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product structure : silicon monolithic integrated circuit this product was no t designed with protection against radioactive rays . 1/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 tsz22111 ? 14 ? 001 www.rohm.com usb switch ic dpdt type (double pole double throw) bd1 1670gwl general description bd11670gwl is a dpdt analog switch that supports usb2.0 high-speed and ha s both a low resistance and a low capacitance. it supports input of dual power supplies from vbus and vcc . vbus of up to 28v is supported. all terminals have electrostatic discharge protection circuit built- in . features ? dual power-supply architecture, vcc and vbus. ? power supply range (vbus) : 3.8v to 28v. ? power supply range (vcc) : 3.0v to 5.5v. ? 5 switches between the input and the output. ? low capacity 2ch analog sw. applications mobile phones, tablet pc, digital still cameras, digital video camcorders, potable navigation devices, tv, portable dvd players, portable game systems, personal computers, pda, key specifications ? power supply range (vcc): 3.0v to 5.5v ? power supply range (vbus): 3.8v to 28 v ? switch on resistance: 5 ( typ) ? operating temperature range: - 40 c to +85c package(s) w(typ) x d(typ) x h(max) wlcsp 1.20mm x 1.60mm x 0.57mm typical application circuit unc1_x unc2_x unc1_y unc2_y com1 com2 vcc vbus vccin sel gnd pmic usb_x usb_y vsys or vbat vbus selector signal c vccin 0.1uf c vcc 1uf c vbus 1uf ucsp50l1c figure 1. application circuit
2/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl pin configuration top view) bottom view) a unc2_y vbus sel d unc1_x gnd vcc b unc1_y - com2 c unc2_x vccin com1 c unc2_x vccin com1 b unc1_y - com2 d unc1_x gnd vcc a unc2_y vbus sel 1 2 3 1 2 3 pin description ball no. ball name function a1 unc2_y analog switch terminal. a2 vbus usb vbus power input terminal. a3 sel switch select input pin b1 unc1_y analog switch terminal. b3 com2 analog switch terminal. c1 unc2_x analog switch terminal. c2 vccin internal power supply. c3 com1 analog switch terminal. d1 unc1_x analog switch terminal. d2 gnd gnd terminal. d3 vcc system power supply. block diagram figure 2. block diagram unc1_x unc2_x unc1_y unc2_y com1 com2 sw1 sw2 vcc (2.5v 5.5v) vbus (3.8v 28v) vccin internal power sel gnd uvlo sel cp uvlo vccin (2.5v 5.5v)
3/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl absolute maximum ratings(ta = 25c) parameter symbol rating unit conditions input supply voltage v max1 -0.3 to +30 v vbus, sel pins input supply voltage v max2 -0.5 to +7 v com1,com2,unc1_x, unc1_y,unc2_x,unc2_y pins input supply voltage v max3 -0.3 to +7 v other pins power dissipation p d 0.512 w operating temperature range t opr -40 to +85 c storage temperature range t stg -55 to +150 c maximum junction temperature t jmax 150 c (note 1) derating is done at 512mw/ c for operating above ta R 25 c (mount ed on 4-layer 70.0mm x 70.0mm x 1.6mm board) caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important t o consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. power dissipation figure 3. power dissipation
4/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl recommended operating conditions (ta= -40c to +85c) parameter symbol min typ max unit input voltage range (v cc ) v cc 3.0 3.6 5.5 v input voltage range (vbus) v bus 3.8 5.0 28 v input capacitance (vcc) c vcc 1.0 - - f input capacitance (vbus) c vbus 1.0 - - f vccin capacitance c vccin 0.01 0.1 1.0 f electrical characteristics (unless otherwise specified v cc =3.6v v b =5.0v ta=25c) parameter symbol min typ max unit conditions power supply vcc supply current i supply_vcc - 23 - a vcc=3.6v, vbus =0v, sel =0v vbus supply current i supply_vb - 26 - a vcc=0v, vbus =5.0v, sel =1.8v analog switch on -resistance(sw1,sw2) r on - 5.0 - vcom=0v sw1 on-resistance match between chenels r on(sw1) - 0.2 - sw2 on-resistance match between chenels r on(sw2) - 0.2 - off leak current (com1,com2,unc1_x,unc1_y, unc2_x,unc2_y) i leak_off -2 - 2 a sw1,sw2=off on leak current (com1,com2,unc1_x,unc1_y, unc2_x,unc2_y) i leak_on -2 - 2 a sw1,sw2=on turn-on time(unc_x to com) t on1 - 4 - s vcc=3.6v, sel=1.8v to 0v, rl=50 turn-on time(unc_y to com) t on2 - 4 - s vcc=3.6v, sel=0v to 1.8v, rl=50 turn-off time(unc_x from com) t off1 - 0.5 - s vcc=3.6v, sel=0v to 1.8v, rl=50 turn-off time(unc_y from com) t off2 - 0.5 - s vcc=3.6v, sel=1.8v to 0v, rl=50 break-before-make time delay t d - 3.5 - s rl=50 switch off capacitance(sw1,sw2) c off - 4.0 - pf switch on capacitance(sw1,sw2) c on - 6.0 - pf logic input sel pin input logic-high v ih 1.62 - - v sel pin input logic-low v il - - 0.4 v sel pin pull down resistance r sel - 5 - m sel=5v truth table input sw1 sw2 vcc vbus off off low off off off off high off off off 3.8v to 28v low com1-unc1_x com2-unc2_x off 3.8v to 28v high com1-unc1_y com2-unc2_y 3.0v to 5.5v off low com1-unc1_x com2-unc2_x 3.0v to 5.5v off high com1-unc1_y com2-unc2_y 3.0v to 5.5v 3.8v to 28v low com1-unc1_x com2-unc2_x 3.0v to 5.5v 3.8v to 28v high com1-unc1_y com2-unc2_y
5/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl 0 5 10 15 20 25 30 35 40 45 50 55 60 65 0.0 1.0 2.0 3.0 4.0 5.0 i_vcc [ua] v_vcc [v] vcc=0 5v sel=0v ta=- 60 ta=25 ta=105 typical performance curves (unless otherwise specified, ta=25 , vcc=5v) (equipment used to plot eye pattern: tektronix dpo7254 oscillos cope, tektronix tdsubf usb test fixture) figure 4. eye pattern at full speed figure 5. eye pattern at high speed figure 6. icc vs input voltage(vcc) 0 1 2 3 4 5 6 0 1 2 3 4 5 6 output voltage vout[v] input voltage vin[v] 0 1 2 3 4 5 6 0 1 2 3 4 5 6 output voltage vout[v] input voltage vin[v] figure 7. icc vs input voltage(vbus) 0 50 100 150 200 250 300 350 400 450 500 550 600 0.0 5.0 10.0 15.0 20.0 25.0 i_vbus [ua] v_vbus [v] vbus=0 28 v sel=0v ta=- 60 ta=25 ta=105
6/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl figure 9.leak current vs input voltage figure 8. ron vs voltage 0.0 0.3 0.5 0.8 1.0 1.3 1.5 1.8 2.0 0.0 1.0 2.0 3.0 4.0 5.0 i_unc1_x [ua] v_unc1_x [v] vcc=5v sel=2v com1=0v unc1_x=0 5 v ta=- 60 ta=25 ta=105 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0.0 1.0 2.0 3.0 4.0 5.0 ron [ ] v_unc1_x [v] ta=- 60 ta=25 ta=105 vcc=5v sel=0v com1=-10ma unc1_x =0v 7v
7/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl timing chart figure 10 . switching time figure 11 . application circuit 0.9 o 0.1 o vout_x 0v vil vih t on t off sel unc_x unc_y 0.1 o t off t on 0v vout_y sel unc_x com_ vin vout_x rl unc_y rl vout_y
8/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl i/o equivalence circuit(s) com1,com2 unc1_x,unc1_y,unc2_x,unc2_y vcc, vbus,vccin s el unc1_x unc2_x unc1_y unc2_y com1 com2 vccin vcc vbus vccin sel
9/ 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl physical dimension tape and reel information package name ucsp50l1c < tape and reel information > tape embossed carrier tape quantity 3000 pcs direction of feed e2 the direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand ordering information reel direction of feed mark pin 1 670
10 / 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl b d 1 1 6 7 0 g w l - e 2 part number package packaging and forming specification e2: embossed tape and reel marking diagrams ucsp50l1c (top view) 6 7 0 part number marking lot number 1pin mark
11 / 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ics power sup ply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capaci tors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground tr aces, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-sig nal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thi ck as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxi mum rating of the pd stated in this specification is when th e ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy bo ard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground th e ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
12 / 12 tsz02201-0232ah300120-1-2 ? 201 4 rohm co., ltd. all rights reserved. 15.feb.2016 rev.003 www.rohm.com tsz22111 ? 15 ? 001 bd11670gwl operational notes C continued 11. unused input pins input pin s of an ic are often connected to the gate of a mos transisto r. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate lay ers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vol tage to an input pin (and thus to the p substrate) should be avoided. figure xx. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bi as and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below th e tsd threshold, the circuits are automatically restored to normal operation . note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from he at damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circu it that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous ope ration or transitioning of the protection circuit. 17. disturbance light in a device where a portion of silicon is exposed to lig ht such as in a wl -csp, ic characteristics may be affected due to photoelectric effect. for this reason, it is recommended to co me up with countermeasures that will prevent the chip from being exposed to light. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bd11670gwl package ucsp50l1c unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes bd11670gwl - web page

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