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1 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am features ? rohs compliant ? chip led package. ? colorless clear resin. ? wide viewing angle 1 3 0o. ? brightness: 71 to 180 mcd at 20 ma. ? qualification according to aec - q101. ? precondition: bases on jedec j - std 020 level 3. ? a utomotive reflow profile (ir reflow or wave soldering) applications ? automotive backlighting or indicator : dashboard, switch, audio and video equipmentsetc. ? backlight : lcd, switches, symbol, mobile phone and illuminated advertising. ? display for indoor and outdoor application. ? ideal for coupling into light guides. ? substitution of traditional light. ?optical indicator. ?general applications.
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 2 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com device selection guide chip materials emitted color resin color algainp brilliant red water clear absolute maximum ratings (ta=25 ) parameter symbol rating unit reverse voltage v r 12 v forward current i f 30 ma peak forward current (duty 1/10 @1khz) i fp 60 ma power dissipation pd 6 0 mw junction temperature t j 125 operating temperature t opr - 40 ~ +110 storage temperature tstg - 40 ~ +110 thermal resistance rth j - a 8 00 k/w rth j - s 45 0 k/w esd (classification acc. aec q101) esd hbm 2000 v esd m m 200 v soldering temperature t sol reflow soldering : 260 for 30 sec. hand soldering : 350 for 3 sec.
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 3 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com electro - optical characteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous intensity iv 71 ----- 180 mcd i f = 20 ma viewing angle 2 1/2 ----- 1 3 0 ----- deg i f = 20 ma peak wavelength p ----- 6 32 ----- nm i f = 20 ma dominant wavelength d 6 17.5 ---- 629.5 nm i f = 20 ma spectrum radiation bandwidth ? ----- 20 ----- nm i f = 20 ma forward voltage v f 1.75 ---- 2.35 v i f = 20 ma reverse current i r ----- ----- 1 0 a v r = 12 v temperature coefficient of p tc p ----- 0.0 6 ----- nm/k i f = 20 ma temperature coefficient of d tc d ----- 0. 4 ----- nm/k i f = 20 ma temperature coefficient of v f tc v ----- - 2. 3 ----- mv/k i f = 20 ma note: 1. tolerance of luminous intensity: 11% 2. tolerance of dominant wavelength: 1nm 3. tolerance of forward voltage: 0.1v bin range of luminous intensity bin code min. max. unit condition q1 71 90 mcd i f = 20 ma q2 90 112 r1 112 140 r2 140 180 note: tolerance of luminous intensity: 11% bin range of dominant wavelength bin code min. max. unit condition e4 617.5 621.5 nm i f = 20 ma e5 621.5 625.5 e6 625.5 629.5 note: tolerance of dominant wavelength: 1nm
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 4 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com typical electro - optical characteristics curves typical curve of spectral distribution relative intensity (%) p (nm) note: v()=standard eye response curve; i f =20ma diagram characteristics of radiation relative intensity (%) relative intensity 70 o 80 o 60 o 50 o 40 o 30 o 20 o 10 o 0 1.0 0 o 0.6 0.2 0.4 0.8 1.0 view angle relative intensity view angle relative intensity 80 o 60 o 40 o 20 o 0 0.2 0.4 0.6 0.8 90 o
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 5 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com forward current vs. forward voltage (ta=25 ) dominant wavelength vs. forward current (ta=25 ) forward current (ma) dominant wavelength (nm) forward voltage (v) forward current (ma) relative luminous intensity vs.forward current ( ta=25 ) forward current vs. ambient and solder temp erature relative luminous intensity forward current (ma) forward current (ma) temperature ( ) 0.01 0.10 1.00 10.00 1 10 100 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 0.0 20.0 40.0 60.0 80.0 100. 0
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 6 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com relative luminous intensity vs. junction temp erature relative forward voltage vs. junction temp erature relative luminous intensity relative forward voltage junction temperature ( junction temperature ( note: f(tj) = iv / iv(25 ) ; i f = 20 ma note : v f = v f - v f (25 ) = f(tj) ; i f = 2 0ma
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 7 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com package dimension note: tolerances unless mentioned 0.1mm. unit = mm
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 8 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com moisture resistant packing materials label explanation label explanation ? cpn : customers product number ? p/n : product number ? qty : packing quantity ? cat : luminous intensity rank ? hue : dom. wavelength rank ? ref : forward voltage rank ? lot no : lot number reel dimensions note: the tolerances unless mentioned is 0.1mm ,unit = mm
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 9 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com carrier tape dimensions: loaded quantity 2000 pcs per reel note: tolerances unless mentioned 0.1mm. unit = mm moisture resistant packing process note: tolerances unless mentioned 0.1mm. unit = mm
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 10 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com precautions for use 1. soldering condition (reference: ipc/jedec j - std - 020d) a. ir reflow b. wave soldering reflow 0 50 100 150 200 250 300 0 50 100 150 200 250 300 times(s) temperature( ) max. 120s max. 100s max. 30s max. ramp up 3 /s max. ramp down 6 /s 217 240 255 245 max. 260
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 11 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com (b) recommend soldering pad note : tolerances unless mentioned 0.1mm. unit = mm 2 . current limiting a resistor should be used to limit current spikes that can be caused by voltage fluctuations. otherwise damage could occur. 3. storage 3.1 moisture proof bag should only be opened immediately prior to usage. 3.2 environment sh ould be less than 30 and 6 0 % rh when moisture proof bag i s opened. 3.3 after opening the package msl conditions stated on page 1 of this spec should not be exceeded. 3.4 if the moisture sensitivity card indicates higher than acceptable moisture, the component should be baked at min. 60deg +/ - 5deg for 2 4 hours. 4. iron soldering hand soldering is not recommended for regular production. these guidelines are fo r rework only. soldering iron tip should contact each terminal no more than 3 sec at 350 , using soldering iron with nominal power less than 25w. allow min. 2 sec. between soldering intervals. 5 . usage do not exceed the values given in this specification. application restrictions 1. high reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. if you have any concerns, please contact everlight before using this product in your application. this specification guarantees the quality and performance of the product as an individual component. do not use this product beyond the specification described in this document . 1.4
datasheet smd ? b 15 - 21 - r6c - b0q1r2b0e - 2t - am 12 copyright ? 2010, everlight all rights reserved. release date : may . 8. 201 3 . issue no: dse - 000 1993 rev. 3 www.everlight.com revision history : rev. modified date file modified contents 1 2 0 1 0 / 4 / 1 new spec 2 20 10/4/1 formal approve 3 2013/ 5 / 8 c hange release

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