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product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.co.jp tsz22111 ? 14 ? 001 1ch ultra small high side load switch bus1djc0gwz bus1djc3gwz general description bus1djc0gwz and bus1djc3gwz are low on-resistance high-side power switch p-channel mosfets. it comes in ultra-small package for portable digital applications. this switch ic operates on low input voltages ranging from 1.1v to 5.0v and exhibits a typical on-resistance of 63 m ? at 3.3v. the turn on time of the device can be controlled to avoid inrush current. features ? p-mosfet high-side load switch ? low input voltage ? ultra low bias current ? ultra low standby current ? built-in discharge circuit ? built-in soft start circuit ? built-in short circuit protection ? input logic : active-high ? ultra small package ? esd protection applications ? digital cameras ? mobile phones ? smart phones ? portable devices ? digital video cameras key specifications ? input voltage range: 1.1v to 5.0v ? r on (at v in =1.2v): 140m ? (typ) ? r on (at v in =3.3v): 63m ? (typ) ? bias current: 0.35a(typ) ? standby current: 0.01 a (typ) ? operating temperature range: -30c to +85c package w(typ) x d(typ) x h(max) ucsp30l1 0.8mm x 0.8mm x 0.35mm typical application circuits figure 1. typical application circuits v out v in gnd c l c in en on/off datashee t downloaded from: http:///
datasheet d a t a s h e e t 2/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz pin configurations pin descriptions pin no. pin name pin function a1 v out switch output a2 v in switch input b1 gnd ground b2 en enable input block diagram b en gnd a v in v out 2 1 top view figure 2. pin configuration figure 3. block diagram b a top view bottom view 2 1 1 2 short circuit protection v in v out en gate driver with soft start gnd downloaded from: http:///
datasheet d a t a s h e e t 3/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz absolute maximum ratings (ta = 25c) parameter symbol rating unit switch input voltage v in -0.3 to +5.5 v switch output voltage v out -0.3 to v in +0.3 v enable input voltage v en -0.3 to +5.5 v power dissipation pd 0.41 (note 1) w operating temperature range topr -30 to +85 c storage temperature range tstg -55 to +125 c junction temperature tjmax 125 c (note 1) derate by 4.1mw/c when operating above 25c. (when m ounted on a 9 layer glass-epoxy board with 63mm x 55mm x 1.6mm di mension.) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta= -30c to +85c) parameter symbol min typ max unit switch input voltage v in 1.1 - 5.0 v output current i out - - 2 (note 2) a (note 2) not to exceed pd and aso. electrical characteristics (unless otherwise specified, v in =3.3v, v en =3.3v, ta=25c) parameter symbol min typ max unit conditions operating current i in - 0.35 1 a v en =3.3v, i out =0a off supply current i in_ off - 0.01 1 a v en =0v, v out =open leakage current i in_ leak - 0.01 1 a v en =0v, v out =0v on-resistance 1 r on1 - 140 245 m ? v in =1.2v on-resistance 2 r on2 - 80 125 m ? v in =1.8v on-resistance 3 r on3 - 63 85 m ? v in =3.3v on-resistance 4 r on4 - 58 80 m ? v in =5.0v en high voltage v en_ high 0.85 - 5.0 v en low voltage v en_ low -0.3 - 0.4 v en bias current i en - 0.7 1.5 a v en =3.3v discharge on-resistance r on_ dis 50 80 110 ? v en =0v bus1djc0gwz parameter symbol min typ max unit conditions turn-on time 1 t on1 - 32 - sec v in =1.2v, r l =510 ? , c l =0.1 f turn-on time 2 t on2 - 12 - sec v in =3.3v, r l =510 ? , c l =0.1 f turn-off time t off - 25 - sec v in =3.3v, r l =510 ? , c l =0.1 f bus1djc3gwz parameter symbol min typ max unit conditions turn-on time 1 t on1 - 510 - sec v in =1.2v, r l =510 ? , c l =0.1 f turn-on time 2 t on2 - 190 - sec v in =3.3v, r l =510 ? , c l =0.1 f turn-off time t off - 25 - sec v in =3.3v, r l =510 ? , c l =0.1 f downloaded from: http:///
datasheet d a t a s h e e t 4/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz measurement circuit figure 4. measurement circuit figure 5. timing diagram v out v in gnd en on/off c l r l c in 50% 10% 90% 10% t on t off t r t f en v out 90% 50% downloaded from: http:///
datasheet d a t a s h e e t 5/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves (unless otherwise specified, ta=25c, v en =3.3v, v in =3.3v) 0 20 40 60 80 100 120 140 160 -30 -10 10 30 50 70 ta [ ] r on [m ? ] figure 7. on-resistance vs temperature v in =1.2v v in =1.8v v in =3.3v v in =5.0v temperature : ta [c] on-resistance : r on [m ? ] figure 6. on-resistance vs switch input voltage 0 20 40 60 80 100 120 140 160 12345 v in [v] r on [m ? ] ta=85c ta=25c ta=-30c on-resistance : r on [m ? ] switch input voltage : v in [v] 0 0.2 0.4 0.6 0.8 1 25 45 65 85 105 125 i in [ a] ta [ ] figure 9. operating current vs t emperature v in =5.0v v in =3.3v v in =1.8v v in =1.2v temperature : ta [c] operating current : i in [a] 0 0.2 0.4 0.6 0.8 1 012345 i in [a] v in [v] figure 8. operating current vs switch input voltage operating current : i in [a] switch input voltage : v in [v] downloaded from: http:///
datasheet d a t a s h e e t 6/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves - continued 0 0.5 1 1.5 2 2.5 3 25 45 65 85 105 125 ta [ ] i in_off [ a] figure 11. off supply current vs temperature (v en =0v) v in =5.0v v in =3.3v v in =1.8v v in =1.2v temperature : ta [c] off supply current : i in _ off [a] 0 0.2 0.4 0.6 0.8 1 012345 i in_leak [ a] v in [v] figure 12. leakage current vs switch input voltage (v en =0v, v out =0v) leakage current : i in _ leak [a] switch input voltage : v in [v] 0 0.5 1 1.5 2 2.5 3 25 45 65 85 105 125 ta [ ] i in_leak [ a] figure 13. leakage current vs temperature (v en =0v, v out =0v) v in =5.0v v in =3.3v vi n =1.8v v in =1.2v leakage current : i in _ leak [a] temperature : ta [c] 0 0.2 0.4 0.6 0.8 1 012345 i in_off [ a] v in [v] figure 10. off supply current vs switch input voltage (v en =0v) off supply current : i in _ off [a] switch input voltage : v in [v] downloaded from: http:///
datasheet d a t a s h e e t 7/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued figure 17. switch output voltage vs enable input voltage (v in =5.0v) 0 1 2 3 4 5 0 0.2 0.4 0.6 0.8 1 v en [v] v out [v] switch output voltage : v out [v] enable input voltage : v en [v] figure 16. switch output voltage vs enable input voltage (v in =3.3v) 0 1 2 3 4 5 0 0.2 0.4 0.6 0.8 1 v en [v] v out [v] switch output voltage : v out [v] enable input voltage : v en [v] figure 15. switch output voltage vs enable input voltage (v in =1.8v) 0 1 2 3 4 5 0 0.2 0.4 0.6 0.8 1 v en [v] v out [v] switch output voltage : v out [v] enable input voltage : v en [v] figure 14. switch output voltage vs enable input voltage (v in =1.2v) 0 1 2 3 4 5 0 0.2 0.4 0.6 0.8 1 v en [v] v out [v] switch output voltage : v out [v] enable input voltage : v en [v] downloaded from: http:///
datasheet d a t a s h e e t 8/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued figure 21. switch output voltage vs switch input voltage (v en =0v) 0 1 2 3 4 5 012345 v in [v] v out [v] switch input voltage : v in [v] figure 18. en bias current vs enable input voltage 0 0.4 0.8 1.2 1.6 2 012345 v en [v] i en [ a] enable input voltage : v en [v] en bias current : i en [a] figure 19. discharge on-resistance vs switch input voltage 60 70 80 90 100 110 120 12345 v in [v] r on_dis [ ? ] switch input voltage : v in [v] discharge on-resistance : r on_dis [ ? ] figure 20. switch output voltage vs switch input voltage (v en =3.3v) 0 1 2 3 4 5 012345 v in [v] v out [v] switch input voltage : v in [v] switch output voltage : v out [v] switch output voltage : v out [v] downloaded from: http:///
datasheet d a t a s h e e t 9/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued figure 22. switch output voltage vs output current (v in =1.2v) 0 0.3 0.6 0.9 1.2 1.5 0 0.3 0.6 0.9 1.2 1.5 1.8 i out [a] v out [v] switch output voltage : v out [v] output current : i out [a] figure 23. switch output voltage vs output current (v in =1.5v) 0 0.3 0.6 0.9 1.2 1.5 1.8 0 0.5 1 1.5 2 2.5 3 3.5 i out [a] v out [v] switch output voltage : v out [v] output current : i out [a] figure 25. switch output voltage vs output current (v in =2.5v) 0 0.4 0.8 1.2 1.6 2 2.4 2.8 0123456 i out [a] v out [v] switch output voltage : v out [v] figure 24. switch output voltage vs output current (v in =1.8v) 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 0 0.8 1.6 2.4 3.2 4 4.8 i out [a] v out [v] switch output voltage : v out [v] output current : i out [a] output current : i out [a] downloaded from: http:///
datasheet d a t a s h e e t 10/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued figure 26. switch output voltage vs output current (v in =3.3v) 0 0.5 1 1.5 2 2.5 3 3.5 01234567 i out [a] v out [v] switch output voltage : v out [v] output current : i out [a] figure 27. switch output voltage vs output current (v in =5.0v) 0 1 2 3 4 5 6 01234567 i out [a] v out [v] switch output voltage : v out [v] output current : i out [a] figure 28. turn-on time vs switch i nput voltage (bus1djc0gwz) 0 10 20 30 40 12345 v in [v] t on [ sec] turn-on time : t on [sec] switch input voltage : v in [v] figure 29 . rise time vs switch input voltage (bus1djc0gwz) 0 5 10 15 20 25 30 12345 v in [v] t r [ sec] switch input voltage : v in [v] rise time : t r [sec] downloaded from: http:///
datasheet d a t a s h e e t 11/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued t:10[sec/div] en:2[v/div] v out :500[mv/div] figure 32. turn on response 1 (bus1djc0gwz v in =1.2v) en:2[v/div] v out :500[mv/div] t:10[sec/div] figure 33. turn off response 1 (bus1djc0gwz v in =1.2v) figure 30. turn-off time vs switch input voltage (bus1djc0gwz) 0 10 20 30 40 12345 v in [v] t off [ sec] turn-off time : t off [sec] switch input voltage : v in [v] figure 31. fall time vs switch input voltage (bus1djc0gwz) 0 5 10 15 20 25 30 12345 v in [v] t f [ sec] switch input voltage : v in [v] fall time : t f [sec] downloaded from: http:///
datasheet d a t a s h e e t 12/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued t:10[sec/div] en:2[v/div] v out :500[mv/div] figure 34. turn on response 2 (bus1djc0gwz v in =1.5v) en:2[v/div] v out :500[mv/div] t:10[sec/div] figure 35. turn off response 2 (bus1djc0gwz v in =1.5v) t:10[sec/div] en:2[v/div] v out :500[mv/div] figure 36. turn on response 3 (bus1djc0gwz v in =1.8v) en:2[v/div] v out :500[mv/div] t:10[sec/div] figure 37. turn off response 3 (bus1djc0gwz v in =1.8v) downloaded from: http:///
datasheet d a t a s h e e t 13/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued t:4[sec/div] en:2[v/div] v out :1 [v/div] figure 38. turn on response 4 (bus1djc0gwz v in =2.5v) en:2[v/div] v out :1[v/div] t:10[sec/div] figure 39. turn off response 4 (bus1djc0gwz v in =2.5v) t:4 [sec/div] en:2[v/div] v out :1[v/div] figure 40. turn on response 5 (bus1djc0gwz v in =3.3v) en:2[v/div] v out :1[v/div] t:10[sec/div] figure 41. turn off response 5 (bus1djc0gwz v in =3.3v) downloaded from: http:///
datasheet d a t a s h e e t 14/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued t:4[sec/div] en:2[v/div] v out :2 [v/div] en:2[v/div] v out :2[v/div] t:10[sec/div] figure.42 turn on response 6 (bus1djc0gwz v in =5.0v) figure.43 turn off response 6 (bus1djc0gwz v in =5.0v) figure 45 . rise time vs switch input voltage (bus1djc3gwz) 0 100 200 300 400 500 12345 v in [v] t r [ sec] switch input voltage : v in [v] rise time : t r [sec] figure 44. turn-on time vs switch i nput voltage (bus1djc3gwz) 0 100 200 300 400 500 600 12345 v in [v] t on [ sec] turn-on time : t on [sec] switch input voltage : v in [v] downloaded from: http:///
datasheet d a t a s h e e t 15/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued figure.48 turn on response 7 (bus1djc3gwz v in =1.2v) figure.49 turn off response 7 (bus1djc3gwz v in =1.2v) t:100[sec/div] en:2[v/div] v out :500 [mv/div] en:2[v/div] v out :500[mv/div] t:10[sec/div] figure 46. turn-off time vs switch input voltage (bus1djc3gwz) 0 10 20 30 40 12345 v in [v] t off [ sec] turn-off time : t off [sec] switch input voltage : v in [v] figure 47. fall time vs switch input voltage (bus1djc3gwz) 0 5 10 15 20 25 30 12345 v in [v] t f [ sec] switch input voltage : v in [v] fall time : t f [sec] downloaded from: http:///
datasheet d a t a s h e e t 16/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued t:100[sec/div] en:2[v/div] v out :500[mv/div] en:2[v/div] v out :500[mv/div] t:10[sec/div] figure.50 turn on response 8 (bus1djc3gwz v in =1.5v) figure.51 turn off response 8 (bus1djc3gwz v in =1.5v) t:100[sec/div] en:2[v/div] v out :500[mv/div] en:2[v/div] v out :500[mv/div] t:10[sec/div] figure.52 turn on response 9 (bus1djc3gwz v in =1.8v) figure.53 turn off response 9 (bus1djc3gwz v in =1.8v) downloaded from: http:///
datasheet d a t a s h e e t 17/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued t:40[sec/div] en:2[v/div] v out :1 [v/div] en:2[v/div] v out :1[v/div] t:10[sec/div] figure.54 turn on response 10 (bus1djc3gwz v in =2.5v) figure.55 turn off response 10 (bus1djc3gwz v in =2.5v) t:40 [sec/div] en:2[v/div] v out :1[v/div] en:2[v/div] v out :1[v/div] t:10[sec/div] figure.56 turn on response 11 (bus1djc3gwz v in =3.3v) figure.57 turn off response 11 (bus1djc3gwz v in =3.3v) downloaded from: http:///
datasheet d a t a s h e e t 18/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz typical performance curves C continued t:40[sec/div] en:2[v/div] v out :2 [v/div] en:2[v/div] v out :2[v/div] t:10[sec/div] figure.58 turn on response 12 (bus1djc3gwz v in =5v) figure.59 turn off response 12 (bus1djc3gwz v in =5v) downloaded from: http:///
datasheet d a t a s h e e t 19/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz application information it is recommended that an input bypass/decoupling capacitor (over 0.1 f) is placed near the ic between the v in and gnd pins. the capacitor between v in and gnd pins is necessary when there is hi gh impedance on the power supply or if the power trace is long. larger capacitance value (0.1 f to 100 f) would result to better line regulation and will improve power characteristics during load change. howe ver, ic operation must be confirmed by mounting the device on an actual application board. power dissipation an estimation of heat reduction characteristics and internal po wer consumption of the ic ar e shown below. use these for reference. it is recommended to measure pd on a set board since power dissipation changes substantially according to the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.). exceeding the power dissipation of ic may lead to degradation of the original ic performance, such as reduction in current capability of the device. it is recommended to provide sufficient margin within the power dissipation rating for usage. calculation of the internal power consumption of ic (p) out out on i i r p = where: r on is the on-state resistance i out is the average output current measurement conditions evaluation board layout of board for measurement top layer (top view) bottom layer (top view) measurement state with board im plemented (wind speed 0 m/s) board material glass epoxy resin (9 layers) board size 63 mm x 55 mm x 1.6 mm wiring rate top layer metal (gnd) wiring rate: approx. 0% bottom layer metal (gnd) wiring rate: approx. 50% through hole diameter 0.5mm x 6 holes power dissipation 0.41w thermal resistance ja=243.9c/w downloaded from: http:///
datasheet d a t a s h e e t 20/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz i/o equivalence circuits a2(v in ) / a1(v out ) b1(gnd) b2(en) b2(en) depression nmos a2(v in ) a 1(v out ) b1(gnd) figure 60. ucsp30l1(bus1djc0gwz/ bus1djc3gwz) power dissipation heat reduction characteristics (reference) * please design the margin so that p is less than pd (p < pd) within the usage temperature range 0 25 50 75 100 125 85 0 0.2 0.3 0.4 0.1 0.41w ambient temperature :ta [c] 0.5 power dissipation :pd [w] downloaded from: http:///
datasheet d a t a s h e e t 21/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluc tuations in the small-signal ground caused by large currents. also ens ure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this spec ification is when the ic is mounted on a glass epoxy board. in case of exceedin g this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic c an be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that th e internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consid eration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application boar d, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup durin g the inspection process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mount ing the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (i n very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
datasheet d a t a s h e e t 22/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz operational notes C continued 11. unused input terminals input terminals of an ic are often connec ted to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unle ss otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably fo rmed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interferenc e among circuits, operational faults, or physical damage. therefore, conditions which c ause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that t he output voltage, output current, and power dissipation are all within the area of safe operation (aso). downloaded from: http:///
datasheet d a t a s h e e t 23/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz ordering information b u s 1 d j c 0 g w z C e2 part number switch number discharge voltage output slew rate package packaging and of channel fet resistance current forming specificatio n 1:1ch d:built in j:5.5v gwz:ucsp30l1 e2:embossed tape and reel n:none i:7.0v h:10v marking diagram physical dimension, tape and reel information 5:500ma a:1a c:2a 0:none 1:fast 3:middle 5:slo w ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) ucsp50l1 (buxxsa4wgwl) s 0.06 s 0.55max 0.10.05 a b ba 0.05 0.20.05 4- 0.250.05 2 1 0.20.05 ba 0.4 0.4 1pin mark 0.80.05 0.80.05 ucsp30l1 (bus1djc0gwz / bus1djc3gwz) 0.08 0.05 0.35max 4- 0.200.05 x x marking lot no. 1pin mark part no. marking bus1djc0gwz gv bus1djc3gwz gx downloaded from: http:///
datasheet d a t a s h e e t 24/24 tsz02201-0r5r0gz00010-1-2 ? 2014 rohm co., ltd. all rights reserved. 8.apr.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bus1djc0gwz bus1djc3gwz revision history date revision changes 11.mar.2014 001 new release 8.apr.2014 002 added bus1djc3gwz downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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