offi ce or distributer if necessary. 8.0 1.75 3.5 5.5 00.5 1 2 1.9 180 60 13 0.1 0.05 1.5 0.1 0.1 +1 0 -3 0 0.05 0 0.73 4 unitmm) packing quantity 3000pcs/reel pull direction (note) tolerance is within 0.2mm unless otherwise specified 11.4 1 +0.1-0.07 +0.1 -0.07 0.1 0.2 0.05 (unit : mm) (note) tolerance is ? 0.2mm, unless otherwise specified. 4/7 2016.03 - rev.c downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet 201 .0 - rev. & sml-d12y3w / fw 5/7 l precaution (surface mount device) 1.storage if the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. therefore, the package is waterproof. please use the product following the conditions: ? using conditions classification temperature humidity expiration date remark before using 5 to 30oc 30 to 70%rh within 1 year from receiving storage with waterproof package after opening package 5 to 30oc below 70%rh within 168h please storing in the airtight container with our desiccant (silica gel) ? baking bake the product in case of below: t he expiration date is passed. the color of indicator (silica gel) turned from blue to colorless or from green to pink. (even if the product is within the expiration date.) ? baking conditions temperature time humidity 60 3oc 12 to 24h below 20%rh remark ? bake products in reel. ? reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it. ? recommend bake once. 2.application methods 2-1. precaution for drive system and off mode design the circuit without the electric load exceed ing the absolute maximum rating that applies on the products. if drive by constant voltage, it may caus e current deviation of the led and result in deviat ion of luminous intensity, so we recommend to drive by con stant current. (deviation of vf value will cause de viation of current in led.) furthermore, for off mode, please do not apply voltage neither forward nor reverse. e specially, for the products with the ag-paste used in the die bonding, there s high possibility to cause electro migration and result in function failure. 2 -2. operation life span th ere s possibility for intensity of light drop according to working conditions and environments (applied current, surrounding temperature and humidity, corr osive gases), please call our sales staffs for inqu iries about the concerned application below. longtime intensity of light life on mode all the time 2-3.applied stress on product the top of the led is very soft, which the silicon resin is used as sealing resin. therefore, please p ay attention to the overstress on it which may influence its rel iability. 2-4.usage th e product is led. we are not responsible for the us age as the diode such as protection chip, rectifier , switching and so on. 3. others 3-1. surrounding gas notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (am monia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optic al characteristics changes (light intensity, chrominan ce) and change in quality of die bonding (ag-paste) materials. all of the above will cause function failure of the products. therefore, please pay attention to the storage envi ronment for mounted product (concern the generated gas of the surrounding parts of the products and the atmos pheric environment). downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet 201 .0 - rev. & sml-d12y3w / fw 6/7 3-2. electrostatic damage the product is part of semiconductor and electrosta tic sensitive, there s high possibility to be damaged by the electrostatic discharge. please take appropriate me asures to avoid the static electricity from human b ody and earthing of production equipment. the resistance va lues of electrostatic discharge (actual values) var y with products, therefore, please call our sales s taffs for inquiries. 3-3. electromagnetic wave pl ease concern the influence on led in case of applic ation with strong electromagnetic wave such as ih (induction heating). 4.mounting 4-1. soldering ? no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the product s reliability. ? the product is not for flow soldering. ? do not expose the product in the environment of high temperature (over 100oc ) or rapid temperature shift (within 3oc of temperature gradient) during the flow soldering of surrounding parts. ? please set appropriate reflow temperature based on our product usage conditions and specification. ? the max for reflow ing is 2 times, please finish the second flow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. ? compare with n2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. ? for our product that has no solder resist, because of its solder amount and soldering conditions, one of i ts specific characteristics is that solder will penetrate into led. thus, there's high possibility that will influence its reliability. therefore, please be informed, concerning it before using it. 4-2. automatic mounting 4-2-1.silicon resin sealing product t h e sealing resin of led is very soft, so please sele ct adsorption nozzle that would not apply stress di rectly on the sealing section. 4-2-2.mini package (smaller than 1608 size) vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. we recommend to ? set magnet on parts feeder cassette of the mounter to control the product stabilization ? set ionizer to prevent electrostatic charge 4-3. mounting location th e stress like bending stress of circuit board divid ing after mounting, may cause led package crack or damage of led internal junction, therefore, please concern the mounting direction and position to avoi d bending or screwing with great stress of the circuit board. . 4-4. mechanical stress after mounting the mechanical stress may damage the led after circ uit mounting, so please pay attention to the touch on product. stress strength according tothe mounting position: a>b> c>d downloaded from: http:///
www.rohm.com ? 201 5 rohm co., ltd. all rights reserved. data sheet direction for circuit board warping 0.8mm 0.85m m 0.8m m 0.8m m 201 .0 - rev. & sml-d12y3w / fw 7/7 4-5. soldering pattern for recommendation we recommend the soldering pattern that shows on th e right. it will be different according to mounting situation of circu it board, therefore, please concern before designing. the product has adopted the electrode structure tha t it should solder with back electrode of the product. thus, please b e informed that the shape of electrode pin of solder fillet formation i s not guaranteed. 4-6. reflow profile f or reflow profile, please refer to the conditions b elow:( ) ? meaning of marks, conditions mark meanings conditions ts max maximum of pre-heating temperature 180oc ts min minimum of pre-heating temperature 140oc ts time from ts min to ts max over 60sec. t l reference temperature 230 to 260oc t l retention time for t l within 40sec. t p peak temperature 260oc(max) t p time for peak temperature within 10sec. t r / t temperature rising rate under 3oc/sec. t d / t temperature decreasing rate over -3oc/sec. above conditions are for reference. therefore, evaluate by customer s own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of reflow furnaces vary by customer s own conditions. 4-7. cleaning after soldering please follow the conditions below if the cleaning is necessary after soldering. solvent we recommend to use alcohols solvent such as, isopropyl alcohols temperature under 30oc within 3 minutes ultrasonic cleaning 15w below 1 liter (capacity of tank) drying under 100oc within 3 minutes downloaded from: http:///
r1102 a www.rohm.com ? 2015 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes the information contained herein is subject to change without notice. before you use our products, please contact our sales representativ e and verify the latest specifica- tions : although rohm is continuously working to improve product reliability and quality, semicon- ductors can break down and malfunction due to various factors. therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. rohm shall have no responsibility for any damages arising out of the use of our poducts beyond the rating specified by rohm. examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm or any other parties. rohm shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. the products are intended for use in general electronic equipment (i.e. av/oa devices, communi- cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. the products specified in this document are not designed to be radiation tolerant. for use of our products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a rohm representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. do not use our products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. rohm shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. rohm has used reasonable care to ensur the accuracy of the information contained in this document. however, rohm does not warrants that such information is error-free, and rohm shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. please use the products in accordance with any applicable environmental laws and regulations, such as the rohs directive. for more details, including rohs compatibility, please contact a rohm sales office. rohm shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. when providing our products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the us export administration regulations and the foreign exchange and foreign trade act. this document, in part or in whole, may not be reprinted or reproduced without prior consent of rohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10)11) 12) 13) 14) downloaded from: http:///
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