1. product profile 1.1 general description the device is designed to protect high-speed interfaces such as superspeed usb 3.1 at 10 gbps, high-definition multimedia interface (hdmi), displayport, external serial advanced technology attachment (esata) and low voltage differential signaling (lvds) interfaces against electrostatic discharge (esd). the device includes a high-level esd prote ction diode structure protecting sensitive transmitters and receivers for ultra high-speed signal lines. the device is encapsulated in a leadless small dfn2510a-10 (sot1176-1) plastic package. all signal lines are protected by a special diode configuration offering ultra low line capacitance of only 0.2 pf maximum. these diodes utilize a snapback structure in order to provide protection to downstream components from esd voltages up to ? 15 kv contact exceeding iec 61000-4-2, level 4. 1.2 features and benefits ? system-level esd protection for usb 2 .0 and superspeed usb 3.1 at 10 gbps, hdmi, displayport, esata and lvds ? line capacitance of only 0.2 pf maximum for each channel ? outstanding system protection: extremely deep snapback combined with dynamic resistance of only 0.4 ? . ? all signal lines with integrated rail- to-rail clamping diodes for downstream esd protection of ? 15 kv exceeding iec 61000-4-2, level 4 ? matched 0.5 mm trace spacing ? signal lines with ? 0.05 pf matching capacitance between signal pairs ? design-friendly ?pass-through? signal routing 1.3 applications the device is designed for high-speed re ceiver and transmitter port protection: ? smartphones, tablet computers, mobile internet devices (mid) and portable devices ? tvs and monitors ? dvd recorders and players ? notebooks, main board graphic cards and ports ? set-top boxes and game consoles pusb3ab4 esd protection for ultra high-speed interfaces rev. 1 ? 25 august 2015 objective data sheet xson10
pusb3ab4 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights re served. objective data sheet rev. 1 ? 25 august 2015 2 of 9 nxp semiconductors pusb3ab4 esd protection for ultra high-speed interfaces 2. pinning information 3. ordering information 4. marking 5. limiting values [1] all pins to ground. table 1. pinning pin symbol description simplified outline graphic symbol 1 ch1 channel 1 esd protection 2 ch2 channel 2 esd protection 3 gnd ground 4 ch3 channel 3 esd protection 5 ch4 channel 4 esd protection 6 n.c. not connected 7 n.c. not connected 8 gnd ground 9 n.c. not connected 10 n.c. not connected transparent top view 109876 12345 aaa-019396 1245 3,8 = table 2. ordering information type number package name description version pusb3ab4 dfn2510a-10 plastic extremely thin small outline package; no leads; 10 terminals; body 1 ? 2.5 ? 0.5 mm sot1176-1 table 3. marking codes type number marking code pusb3ab4 ab table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v i input voltage ? 0.5 +3.3 v v esd electrostatic discharge voltage iec 61000-4-2, level 4 [1] contact discharge ? 15 +15 kv air discharge ? 15 +15 kv i ppm rated peak pulse current t p =8/20 ? s ? 77 a t amb ambient temperature ? 40 +85 ?c t stg storage temperature ? 55 +125 ?c
pusb3ab4 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights re served. objective data sheet rev. 1 ? 25 august 2015 3 of 9 nxp semiconductors pusb3ab4 esd protection for ultra high-speed interfaces 6. characteristics [1] this parameter is guaranteed by design. [2] 100 ns transmission line pulse (tlp); 50 ? ; pulser at 80 ns. [3] according to iec 61000-4-5 (8/20 ? s current waveform). the device uses an advanced cl amping structure showing a negative dynamic resistance. this snapback behavior strongly reduces the clamping voltage to the system behind the esd protection during an esd event. do not connect unlimited dc current sources to the data lines to avoid keeping the esd protection device in snap-back state after exceeding breakdown voltage (due to an esd pulse for instance). 7. application information the device is designed to provide high-level esd protection for high-speed serial data buses such as hdmi, displayport, esata and lvds data lines. when designing the pcb, give careful cons ideration to impedance matching and signal coupling. do not connect the signal lines to unlimited current sources like, for example, a battery. table 5. characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit v br breakdown voltage i i =1ma 5.5 9 - v i lr reverse leakage current per channel; v i =5v - <1 100 na v f forward voltage i i =1ma -0.7-v c line line capacitance [1] - 0.17 0.2 pf r dyn dynamic resistance tlp [2] positive transient - 0.4 - ? negative transient - 0.4 - ? v sbck snapback voltage i i = 1 a; tlp 100/10 ns - 3.3 - v v cl clamping voltage i pp = 5 a; positive transient [3] -4.5-v i pp = ? 5a; negative transient [3] - ? 4.5 - v
pusb3ab4 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights re served. objective data sheet rev. 1 ? 25 august 2015 4 of 9 nxp semiconductors pusb3ab4 esd protection for ultra high-speed interfaces 8. package outline fig 1. package outline dfn2510a-10 (sot1176-1) 12-05-23 dimensions in mm 10 6 1 5 0.4 0.3 0.45 0.35 0.05 max 0.5 max 0.127 0.25 0.15 1.1 0.9 0.2 min 2 0.5 2.6 2.4
pusb3ab4 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights re served. objective data sheet rev. 1 ? 25 august 2015 5 of 9 nxp semiconductors pusb3ab4 esd protection for ultra high-speed interfaces 9. soldering fig 2. reflow soldering footprint dfn2510a-10 (sot1176-1) sot1176-1 remark: stencil of 75 m is recommended. a stencil of 75 m gives an aspect ratio of 0.77 with a stencil of 100 m one will obtain an aspect ratio of 0.58 footprint information for reflow soldering of dfn2510a-10 package solder land plus solder paste occupied area solder land solder paste deposit solder resist hx by hy 0.05 c p d 0.05 ay dimensions in mm ay by c d hy 1.25 0.3 0.475 0.2 p 0.5 1.5 hx 2.45 generic footprint pattern refer to the package outline drawing for actual layout sot1176-1fr
pusb3ab4 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights re served. objective data sheet rev. 1 ? 25 august 2015 6 of 9 nxp semiconductors pusb3ab4 esd protection for ultra high-speed interfaces 10. revision history table 6. revision history document id release date data sheet status change notice supersedes pusb3ab4 v.1 20150825 objective data sheet - -
pusb3ab4 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights re served. objective data sheet rev. 1 ? 25 august 2015 7 of 9 nxp semiconductors pusb3ab4 esd protection for ultra high-speed interfaces 11. legal information 11.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 11.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 11.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
pusb3ab4 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights re served. objective data sheet rev. 1 ? 25 august 2015 8 of 9 nxp semiconductors pusb3ab4 esd protection for ultra high-speed interfaces export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 11.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 12. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors pusb3ab4 esd protection for ultra high-speed interfaces ? nxp semiconductors n.v. 2015. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 25 august 2015 document identifier: pusb3ab4 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 13. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 application information. . . . . . . . . . . . . . . . . . . 3 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 legal information. . . . . . . . . . . . . . . . . . . . . . . . 7 11.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7 11.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 contact information. . . . . . . . . . . . . . . . . . . . . . 8 13 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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