SPI-335-34 no.6029 1/6 features infrared led plus phototransistor (single) dip type compact type : 3.4 (l) 5 2.7 (w) 5 1.5 (h) mm visible light cut type lead length : (l=3.5mm) absolute maximum ratings at ta=25 c, 65%rh parameter symbol rating unit input led forward current i f 50 ma reverse voltage v r 5v power dissipation p d 70 mw output collector-emitter voltage v ceo 20 v phototransistor emitter-collector voltage v eco 5v collector curren i c 20 ma power dissipation p c 70 mw operating temperature topr --20 to +80 c storage temperature tstg - -40 to +100 c soldering temperature * 1 tsol 260 c * 1 soldering conditions : time : max. 3sec; clearance : min. 1mm from lower case edge. electro-optical characteristics at ta=25 c, 65%rh parameter symbol condition min. typ. max. unit input forward voltage v f i f =10ma 1.0 1.2 1.6 v reverse current i r v r =5v -- -- 10 m a output dark current i ceo i f =0ma, v ce =10v -- 10 200 na coupled collector output current i c i f =4ma, v ce =5v * 1 33 -- 180 m a leakage current i leak i f =10ma, v ce =5v * 2 -- -- 1 m a collector emitter v ce (sat) i f =10ma, i c =50 m a -- -- 0.5 v saturation voltage rise time tr v cc =5v, r l =100 w -- 5 -- m s fall time tf i c =1ma -- 5 -- m s * 1 location of reflector is show in fig. 1. * 2 no reflector * 3 table of classification of collector output class e f g h ic ( m a) 180 to 110 140 to 80 100 to 50 65 to 33 marking color orange green white silver sanyo electric co.,ltd. semiconductor company tokyo office tokyo bldg., 1-10, 1 chome, ueno, taito-ku, tokyo, 110-8534 japan SPI-335-34 infrared led ultraminiature photoreflector (single-transistor type) 72199 gi, ( mi ) al v.e. film glass plate (t : 1mm) fig. 1 location of reflector ordering number : en6029
SPI-335-34 no.6029 2/6 package dimensions and pin connection as stated in the sttached paper. (no.6029 5/6) rank marking of collector output the bottom of the package is colored following the table of classification of collector output. lot marking color division shall be done as shown in the drawing. (fig. 2) year of even number : front side year of odd number : back side color black blue red green orange brown part a january february march april may june part b july august september october november december soldering conditions (1) temperature : max. 260 c (2) time : max. 3sec (3) clearance : min. 1mm from the case edge. (fig. 3) (1) bending a lead should avoid. however, when bending is necessary, take care the next items. q bending a lead must be done before soldering. w bending a lead must be done in the states of fixing leads and no stress for the regin part. because it is possible that stress for the regin part cause troubles such as gold wire breaking and so on. e a lead must be bend at intervals of 2mm from the case edge. r do not bend the same position of leads more than twice. (2) the hole pitch of a circuit board must fit to the lead pitch. (3) take core the following when soldering. q do not heat a product under any stress (a twist and so on) to leads. w do not heat a product in the states of operating force to the regin part. (4) use the flux which contain no chlorine, have no corrosion and do not need washing. (5) be careful that flux or other chemicals do not attach to the luminous surface and passive surface. precautions a front side b fig. 2 1mm fig. 3
SPI-335-34 no.6029 3/6 1.5 14 pin no. c 0.6 0.4 1.6 3 2 3.4 0.5 3.5 0.5 0.5 0.6 3.3 2.0 10 10 4 -- 0.4 4.0 2.7 2.6 m h m : color marking of ic class 0 to 20 0 to 20 4 -- 0.2 4 3 2 1 pin connection 1. ph. tr emitter 2. ph. tr collector 3. led cathode 4. led anode tolerance : 0.2 unit : mm
SPI-335-34 no.6029 4/6 typical characteristics these numerical value show the electrical and optical characteristics of this product, and not assure this contents. caution 60 50 40 30 20 10 0 --25 0 25 50 75 100 120 100 80 60 40 20 0 --25 0 25 50 75 100 0 100 200 300 400 500 048121620 v ce =5v ta=25 c 0510 40 60 80 100 120 140 0 200 400 600 800 1000 --25 0 25 50 75 100 i f =10ma v ce =5v ta=25 c i f =20ma 15ma 10ma 5ma forward current vs. ambient temperature collector current vs. collector-emitter voltage ambient temperature ta ( c) collector-emitter voltage v ce (v) forward current i f (ma) collector current i c ( a) (rating) power dissipation vs. ambient temperature relative collector current vs. ambient temperature ambient temperature ta ( c) ambient temperature ta ( c) power dissipation p (mw) relative collector current (%) collector vs. forward current forward current i f (ma) collector current i c ( a) (rating) ta=75 c 50 c 25 c 0 c --25 c 500 100 50 10 5 1 0 0.5 1 1.5 2 forward current vs. forward voltage forward voltage v f (v) forward current i f (ma)
SPI-335-34 no.6029 5/6 typical characteristics these numerical value show the electrical and optical characteristics of this product, and not assure this contents. caution 10 -6 5 10 -7 5 10 -8 5 10 -9 10 -10 5 --25 0 25 50 75 100 120 100 80 60 40 20 0 01 234 5 1000 500 100 50 10 5 1 0.1 0.5 1 5 10 50 100 0.14 0.16 0.18 0.20 0.22 0.24 --25 0 25 50 75 100 i f =10ma i c =50 a v ce =10v i fp =20ma v cc =5v ta=25 c i f =10ma v ce =5v ta=25 c d tf tr 120 100 80 60 40 20 0 -- 4 -- 2 0 2 4 6 0 0 + i fp v cc r l v out v out i fp r d 10% 90% tr tf r 1 r 2 r 2 r 1 + collector-emitter saturation voltage vs. ambient temperature ambient temperature ta ( c) collector-emitter saturation voltage v ce (sat) (v) response time vs. load resistance test circuit for response time load resistance r l (k ) response ( s ) collector dark current vs. ambient temperature ambient temperature ta ( c) collector dark current i ceo (a) i f =10ma,v ce =5v ta=25 c,d=1mm relative collector current vs. distance relative collector current vs. ppc paper moving distance ppc paper moving distance r (mm) relative collector current (%) distance between sensor and a r evaporation d (mm) relative collector current (%)
SPI-335-34 no.6029 6/6 caution 1. no products described or contained herein are intended for use in surgical implants, life-support systems, aerospace equipment, nuclear power control systems, vehicles, disaster / crime-prevention equipment or the like, and the failure of which may directly or indirectly cause injury, death or property loss. 2. anyone purchasing any products described or contained herein for an above-mentioned use shall: 1) accept full responsibility and indemnify and defend sanyo electric co.,ltd., its affiliates, subsidiaries and distributors or any of their officers and employees, jointly and severally, against any and all claims and litigation and all damages, costs and expenses associated with such use. 2) not impose any responsibility for any fault or negligence which may be cited in any such claim or litigation on sanyo electric co., ltd., its affiliates, subsidiaries and distributors or any of their officers and employees jointly or severally. 3. information (including circuit diagrams and circuit parameters) disclosed herein is for example only; it is not guaranteed for mass production, sanyo believes the information disclosed herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. precautionary instructions in handling gallium arsenic products special precautions must be taken in handling this product because it contains, gallium arsenic, which is designated as a toxic substance by law. be sure to adhere strictly to all applicable laws and regulations enacted for this substance, particularly when it comes to disposal. manufactured by ; tottori sanyo electric co., ltd. led division 5-318, tachikawa-cho, tottori city, 680-8634 japan tel: +81-857-21-2137 fax: +81-857-21-2161 ps
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