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luxpia co.,ltd. 948-1, dunsan-li bongdong-eup, wa nju-gun, jeonbuk, korea tel 82-63-260-4500 fax 82-63-261-8255 comments luxpia co., ltd. date : . . . date : . . . designed by checked by approved by approved by approved by approved by / / / / / / part no. :LYH1032 s p ecification for a pp roval ( tentative 1.0 )
1/14 - contents - 1. features 2. package outline dimensions and materials 3. absolute maximum ratings 4. electro-optical characteristics 5. materials 6. taping 7. packing 8. reliability 9. cautions 10. warranty 11. others 12. characteristic diagrams 2/14 1. features ? package : smd top view type (2chips in 1) ? dimension : 3.5 2.7 1.8 mm (lwh) ? small size surface mount type ? viewing angle : extremely wide(120 ? ) ? soldering methods : ir reflow soldering 2. package outline dimensions and recommended solder patterns 3/14 3. absolute maximum ratings (t a =25 ? ) item symbol value unit forward current i f 60 ma pulse forward current 1) i fp 100 ma reverse voltage v r 5 v power dissipation p d 160 mw operating temperature t opr -30 to+85 ? storage temperature t stg -40 to +100 ? * ' 1 d p o e j u j p o t q v m t f x j e u i n t f d e v u z s b u j p 4/14 4. electro-optical characteristics (t a =25 ? ) item rank symbol condition min typ max unit forward voltage 2) 1 v f i f = 40ma 1.8 - 2.0 v 2 2.0 - 2.2 3 2.2 - 2.4 4 2.4 - 2.6 dominant wavelength 3) a d i f = 40ma 585 - 595 nm luminous intensity 4) h i v i f = 40ma 200 - 300 mcd j 300 - 400 k 400 - 500 l 500 - 600 m 600 - 700 n 700 - 800 o 800 - 900 reverse current - i r v r =5v - - 50 u 2) forward voltages are tested at a current pulse duration of 10 ms and an accuracy within 0.1v. 3) dominant wavelength are tested at a current pulse duration of 10 ms and an accuracy within 1nm. 4) the allowance of luminous intensity measurement is within 10%. 5/14 5. materials item material led chip algainp wire gold lead frame copper alloy/ni/ag plating encapsulation silicone resin heat-resistant polymer ppa 6. taping 6.1. tape (material : ps conductive, 10 4 ~10 5 ? ) (unit : mm) cathode anode 6/14 6.2. wheel (color : black) - quantity per reel lyh : 2,000pcs 6.3. label part no. size (l x w) : 85mm 50mm w d rank i v rank v f rank LYH1032 a - m - 3 2 , 000ea (unit : mm) 7/14 7. packing ? the leds are packed in cardboard boxes after taping. the label shows part number, lot number, rank, and quantity. ? in order to protect the leds from mechanical shock, they are packed with cardboard boxes for transportation. ? the leds may be damaged if the boxes are drop ped or receive a strong impact against them, so cautions must be taken to prevent any possible damage. ? the boxes are not water-resistant and, ther efore, must be kept away from water and moisture. ? when the leds are transported, it is recommended that the same packing method as luxpia's is used. ? if noticeable damage on a box appears upon ar rival at the user?s warehouse, the user should submit a claim to luxpia within one week after arrival of the products. 8/14 8. reliability 8.1. test items and results no. test item test conditions note number of damaged sample 1 resistance to soldering heat (reflow) t sld =260 o c, 10sec (pre treatment 60 o c,90%,24hrs) 2 times 0/45 2 solderability (reflow) t sld =2155 o c, 3sec 1 time over 95% 0/45 3 temperature cycle -40 o c through +25 o c to +100 ? (30min/5min/30min) 100 cycles 0/45 4 high temperature storage t a =100 ? 1000 hrs 0/45 5 high humidity and temperature storage t a =60 , rh=90% ? 1000 hrs 0/45 6 low temperature storage t a =-40 ? 1000 hrs 0/45 7 steady-state operating lifetime test t a =25 , i ? f =60ma 500 hrs 0/45 8 steady-state operating lifetime of high temperature t a =85 , i ? f =15ma 1000 hrs 0/45 9 steady-state operating lifetime of high humidity and temperature t a =60 , rh=90%, ? i f =40ma 500 hrs 0/45 10 steady-state operating lifetime of low temperature t a =-30 , i ? f =40ma 1000 hrs 0/45 * led with luxpia standard circuit board 9/14 8.2. criteria for judging the damage item symbol test condition criteria for judgement min max forward voltage v f i f = 40ma - u.s.l. 5) 1.1 luminous intensity i v i f = 40ma l.s.l. 6) 0.7 - 5) u.s.l. : upper standard level 6) l.s.l. : lower standard level 9. cautions white leds are devices which are materialized by combining blue leds and special phosphors. consequently, the color of white leds is subject to change a little by an operating current. care should be taken after due co nsideration when using leds. (1) moisture-proof package ? when moisture is absorbed into the smt package it may vaporize and expand products during soldering. there is a possibility that this may ca use exfoliation of the cont acts and damage to the optical characteristics of the leds. for this reason, the moisture-proof package is used to keep moisture to a minimum in the package. ? a package of a moisture-absorbent material (silica gel) is inserted into the shielding bag. the silica gel changes its color from yellow to green as it absorbs moisture. (2) storage ? storage conditions - after opening the package : the leds should be kept at 5 ~40 or less and 30%rh or less. the leds should be used within ? ? a year. when storing the leds, moisture-proof pack aging with moisture-absorbent material (silica gel) is recommended. if unused leds remain, they should be stored in moisture-proof packages, such as sealed containers with packages of moisture-a bsorbent material (silica gel). it is also recommended to return the leds to the original moisture-proof bag and to reseal the moisture- proof bag again. ? if the moisture-absorbent mate rial (silica gel) has faded away or the leds have exceeded the recommended storage time, baking treatment should be performed using th e following conditions. - baking treatment : led bulk: more than 12 hours at 1255 ? led reel: more than 24 hours at 605 ? ? luxpia's led electrode sections are comprised of a silver-plated copper alloy. the silver surface may be affected by environments which contain co rrosive gases and so on. please avoid condition which may cause difficulty during soldering operat ions. it is recommended that the user use the leds as soon as possible. ? please avoid rapid transitions in ambient temper ature, especially in high humidity environments 10/14 where condensation can occur. (3) heat generation ? thermal design of the end product is of paramount importance. please consider the heat generation of the led when the system is designed. the coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of led placement on the board, as well as other components. it is necessary to avoid intense heat generation and operate within the maximum ratings given in the specification. ? the operating current should be decided after considering the ambient maximum temperature of leds. (4) soldering conditions ? the leds can be soldered in place using the reflow soldering method. luxpia does not make any guarantee on the leds after they have been assembled using the dip soldering method. ? recommended soldering conditions reflow soldering hand soldering pre-heat pre-heat time peak temperature soldering time condition lead solder lead-free solder temperature soldering time 350 ? max 3sec max (one time only) 120~150 ? 120sec max 240 ? max 10sec max refer to profile y 180~200 ? 120sec max 260 ? max 5sec max refer to profile t * after reflow soldering, rapid cooling should be avoided. [temperature-profile (surface of circuit board)] use the conditions shown to the following figures. < y : lead solder> < t : lead-free solder> 5 j n f < |