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? 2009-2016 microchip technology inc. ds60001314a-page 1 eqco875sc.3/eqco850sc.3 features combined transmitter and receiver with an integrated equalizer to form a full-duplex bidirectional connection over a single 75 ? coax cable (eqco875sc.3) or 50 ? coax cable (eqco850sc.3) compatible with fx version of fast ethernet low-power: 205 mw from single 3.3v supply integrated termination resistors for low external discrete count fully supports poe-based power and data signal distribution over coax 16-pin, 0.65 mm pin pitch, 4 mm qfn package pb-free and rohs compliant applications this solution is useful and economical for many markets and applications, including the following: camera networks - home security, surveillance, industrial/ inspection, medical cameras home networking over coax infrastructure - when cat5 or cat6 cabling is not available and existing 75 ? coax is not used for analog tv signals tv, stb, pvr connections including inter-room links table 1: typical device pe rformance for eqco875sc.3 version eqco875sc.3 range using rg11 rg6 (? 5 mm) eqco875sc.3 225m 150m table 2: typical device pe rformance for eqco850sc.3 version eqco850sc.3 range using rg174 rtk rg58 eqco850sc.3 40m 70m 70m eqco875sc.3/eqco850sc.3 si ngle-coax transceiver for fast ethernet downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 2 ? 2009-2016 microchip technology inc. table of contents 1.0 device overview ............................................................................ ................................. ............................................................. 3 2.0 application information ............................................ ......................................................... ............................................................ 7 3.0 electrical characteristics ......................................................... ......................................... ............................................................ 9 4.0 packaging................................................................................ ................................................................................................... 11 to our valued customers it is our intention to provide our valued customers with the be st documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publications to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regardi ng this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com . we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the versio n number, (e.g., ds30000000a is ve rsion a of document ds30000000). errata an errata sheet, describing minor operational differences fr om the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation issues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particular device, please check with one of the following: microchips worldwide web site; http://www.microchip.com your local microchip sales office (see last page) when contacting a sales office, please specify which device, re vision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products. downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 3 eqco875sc.3/eqco850sc.3 1.0 device overview the eqco875sc.3 single-coax transceiver is designed to simultaneously transmit and receive signals on a single 75 ? coax cable for fast ethernet. a sister product, the eqco850sc.3, can achieve similar performance when used in 50 ? coaxial systems. the eqco875sc.3 is ideally suited for fast ethernet connections over a 75 ? coax cable at a 125 mbps data rate. the eqco875sc.3 connec ts seamlessly to any fx- compliant physical layer controller (phy). for correct operation, the signals are expected to be 4b/5b encoded, dc balanced and to have a bit rate of 125 mbps. this eqco875sc.3 is useful and economical for connecting remote poe-enabled fast ethernet ip cameras and other ethernet over coax applications. figure 1-1 illustrates a typical ethernet coaxial connection: figure 1-1: coaxial et hernet pmd connection up to 225 meters 75 coax (including inline connectors as required) ieee 802.3 fx compliant phy eqco875sc ieee 802.3 fx compliant phy eqco875sc downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 4 ? 2009-2016 microchip technology inc. figure 1-2: eqco875sc.3 pin diagram (viewed from top) ( 1 ) note 1: devices named eqco850sc.2 can be used for all applications contained in this data sheet. they are the same in all aspects. table 1-1: eqco875sc.3 pin descriptions pin number pin name signal type description (tab) gnd power connect to ground of power supply. 15 dvcc power digital vcc. connect to +3.3v of power supply. 13 dgnd power digital gnd. connect to ground of power supply. 1 avcc power analog vcc. connect to +3.3v of power supply via ferrite bead (rf choke) and capacitor to cable outer screen. 4 agnd power analog gnd. connect to cable outer screen. 2 sdio bidirectional serial input/output. connect to center conductor of 75 ? coax cable. 3 ref bidirectional reference. connect through 75 ? resistor (or impedance matched to cable) to cable outer screen. 8 nc output do not connect. 10, 9 sdip/sdin input positive/negative differential serial input. connect to the ethernet phy fx out pins. 12, 11 sdop/sdon output positive/negative differential serial output. connect to the ethernet phy fx in pins. 14, 5 opt0, opt1 input connect opt0 to dgnd and opt1 to dvcc to enable fast ethernet mode. 6, 7 clk, dat input used for production test. connect to dgnd. 16 ccut analog connect to dvcc. gnd tab 16 15 14 13 5 6 7 8 1 2 3 4 12 11 10 9 dgnd clk avcc sdin sdip dvcc sdon sdop eqco875sc.3 ref nc sdio agnd ccut opt1 dat opt0 downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 5 eqco875sc.3/eqco850sc.3 figure 1-3: eqco875sc.3 block diagram showing electrical connections 1.1 sdip/sdin sdip/sdin together form a differential input pair. the serial data received on these pins will be transmitted on sdio. the input pre-driver automatically corrects for variations in signal levels and different edge slew rates at these inputs before they go into the active splitter/ combiner for transmission over the coax. both sdip and sdin inputs are differentially terminated by 110 ? on-chip. the center of the 110 ? is connected to dgnd with a 10 k ? resistor for dc biasing. the inputs also have protection diodes to ground for esd purposes. these inputs should always be capacitively coupled to the fx output of the ethernet phy. a transmit wake-up detection circuit puts both the input pre-driver and the active signal splitter/combiner into a low-power mode when no signal is detected on the sdip/sdin signal pair. 1.2 sdio/ref the signal on the sdio pin is the sum of the incoming signal (i.e. the signal transmitted by the eqco875sc on the far-end side of the coax) and the outgoing signal (i.e. the signal created based on sdip/sdin). the far-end signal is extracted by subtraction of the near-end signal, and it is this voltage that the equalizer analyses and adaptively equalizes for level and frequency response based on the knowledge that the originating signal is 4b/ 5b encoded before transmission. the ref signal carries a precise anti-phase current to the transmit current on sdio. ref must be connected directly to agnd at the connector (see figure 3-2 ) via a resistor precisely matched to the impedance of the coaxial cable used. 1.3 sdop/sdon sdop/sdon together form a differential pair outputting the reconstructed far-end transmit signal. the eqco850sc-hs uses lvds drivers with source matching for a 100 ? transmission line. this lvds signal can normally be connected (subject to input common-mode requirements) directly to the rx signal pair of a standard lvds receiver. 1.4 opt0, opt1 connect opt0 to dgnd and opt1 to dvcc to enable fast ethernet mode. 1.5 clk, dat pins these pins are normally used to access an internal register during production test. connect them to dgnd for normal operation. they should not be left floating. eqco875sc.3 rx output driver active signal splitter/combiner input pre-driver sdio sdop sdip sdin transmit wake-up detection equalizer core ref sdon downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 6 ? 2009-2016 microchip technology inc. 2.0 circuit operation 2.1 pre-driver the pre-driver removes any dependency on ethernet phy for the amplitude and rise time of the outgoing signal on sdio. 2.2 active signal splitter/combiner the active splitter/combiner controls the amplitude and rise time of the outgoing coax signal and transmits it via a precise 75 ? output termination resistor. the output resistor, when balanced with the coax characteristic impedance, also forms part of a hybrid splitter circuit which subtracts the tx output from the signal on the sdio output to give yield the far-end tx signal. the return-loss of the coax termination is a key factor in the performance of the line hybrid. 2.3 equalizer core the eqco875sc-hs has an embedded high-speed equalizer in the receive path with unique characteristics: auto-adaptive the equalizer controls a multiple-pole analog filter which compensates for attenuation of the cable, as illustrated in figure 2-1 . the filter frequency response needed to restore the signal is automatically determined by the device using a time-continuous feedback loop that measures the frequency components in the signal. upon the detection of a valid signal, the control loop converges within a few microseconds. variable gain eqco875scs are used in pairs, with one at each end of the coax cable. the eqco875sc can be used with any fast ethernet compliant fiber optic phy; any differences in transmit amplitude are removed by the input pre-driver. the receiver equalizer has variable gain to compensate for attenuation through the coax cable. figure 2-1: principle of equalizer operation downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 7 eqco875sc.3/eqco850sc.3 3.0 application information figure 3-1 illustrates a typical schematic implementation for the eqco875sc.3 in ethernet mode. figure 3-1: eqco87 5sc.3 typical application circuit to improve isolation from noise on the board power plane and improve emc immunity and emissions, it is recommended to power the transmit side of the equalizer (avcc) through a ferrite bead (fb1). c9 is used to reference avcc to the ground directly at the connector j1, while agnd is also connected directly to the connector. a 100 nf decoupling capacitor (c7) should be placed as close as possible between the dvcc pin and the dgnd pin. the ref and sdio signals are ac-coupled with identical capacitors, c5 and c6. termination resis- tor r1 should match the characteristic impedance of the system, 50 ? for eqco850sc.3 and 75 ? for eqco875sc.3. a coilcraft 1812ps-103klb inductor (l1) is recommended for best performance when using power over coax. l1 and c10 can be removed if power over coax is not required. 1 100v c10 10n100v c6 10n100v c5 50r/75r r1 gnd gnd gnd vcc vcc gnd 100n c7 10 c8 100n c3 100n c4 100n c1 100n c2 sdop sdon sdip sdin 48v_dc fb1 b l m15hd182sn1d 10n c9 avcc 1 sdio 2 ref 3 agnd 4 opt1 5 clk 6 dat 7 nc 8 sdin 9 sdip 10 sdon 11 sdop 12 dgnd 13 opt0 14 dv cc 15 ccut 16 a v c c s di o re f ag n d o p t 1 c l k d a t n c s di n s di p s d o n s d o p d g n d o p t 0 d v c c c c u t tab 17 u1eqco850sc.3/eqco875sc.3 l1 1812ps-103k l b j1 downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 8 ? 2009-2016 microchip technology inc. 3.1 guidelines for pcb layout because signals are strongly attenuated by long cables, special attention must be paid on the pcb layout between the coaxial connector and the eqco875sc.3. the eqco875sc.3 should be placed as close as is practical to the coaxial connector. the trace between the coaxial connector and the sdio pin of the eqco875sc.3 must be a 75 ? (50 ? for eqco850sc.3) trace referenced to gnd. to avoid noise pickup, other traces carrying digital signals or fast-switching signals should be placed as far away as possible from this trace. the ground layout on the eqco875sc.3 is crucial to the emc and emi performance of the circuit. the agnd connection should be connected directly to the body of the connector as shown. similarly, avcc should be decoupled directly to the connector body (see the position of c9). the termination resistor (r1 in figure 3-1 and figure 3-2 ) must have its ground connection at the connector body. the impedance of all the traces must be well controlled, including on the connector itself. to compensate for parasitic capacitances, the ground and power planes underneath l1 and part of the coax connector need to be removed, as indicated by the green areas on figure 3-2 . the sdip/sdin and sdop/sdon differential traces should be laid out as 100 ? differential traces. the following diagram shows the layout of the critical section of the pcb corresponding to the circuit of figure 3-1 from the coax connector to the twin differential pairs: figure 3-2: typical pcb layout downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 9 eqco875sc.3/eqco850sc.3 4.0 electrical characteristics 4.1 absolute maximum ratings stresses beyond those listed under this section may cause permanent damage to the device. these are stress ratings only and are not tested. functional operation of the device at these or any other conditions beyond those indicated in the operational sections is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. table 4-1: absolute maximum ratings parameter min. typ. max. units conditions storage temperature -65 +150 c ambient temperature -55 +125 c power applied supply voltage to ground -0.5 +4.0 v dc input voltage -0.5 +4.0 v dc voltage to outputs -0.5 +4.0 v output current into outputs 90 ma outputs low table 4-2: electrical characteristics parameter min. typ. max. unit description power supply v cc 3.2 3.3 3.4 v supply voltage. i s 47.5 62.5 75.5 ma supply current, both transmitting and receiving. i sr 25 35 43 ma supply current when not transmitting. sdip/sdin input (lvds-like) ? v i 250 800 mv input amplitude v sdip,n . v turnon 100 140 200 mv minimal ? v i to turn on transmit function. v cmin 0 v common-mode input voltage (terminated to ground with protection diodes). r input 85 104 115 ? differential input termination. sdio connection to coax z coax 72 (48) 75 (50) 78 (52) ? required coax cable characteristic impedance. r sdio 65 (46) 75 (51) 86 (55) ? input impedance between sdio and agnd. r loss 20 db coax return-loss as seen on sdio pin. frequency range = 10 mhz-62.5 mhz. ? v tx 250 300 350 mv transmit amplitude. t rise_tx 350 450 550 ps rise/fall time 20% to 80% of ? v tx. att max 10 db cable attenuation budget @ 62.5 mhz. ? v rxmin 40 mv minimum input for fully reconstructed output. downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 10 ? 2009-2016 microchip technology inc. table 4-3: jitter performance table 4-4: temperature specifications sdop/sdon outputs (lvds-like) ? v o 250 350 450 mv output amplitude v sdop,n. v cmout 1.1 1.2 1.3 v common-mode output voltage. r output 85 102 115 ? differential termination between sdop and sdon. t rise_o 150 240 350 ps rise/fall time 20% to 80% of v sdop,n . parameter min. typ. max. units conditions jitter peak-to-peak on sdo 40% 50% ui 150m rg6 coax; over full v cc, ? v tx, and temp range; 125 mbps; pattern prbs7 parameter symbol min. typ. max. unit temperature ranges operating ambient temperature t a -10 C 70 c operating junction temperature t j -10 C 85 c thermal package resistances typical junction to package ? jt C1 . 2C c / w typical junction to ambient ? ja C5 9C c / w typical junction to case ? jc C1 0C c / w table 4-2: electrical characteristics (continued) downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 11 eqco875sc.3/eqco850sc.3 5.0 packaging information 5.1 package marking information 16-lead plastic quad flat, no lead package 4x4x0.9 mm body [qfn] 16-lead qfn (4x4x0.9 mm) example pin 1 pin 1 eqco 875sc.3 yywwnnn yywwnnn legend: xx...x part number yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code (optional) pb-free jedec ? designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 12 ? 2009-2016 microchip technology inc. b a 0.20 c 0.20 c (datum b) (datum a) c seating plane 1 2 n 2x top view side view bottom view for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: note 1 1 2 n 0.10 c a b 0.10 c a b 0.10 c 0.08 c microchip technology drawing c04-259b sheet 1 of 2 16-lead plastic quad flat, no lead package (8e) - 4x4x0.9 mm bod [qfn] d e 2x 16x (a3) a d2 e2 16x l 16x b e e 2 (16x k) a1 0.10 c a b 0.05 c downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 13 eqco875sc.3/eqco850sc.3 microchip technology drawing c04-259b sheet 2 of 2 for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: number of pins overall height terminal width overall width overall length terminal length exposed pad width exposed pad length terminal thickness pitch standoff units dimension limits a1 a b d e2 d2 a3 e l e n 0.65 bsc 0.20 ref 1.951.95 0.45 0.25 0.80 0.00 0.30 4.00 bsc 0.55 2.05 2.05 0.870.02 4.00 bsc millimeters min nom 16 2.152.15 0.65 0.35 0.950.05 max k 0.425 ref ref: reference dimension, usually without tolerance, for information purposes only. bsc: basic dimension. theoretically exact value shown without tolerances. 1.2. 3. noes: pin 1 visual index feature may vary, but must be located within the hatched area. package is saw singulated dimensioning and tolerancing per asme y14.5m terminal-to-exposed-pad 16-lead plastic quad flat, no lead package (8e) - 4x4x0.9 mm bod [qfn] downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 14 ? 2009-2016 microchip technology inc. recommended land pattern for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: dimension limits units c2 optional center pad width contact pad spacing optional center pad length contact pitch y2 x2 2.15 2.15 millimeters 0.65 bsc min e max 3.625 contact pad length (x16) contact pad width (x16) y1 x1 0.725 0.30 bsc: basic dimension. theoretically exact value shown without tolerances. notes: 1. dimensioning and tolerancing per asme y14.5m microchip technology drawing c04-2259a nom 16-lead plastic quad flat, no lead package (8e) - 4x4x0.9 mm bod [qfn] silk screen 12 16 c1 contact pad spacing 3.625 contact pad to center pad (x16) g1 0.20 c1 c2 y2 x2 y1 g1 x1 e downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 15 eqco875sc.3/eqco850sc.3 appendix a: revision history revision a (april 2016) this is the initial release of the document in the microchip format. this replaces eqcologic document version 2.0. table a-1: revision history version date comments 2v0 1/28/14 merged 50 ? and 75 ? systems into one data sheet. 1v2 10/25/11 fixed lower temperature limit. 1v1 6/8/11 fixed bitrate, temperature range, sdip/sdin descriptions. 0v4 2/28/11 internal quality review. removed preliminary status. 0v3 10/26/09 technical review. revised section 5.1 0v2 10/15/09 internal review. 0v1 10/15/09 modified from eqco875sc ieee1394 data sheet. downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 16 ? 2009-2016 microchip technology inc. notes: downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 17 eqco875sc.3/eqco850sc.3 the microchip web site microchip provides online support via our web site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: product support C data sheets and errata, application notes and sample programs, design resources, users guides and hardware support documents, latest software releases and archived software general technical support C frequently asked questions (faqs), technical support requests, online discussion groups, microchip consultant program member listing business of microchip C product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchips customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under support, click on customer change notification and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: distributor or representative local sales office field application engineer (fae) technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support downloaded from: http:///
eqco875sc.3/eqco850sc.3 ds60001314a-page 18 ? 2009-2016 microchip technology inc. product identification system to order parts, including industrial, or obtain information, for e.g., on pricing or delivery, re fer to the factory or the list ed sales office . part no. device device: eqco875sc.3 eqco850sc.3 package: tray = tray blank = tube examples: a) eqco875sc.3-tray = 75 ? coax, industrial temperature, 16-lead qfn package, tray packaging b) eqco850sc.3 = 50 ? coax, industrial temperature, 16-lead qfn package, tube packaging xxxx package downloaded from: http:///
? 2009-2016 microchip technology inc. ds60001314a-page 19 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered trademar ks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2009-2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-0468-2 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the companys quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchips quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
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