q?v~zy??q?v?_ra]qr???qcabgq HCA65R099FE super junction mosfet parameter value unit bv dss @t j,max 700 v i d 40 a r ds(on), max 99 p
qg ,typ 45 nc key parameters features thermal resistance characteristics symbol parameter typ. max. units r jc junction-to-case -- 0.45 e /w r ja junction-to-ambient -- 40 symbol parameter value units v dss drain-source voltage 650 v v gs gate-source voltage 30 v i d drain current ? continuous (t c = 25 e ) 40 a drain current ? continuous (t c = 100 e ) 25 a i dm drain current ? pulsed (note 1) 120 a e as single pulsed avalanche energy (note 2) 1000 mj dv/dt mosfet dv/dt ruggedness, v ds =0?480v 100 v/ns dv/dt reverse diode dv/dt, v ds =0?480v, i ds ? i d 50 v/ns p d power dissipation 278 w t j , t stg operating and storage temperature range -55 to +150 e t l maximum lead temperature for soldering purposes, 1/8? from case for 5 seconds 300 e absolute maximum ratings t c =25 e unless otherwise specified april 2016 to-247 package & internal circuit application d g s HCA65R099FE (fast recovery diode type) 650v n-channel super junction mosfet ? very low fom (r ds(on) xq g ) ? extremely low switching loss ? excellent stability and uniformity ? 100% avalanche tested ? higher reverse recovery dv/dt ? fast recovery time ? telecom power equipment / server station ? uninterruptible power supply (ups) ? micro solar inverter & ev charger ? suitable for soft switching (zvs full bridge & llc) demanding high efficiency
q?v~zy??q?v?_ra]qr???qcabgq HCA65R099FE super junction mosfet electrical characteristics t j =25 q c unless otherwise specified symbol parameter test conditions min typ max units i s continuous source-drain diode forward current -- -- 40 a i sm pulsed source-drain diode forward current -- -- 120 v sd source-drain diode forward voltage i s = 20 a, v gs = 0 v -- -- 1.4 v trr reverse recovery time i s = 20 a, v gs = 0 v di f /dt = 100 a/ v -- 162 -- qrr reverse recovery charge -- 1.12 -- & bv dss drain-source breakdown voltage v gs = 0 v, i d = 1 ma 650 -- -- v i dss zero gate voltage drain current v ds = 650 v, v gs = 0 v -- -- 10 3 v ds = 520 v, t j = 125 e -- -- 100 3 i gss gate-body leakage current v gs = 30 v, v ds = 0 v -- -- 100 2 off characteristics c iss input capacitance v ds = 50 v, v gs = 0 v, f = 1.0 mhz -- 3300 -- ? c oss output capacitance -- 210 -- ? c rss reverse transfer capacitance -- 12 -- ? dynamic characteristics t d(on) turn-on time v ds = 325 v, i d = 20 a, r g = 25 ? -- 80 -- t r turn-on rise time -- 25 -- t d(off) turn-off delay time -- 120 -- t f turn-off fall time -- 16 -- q g total gate charge v ds = 520 v, i d = 20 a v gs = 10 v -- 45 60 nc q gs gate-source charge -- 18 -- nc q gd gate-drain charge -- 8 -- nc switching characteristics source-drain diode maximum ratings and characteristics notes ; 1. repetitive rating : pulse width limited by maximum junction temperature 2. l=80mh, v dd =50v, r g =25 : , starting t j =25 q c 3. pulse test : pulse width ? v ' x w \ & |