creat by art - glass passivated junction - ideal for printed circuit board - typical ir less than 0.1 a - high surge current capability - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test symbol unit v rrm v v rms v v dc v i f(av) a i 2 ta 2 s r jc o c/w t j o c t stg o c document number: ds_d1311036 version: d13 ts4k40 thru TS4K80 taiwan semiconductor glass passivated brid g e rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec ts4k mechanical data case: ts4k polarity: polarity as marked on the body mounting torque: 8.17 in-lbs maximum weight: 4 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter ts4k40 ts4k60 TS4K80 maximum repetitive peak reverse voltage 400 600 800 maximum rms voltage 280 420 560 maximum dc blocking voltage 400 600 800 v maximum average forward rectified current 4 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 120 a storage temperature range rating for fusing (t<8.3ms) 60 maximum instantaneous forward voltage i f = 2 a (note 1) i f = 4 a v f 1.0 1.1 - 55 to +150 maximum dc reverse current t j =25 at rated dc blocking voltage t j =125 i r 10 500 a note 1: pulse test with pw=300 s, 1% duty cycle typical thermal resistance 5.5 operating junction temperature range - 55 to +150
part no. part no. TS4K80 TS4K80 ratings and characteristics curves (ta=25 unless otherwise noted) document number: ds_d1311036 version: d13 green compound description example TS4K80 d3g d3 g preferred p/n packing code green compound code TS4K80 d3 d3 ts4k40 thru TS4K80 taiwan semiconductor packing code green compound code package d3 packing ordering information ts4k x0 ts4k 20 / tube forming note 1: "xx" defines voltage from 400v (ts4k40) to 800v (TS4K80) ts4kxx (note 1) suffix "g" 0 1 2 3 4 5 0 50 100 150 average forward a current (a) case temperature ( o c) fig.1- maximum forward current derating curve resistive or inductive load with heatsink 0 25 50 75 100 125 150 175 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3- maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2- typical reverse characteristics tj=25 tj=125 0.1 1 10 100 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 instantaneous forward current (a) instantaneous forward voltage (v) fig. 4- typical forward characteristics
min max min max a 24.70 25.30 0.972 0.996 b 2.00 2.30 0.079 0.091 c 0.90 1.10 0.035 0.043 d 7.30 7.70 0.287 0.303 e 3.00 5.00 0.118 0.197 f 14.70 15.30 0.579 0.602 g 3.30 3.70 0.130 0.146 h 17.00 18.00 0.669 0.709 i 4.40 4.80 0.173 0.189 j 3.40 3.80 0.134 0.150 k 9.30 9.60 0.366 0.378 l 3.10 3.60 0.122 0.142 m 3.10 3.40 0.122 0.134 n 0.50 0.70 0.020 0.028 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1311036 version: d13 marking diagram ts4k40 thru TS4K80 taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 0 50 100 150 200 250 300 0.1 1 10 100 j unction capacitance (pf) a reverse voltage (v) fig. 5- typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1311036 version: d13 ts4k40 thru TS4K80 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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