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IC-HG 3 a laser switch rev b1, page 1/ 20 features ? six channel laser switch from cw up to 200 mhz ? cw operation with up to 500 ma per channel ? pulsed operation with up to 1.5 a per channel ? spike-free switching of the laser current ? 6 x 1 channels with ttl inputs ? 3 x 2 channels with lvds inputs ? operates as six independent voltage-controlled current sinks ? outputs (ldkx) are 12 v capable for blue/green laser diodes ? fast and slow switching mode ? simple current control at pins cix ? cix voltage < 3 v for full cw current ? wide supply voltage range from 3 to 5.5 v ? all channels can be paralleled for up to 3 a cw and 9 a pulsed operation ? multiple IC-HG can be connected in parallel for higher currents ? open drain error output ? thermal shutdown applications ? pump lasers ? laser projection ? laser tv ? data transmission ? tof camera ligthing packages qfn28 5 mm x 5 mm block diagram copyright ? 2013 ic-haus http://www.ichaus.com l d k 5 a g n d 3 & i c - h g c i 1 & l d k 3 v d d a g n d 5 c i 2 n e r & - g n d 4 0 % a g n d 1 l d k 2 e n 1 e n 4 l d k 4 & a g n d 4 e n 6 8 0 % e n 2 c i 4 t e m p e r a t u r e 2 0 % a g n d 2 p o w e r & & & c i 6 e n 3 + l d k 1 c i 5 m o n i t o r e n 5 l d k 6 c i 3 a g n d 6 v d d 6 0 % e l v d s
IC-HG 3 a laser switch rev b1, page 2/ 20 description six channel laser switch IC-HG enables the spike- free switching of laser diodes with well-de?ned cur- rent pulses at frequencies ranging from dc to 200 mhz. the diode current is determined by the voltages at pins cix. the six fast switches are controlled independently via ttl inputs. input elvds = hi selects lvds type in- puts and three channel mode. ttl slow switch mode is selected with 30% vdd and lvds slow switch mode with 70% vdd at input elvds. the laser diode can thus be turned on and off or switched between different current levels (ldkx con- nected) de?ned by the voltages at cix. each channel can be operated up to 500 ma cw and 1500 ma pulsed current depending on the frequency, duty cycle and heat dissipation. the integrated thermal shutdown feature protects the IC-HG from damage by excessive temperature.
IC-HG 3 a laser switch rev b1, page 3/ 20 packaging information qfn28 5 mm x 5 mm to jedec pin configuration qfn28 5 mm x 5 mm pin functions no. name function 1 ci1 current control voltage channel 1 2 ci2 current control voltage channel 2 3 ci3 current control voltage channel 3 4 gnd ground 5 ci4 current control voltage channel 4 6 ci5 current control voltage channel 5 7 ci6 current control voltage channel 6 8 agnd6 analog ground channel 6 9 ldk6 laser diode cathode channel 6 10 agnd5 analog ground channel 5 11 ldk5 laser diode cathode channel 5 12 agnd4 analog ground channel 4 13 ldk4 laser diode cathode channel 4 14 en6 ttl switching input channel 6 negative lvds input channel 5 and 6 15 en5 ttl switching input channel 5 positive lvds input channel 5 and 6 16 en4 ttl switching input channel 4 negative lvds input channel 3 and 4 17 en3 ttl switching input channel 3 positive lvds input channel 3 and 4 18 vdd supply voltage 19 elvds ttl/lvds fast/slow input selector 20 en2 ttl switching input channel 2 negative lvds input channel 1 and 2 21 en1 ttl switching input channel 1 positive lvds input channel 1 and 2 22 ner error monitor output 23 ldk3 laser diode cathode channel 3 24 agnd3 analog ground channel 3 25 ldk2 laser diode cathode channel 2 26 agnd2 analog ground channel 2 27 ldk1 laser diode cathode channel 1 28 agnd1 analog ground channel 1 the thermal pad is to be connected to a ground plane (gnd, agnd1. . . 6) on the pcb. only pin 1 marking on top or bottom de?nes the package orientation ( hg label and coding is subject to change). hg code... ... 1 2 3 4 5 9 10 11 12 13 18 19 20 21 25 26 27 28 14 16 17 23 24 6 7 8 15 22
IC-HG 3 a laser switch rev b1, page 4/ 20 package dimensions qfn28-5x5 all dimensions given in mm. this package falls within jedec mo-220-vhhd-1. 5 5 top 0.25 0.50 3.15 3.15 0.55 bottom 0.90 side 4.70 3.15 4.70 0.50 r 0.15 3.15 0.90 0.30 recommended pcb-footprint drb_qfn28-2_pack_1, 10:1
IC-HG 3 a laser switch rev b1, page 5/ 20 absolute maximum ratings beyond these values damage may occur; device operation is not guaranteed. item symbol parameter conditions unit no. min. max. g001 vdd voltage at vdd -0.3 6 v g002 i(vdd) current in vdd -10 750 ma g003 v(ci) voltage at ci1. . . 6 -0.3 6 v g004 v() voltage at en1. . . 6, agnd1. . . 6, elvds, ner -0.3 6 v g005 v(ldk) voltage at ldk1. . . 6 -0.3 12 v g006 i(ldk) current in ldk1. . . 6 dc current -10 600 ma g007 i(agnd) current in agnd1. . . 6 dc current -600 10 ma g008 i() current in ci1. . . 6, en1. . . 6, elvds -10 10 ma g009 i(ner) current in ner -10 20 ma g010 vd() esd susceptibility at all pins hbm 100 pf discharged through 1.5 k
2 kv g011 tj operating junction temperature -40 125 c g012 ts storage temperature range -40 150 c thermal data item symbol parameter conditions unit no. min. typ. max. t01 ta operating ambient temperature range (extended range on request) -25 85 c t02 rthja thermal resistance chip/ambient mounted onto the evaluation board hg1d 25 k/w t03 rthjtp thermal resistance chip/thermal pad 4 k/w all voltages are referenced to ground unless otherwise stated. all currents ?owing into the device pins are positive; all currents ?owing out of the device pins are negative.
IC-HG 3 a laser switch rev b1, page 6/ 20 electrical characteristics operating conditions: vdd = 3.0...5.5 v, agnd1. . . 6 = gnd, tj = -40...125 c unless otherwise stated item symbol parameter conditions unit no. min. typ. max. total device (x = 1. . . 6) 001 vdd permissible supply voltage 3 5.5 v 002 i(vdd) supply current in vdd cw operation 10 ma 003 i(vdd) supply current in vdd pulsed operation, f(enx) = 200 mhz 700 ma 004 v(ldkx) permissible voltage at ldkx -0.3 12 v 005 v(ner) permissible voltage at ner -0.3 5.5 v 006 vc()hi clamp voltage hi at ldkx i(ldk) = 10 ma 12.1 18 v 007 vc(ner) clamp voltage hi at ner i(ner) = 1 ma 7 15 18 v 008 vc(cix)hi clamp voltage hi at cix vc(cix) = v(cix) vdd; i(ci) = 10 ma, other pins open 0.3 1.6 v 009 vc()hi clamp voltage hi at enx, elvds vc() = v() vdd; i() = 1 ma, other pins open 0.8 3 v 010 vc()lo clamp voltage lo at vdd, ldkx, cix, enx, agndx, elvds, ner i() = -10 ma, other pins open -1.6 -0.3 v laser control ldk1. . . 6, ci1. . . 6 (x = 1. . . 6) 101 icw(ldkx) permissible cw current in ldkx (per channel) 500 ma 102 vs(ldkx) saturation voltage at ldkx i(ldkx) = 450 ma, v(cix) = v(cix)@i(ldkx) = 500 ma 1.5 v 103 i0(ldkx) leakage current in ldkx enx = lo, v(ldkx) = 12 v 100 a 104 tr() ldkx current rise time fast iop(ldkx) = 500 ma, i(ldkx): 10% ! 90% iop, v(elvds) = 0 v or vdd 1 ns 105 tf() ldkx current fall time fast iop(ldkx) = 500 ma, i(ldkx): 90% ! 10% iop, v(elvds) = 0 v or vdd 1 ns 106 tr() ldkx current rise time slow iop(ldkx) = 500 ma, i(ldkx): 10% ! 90% iop, v(elvds) = 30% vdd or 70% vdd, vdd = 5 v 5 10 40 ns 107 tf() ldkx current fall time slow iop(ldkx) = 500 ma, i(ldkx): 90% ! 10% iop, v(elvds) = 30% vdd or 70% vdd, vdd = 5 v 5 10 40 ns 108 tr() ldkx current rise time slow iop(ldkx) = 500 ma, i(ldkx): 10% ! 90% iop, v(elvds) = 30% vdd or 70% vdd, vdd = 3.3 v 10 30 90 ns 109 tf() ldkx current fall time slow iop(ldkx) = 500 ma, i(ldkx): 90% ! 10% iop, v(elvds) = 30% vdd or 70% vdd, vdd = 3.3 v 10 30 90 ns 110 tp() propagation delay fast v(enx) ! i(ldkx) v(elvds) = 0 v or vdd, differential lvds rise and fall time < 0.5 ns 3 5 14 ns 111 cr() current matching all channels 0.9 1.1 112 v(cix) permissible voltage at cix -0.3 vdd v 113 vt(cix) threshold voltage at cix i(ldkx) < 5 ma 0.5 1.2 v 114 v(cix) operating voltage at cix i(ldkx) = 500 ma, v(ldkx) > 1.8 v 2 2.9 v 115 ipd(cix) pull-down current at cix v(cix) = 0.5. . . 5.5 v 1 2.5 5 a 116 c(cix) capacity at cix v(cix) = 2 v 500 635 760 pf 117 vc(ldkx) clamp voltage at ldkx i(ldkx) = 100 ma, tclamp < 1 ms, tclamp/t < 1:100 12.5 20 v 118 tskc() channel to channel skew 160 ps 119 tskp() part to part skew best to worst 4 ns input en1. . . 6 (x = 1. . . 6) 201 vt(ttl)hi input threshold voltage hi v(elvds) < 35% vdd, ttl 2 v 202 vt(ttl)lo input threshold voltage lo v(elvds) < 35% vdd, ttl 0.8 v 203 vhys(ttl) hysteresis vhys() = vt()hi vt()lo; v(elvds) < 35% vdd, ttl 50 mv 204 i(enx) pulldown current v(elvds) < 35% vdd, v() = 0.8 v. . . vdd, ttl 4 30 80 a projected values by simulation
IC-HG 3 a laser switch rev b1, page 7/ 20 electrical characteristics operating conditions: vdd = 3.0...5.5 v, agnd1. . . 6 = gnd, tj = -40...125 c unless otherwise stated item symbol parameter conditions unit no. min. typ. max. 205 r(enx) differential input impedance at enx v(elvds) > 65% vdd, v(enx) < vdd 1.4 v, lvds 14 28 k
206 vdiff differential voltage vdiff = |v(en1,3,5) v(en2,4,6)|; v(elvds) > 65% vdd, lvds 200 mv 207 v() input voltage range v(elvds) > 65% vdd, lvds 0.6 vdd 1.4 v input elvds 301 v(elvds) voltage at elvds elvds open 48 50 52 %vdd 302 ri(elvds) 35 50 70 k
303 vt(elvds) threshold voltage ttl fast to ttl slow 16 20 24 %vdd 304 vt(elvds) threshold voltage ttl slow to error 36 40 44 %vdd 305 vt(elvds) threshold voltage error to lvds slow 56 60 64 %vdd 306 vt(elvds) threshold voltage lvds slow to lvds fast 74 80 84 %vdd 307 vhys() hysteresis 10 25 50 mv ouput ner 401 vsat(ner) saturation voltage at ner elvds open, i(ner) = 2 ma 0.6 v 402 i(ner) current in ner elvds open, v(ner) > 0.6 v 3 9 20 ma overtemperature 501 toff overtemperature shutdown rising temperature 130 170 c 502 ton overtemperature release falling temperature 120 160 c 503 thys hysteresis toff ton 5 c power on 601 von power on voltage vdd rising voltage 2.9 v 602 voff power down voltage vdd falling voltage 1.5 v 603 vhys hysteresis 50 500 mv
IC-HG 3 a laser switch rev b1, page 8/ 20 configuration input elvds pin elvds selects between 6 channel ttl mode or 3 channel lvds mode and chooses slow or fast switch- ing speed. the unconnected pin elvds is an error condition signaled at pin ner with the laser current disabled. pin elvds connected to gnd selects the six channel fast ttl mode. pin elvds connected to 30% vdd selects the six channel slow ttl mode. pin elvds connected to 70% vdd selects the three channel slow lvds mode. pin elvds connected to vdd selects the three channel fast lvds mode. an easy way to set the slow operation mode for ttl and lvds mode is to connect a voltage divider at pin elvds. figure 1 shows the recommended voltage di- vider for slow ttl mode and figure 2 shows the rec- ommended voltage divider for slow lvds mode. figure 1: ttl slow figure 2: lvds slow digital inputs en1...6 en1...6 are the digital switching inputs. with pin elvds set to 6 channel ttl mode , each pin enx en- ables the current sink at the respective ldkx. with pin elvds set to 3 channel lvds mode , the odd enx pins are the positive and the even enx pins are the neg- ative lvds inputs. en1 and en2 control ldk1 and ldk2, en3 and en4 control ldk3 and ldk4 and en5 and en6 control ldk5 and ldk6. for correct lvds operation 100
terminating resistors between the re- spective epx and enx pins, very close to the inputs, are strongly recommended. input pins from unused channels have to be connected to gnd (ttl opera- tion) resp. epx to gnd and enx to vdd (lvds opera- tion).
IC-HG 3 a laser switch rev b1, page 9/ 20 analog current control voltage inputs ci1...6 the voltage at pins ci1...6 sets the current in pins ldk1...6. figures 3 and 4 show the temperature de- pendency of the current in a single ldkx output versus the voltage at cix for a typical device. figures 5 and 6 show the min., typ. and max. variations between de- vices at 27 c temperature. the voltage at pins ldkx is 2.5 v. figure 3: i(ldkx) vs. v(cix) at vdd = 5 v figure 4: i(ldkx) vs. v(cix) at vdd = 3.3 v figure 5: i(ldkx) vs. v(cix) at vdd = 5 v figure 6: i(ldkx) vs. v(cix) at vdd = 3.3 v
IC-HG 3 a laser switch rev b1, page 10/ 20 laser outputs ldk1...6 ldk1...6 are the current outputs for the laser diode cathode. for high speed operation, connect the laser diode as close as possible to this pins to minimize the inductance. to ensure a high switching speed, it is important to minimise the inductance of the whole cur- rent loop (cf. figure 7 , marked red) consisting of ic- hg (pins ldkx and agndx), the laser diode (anode and cathode), the backup capacitors as well as the en- closed area. it may still be necessary though to use an r/c snubber network for damping l/c oscillations. figure 7: current loop depending on the residual inductance in the laser current path and the actual laser current, fast free- wheeling diodes from ldkx to vlda may be required (cf. figure 8 , diode d1) to protect the outputs. the an- ode of the free-wheeling diode should be close to the to be protected ldkx output and the cathode close to the backup capacitors at vlda for the free-wheeling current to be dumped into, when switching the respec- tive channel off. figure 8: free-wheeling diode pulsed operation the current for pulsed operation may be higher than for cw operation. therefore the rms current of the pulse train has to be considered. i pulse max = i cw max s repetition time ( t ) pulse time ( t ) (1) with i cw max from electrical characteristics no. 101 and pulses < 10 s. so for a single channel operated with a 50% duty cycle, the max. laser current becomes i pulse max = 500 ma p 2 = 707 ma analog grounds agnd1...6 agnd1...6 are the ground pins for the channels. it is recommended to connect all agnd1...6 pins to gnd. error output ner the open drain pin ner is a low-active error output. signalled errors are elvds open or at 50% vdd, vdd undervoltage and thermal shutdown. power & temperature monitor IC-HG 80% 60% 40% 20% cvdd1 10f 100nf clda3 10f clda2 & & ld2 ld3 ld4 ld5 ld6 clda4 10nf ci3 10nf 10nf cvdd3 & clda1 100f + - rner cvdd2 100nf 10k ci1 10nf 10nf ci2 10nf ci6ci5 10nf10nf ci4 ld1 ci6 en6 elvds vdd ..12v 3..5.5v enttl1 enttl2 enttl3 enttl4 enttl5 enttl6 ci1 ci3 ci5 ci6 ci4 ci2 nerror ldk1 agnd1 ci1 en1 en2 ldk2 agnd2 ci2 ldk3 agnd3 ci3 en3 ldk4 agnd4 ci4 en4 vdd gnd ner ldk5 agnd5 ci5 en5 ldk6 agnd6 & & 10f cvdd1 clda3 100nf clda2 10f & 100f clda1 10nf clda4 10nf ci3 cvdd3 10nf ld2 ld3 ld4 ld5 ld6 100nf cvdd2 ld1 ci6 10nf 10nf ci5 ci4 10nf 10nf ci1 ci2 10nf rner 10k power & temperature monitor IC-HG 80% 60% 40% 20% + - rner cvdd2 100nf d1 10k ci1 10nf 10nf ci2 ld5 ld6 ci3 10nf ci4 10nf cvdd3 ld2 ld3 ld4 ld1 10nf ci6ci5 10nf10nf 10f clda2 cvdd1 10f 100nf clda3 & & clda4 10nf & clda1 100f ldk6 agnd6 ci6 en6 elvds vdd 3..5.5v enttl1 enttl2 enttl3 enttl4 enttl5 enttl6 ci1 ci3 ci5 ci6 ci4 ci2 ..12v nerror ldk1 agnd1 ci1 en1 en2 ldk2 agnd2 ci2 ldk3 agnd3 ci3 en3 ldk4 agnd4 ci4 en4 vdd gnd ner ldk5 agnd5 ci5 en5 rner 10k 100nf cvdd2 d1 ld1 ci6 10nf 10nf ci5 ci4 10nf cvdd3 10nf ld2 ld3 ld4 ld5 ld6 10nf ci3 10nf ci1 ci2 10nf 10f cvdd1 clda3 100nf clda2 10f & 100f clda1 10nf clda4 & &
IC-HG 3 a laser switch rev b1, page 11/ 20 thermal shutdown IC-HG is protected by an integrated thermal shutdown feature. when the shutdown temperature is reached all channels are disabled. falling temperature after this shutdown will unconditionally enable all channels again. necessary precaution to prevent damage of the laser may be to also disable any external control cir- cuits for the laser output power or current control dur- ing thermal shutdown. the error signal at pin ner can be used to e.g. disable the control circuit. application examples figure 9: 1 channel lvds fast 1 0 f a g n d 5 1 0 n f c i & 1 0 0 n f p o w e r & & c i l d k 6 c l d a 1 c v d d 3 c v d d 2 1 0 n f + 1 0 0 f c v d d 3 c i 6 e n 5 a g n d 6 e n 6 1 0 k c v d d 2 . . 1 2 v e l v d s c i 3 e n 3 e n 4 4 0 % 1 0 0 & e n 1 a g n d 1 e n 2 c i v d d a g n d 3 l d k 3 6 0 % a g n d 2 i c - h g c v d d 1 n e r & c l d a 3 1 0 0 n f l d k 4 8 0 % l d k 1 1 0 f g n d l d k 2 1 0 0 n f 1 0 n f c l d a 1 1 0 f 1 0 0 f 3 . . 5 . 5 v 2 0 % c i 1 - 1 0 n f c l d a 2 l d k 5 a g n d 4 n e r r o r c i 4 m o n i t o r r n e r 1 0 n f c i 5 1 0 n f 1 0 k & r n e r r l v d s c l d a 3 1 0 0 n f & t e m p e r a t u r e c l d a 4 c l d a 4 c v d d 1 r l v d s e n - l v d s 1 0 f c l d a 2 v d d 1 0 0 e n + l v d s c i 2
IC-HG 3 a laser switch rev b1, page 12/ 20 figure 10: 1 channel lvds slow 3 . 3 2 k r e l v d s 2 t e m p e r a t u r e 1 0 n f 1 0 n f 1 0 f c v d d 2 c l d a 2 1 0 0 c l d a 2 r n e r 1 0 0 n f c l d a 4 1 0 f 1 0 k 1 0 k 1 0 0 n f n e r p o w e r & c i 1 0 0 c i 5 1 0 f + c i 6 1 0 n f 1 0 n f e n 1 . . 1 2 v e n 2 e n 5 1 0 0 f & c l d a 1 r l v d s c v d d 1 e l v d s & l d k 6 e n 6 c i 4 & 4 0 % l d k 4 c l d a 1 a g n d 4 a g n d 3 r e l v d s 2 c i 1 c i 2 e n + l v d s c i 8 0 % e n - l v d s 7 . 5 k l d k 3 v d d c i c i 3 l d k 1 a g n d 2 e n 4 a g n d 1 v d d l d k 2 n e r r o r g n d e n 3 1 0 n f & 3 . . 5 . 5 v l d k 5 - 1 0 0 n f r n e r m o n i t o r 6 0 % a g n d 5 1 0 0 n f i c - h g & c v d d 3 c v d d 1 r e l v d s 1 r e l v d s 1 7 . 5 k 1 0 0 f c l d a 4 c v d d 3 1 0 n f r l v d s a g n d 6 1 0 f & c l d a 3 c l d a 3 3 . 3 2 k c v d d 2 2 0 %
IC-HG 3 a laser switch rev b1, page 13/ 20 figure 11: 1 channel ttl fast t e m p e r a t u r e v d d i c - h g 1 0 k e n 6 1 0 n f 4 0 % 1 0 n f c v d d 1 c v d d 1 & 1 0 0 n f a g n d 5 c v d d 2 c i 5 1 0 0 f r n e r p o w e r & v d d 1 0 n f 6 0 % e n 1 c i 1 0 k + c l d a 3 c i 2 1 0 n f 1 0 f e n 3 n e r r o r g n d c l d a 4 - c i 3 a g n d 3 c v d d 3 c l d a 3 . . 1 2 v a g n d 1 2 0 % c i 4 e n 2 l d k 1 r n e r e n 5 & c i & a g n d 2 a g n d 4 l d k 3 l d k 2 c l d a 1 l d k 4 & 1 0 0 n f 1 0 0 f e l v d s n e r 3 . . 5 . 5 v c i 1 c v d d 2 e n t t l e n 4 1 0 0 n f 1 0 f l d k 6 c l d a 2 1 0 n f a g n d 6 c i 6 1 0 f 1 0 n f c l d a 4 1 0 0 n f m o n i t o r c l d a 1 c v d d 3 & 1 0 f l d k 5 c l d a 2 c i & 8 0 %
IC-HG 3 a laser switch rev b1, page 14/ 20 figure 12: 1 channel ttl slow r e l v d s 1 m o n i t o r 1 0 n f 1 0 0 n f c l d a 4 t e m p e r a t u r e 1 0 k 1 0 n f & l d k 6 1 0 0 n f 1 0 n f r e l v d s 2 i c - h g c v d d 3 7 . 5 k 1 0 f 3 . 3 2 k e l v d s 3 . . 5 . 5 v 1 0 n f 7 . 5 k c v d d 3 1 0 f 1 0 f & p o w e r & c v d d 2 c l d a 3 e n 1 c v d d 1 v d d r n e r - & 1 0 0 n f e n 3 a g n d 1 1 0 n f c i 1 0 0 n f 1 0 k e n t t l n e r r o r c i c i l d k 4 4 0 % v d d . . 1 2 v c i 4 c i 3 & a g n d 2 c i 2 c l d a 1 c i 6 r n e r c l d a 1 3 . 3 2 k l d k 3 6 0 % a g n d 4 a g n d 3 l d k 1 8 0 % n e r l d k 2 r e l v d s 2 c i 1 a g n d 6 e n 2 g n d c l d a 4 e n 4 1 0 n f c l d a 2 c l d a 3 l d k 5 & 1 0 0 f c v d d 2 & 1 0 0 f + a g n d 5 e n 6 c l d a 2 2 0 % c v d d 1 r e l v d s 1 1 0 f c i 5 e n 5
IC-HG 3 a laser switch rev b1, page 15/ 20 figure 13: 3 channel lvds fast g n d c i 3 i c - h g & 1 0 n f c l d a 4 l d 3 1 0 n f m o n i t o r p o w e r & r l v d s 3 1 0 0 n f c v d d 2 + 1 0 f 1 0 0 1 0 n f 1 0 0 n f c i 3 c v d d 2 c v d d 1 1 0 f c l d a 2 1 0 0 r l v d s 2 a g n d 1 a g n d 3 l d k 5 c i 2 1 0 n f c i 1 & 1 0 0 l d k 1 - a g n d 6 e n + l v d s 2 l d 2 e n - l v d s 2 3 . . 5 . 5 v e n 1 c i 1 . . 1 2 v l d 1 v d d l d k 2 v d d 1 0 n f 1 0 f 4 0 % c v d d 3 l d k 6 c l d a 4 n e r r o r 1 0 k r n e r n e r e n 6 1 0 k c i 2 e n 3 1 0 0 n f c i 3 e n + l v d s 3 l d k 3 e l v d s e n + l v d s 1 a g n d 5 1 0 0 r l v d s 3 c i 3 e n 4 e n - l v d s 3 e n 2 & a g n d 4 e n - l v d s 1 l d k 4 & 1 0 n f 1 0 f a g n d 2 c l d a 1 e n 5 c i 5 c i 6 r l v d s 1 c v d d 1 c i 4 1 0 0 f 1 0 n f l d 1 1 0 n f r l v d s 2 1 0 n f c i 2 l d 2 l d 3 c l d a 1 1 0 0 n f 2 0 % c i 2 8 0 % r n e r t e m p e r a t u r e c l d a 3 c l d a 3 c l d a 2 1 0 0 f & 1 0 0 1 0 n f 1 0 0 c i 1 6 0 % c v d d 3 & r l v d s 1 c i 1
IC-HG 3 a laser switch rev b1, page 16/ 20 figure 14: 6 channel ttl fast l d 5 c i 1 c i 1 c i 6 t e m p e r a t u r e 1 0 n f 1 0 0 f c i 4 c v d d 3 c l d a 4 1 0 n f 1 0 n f - c i 5 c i 2 & c l d a 4 c v d d 1 c l d a 2 1 0 0 n f c l d a 1 1 0 n f l d 6 1 0 f 1 0 f 1 0 n f c i 3 c i 3 & 1 0 0 n f c l d a 3 1 0 n f 1 0 n f g n d c l d a 1 c i 5 c i 2 l d 6 l d k 3 n e r l d 2 a g n d 5 c i 4 a g n d 1 c l d a 2 e n 6 c i 5 e n 1 c i 4 e n t t l 3 . . 1 2 v 1 0 f l d 5 + a g n d 3 l d 4 & 1 0 n f e n t t l 5 & 1 0 n f l d 2 l d k 1 c i 3 1 0 f a g n d 6 4 0 % 1 0 n f e n t t l 1 e n t t l 4 r n e r 2 0 % v d d l d k 6 n e r r o r a g n d 2 m o n i t o r 1 0 n f r n e r c v d d 3 1 0 k e n t t l 6 l d k 2 c i 4 c i 6 v d d a g n d 4 c i 2 e n 4 1 0 0 n f 3 . . 5 . 5 v i c - h g l d 3 l d 1 1 0 n f c i 1 e n 2 e n 5 l d k 5 l d k 4 e n t t l 2 e n 3 e l v d s c i 1 l d 3 & 6 0 % c v d d 2 c i 2 c v d d 1 1 0 n f 1 0 0 n f 1 0 n f p o w e r & 1 0 k c i 6 & 1 0 0 f 8 0 % l d 1 1 0 n f c v d d 2 l d 4 c i 6 c l d a 3 1 0 n f c i 3 c i 5
IC-HG 3 a laser switch rev b1, page 17/ 20 evaluation board IC-HG comes with an evaluation board for test purpose. figures 15 and 16 show both the schematic and the component side of the evaluation board. figure 15: schematic of the evaluation board a a i c 1 4 9 _ 1 1 2 a a a a a a 1 0 j 2 - l v d s _ p 9 j 2 - g n d 4 8 j 2 - g n d 6 e n 4 g n d 1 j 2 - g n d 5 4 7 f j p 1 a 1 k p 1 c l r c 1 7 2 j 2 - g n d 1 j 5 3 a a 4 5 6 7 8 s s 1 j 2 - g n d 1 j p 7 _ 4 i c 1 4 9 _ 1 j 1 1 2 3 j 5 1 j 5 2 a c 5 1 0 0 n f c 1 0 4 7 f j 3 1 0 1 0 n f c 1 3 c 6 1 0 0 n f j 3 1 j 3 2 c i 2 1 0 f c 3 3 c 1 2 1 0 n f 2 j 4 3 a a a d 2 l d k 4 j 4 1 j 4 d 1 l d k 3 c 7 1 0 f l d k 2 1 0 0 n f v l d a l d k 1 d 7 r d c 8 a e n 6 d 6 c 2 5 1 f c 2 4 1 f 1 0 n f c 1 6 j 3 6 c i 6 c 9 1 0 n f j 3 4 1 f c 2 2 1 f c i 5 c l r 1 f c 2 1 c 2 3 a a j p 5 1 k p 5 j p 7 _ 2 a a p 6 1 k c l r j p 7 _ 3 1 0 n f c 1 1 j p 6 a j 2 - v 5 d 6 c i 1 j p 3 a c 4 1 0 0 n f l d k 5 c 3 4 1 0 f j p 5 6 d 5 j p 1 2 j p 7 _ 1 a a 3 . 3 2 k r 1 j p 3 4 c 3 1 1 0 f a a j 2 - g n d 3 5 c 3 2 1 0 f a a a a j 2 - l v d s _ n 1 1 1 k p 3 c l r j 3 8 j 3 9 j 3 5 a 3 a a a a a a c 1 1 0 0 n f j 2 - t t l l r c 3 1 0 0 n f c 2 1 0 0 n f a j p 4 p 4 1 k c 1 1 l d k 6 9 n e r 2 2 s u b e p a d v d d 1 8 1 0 0 r 5 6 e n 2 2 0 1 7 e n 3 1 6 e n 4 1 5 e n 5 1 4 e n 6 4 g n d l d k 1 2 7 2 5 l d k 2 2 3 l d k 3 l d k 4 1 3 l d k 5 a g n d 4 a g n d 5 1 0 8 a g n d 6 1 c i 1 2 c i 2 c i 3 3 c i 4 5 c i 5 6 c i 6 7 e l v d s 1 9 e n 1 2 1 l d k 6 i c - h g u 1 2 8 a g n d 1 a g n d 2 2 6 a g n d 3 2 4 1 2 c 2 6 1 f 1 0 0 r 3 4 5 6 2 r 1 2 1 0 0 c 1 5 1 0 n f c i 4 r 7 a j 3 7 1 0 n f c 1 4 j 2 - g n d 2 4 j 2 - v 5 d 1 7 c 3 6 1 0 f e n 5 e n 2 c 3 5 1 0 f d 4 e n 1 e n 3 j 3 3 n e r d 3 g n d c i 3 1 k c l r v d d r 2 j p 2 p 2 3 . 3 2 k r 3 4 . 2 2 k v d d v d d v d d v d d v d d v d d v d d v d d v d d j p 1 e n 4 g n d 1 j 2 - g n d 5 j 2 - l v d s _ p j 2 - g n d 4 j 2 - g n d 6 a a a a a a a a j 4 a a a c 3 3 1 0 f 1 0 n f c 1 2 j 3 j 3 c i 2 j 3 c 1 3 1 0 n f 1 0 0 n f c 6 1 0 0 n f c 5 4 7 f c 1 0 j 5 j 5 a j p 7 _ 4 g n d l v d s _ p l v d s _ n g n d n c n c g n d t t l j 1 i c 1 4 9 _ 1 j 2 - g n d 1 j 2 - g n d j 5 a a a p 1 1 k 4 7 f c 1 7 a a j p 5 p 5 1 k c 2 1 1 f 1 f c 2 3 1 f c 2 2 c i 5 1 0 n f c 9 j 3 c 1 6 1 0 n f j 3 c i 6 1 f c 2 5 1 f c 2 4 a e n 6 d 6 r d d 7 1 0 0 n f c 8 v l d a l d k 1 1 0 f c 7 l d k 2 d 1 l d k 3 d 2 l d k 4 j 4 j 4 j 2 - g n d 3 1 0 f c 3 2 1 0 f c 3 1 a a a a r 1 3 . 3 2 k j p 3 4 j p 1 2 j p 7 _ 1 j p 5 6 d 5 l d k 5 1 0 f c 3 4 j p 3 a 1 0 0 n f c 4 a j 2 - v 5 d c i 1 c 1 1 1 0 n f j p 6 1 k p 6 j p 7 _ 3 j p 7 _ 2 a a a j p 4 1 k p 4 1 0 0 n f c 3 1 0 0 n f c 2 a 1 0 0 n f c 1 j 2 - t t l a a a a a j 3 j 3 j 3 a j 2 - l v d s _ n p 3 1 k a a a a r 3 3 . 3 2 k r 2 4 . 2 2 k j p 2 1 k p 2 v d d d 3 g n d c i 3 j 3 n e r d 4 e n 1 e n 3 e n 2 1 0 f c 3 5 1 0 f c 3 6 e n 5 j 2 - g n d 2 j 2 - v 5 d 1 a j 3 c 1 4 1 0 n f 1 0 n f c 1 5 c i 4 5 6 2 r 7 1 0 0 r 1 2 1 f c 2 6 r 3 4 1 0 0 l d k 6 / t t l l v d s m o n i t o r p w r & t e m p & & & & & & u 1 i c - h g r 5 6 1 0 0
IC-HG 3 a laser switch rev b1, page 18/ 20 figure 16: evaluation board (component side) figure 17: evaluation board (solder side) with mounting option for heat sink
IC-HG 3 a laser switch rev b1, page 19/ 20 ic-haus expressly reserves the right to change its products and/or speci?cations. an info letter gives details as to any amendments and additions made to the relevant current speci?cations on our internet website www.ichaus.de/infoletter ; this letter is generated automatically and shall be sent to registered users by email. copying C even as an excerpt C is only permitted with ic-haus approval in writing and precise reference to source. ic-haus does not warrant the accuracy, completeness or timeliness of the speci?cation and does not assume liability for any errors or omissions in these materials. the data speci?ed is intended solely for the purpose of product description. no representations or warranties, either express or implied, of merchantability, ?tness for a particular purpose or of any other nature are made hereunder with respect to information/speci?cation or the products to which information refers and no guarantee with respect to compliance to the intended use is given. in particular, this also applies to the stated possible applications or areas of applications of the product. ic-haus conveys no patent, copyright, mask work right or other trade mark right to this product. ic-haus assumes no liability for any patent and/or other trade mark rights of a third party resulting from processing or handling of the product and/or any other use of the product.
IC-HG 3 a laser switch rev b1, page 20/ 20 ordering information type package options order designation IC-HG qfn28 5 mm x 5 mm IC-HG qfn28 general purpose evaluation board IC-HG eval hg1d host adapter for high-speed modules IC-HG eval hg2d host adapter for high-speed modules with heat-sink assembly kit IC-HG eval hg2d-hsk high-speed module for c-mount laser diodes IC-HG icsy hg2m high-speed module for to type laser diodes IC-HG icsy hg8m for technical support, information about prices and terms of delivery please contact: ic-haus gmbh tel.: +49 (61 35) 92 92-0 am kuemmerling 18 fax: +49 (61 35) 92 92-192 d-55294 bodenheim web: http://www.ichaus.com germany e-mail: sales@ichaus.com appointed local distributors: http://www.ichaus.com/sales_partners

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