1. 2. 3. material content data sheet sales product name ipd25n06s4l-30 issued 29. august 2013 ma# MA000484866 package pg-to252-3-11 weight* 389.64 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.678 0.17 0.17 1741 1741 leadframe non noble metal iron 7439-89-6 0.140 0.04 359 inorganic material phosphorus 7723-14-0 0.042 0.01 108 non noble metal copper 7440-50-8 139.706 35.85 35.90 358549 359016 wire non noble metal aluminium 7429-90-5 0.679 0.17 0.17 1743 1743 encapsulation organic material carbon black 1333-86-4 1.489 0.38 3820 plastics epoxy resin - 26.051 6.69 66858 inorganic material silicondioxide 60676-86-0 121.323 31.14 38.21 311369 382047 leadfinish non noble metal tin 7440-31-5 3.740 0.96 0.96 9599 9599 plating non noble metal nickel 7440-02-0 0.091 0.02 233 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 234 solder noble metal silver 7440-22-4 0.027 0.01 70 non noble metal tin 7440-31-5 0.022 0.01 56 non noble metal lead 7439-92-1 1.044 0.27 0.29 2679 2805 heatspreader inorganic material phosphorus 7723-14-0 0.028 0.01 73 non noble metal iron 7439-89-6 0.095 0.02 243 non noble metal copper 7440-50-8 94.488 24.25 24.28 242499 242815 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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