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| QFN0404-24C ? / packaging information ? packaging information / ?` reference pattern layout dimensions unit: (mm) ?`? / reference pattern layout (2.5) (2.5) 0.22 (0.50) 0.400.1 0.750.05 4.00.10 4.00.10 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 +0.08 -0.07 1pin indent 6 5 4 3 2 1 9 8 7
QFN0404-24C ` /reel ?`?? /taping specifications (1.5) 2.10.6 13.40.6 13.0 (`??) +0.1 -0 ?`?? / ta p in g s p ecifications 1,000pcs/reel r type :[device orientation : right] standard feed direction of feed (1.75) 5.50.05 12.00.3 (4.45) QFN0404-24C power dissipation power dissipation data for the QFN0404-24C is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as the reference data taken in the following condition. 1. measurement condition condition: mount on a board ambient: natural convection soldering: lead (pb) free board dimensions: 40 x 40 mm ( 1600mm 2 ) board structure: 4 copper layers each layer is 50% connected to the package heat-sink. material: glass epoxy (fr-4) thickness: 1.0 mm through-hole: 4 x 0.4 diameter evaluation board (unit: mm) 2. power dissipation vs. ambient temperature thermal resistance( /w) 25 1500 66.67 85 600 ambient temperature power dissipation pd mw 0 200 400 600 800 1000 1200 1400 1600 25 45 65 85 105 125 power dissipation pd mw ambient temperature ta pd vs ta 2.54 1.4 40.0 40.0 2.5 28.9 28.9 ????`? ???????? |
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