this is information on a product in full production . june 2014 docid023365 rev 2 1/8 ESDAVLC5-4BX4 4-line bidirectional transil?, transient surge voltage suppressor for esd protecti on datasheet - production data figure 1. functional diagram features 4 bidirectional transil diodes breakdown voltage v br = 5.5 v min. low leakage current: < 50 na very small pcb area: 0.64 mm 2 lead-free and rohs compliant complies with the following standards iec 61000-4-2 level 4: C 15 kv (air discharge) C 8 kv (contact discharge) applications where transient over voltage protection in esd sensitive equipment is required, such as: mobile phones portable multimedia devices and accessories computers, tablets and peripherals set top boxes audio equipment description the ESDAVLC5-4BX4 is monolithic array designed to protect up to 4 bidirectional lines against esd transients. the device is ideal for applications where both reduced printed circuit board space and high esd protection level are required. tm: transil is a trademark of stmicroelectronics 1 2 3 4 gnd 4-lead micro package io1 io2 io3 io4 gnd www.st.com
characteristics ESDAVLC5-4BX4 2/8 docid023365 rev 2 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp (1) peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 16 16 kv i pp peak pulse current (8/20 s) 2 a p pp peak pulse power (8/20 s) 30 w t j operating temperature range -30 to +85 c t stg storage temperature range - 55 to +150 c t l maximum lead temperature for soldering during 10 s 2 60 c 1. for a surge greater than the maximum values, the diode will fail in short-circuit. v i v cl v cl v br v br v rm v rm i rm i pp slope: 1/r d symbol p arameter v = breakdown voltage v = stand-off voltage v = clamping voltage i = peak pulse current brrm cl pp i = leakage current @ v rm rm = line capacitance c line r = dynamic resistance d table 2. electrical characteristics (values, t amb = 25 c) symbol parameter test conditions value unit min. typ. max. v br breakdown voltage i r = 1 ma 5.5 v i rm leakage current v rm = 3 v 50 na v cl clamping voltage i pp = 1 a, 8/20 s 18 v c line line capacitance, i/o to gnd v r = 0 v, f osc = 1 mhz, v osc = 30 mv 10 pf r d dynamic resistance, pulse width 100 ns i/o to gnd 0.53 w gnd to i/o 0.37
docid023365 rev 2 3/8 ESDAVLC5-4BX4 characteristics 8 figure 3. leakage current versus junction temperature (typical values) figure 4. junction capacitance versus reverse applied voltage (typical values) i r (na) 0.01 0.1 1 10 25 50 75 100 125 150 io/gnd t j (c) 0 1 2 3 4 5 6 7 8 9 10 11 12 0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 t j = 25 c io/gnd c (pf) v r (v) figure 5. esd response to iec 61000-4-2 (typical values, +8 kv contact discharge) figure 6. esd response to iec 61000-4-2 (typical values, -8 kv contact discharge) 10 v/div 20 ns/div v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns ppcl cl v :clamping voltage @ 100 ns cl 1 2 3 4 56 v 22 v 21 v 15 v 1 2 4 3 10 v/div 20 ns/div -48 v -15 v -15 v -10 v 1 2 4 3 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns ppcl cl v :clamping voltage @ 100 ns cl 1 2 3 4 figure 7. s21 attenuation measurement figure 8. tlp measurement s21 (db) 100k 1m 10m 100m 1g 10g -21 -18 -15 -12 -9 -6 -3 0 io1 io2 io3 io4 f (hz) i pp (a) 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 0 5 10 15 20 25 30 35 40 v cl (v) gnd to i/o i/o to gnd
package information ESDAVLC5-4BX4 4/8 docid023365 rev 2 2 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st off ers these devices in different grades of ecopack ? packages, depending on their level of environmenta l compliance. ecopack ? specifications, grade definitions and product statu s are available at: www.st.com . ecopack ? is an st trademark. figure 9. micro package dimensions figure 10. marking note: the marking codes can be rotated by 90 or 180 to differentiate assembly location. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose . 250 16 m 250 16 m 800 30 m 800 30 m 200 16 m 200 16 m 200 16 m 706 16 m thickness: 350 30 m exj yww
docid023365 rev 2 5/8 ESDAVLC5-4BX4 package information 8 figure 11. tape and reel specification dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 2.0 2.0 8.0 1.75 3.5 ? 1.55 0.43 0.88 0.22 exj yww 0.88 exj yww exj yww exj yww exj yww exj yww exj yww
recommendation on pcb assembly ESDAVLC5-4BX4 6/8 docid023365 rev 2 3 recommendation on pcb assembly 3.1 pcb design recommendations pcb pad design: non solder mask defined pcb pad size: see figure 12 . solder mask opening: 50 m between the edge of the pad and the edge of the solder mask 3.2 stencil recommendations stencil aperture: see figure 12 . stencil thickness: 75 m figure 12. micro package footprint and stencil (dim ensions in mm) 3.3 solder paste recommendations near eutectic 95.8% sn, 3.5% ag, 0.7% cu solder pas te, type 4. 0.20 0.15 0.25 0.25 0.25 0.05 copper pad dimensions solder mask opening stencil opening
docid023365 rev 2 7/8 ESDAVLC5-4BX4 ordering information 8 4 ordering information figure 13. ordering information scheme 5 revision history table 3. ordering information order code marking weight base qty delivery mode ESDAVLC5-4BX4 ex (1) 1. the marking codes can be rotated by multiples of 90 to differentiate assembly location 0.504 mg 10 000 tape and reel esda vlc 5 - 4 b x4 esd array very low capacitance breakdown voltage package 5 = 5.5 v min. x4 = 4 lead micro package b = bidirectional number of linesdirectional table 4. document revision history date revision changes 18-sep-2012 1 first issue 05-jun-2014 2 updated values for dynamic resistance in table 2 and added figure 8 .
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