View BH28SA3WGUT-E2_8540001.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. cmos ldo regulators for port a b le devices 1ch 150ma cmos ldo regulators bh sa3wgut series description the bh sa3wgut series are 150 ma output cmos regulators that deliver a highly stable output voltage with the precision of 1%. with the use of rohm s original technology, the load regulati on of only 2 mv, 100 mv i/o drop voltage, and the load transient of 50mv (at 1ma ? 100ma) have been achieved. the vcsp60n1 package is extremely compact as just 0.96 mm 0.96 mm, and the ic's enh anced protection circuits contribute to improved application safety. f eat ures 1) high accuracy output voltage: 1% 2) i/o drop voltage: 100 mv (at 100 ma) 3) load transient S vout : 50mv (at 1ma ? 100ma) 4) stable with ceramic capacitors (1f) 5) low bias current: 40 a 6) high ripple rejection ratio: 63 db (typ., 1 khz) 7) output voltage on/off control 8) built-in overcurrent (short) and thermal shutdown circuits 9) uses the vcsp60n1 wl-csp package. ap pli c ati ons battery-driven portable devices, etc. prod u c t li ne 150 ma bh sa3wgut series product name 1.8 2.8 3.0 package bh sa3wgut ? vcsp60n1 model name: bh sa3w a b symbol description output voltage specification a output voltage (v) 18 1.8 v (typ.) 28 2.8 v (typ.) 30 3.0 v (typ.) b package gut: vcsp60n1 no.11020eat10 downloaded from: http:///
technical note 2/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series absolute maxi mu m ra ti ng s parameter symbol ratings unit applied supply voltage vmax -0.3 to +6.5 v power dissipation pd 530 *1 mw maximum junction temperature tjmax 125 operating temperature range topr -40 to +85 storage temperature range tstg -55 to +125 *1: derated at 5.3 mw/ for temperature above ta = 25 , when mounted on a glass epoxy pcb (7 mm ? 7 mm ? 0.8 mm). re comm en de d oper ati ng ra ng es (n ot to exc e e d pd) parameter symbol ratings unit power supply voltage v in 2.2 to 5.5 v output current iout 0 to 150 ma re comm en de d oper ati ng co nd iti ons parameter symbol ratings unit conditions min. typ. max. input capacitor c in 0.5 *2 1.0 f the use of ceramic capacitors is recommended. output capacitor c o 0.7 *2 1.0 f the use of ceramic capacitors is recommended. *2: the minimum value of capacitance must be met th is specifications over full operating conditions. (ex. temperature, dc bias, aging conditions) downloaded from: http:///
technical note 3/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series el ectrica l cha r acter i stics (unless otherwise specified, ta = 25 , v in = v out + 1.0 v *6 , stby = 1.5 v, c in = 1 f, c o = 1 f) parameter symbol limits unit conditions min. typ. max. output voltage 1 v out 1 vout ? 0.99 vout vout 1.01 v iout = 1 ma, ta = 25 , vout R 2.5v vout - 25 mv vout + 25 mv iout = 1ma, ta = 25 , vout 2.5v output voltage 2 v out 2 vout ? 0.97 vout vout 1.03 v iout = 0 to 150 ma vin = vout+0.5v to 5.5v ta = - 4 0 to 85 *3,4,5 circuit current ignd 40 72 a iout = 0 ma ta = - 4 0 to 85 *4 circuit current (stby) iccst 1.0 a stby = 0 v ripple rejection ratio rr 50 63 db vrr = -20 dbv, frr = 1 khz, iout = 10 ma input output voltage difference vsat 100 150 mv vin = 0.98 ? vout, iout = 100 ma (except bh18sa3wgut) line regulation vdli 2 20 mv iout = 10 ma vin = vout + 0.5 v to 5.5 v *5 load regulation1 vdlo1 2 30 mv iout = 1 ma to 100 ma load regulation1 vdlo1 4 45 mv iout = 1 ma to 150 ma maximum output current iomax 150 ma vin = vout + 0.5 v*6 limit current ilmax 400 ma vo = vout ? 0.98 short current ishort 50 200 ma vo = 0 v stby pin current istby 0.5 1.3 3.6 a ta = - 4 0 to 85 *4 iout = 150 ma stby control voltage on vstbh 1.2 vin v off vstbl -0.2 0.2 v *this product is not designed for protection against radio active rays. *3: operating condition are limited by pd. *4: typical values apply for ta=25 . *5: vin=3.0v to 5.5v for bh18sa3wgut. *6: vin=3.5v for bh18sa3wgut. downloaded from: http:///
technical note 4/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series ref e re nce data b h 18sa3wgut (ta=25 unless otherwise specified.) fig.1 output voltage fig.2 line regulation fig.3 circuit current 0 10 20 30 40 50 60 0 50 100 150 output current (ma) gnd current (ua) t=85 t=25 t=-40 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 0 200 400 600 output current (ma) output voltage (v) t=t= t= 1.75 1.76 1.77 1.78 1.79 1.8 1.81 1.82 1.83 1.84 1.85 -40 -15 10 35 60 85 temp (c) output voltage (v) vcc=5.5v vcc=3.5v vcc=3.0v 20 25 30 35 40 45 50 55 60 65 70 -40 -15 10 35 60 85 temp (c) gnd current (ua) vcc=5.5v vcc=3.5v vcc=3.0v v [v] r r rr [] [] r r rr[] 0 10 20 30 40 50 60 70 80 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 input voltage (v) gnd current (ua) t=85 t=25 t=-40 0.0 0.5 1.0 1.5 2.0 2.5 00.511.522.533.544.555.5 input voltage (v) output voltage (v) t=85 t=25 t=-40 1.77 1.78 1.79 1.8 1.81 1.82 1.83 00.511.522.533.544.555.5 input voltage (v) output voltage (v) t=85 t=25 t=-40 [] [ v 1.75 1.76 1.77 1.78 1.79 1.8 1.81 1.82 1.83 0 50 100 150 output current (ma) output voltage (v) t=85 t=25 t=-40 fig.4 load regulation fig.5 iout - ignd fig.6 ocp threshold fig.7 vout - temp fig.8 ignd - temp fig.9 r.r. - vin fig.10 r.r. - freq. fig.11 noise - freq. downloaded from: http:///
technical note 5/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series fig.15 start_up ( ta = - 4 0 ) fig.16 start_up ( ta = 2 5 ) fig.17 start_up ( ta = 8 5 ) fig.18 load_response (io=1 30ma) (ta=-40 ) fig.19 load_response (io=1 30ma) (ta=25 ) fig.20 load_response (io=1 30ma) (ta=85 ) fig.21 load_response (io=30 1ma) (ta=-40 ) fig.22 load_response (io=30 1ma) (ta=25 ) fig.23 load_response (io=30 1ma) (ta=85 ) iout vout io=1 30ma v =15.0mv iout vout io=1 30ma v =15.2mv iout vout io=1 30ma v =16.4mv iout vout io=30 1ma v =19.8mv iout vout io=30 1ma v =17.8mv iout vout io=30 1ma v =20.0mv v =2.7mv ref e re nce data b h 18sa3wgut (ta=25 unless otherwise specified.) fig.12 transient_response (ta=-40 ) fig.13 transient_response (ta=25 ) fig.14 transient_response ( ta = 8 5 ) stby=1.5v vout stby stby=0v stby vout stby=1.5v stby=0v stby=1.5v stby=0v stby vout vin=4.5v vin=3.5v vin vout v =2.0mv vin vout vin=4.5vvin=3.5v v =2.15mv t vin vout vin=4.5v vin=3.5v downloaded from: http:///
technical note 6/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series v v v v t= t= t= ref e re nce data b h 28sa3wgut (ta=25 unless otherwise specified.) fig.24 output voltage fig.25 line regulation fig.26 circuit current fig.27 load regulation fig.28 iout - ignd fig.29 ocp threshold fig.30 vout - temp fig.31 ig nd - temp fig.32 r.r. - vin fig.33 r.r. - freq. fig.34 noise - freq. v v t= t= t= v v v v t= t= t= v v t= t= t= t v=v v=v v=v t v v v=v v=v v=v 0 10 20 30 40 50 60 0 50 100 150 output current (ma) gnd current (ua) t=85 t=25 t=-40 2.75 2.76 2.77 2.78 2.79 2.8 2.81 2.82 2.83 2.84 2.85 0 50 100 150 output current (ma) output voltage (v) t=85 t=25 t=-40 0 10 20 30 40 50 60 70 80 100 1000 10000 100000 frequency f [hz] ripple rejection r.r.[db] v [v] r r rr [ [] [v] downloaded from: http:///
technical note 7/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series fig.41 load_response (io=1 30ma) (ta=-40 ) fig.42 load_response (io=1 30ma) (ta=25 ) iout vout fig.43 load_response (io=1 30ma) (ta=85 ) iout vout iout vout io=1 30ma io=1 30ma io=1 30ma v =16.8mv v =15.6mv v =16.8mv fig.44 load_response (io=30 1ma) (ta=-40 ) fig.46 load_response (io=30 1ma) (ta=25 ) iout vout fig.46 load_response (io=30 1ma) (ta=85 ) io=30 1ma v =17.6mv v =16.4mv v =17.4mv ref e re nce data b h 28sa3wgut (ta=25 unless otherwise specified.) fig.38 start_up (ta=-40 ) vout stby stby=1.5v stby=0v stby=1.5v stby=0v stby=1.5v stby=0v fig.39 start_up (ta=25 ) fig.40 start_up (ta=85 ) fig.35 transient_response (ta=-40 ) vcc vout vin=4.5v vin=3.5v vcc vout vin=4.5vvin=3.5v vcc vout vin=4.5v vin=3.5v fig.36 transient_response (ta=25 ) fig.37 transient_response (ta=85 ) v =0mv v =0mv v =0mv downloaded from: http:///
technical note 8/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series 0 0.5 1 1.5 2 2.5 3 3.5 4 00.511.522.533.544.555.5 input voltage (v) output voltage (v) t= t= t= 2.8 2.85 2.9 2.95 3 3.05 3.1 3.15 3.2 -40-30-20-10 0 1020304050607080 temp (c) output voltage (v) v=v vv v=v 2.96 2.97 2.98 2.99 3 3.01 3.02 3.03 3.04 0 50 100 150 200 output current(ma) output voltage(v) t=85 t=25 t=-40 ref e re nce data bh3 0 sa 3w gu t (ta=25 unless otherwise specified.) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 50 100 150 200 250 300 350 400 450 500 550 output current (ma) output voltage (v) t= t= t= 0 10 20 30 40 50 60 0 50 100 150 200 output cur rent ( ma) gnd current (ua) t=85 t=25 t=-40 fig.47 output voltage fig.48 line regulation fig.49 circuit current fig.50 load regulation fig.51 iout - ignd fig.52 ocp threshold fig.53 vout - temp fig.54 ignd - temp fig.55 r.r. - vin fig.56 r.r. - freq. fig.57 noise - freq. v [v] r r rr [] [] r r rr[] 0 10 20 30 40 50 60 70 80 90 100 00.511.522.5 33.544.555.5 input voltage (v) gnd cu rre nt (u a ) t= t= t= 30 35 40 45 50 55 60 65 70 -40-30-20-10 0 102030 4050607080 temp (c) gnd current (ua) v=v vv v=v 2.94 2.96 2.98 3 3.02 3.04 3.06 1.52 2.53 3.544.5 55.5 input voltag e (v) output voltage ( v) t=85 t=25 t=-40 [] [v] downloaded from: http:///
technical note 9/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series fig.58 transient_response ( ta = - 4 0 ) fig.59 transient_response ( ta = 2 5 ) fig.60 transient_response ( ta = 8 5 ) fig.61 start_up ( ta = - 4 0 ) fig.62 start_up ( ta = 2 5 ) fig.63 start_up ( ta = 8 5 ) vout stby stby=1.5v vout stby stby=1.5v vout stby stby=1.5v fig.64 load_response (ta=-40 ) (io=1 30ma) fig.65 load_response (ta=25 ) (io=1 30ma) fig.66 load_response (ta=85 ) (io=1 30ma) iout vout io=1 30ma iout vout io=1 30ma iout vout io=1 30ma fig.67 load_response (ta=-40 ) (io=30 1ma) fig.68 load_response (ta=25 ) (io=30 1ma) fig.69 load_response (ta=85 ) (io=30 1ma) iout vout io=30 1ma iout vout io=30 1ma iout vout io=30 1ma v =0mv v =0mv v =0mv v =15.2mv v =14.6mv v =15.6mv v =16.6mv v =16.8mv v =16.0mv ref e re nce data b h 30sa3wgut (ta=25 unless otherwise specified.) vin vout vin=4.5v vin=3.5v vin vout vin=4.5vvin=3.5v vin vout vin=4.5v vin=3.5v stby=0v stby=0v stby=0v downloaded from: http:///
technical note 10/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series bl ock di agr am, rec o mme nd ed circ u it di ag ram, a nd pi n ass i g n me nt dia gr am bh sa3wgut pin no. symbol function b2 v in power supply input b1 v out voltage output a1 gnd ground a2 stby output voltage on/off control (high: on, low: off) po w e r dissip a tion (pd) 1. power dissipation (pd) power dissipation calculations include estimates of power dissipation characteristics and internal ic power consumption and should be treated as rough guidelines. in the event that the ic is used in an environment where this power dissipation is exceeded, the attendant rise in the chip's te mperature will trigger the thermal shutdown circuit, reducing the current capacity and otherwise degrading the ic's design performance. allow for suffic ient margins so that this power dissipation is not exceeded during ic operation. calculating the maximum internal ic power consumption (p max ) pma x = (vin - vout) ? iou t (max . ) vin: input volt age v out : output voltage i out (max): output current 2. power dissipation/power dissipation reduction (pd) v c sp60n1 fig.71 vcsp60n1 power dissipation/power dissipation reduction (example) *circuit design should allow a sufficient ma rgin for the temperature range so that p max < pd. board: 7 mm ? 7 mm ? 0.8 mm material: glass epoxy pcb 0 0.2 0.4 0.6 0 25 50 75 100 125 ta[ ] pd[w] 530 mw fig.70 cin: 1.0 ? f co: 1.0 ? f thermal protection over current protection voltage reference control block b1 a1 b2a2 cin vout co vin vin gnd vstby vout stby ab 2 1 top view (mark side) 1pin mark downloaded from: http:///
technical note 11/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series i n put output cap a citors it is recommended to insert bypass capacitors between input and gnd pins, positioning them as close to the pins as possible. these capacitors will be used when the power supply impedance increases or when long wiring routes are used, so they should be checked once the ic has been mounted. ceramic capacitors generally have temperature and dc bias char acteristics. when selecting ceramic capacitors, use x5r or x7r or better models that offer good temperature and dc bias characteristics and high torelant voltages. typical ceramic capacitor characteristics ou t p u t c a p a c i to r s ceramic capacitors for stopping oscillation must be inserted between output and gnd pins, positio ned as close to the pins as possible. larger output capacitance va lues provide greater stability as well as improved output load variation and other characteristics. bh sa3wgut fig.75 stable operating region characteristics (example) 0 20 40 60 80 100 120 01234 v v capacitance rate of change (% ) 70 75 80 85 90 95 100 01234 dc bias vdc (v) capacitance rate of change (%) 50 v tor e l ance 16 v t o r e l a nce 10 v t o r e l ance 50 v t o r e l a nce 16 v t o r e l a nce 10 v t o r e l a nce fig.72 capacitance vs bias (y5v) fig.73 capacitance vs bias (x5r, x7r) fig.74 capacitance vs temperature (x5r, x7r, y5v) 0 20 40 60 80 100 120 -25 0 25 50 75 temp[ ] [%] y5 v x7 r x5 r capacitance rate of change (%) capacitance rate of change (%) ca p acitance rate of chan g e ( % ) downloaded from: http:///
technical note 12/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series ot her pre c aut io ns ? absolute maximum ratings this product is subject to a strict quality management regi me during its manufacture. however, damage may result if absolute maximum ratings such as applied voltage and oper ating temperature range are exceeded. assumptions should not be made regarding the stat e of the ic (short mode or open mode) when such damage is suffered. a physical safety measure such as a fuse should be implemented when use of the ic in a special mode where the absolute maximum ratings may be exceeded is anticipated. ? setting of heat use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. ? pin short and mistake fitting use caution when orienting and positioning the ic for mounting on printed circuit boards. improper mounting may result in damage to the ic. shorts between output pins or between output pins and the power supply and gnd pins caused by the presence of a foreign object may result in damage to the ic. ? thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit. the the rmal shutdown circuit is designed only to shut the ic off to prevent runaway thermal operation. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operating this circuit or use the ic in an envir onment where the operation of t he thermal shutdown circuit is assumed. ? overcurrent protection circuit the ic incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. this circuit serves to protect the ic from damage when the load is shorted. the protection circuits use fold-back type current limiting and are designed to limit current flow by not latc hing up in the event of a large and instantaneous current flow originating from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in applications characterized by the continuous operation or transitioning of the protection circuits. ? actions in strong magnetic fields use caution when using the ic in the pr esence of a strong magnetic field as such environments may occasionally cause the chip to malfunction. ? mutual impedance power supply and ground wiring should reflect consideratio n of the need to lower common impedance and minimize ripple as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance). ? influence of strong light exposure of the ic to strong light sources such as infrared light from a halogen lamp may cause the ic to malfunction. when it is necessary to use the ic in such environments, implement measures to block exposure to light from the light source. during testing, exposure to neither fluorescent lighting nor white leds had a significant effect on the ic. ? gnd potential ensure a minimum gnd pin potentia l in all operating conditions. in addition, ensure that no pins other than the gnd pin carry a voltage less than or equal to the gnd pin, including during actual transient phenomena. downloaded from: http:///
technical note 13/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series back curr ent in applications where the ic may be exposed to back current fl ow, it is recommended to create a route to dissipate this current by inserting a bypass diode between the v in and v out pins. t e sti ng on ap pl icati on b oard s when testing the ic on an application board, connecting a capaci tor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each pr ocess or step. ground the ic during assembly steps as an antistatic measure, and use similar caution when transporting or stor ing the ic. always turn the ic's powe r supply off before connecting it to or removing it from a jig or fixtur e during the inspection process. re gar di ng inp u t pin of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with the n layers of other elements to create a variety of parasitic elements. for example, when a resistor and transistor are connected to pins as shown in fig.77 the p/n junction functions as a parasitic diode when gnd > (pin a) for the resistor or gnd > (pin b) for the transistor (npn). similarly, when gnd > (pin b) for the transistor (npn), th e parasitic diode described above combines with the n layer of other adjacent elements to operate as a parasitic npn transistor. the formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable resul t of the ic's architecture. the operation of parasitic elements c an cause interference with circuit operation as well as ic malfunction and damage. for these reasons, it is necessary to use caution so that the ic is not used in a way that will trigger the operation of parasitic elements, such as by the application of voltages lower than the gnd (p substrate) voltage to input pins. resistor transistor (npn) fig.76 example bypass diode connection p substrate n p n n p + p + (pin a) parasitic element p substrate n p n n p + p + (pin b) parasitic elements n (pin a) parasitic element parasitic elements (pin b) other adjacent element fig.77 vin stby gnd out back current downloaded from: http:///
technical note 14/14 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. bh sa3wgut series se lecti ng a m ode l n a me w h en ord e ri ng b h 1 8 s a 3 w g u t e 2 rohm model name output voltage series chip sizepackage shutdown switch packege gut: vcsp60n1 packaging and forming specification e2: embossed tape and reel (unit : mm) vcsp60l1 (bhxxsa3wgut) 0.960.05 0.960.05 ba 0.05 4- 0.30.05 0.230.05 0.5 0.5 0.230.05 b 1pin mark s 0.06 s 0.210.05 0.60.075 ba 2 1 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (heat sealing method) tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BH28SA3WGUT-E2

	To Download BH28SA3WGUT-E2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .