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  avago technologies - 1 - description the avago technologies' ACFM-7037 is a quadplexer that combines band 3 and band 7 duplexers into a single, miniature package. the ACFM-7037 features a single antenna connection, which eliminates the need for ante nna switching. all ports are matched to 50 ohms. the ACFM-7037 is designed with avago technologies' film bulk acoustic resonator (fbar) technology. the ACFM-7037 also utilizes avago technologies' innovative microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled in a module with a footprint of only 3.6 mm 2 mm with a maximum height of 0.80 mm. low tx insertion loss of the ACFM-7037 reduces power amplifier current, which extends battery life. the ACFM-7037 enhances receiver sensitivity and dynamic range with low rx insertion loss and high rejection of tx signals at the rx ports. the excellent power handling capability of avago technologies' fbar bulk-mode resonators supports the high tx output power levels needed mobile communications devices while adding vir tually no distortion. features ? single antenna ? band 3 and band 7 carrier aggregation ? miniature size 3.6 mm 2 mm footprint 0.80 mm maximum height ? high power rating +31 dbm maximum tx power ? environmental rohs 6 compliant halogen free tbbpa free applications smartphones, tablets, and mo bile/portable communications devices operating in bands 3 and 7. functional block diagram ordering information part number number of devices container ACFM-7037-blk 100 tape strip or gel-pack ACFM-7037-tr1 3000 178 mm (7-inch) reel #boe5y 1psu 1jo
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#boe %vqmfyfs #boe %vqmfyfs ACFM-7037 band 3/band 7 quadplexer product brief
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. all other brand and product names may be trademarks of their respective companies. data subject to change. copyright ? 2015 avago technologies. all rights reserved. av02-4911en C 2015-05-01 package dimensions and marking specification pin description pin connection 1band 7 rx 4band 3 rx 8band 3 tx 11 band 7 tx 13 ant 2, 3, 5, 6, 7, 9, 10, 12, 14, 15 gnd 1.600 x 0.750 0.25 x 45 chamfer 0.400 x 0.255 (14x) 0.515 1.545 0.750 3.000 1.500 0.7725 0.750 0.05 2.000 0.075 ant b3 rx 3.600 0.075 b7 tx b3 tx b7 rx pin 1 mark oxide layer (see notes) 1 14 13 12 11 10 9 87 15 2 3 4 5 6 wiyww ddxxxx ssssss vago notes: 1. dimensions in millimeters 2. tolerance, unless otherwise noted: x.xx 0.05 mm x.xxx 0.025 mm 3. dimensions nominal unless otherwise noted 4. angles 45 nominal 5. contact areas are gold plated 6. metal gnd and i/o pads are solder mask defined by means of a thin (< 1m) oxide layer top view bottom view side view package marking code: avago = avago technologies, inc. w = ACFM-7037 i = assembly information y = year ww = work week dd = date code xxxx = assembly lot ssssss = production information


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