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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 tsz22111 ? 14 ? 001 www.rohm.com power supply ic series for tft-lcd panels multi- channel system power supply ic + gamma buffer BD8162AEKV general description the BD8162AEKV is a system power supply ic that provides control 6 power supply channels and 4 gamma output channels + vcom required for tft-lcd panels on a single chip. all channels have built-in control inp ut and power-good output functions, enabling free sequence control setting just by changing channels. in addition, t he BD8162AEKV is a user-friendly ic incorporating input switch, short-circuit protection, and protection detection output circuits. features ? step-up dc/dc converter with b uilt -in 3a fet ? step-down dc/dc converter with b uilt -in 2a fet ? synchronous rectification step-down dc/dc converter with built-in 2a fet ? 3ch ldo regulator (500ma, 200ma, 20ma) ? positive/negative c har ge pumps ? 4ch gamma buffer amplifier + vcom ? protection circuits: ? under-voltage lockout protection circuit ? thermal shutdown circuit ? timer latch type short-circuit protection circuit ? controllable startup sequence applications lcd tv power supplies key specifications ? power supply voltage 1 range: 4.2v to 14 v ? oscillating frequency: 200khz to 800khz(variable) ? operating temperature range: -40c to +105c package w(typ) x d(typ) x h(max) htqfp64v 12.00mm x 12.00mm x 1.00mm datashee t datashee t downloaded from: http:///
2/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV typical application circuit (1) 1. application used to input v cc 12v: figure 1. typical 12v input application diagram 2. startup sequence vcc input vdd3 vdd1 avcc vol voh (sync rectification) (step-down) (step-up) (negative charge pump) (positive charge pump) vdd2 ldo3 (ldo2) amp+vcom 3. sequence image chart figure 2. sequence chart v cc (12v) vdd3 vdd2 vdd1 avcc ldo3 amp + vcom voh vol BD8162AEKV downloaded from: http:///
3/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV typical application circuit (2) 1. application used to input 5v: figure 3. typical 5v input application circuit diagram 2. startup sequence vcc input vdd3 vdd1 avcc vol voh (sync rectification) (ldo1) (step- up) (negative charge pump) (positive charge pump) vdd2 ldo3 (ldo2) amp+vcom 3. sequence image chart figure 4. sequence chart v cc (5v) vdd3 vdd2 vdd1 avcc ldo3 amp + vcom voh vol BD8162AEKV downloaded from: http:///
4/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV block diagram pin description pin no. pin name function pin no. pin name function pin no. pin name function 1 pgnd3 ground pin 23 cpctl cp control input pin 45 comp2 error amp output 2 pin 2 pg3 power good output 3 pin 24 c2 charge pump output 2 pin 46 dtc2 duty limit pin 2 pin 3 dtc3 duty limit pin 3 pin 25 vcp2 charge pump ldo output 2 pin 47 pvcc2 power supply input pin 4 comp3 error amp output 3 pin 26 hvcc power supply input pin 48 boot2 switch boot pin 2 pin 5 fb3 feedback input 3 pin 27 vcp1 charge pump ldo output 1 pin 49 sw2 switching output 2 pin 6 pvcc3 power supply input pin 28 c1 charge pump output 1 pin 50 ctl2 control input 2 pin 7 ldfb3 ldo feedback input 3 pin 29 cppg cp power good output pin 51 pg2 power good output 2 pin 8 ldctl3 ldo3 control input pin 30 cpfb1 charge pump feedback 1 pin 52 reg boot ldo output pin 9 ldo3 ldo output 3 pin 31 pgnd1 ground pin 53 ldfb1 ldo feedback 1 pin 10 in1 amp input 1 pin 32 pg1 power good output 1 pin 54 ldctl1 ldo1 control input pin 11 in2 amp input 2 pin 33 sw1 switching output 1 pin 55 ldpg1 ldo1 power good output pin 12 in3 amp input 3 pin 34 pgate pch gate drive output pin 56 ldo1 ldo output 1 pin 13 in4 amp input 4 pin 35 dtc1 duty limit pin 1 pin 57 gnd ground pin 14 in+ com input + pin 36 comp1 error amp output 1 pin 58 rt frequency setting pin 15 in - com input ? pin 37 fb1 feedback input 1 pin 59 ldfb2 ldo feedback 2 pin 16 vcom com output pin 38 ctl1 control input 1 pin 60 ldo2 ldo output 2 pin 17 out4 amp output 4 pin 39 fault protection detection output pin 61 ld vcc2 power supply input pin 18 out3 amp output 3 pin 40 scp short-circuit protection delay pin 62 ctl3 control input 3 pin 19 out2 amp output 2 pin 41 uvlo under-voltage lockout protection setting pin 63 sw3 switching output 3 pin 20 out1 amp output 1 p in 42 vcc power supply input pin 64 boot3 switch boot pin 3 pin 21 hgnd ground pin 43 vref reference voltage output pin 22 cpfb2 charge pump feedback 2 pin 44 fb2 feedback input 2 pin vref osc ldo 2 ldo 3 ` ? pgnd1 sw2 reg ldo1 rt ldo2 ldvcc2 sw3 ldfb2 gnd ldfb1 ldctl1 cpfb1 cppg c1 vcp1 hvcc cpctl cpfb2 hgnd ou t1 out2 out3 out4 vcp2 c2 sw1 pgate dtc1 comp1 fb1 fault scp uvlo vcc vref fb2 comp2 dtc2 boot2 pvcc2 in - in+ in4 in3 in2 in1 ldo3 ldctl3 ldfb3 fb3 comp3 dtc3 pg3 pvcc3 pgnd3 protect ?` ? reg hgnd hgnd pvcc2 pgnd1 ctl1 pg1 vcom ldpg1 ldo 1 R ` ctl2 pg2 hvcc ctl3 boot3 ? R` NR ` step-up converter negative charge pump sync rectification step-down converter step-dow n converter positive charge pump downloaded from: http:///
5/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV absolute maximum ratings (ta=25 c ) parameter symbol rating unit power supply voltage 1 v cc , v pvcc2, 3 15 v power supply voltage 2 v ldvcc2 7 v power supply voltage 3 v hvcc 20 v sw1 pin voltage v sw1 20 v maximum junction temperature tjmax 150 c power dissipation pd 5. 20 (note 1) w operating temperature range to pr - 40 to + 105 c storage temperature range tstg - 55 to + 150 c (note 1 ) to use the ic at temperatures over ta ? 25 c , derate power rating by 41.6mw/c. when mounted on a four-layer glass epoxy board measuring 70 mm x 70 mm x 1.6 mm (with reverse side of copper foil measuring 70mm x 70 mm). caution: operating the ic over the absolute maximum ratings may damage th e ic. the damage can either be a short circuit between pins or a n open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions ( ta ? - 40 c to +105c) parameter symbol min max unit power supply voltage 1 v cc , v pvcc2, 3 4.2 14 v power supply voltage 2 v ldvcc2 - 5.5 v power supply voltage 3 v hvcc 6 18 v sw1 pin voltage v sw1 - 18 v sw1 pin current i sw1 - 3 a sw2, 3 pin current i sw2,3 - 2 a fault detection pull-up voltage v fault - 5.5 v power good pull-up voltage v pg - 5.5 v switching frequency f sw 200 800 khz downloaded from: http:///
6/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV electrical characteristics (unless otherwise noted, ta ? 25 c , v cc ? 12v, v hvcc ? 15v ) parameter symbol limit unit conditions min typ max [dc/dc converter controller block] step-up feedback voltage v fb1 1.230 1.250 1.270 v step-down feedback voltage v fb2 1.225 1.250 1.275 v sync rectification feedback voltage v fb3 0.882 0.900 0.918 v input bias current i fb -1.2 -0.1 +1.2 a v fb =1.5v comp source current i cso 15 40 65 a comp sink current i csi - 65 - 40 - 15 a sw1, 2, 3 m ax duty ratio mdt 85 92 99 % dtc at 0% duty v dtcmin - 0.1 - v v fb = 0v dtc at m ax duty v dtcmax - 0.9 - v v fb = 0v dtc bias current i dtc -1.2 -0.1 +1.2 a v dtc =0v dtc sink current i dtc 1 2 4 ma sw1 on resistance r on1 - 0.2 - i sw =1a sw1 current limit i sw1ocp 3 - - a sw2 high level on resistance r on2h - 0.2 - i sw = 1a sw2 low level on resistance r on2l - 2 - i sw =20ma sw3 high level on resistance r on3h - 0.2 - i sw = 1a sw3 low level on resistance r on3l - 0.2 - i sw = 1a sw1, 2, 3 leak current i swleak -5 0 +5 a pgate sink current i pgtsi 4 9 14 a v pg =5v pgate source current i pgtso 4 8 15 ma v pg =5v pg on resistance r onpg 0.5 1.0 1.5 k pg leak current i pgleak -5 0 +5 a pg1, 2, 3 on voltage pgh - 90 - % pg1, 2, 3 off voltage pgl - 60 - % [ldo1, 2, 3 block] feedback voltage 1, 2 ,3 v ldfb123 1.231 1.250 1.269 v input bias current i ldfb123 -1.2 -0.1 +1.2 a ldo1 output voltage range 1 v ldo1 0 - v pvcc2 v ldo1 output voltage range 2 v ldo2 0 - v ldvcc2 v ldo1 output voltage range 3 v ldo3 0 - v hvcc v i/o voltage difference 1 v dpld1 0.3 0.75 1.6 v v ldfb1 =0v, i o =500ma i/o voltage difference 2 v dpld2 0.1 0.33 0.75 v v ldfb2 =0v, i o =200ma i/o voltage difference 3 v dpld3 0.14 0.3 0.65 v v ldfb3 =0v, i o =20ma ldpg1 on voltage ldpg1h - 90 - % ldpg1 off voltage ldpg1l - 60 - % downloaded from: http:///
7/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV electrical characteristics C continued (unless otherwise noted, ta ? 25 c , v cc ? 12v, v hvcc ? 15v ) parameter symbol limit unit conditions min typ max [charge pump block] positive/negative feedback voltage v cpfb12 1.225 1.250 1.275 v input bias current i cpfb12 -1.2 -0.1 +1.2 a vcp i/o voltage difference v dpcp12 0.28 0.7 1.55 v i o =100ma c1, 2 high level on resistance r onch - 3 - c1, 2 low level on resistance r oncl - 3 - cppg1 on voltage cppgh - 80 - % cppg1 off voltage cppgl - 60 - % [operation amplifier block] input offset voltage v off - 15 0 + 15 mv input bias current i bamp -1.2 0 +1.2 a amp output current capability i amp 30 50 200 ma vcomp output current capability i com 60 150 400 ma amp slew rate sramp - 4 - v/ s vcom slew rate srcom - 4 - v/ s load stability vo - 15 0 + 15 mv i o =+1ma to -1ma max output voltage v oh v hvcc -1.0 v hvcc -0.8 - v i o =-1ma, v in =v hvcc -0.8v min output voltage v ol - 0.1 0.16 v i o =1ma, v in =0v [overall] reference output voltage v vref 2.44 2.50 2.66 v reg output voltage v reg 4.7 5.0 5.3 v oscillating frequency f sw 450 550 650 khz r rt =5 1k uvlo pin on voltage v uvloon 0.88 1.00 1.12 v uvlo pin off voltage v uvlooff 0.93 1.05 1.17 v vcc under-voltage lockout protection on/off voltage v ccuv 3.5 - 4.2 v hvcc under-voltage lockout protection on/off voltage v hvuv 4.3 - 5.3 v ctl on voltage v ctlon 2 - - v ctl off voltage v ctlof - - 0.2 v ctl bias current i ctl - 20 -12.5 -5 a v ctlx =0v scp source current i scpso 2 5 8 a scp sink current i scpsi 2 5 10 ma scp threshold voltage v scp - 1.25 - v fault detection on resistance r onflt 0.5 1 1.5 k average consumption current 1 (vcc, pvcc2, 3) i cc - 5 11 ma no switching average consumption current 2 (hvcc) i hicc - 2.8 6 ma no switching downloaded from: http:///
8/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV description of operation of each block and procedure for selecting application components (1) step-up dc/dc converter block figure 5. step-up dc/dc converter block this is a step-up dc/dc converter block that outputs a step-up voltag e upon receipt of a signal from ctl1. when the high-level signal is input to ctl1, a current will be pulled up from pgate to turn on input switch m1. at the time of startup, since the switching duty is limited by the dtc1 pin voltage, a soft start is operated. when output reaches 90% of the set voltage, the power good signal will be outp ut from pg1. (1.1) selecting input switch m1 input switch m1 will serve as a switch to block the path from vcc to output when a low -level control signal is input to ctl1. select the input switch with careful attention paid to the fo llowing conditions. recommended ics: rsq and rtq series maximum inductor current: i inmax + < rated current of fet power supply voltage: vcc < rated voltage of fet power supply voltage: vcc < on voltage of fet gate when the ctl1 control input is switched to the high leve l, a 9a (typ) sink current will be pulled from the pgate p in to turn on the input switch. pgate dtc drv err 1.25 ctl power good ctl1 pg1 fb1 comp1 pgnd1 sw1 pgate pwm ci1 m1 d1 co1 vref vref (2.5v) r15 c13 dtc1 r16 r13 c12 c11 r11 r12 control power good r14 v o v cc S i l 2 downloaded from: http:///
9/ 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV (1.2) selecting the output l constant the coil l to be used for output is determined by the rate d current i lr and the maximum input current value i in max of the coil. figure 6. coil current waveform (step-up dc/dc converter) make adjustments so that i inmax + i l / 2 will not reach the rated current i lr . at this time, i l is obtained by the following equation. ][ 1 1 a f v v v v l i o cc o cc l ? ? ? ? where: f = switching frequency in addition, since the coil l value may have variatio ns in the range of approximately 30%, s et this value with sufficient margin. if the coil current exceeds the rated current i lr , the internal ic element may be damaged. (1.3) output capacitor setting for capacitor c to be used for output, set it to the permissible value of the ripple voltage vpp or that of the drop voltage at the time of a sudden load change, whichever is l arger. the output ripple voltage is obtained by the following equatio n. ) 2 ( 1 l lmax o cc o esr lmax i i v v fc r i vpp ? ? ? ? ? ? make this setting so that the voltage will fall within the per missible ripple voltage range. for the drop voltage vdr during a sudden load change, estimate the vdr w ith the following equation. ][ sec 10 v c i vdr o ? ? ? wherein, 10 sec is the estimate of dc/dc response speed. set c o so that these two values will fall within the limit values. since the dc/dc converter causes a peak current to flow betwee n input and output, capacitors must also be mount ed on the input side. for this reason, it is recommended to u se low-esr capacitors above 10f and below 100m as the input capacitors. using input capacitors outside o f this range may superimpose excess ripple voltage upon the input voltage, causing the ic to malfunction. however, since the aforementioned conditions vary with load current, input voltage, output voltage, inductor value, and switching frequency, be sure to verify the margin using the actual product. downloaded from: http:///
10 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV (1.4) output rectifier diode setting for the rectifier diodes to be used as the output stage of t he dc/dc converter, it is recommended to use schottky diodes. select diodes with careful attention paid to the m aximum inductance current, maximum output voltage, and power supply voltage. maximum inductance current: i inmax i l < rated current of diode maximum output voltage: v omax < rated voltage of diode in addition, since each parameter has variations in curren t and voltage of 30% to 40%, design systems with suffi cient margin. (1.5) output voltage setting set output voltage using the following equation with feedba ck resistance composed of r11 and r12. ][ 25 .1 12 12 11 v r r r v o ? ? ? set the maximum output voltage to not more than 18v so that it w ill not exceed the rating of the sw1 pin. it is recommended to apply a setting range of 1 0k to 330k . setting the feedback resistance to not more than 10 k will result in degraded voltage efficiency, while setting it to not less than 330 k will result in higher offset voltage due to an input bias current of 0.1 a (typ) of the internal error a mp lifier. (1.6) phase compensation setting phase setting procedure: the following conditions are required to ensure the stability of the negative feedback system. ? when the gain is set to 1 (0 db), the phase lag should not be more than 150 (i.e., p hase margin should not be less than 30 ). in addition, since dc/dc converter applications are sampled a ccording to the switching frequency, the overall system gbw should be set to not more than 1/10 of the switching fre quency. the targeted characteristics of the applications can be summarized as follows . ? when the gain is set to 1 (0 db), the phase lag should not be more than 150 (i.e., p hase margin should not be less than 30 ). ? the gbw at that time (i.e., frequency when the gain is se t to 0 db ) should not be more than 1/10 of the switching frequency. the responsiveness is determined by the gbw limitation. consequently, to raise the responsiveness, higher switching frequencies are required. to ensure the stability through the phase compensation, it is necessary to cancel the secondary phase delay (-180) caused by lc resonance with the secondary phase lead (in other w ords, by adding two phase leads). the gbw (i.e., frequency when the gain is set to 0 db ) is determined by phase compensation capacitance connected to the error amplifier. if gbw needs to be reduced, in crease the capacitance of the capacitor. 2 downloaded from: http:///
11 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1 dtc [v] duty[%] figure 10. characteristics of dtc voltage vs duty cycle ( i ) ordinary integrator (low-pass filter) ( ii ) open loop characteristics of integrator ] [ 2 1 ) int( hz rca fa a po ? ? ] [ 2 1 ) int( hz rc gbw fb b po ? ? ? since the phase compensation like that shown in (a) and (b) applies to the error amplifier, it will act as a low-p ass filter. for dc/dc converter applications, r represents feedback resistors c onnected in parallel. according to the lc resonance of the output, two phase leads shou ld be added. ] [ 2 1 hz lc fp frequency resonant lc ? ? ] [ 11 2 1 1 hz rc fz lead phase ? ? ][ 32 2 1 2 hz r c fz lead phase ? ? figure 9 set the lead frequency of one of the phases close to the l c resonant frequency for the purpose of canceling the lc resonance. note: if high-frequency noise occurs in output, it will pass throug h capacitor c1 and affect the feedback. to avoid this problem, add resistor r4 of approximately 1k in series with capacitor c1. (1.7) duty cycle limit setting applying a voltage to the dtc pin makes it possible to fix the maximum duty cycle. furthermore, since the upper limit value of the maximum duty cycle is fixed within the ic, it w ill not increase beyond the upper limit value. figure 10 shows the relationship between the dtc voltage and the maxi mum duty cycle. refer to this figure to make the dtc voltage setting. subsequently, set r15 and r16 so that the dtc v oltage will reach the level shown in the figure. set the maximum duty cycle with sufficient margin so that it will not reach the maximum duty cycle for normal use. for step-up converters, the range normally used is as follow s. max on duty cycle = < max set duty cycle figure 7 figure 8 vo r1 r2 a c2 c1 comp r3 r4 v omax - v cc min v omax a comp r feedback phase margin 180 90 180 90 0 0 a (a) -20db/decade gbw(b) f f gain db phase fb c downloaded from: http:///
12 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV (1.8) soft-start time setting adding capacitor c13 to dtc resistive dividers r15 and r16 makes it possible to use the soft-start function. the soft-start function is needed to prevent an excessive in crease in coil current and output voltage overshoot at sta rtup. the capacitance and soft-start time are obtained by the follo wing equation. [sec] ) 16 15 16 5.2 28 .0 62 .0 1( ln 16 15 16 15 13 r r r v v v r r r r c tss o cc o ? ? ? ? ? ? ? ? ? ? ?? (1.9) control and power good functions when the control pin (ctl) is set to low-level input, the rel evant block will stop operation. the control pin voltage is internally pulled up to the reference voltage vref, whereby operat ing the relevant block in the open state. the power good terminal (pg) is designed in an open-drain pattern to use as the control pin of a different block or an external power-good signal. the pg pin outputs a low-l evel signal while in the rising mode and, when the o utput voltage reaches 90% of the set voltage, will enter a hi gh impedance state. at this time, the ctl pin at the destinatio n will be switched to high-level input by the use of a pu ll-up resistor. in contrast, when the output voltage falls b elow 60% of the set voltage, the ctl pin will switch to low-level ou tput. to use the pg pin output as an external signal, connect a pull-up re sistor. a pull-up resistance ranging from 51k to 200k is recommended. typical application: figure 11. typical application of control / power good functions step-up output 90% pg1 (ldctl3) ldo3 output low switched to high by pull-up resistor connect step-up dc/dc ldo3 pg1 ldctl3 downloaded from: http:///
13 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV (2) step-down dc/dc converter block and sync rectification step-down dc/dc converter block figure 12. step-down dc/dc converter block and sync rectification step-down dc/dc converter block the step-down dc/dc converter block and the sync rectificat ion step-down dc/dc converter block differ in the feedback voltage and sw low-level on resistance, but have ab out the same configuration. while the control signal remains at low level, the low-le vel sw turns on to output a low voltage. when the control signal is switched to a high level, output voltage will sta rt rising with the soft start function in operation. when the output voltage reaches 90% of the set voltage, the po wer good signal will be output. (2.1) selecting the output l constant the inductance l to be used for output is determined by the rated current i lr and the maximum output current value i omax of the inductor. figure 13 . coil current waveform (step-down dc/dc converter) make adjustments so that i omax + i l / 2 will not reach the rated current i lr . at this time, i l is obtained by the following equation. ][ 1 ) ( 1 a f v v v v l i cc o o cc l ? ? ? ? ? in addition, since the inductance l value may have va riations in the range of approximately 30%, set this valu e with sufficient margin. if the coil current exceeds the rated current i lr , the internal ic element may be damaged. control power good dtc err 1.25/0.9v ctl power good ctl2,3 pg2,3 fb2,3 comp2,3 pwm ci2 c24 d2 co2 vref vref (2.5v) r25 c23 dtc2,3 r26 r23 c22 c21 r21 r22 r24 ctl drv pgnd1,3 vcc pvcc2,3 boot2,3 l2 v o 5v sw2,3 v o il t i omax + i l should not reach the rated value level. i omax mean current 2 i lr downloaded from: http:///
14 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV (2.2) selecting i/o capacitors to select i/o capacitors, refer to information in section (1.3). however, the output ripple voltage of the step-down dc/dc converter is obt ained by the following equation. ][ 1 2 v f v v c i r i v cc o o l esr l pp ? ? ? ? ? (2.3) output rectifier diode setting for the rectifier diodes to be used as the output stage of t he dc/dc converter, it is recommended to use schottky diodes. select diodes with careful attention paid to the m aximum inductance current, maximum output voltage, and power supply voltage. maximum inductance current: i omax + i l < rated current of diode power supply voltage: vcc < rated voltage of diode in addition, since each parameter has variations in current and voltage of 30% to 40%, design systems with sufficie nt margin. (2.4) output voltage setting set output voltage using the following equation with feedba ck resistance composed of r21 and r22. ][ 22 22 21 v v r r r v fb o ? ? ? wh ere: v fb : set to 1.25 for the step-down dc/dc converter (fb2) and 0.9 for the sync rectification step-down dc/dc converter (fb3). it is recommended to apply a setting range of 10k to 330k . setting the feedback resistance to not more than 10k will result in degraded voltage efficiency, while setting it to not less than 330k will result in higher offset voltage due to an input bias current of 0.1 a (typ) of the internal error a mp lifier. (2.5) phase compensation setting for details of phase compensation setting, refer to information in section (1.6). (2.6) duty cycle limit setting for details of duty cycle limit setting, refer to information in section (1.7). for step-down converters, however, the range normally used comes t o the following: max on duty cycle = < max set duty cycle 2 v omax v ccmin downloaded from: http:///
15 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV (2.7) s of t start time setting adding the capacitor c23 to the dtc resistive dividers r25 and r26 makes it possible to use the soft start function. the soft start function is needed to prevent an excessive increase in coil current at startup and output voltage overshoot at startup. the capacitance and soft start time are o btained by the following equation: [se ) 26 25 26 5.2 28 .0 62 .0 1( ln 26 25 26 25 23 r r r v v r r r r c tss cc o ? ? ? ? ? ? ? ? ? ?? (2.8) control and power good functions for details of the control and power good functions, refer to information in section (1.9). (3) ldo1 to ldo3 blocks figure 14. ldo1 block figure 15. ldo2 block figure 16. ldo3 block (3.1) selecting i/o capacitors the ldo1 to ldo3 blocks are ceramic capacitor compatible. capacitance in the range of 1f to 100f is recommended. err 1.25v ldfb2 ldo2 ldvcc2 ci4 vdd v o r51 r52 co5 err 1.25v ldctl3 ldfb1 ldo3 hvcc ci5 control ctl hvcc v o r61 r62 co6 err 1.25v power good ldctl1 ldpg1 ldfb1 ldo1 pvcc2 ci2 control ctl vcc v o r41 r42 co4 power good downloaded from: http:///
16 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV (3.2) output voltage setting set output voltage using the following equation with feedba ck resistance composed of r ? 1 and r ? 2. ][ 25 .1 2 2 1 v r r r v o ? ? ? ?? ? ? :4 to 6 it is recommended to apply a setting range of 10k to 330k . setting the feedback resistance to not more than 10k will result in degraded voltage efficiency, while setting it to not less than 330k will result in higher offset voltage due to an input bias current of 0.1 a (typ) of the internal error amplifier. the following table shows the output voltage setting range s and current capabilities. minimum setting maximum setting (with maximum output current) output current capability ldo1 1.5v v cc (max 14v) -1.6v up to 500ma ldo2 1.5v ldvcc2 (max 5.5v) -0.75v up to 200ma ldo3 1.5v hvcc (max 18v) -0.65v up to 20ma (3.3) control and power good functions for details of the control and power good functions, refer to information in section (1.9). for the ldo3 block, however, set output voltage so that the sign al will be input into the control pin after hvcc, which serves as a power source, starts up. (4) charge pump block figure 17. charge pump block ctl power g ood cpctl cppg c73 control power good 1.25v 1.25v cpfb1 hvcc cpfb2 hgnd vcp1 c1 vcp2 c2 c81 c82 d71 d72 c83 r82 r81 vref vol r72 r71 voh d73 d74 c71 c72 c74 c75 cin7 hvcc d81 d82 downloaded from: http:///
17 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV when the charge pimp block receives the control input sign al, the negative-side charge pump will start operation. the startup sequences are internally fixed. consequently, when the negative-side charge pump reaches 80% of the set voltage, the positive-side charge pump will start opera tion. when both negative- and positive-side charge pump s reach 80% of the set voltage, the power-good signal will be ou tput from the cppg pin. (4.1) selecting output diodes for diodes d71 to d74, and d81 and d82, select schottky diodes h aving a current capability three times (positive side) or two times (negative side) as high as the maximum o utput current and a withstand voltage higher than the output voltage. due to the aforementioned requirements, it is recommended to use the rb550ea dual schottky barrier diode. (4.2) selecting output capacitors capacitors c73 and c81 serve as output capacitors for the c harge pump regulators; a capacitance in the range of 1 f to 10 f is recommended. capacitors c71, c72, and c82 serve as flying capacitor s; a capacitance in the range of 0.1 f to 1 f is recommended. capacitors c74, c75, and c83 serve as cha rge pump output capacitors; a capacitance in the range of 0.1 f to 10 f is recommended. (4.3) output voltage setting set output voltage using the following equation with feedba ck resistance. ][ 25 .1 72 72 71 v r r r hv o ? ? ? ? ? 25 .1 81 82 81 ? ? ? ? vref r r r vref lv o ][ 25 .1 81 82 81 5.2 v r r r ? ? ? ? it is recommended to apply a setting range of 10k to 330k . setting the feedback resistance to not more than 10k will result in degraded voltage efficiency, while setting it to not less than 330k will result in higher offset voltage due to an input bias current of 0.1 a (typ) of the internal error amplifier. (4.4) control and power good functions make the sequence setting by inputting the power-good s ignal output from a different block. however, make this setting so that the signal will be input into the cpctl co ntrol pin after hvcc, which serves as a power source, start s up. for example, to generate hvcc in the step-up dc/dc converter bloc k, do not set the sequence so that the same power good pin is connected to ctl1 and cpctl. since the se quences of the negative- and positive-side charge pumps are internally fixed, the sequence of the negative-si de pump starts up first and is followed by that of the positive-side pump. when both negative- and positive-sid e charge pumps reach 80% of the set voltage, the power-good signal will be output from the cppg pin. the pow er-good signal output pattern is the same as that of different blocks. for deta il s, refer to information in section (1.9). downloaded from: http:///
18 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV (5) common amplifier + 4ch buffer amplifier the amp and vcom amplifiers operate in the range of 0. 1v to hvcc ? 0. 8v (typ). normally, use the vcom amplifier as a buffer type amplifier as shown in (a). use the output volta ge of the ldo3 block for power supply on the reference side. to increase the current drive capability, use the pnp and npn transistors as shown in (b). when the vcom amplifier is not used, set the block to the buffer type as shown in (a) and ground the v+ pin. in this case, it is recommended to set the r3 and r4 resistors in the range of 10k to 100k . setting them to not more than 10 k may increase current consumption, thus resulting in deg raded power efficiency. setting them to not less than 100 k may result in higher offset voltage due to the input bias curr ent of 0.1a (typ). (a) (b) figure 18 vcom block ][3 2 1 2 v ldo rcom rcom rcom vcom ? ? ? (6) common block (6.1) uvlo function figure 19. uvlo block set the uvlo voltage with ru1 and ru2. the uvlo protection function will be implemented when the uvlo pin voltage falls below 1.0v (typ) and canceled when it excee ds 1.05v (typ). the v cc voltage at which the uvlo function is activated is expressed by the following equati on. ][ 2 2 1 v ru ru ru vuvlo ? ? it is recommended to set resistance in the range of 10k to 200k . in addition, the v cc pin incorporates a fixed uvlo function. consequently, when the uvlo pin voltage falls below 3.8v (typ), the uvlo protection function will be operated even if the e xternal uvlo voltage is set below 3.8v (typ). (6.2) scp function figure 20. scp block ldo3 rcom1 vcom + - in + in - vcom rcom2 + - v+ v- - vcom ldo3 rcom1 1k 1000 pf 30k 30k vo1 vcom rcom2 rcom3 resistance of approximately 1k is recommended for rcom3. 1.25v latch 5a scp c scp v cc ru1 ru2 uvlo 1.0v downloaded from: http:///
19 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV the scp function protects against short-circuits in the ou tputs of the step-up dc/dc converter, step-down dc/dc converter, sync rectification step-down dc/dc converter, ldo1, a nd charge pump blocks. when any one of these outputs falls below 60% of the set voltage, it will be reg arded as a short-circuit in output, thus activating the short-circuit protection function. if a short-circuit is detected, source current of 5a (typ) wil l be output from the scp pin. then, delay time will be set with external capacitance. when the scp pin voltage exceed s 1.25v (typ), the state will be latched to shut down all outputs. once the state has been latched, it will not be canceled unless v cc restarts. the delay time setting is obtained by using the following equation. ) 10 5 /( ) 25 .1 (][ 6 ? ? ? ? scp c s tl even if none of the output startup sequences is complete a t startup of the ic, short-circuits will be detected and the scp function activated. for this reason, set the delay time substanti ally longer than the startup time. (6.3) fault detection function this ic has the built-in fault detection function that alerts the operating status of protection circuits. if any of the protection circuits turns on, the fault pin will be pull ed up to output low voltage. in stable operating status, the pin outputs high voltage. in this case, resistance ranging from 10k to 220k is recommended. setting resistance to not more than 10k may generate offset voltage due to the internal on resistance, thus disabling proper output of low voltage. in contrast, setting it to not less than 220k may not output proper high-level voltage due to leak current. the fault pin is switched to low voltage output under any of the following conditions. ? when the uvlo (under-voltage protection) function is activated; ? when the tsd (thermal shutdown circuit) function is activa ted; ? when the ocp (overcurrent protection circuit) function is act ivated, or ; ? when the scp (short-circuit protection) function is activated. (6.4) variable oscillator changing the timing resistance rt enables switching freque ncy adjustment. set resistance referring to figure 21. set frequency in the range of 200khz to 800khz. figure 21 . rt vs switching frequency 100 1000 10 100 1000 rt [k] frequency [khz] frequency [khz] downloaded from: http:///
20 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV i/o equivalent circuits 2.pg3 3.dtc3 4.comp3 36.comp1 40.scp 45.comp2 v pv cc 3 v pv cc 3 v vref 5.fb3 22.cpfb2 44.fb2 53.ldfb1 59.ldfb2 7.ldfb3 8.ldctl3 23.cpctl v vref v hvcc v hvcc v vref 9.ldo3 10.in1 11.in2 12.in3 13.in4 14.in+ 15.in- 16.vcom 17.out4 18.out3 19.out2 20.out1 24.c2 28.c1 v hvcc v hvcc v hvcc 25.vcp2 27.vcp1 29.cppg 30.cpfb1 v hvcc v hvcc v hvcc 32.pg1 51.pg2 55.ldpg1 33.sw1 34.pgate v cc v cc downloaded from: http:///
21 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV i/o equivalent circuits - continued 35.dtc1 46.dtc2 37.fb1 38.ctl1 50.ctl2 62.ctl3 54.ldctl1 v cc v vref v cc v vref 39.fault 41.uvlo 43.vref v cc v vref v cc 48.boot2 64.boot3 49.sw2 63.sw3 52.reg v reg v pv cc 2 56.ldo1 58.rt 60.ldo2 v pv cc 2 v pv cc 2 v cc 61.ldvcc2 v cc downloaded from: http:///
22 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in cas e of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after eac h process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground th e ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in dam aging the ic. avoid nearby pins being shorted to each othe r especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins d uring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
23 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transisto r. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 22. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 14. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. 15. discontinuous mode the step-up and step-down dc/dc converters used in this ic have been designed on the assumption that t he converters are used in continuous mode. using the ic constantl y while in discontinuous mode may result in malfuncti ons. to avoid this problem, make coil adjustments or insert a resistor betwee n output and gnd to prevent the ic from entering disconti nuous mode while in use. 16. pcb layout for open-drain pin (sw1) of step-up dc/dc converter connect the open- dr ain pin of the fet built in the step-up dc/dc conve rter to the coil / diode with as thick and short of a line as possible. particularly, making the line dis tance between the open-drain pin and the external d iode longer or routing it with the use of a throu gh -hole may form parasitic impedance due to patterns and cause the open-drain pin to generate a high surge voltage, thus leading to ic destruction. for this reason, ensure that the open-drain pin vo ltage (direct mounting to ic pin) will never exceed the absolute maximum r atings in practical applications of this ic. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
24 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV ordering information b d 8 1 6 2 a e k v - part number package ekv htqfp64v packaging and forming specification none: tray marking diagram htqfp64v (top view) b d 8 1 6 2 e k v part number marking lot number 1pin mark a downloaded from: http:///
25 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV physical dimension, tape and reel information package name htqfp64v downloaded from: http:///
26 / 26 tsz02201-0323aaf00690-1-2 ? 20 16 rohm co., ltd. all rights reserved. 15.feb.2016 rev.001 www.rohm.com tsz22111 ? 15 ? 001 BD8162AEKV revision history date revision changes 15.feb.2016 001 new release downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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