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sml-p1 series picoled tm l features l outline ? ultra compact, thin size 1.00.6mm ? ? lead free/rohs compliant. l size 1006 (0402) 1.00.6mm (t=0.2mm) l dimensions l recommended solder pattern l specifications typ. i f max. v r min.* 2 typ. max.* 2 i f min. typ. i f (v) (ma) ( m a) (v) (nm) (nm) (nm) (ma) (mcd) (mcd) (ma) sml-p12vt(r) 625 630 635 25 60 sml-p12ut(r) 615 620 625 40 85 sml-p12dt(r) 602 605 608 63 sml-p12yt(r) 587 590 593 40 sml-p12mt(r) 569 572 575 10 25 sml-p12pt(r) 557 560 563 2.5 6.3 smlp13ec8t 3.0 520 527 535 56 (110) smlp13bc8t 465 470 475 9.0 (25) scmp13wbc8w 90 150 * 1 : duty 1/10, 1khz * 2 : reference l thermal resistance conditions
* the above value is a result of actual measurement performed on randomly selected product. the value does not have any meanings of guarantee. *picoled tm is rohm's pending trademark. 4 5 20 5 5 (x, y) (0.30, 0.30) 20 100 54 2.0 2.1 2.2 33 2.9 5 - 40 to + 85 - 40 to + 100 20 5 100 tstg(oc) aigainp on gaas ingan 20 10 100* 1 50* 1 50 52 blue white red orange yellow yellowish green green original device technology enables high brightness and high reliability part no. bluish green 34 chip structure absolute maximum ratings (ta=25oc) i fp (ma) v r (v) topr(oc) power forward current p d (mw) i f (ma) dissipation operating temp. color emitting current peak forward electrical and optical characteristics (ta=25oc) voltage reverse forward voltag v f reverse current i r dominant wavelength l d luminous intensity i v storage temp. (unit : mm) tolerance : 0.05 (unit : mm) color type v u d y m p e b wb 1006 (0402) 1.0 0.6mm (t=0.2mm) 1/10 2014.07 - rev.e data sheet www.rohm.com ? 2014 rohm co., ltd. all rights reserved. mv md 643oc/w 899oc/w glass epoxy circuit board 30100.8mmt 1.5mm 2 (cathode) circuit board circuit board dimensions pad size
sml-p1 series l electrical characteristics curves 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 - 40 - 30 - 20 - 10 0 10 20 30 40 50 60 70 80 90 100 fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] sml - p12vt(r) sml - p12ut(r) sml - p12dt(r) sml - p12yt(r) sml - p12mt(r) sml - p12pt(r) ta=25 oc fig.3 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.4 luminous intensity - forward current relative luminous intensity forward current : i f [ma] sml - p12vt(r) sml - p12ut(r) sml - p12dt(r) sml - p12yt(r) sml - p12mt(r) sml - p12pt(r) sml - p12vt(r) sml - p12ut(r) sml - p12dt(r) sml - p12yt(r) sml - p12mt(r) sml - p12pt(r) ta=25 oc i f = 20ma atmosphere temperature : ta [oc] fig.2 forward voltage - atmosphere temperature forward voltage : v f [v] * please take this data as a reference data for the samples are measured randomly. i f = 20ma sml - p12vt(r) sml - p12ut(r) sml - p12dt(r) sml - p12yt(r) sml - p12mt(r) sml - p12pt(r) 2/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-p1 series l electrical characteristics curves fig.5 derating maximum forward current : [ma] ambient temperature : ta [oc] sml - p12vt(r) sml - p12ut(r) sml - p12dt(r) sml - p12yt(r) sml - p12mt(r) sml - p12pt(r) 3/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-p1 series l electrical characteristics curves 2.8 2.9 3.0 3.1 - 40 - 30 - 20 - 10 0 10 20 30 40 50 60 70 80 90 100 2.7 2.8 2.9 3.0 3.1 - 40 - 30 - 20 - 10 0 10 20 30 40 50 60 70 80 90 100 fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] ta=25 oc smlp13ec8t smlp13bc8t scmp13wbc8w fig.2 - 1 forward voltage - atmosphere temperature (p13bc8t, p13wbc8w) forward voltage : v f [v] atmosphere temperature : ta [oc] fig.2 - 2 forward voltages - atmosphere temperature (p13ec8t) forward voltage : v f [v] atmosphere temperature : ta [oc] i f = 5ma * please take this data as a reference data for the samples are measured randomly. * please take this data as a reference data for the samples are measured randomly. smlp13bc8t scmp13wbc8w smlp13ec8t i f = 5ma 4/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-p1 series l electrical characteristics curves fig.3 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.4 luminous intensity - forward current relative luminous intensity forward current : i f [ma] fig.5 derating maximum forward current : [ma] ambient temperature : ta [oc] ta=25 oc i f = 20ma smlp13ec8t smlp13bc8t scmp13wbc8w smlp13ec8t smlp13bc8t scmp13wbc8w smlp13ec8t smlp13bc8t scmp13wbc8w 5/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-p1 series l spectrum data * please take this data as a reference data for the samples are measured randomly. * the data is relativized for each color. it is not to show the spectrum peaks are equal. l viewing angle 0 0.2 0.4 0.6 0.8 1 380 480 580 680 780 0.0 0.2 0.4 0.6 0.8 1.0 380 480 580 680 780 intensity [a.u.] wavelength [nm] intensity [a.u.] wavelength [nm] i f = 5ma scanning angle (deg) relative intensity scanning angle (deg) relative intensity sml - p12vt(r) sml - p12ut(r) sml - p12dt(r) sml - p12yt(r) sml - p12mt(r) sml - p12pt(r) scanning angle (deg) relative intensity scanning angle (deg) relative intensity smlp13ec8t smlp13bc8t scmp13wbc8w i f = 20ma sml - p12vt(r) sml - p12ut(r) sml - p12dt(r) sml - p12yt(r) sml - p12mt(r) sml - p12pt(r) smlp13bc8t 6/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-p1 series l rank reference of brightness red(v,u) (ta=25oc, i f 20ma) g h j k l m n p q r s t u v w x 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 sml-p12vt sml-p12ut orange(d) (ta=25oc, i f 20ma) g h j k l m n p q r s t u v w x 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 sml-p12dt yellow(y) (ta=25oc, i f 20ma) g h j k l m n p q r s t u v w x 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 sml-p12yt green(m,p) (ta=25oc, i f 20ma) g h j k l m n p q r s t u v w x 1.0 to 1.6 1.6 to 2.5 2.5 to 4.0 4.0 to 6.3 6.3 to 10 10 to 16 16 to 25 25 to 40 40 to 63 63 to 100 100 to 160 160 to 250 250 to 400 400 to 630 630 to 1000 1000 to 1600 sml-p12mt sml-p12pt bluish green(e) (ta=25oc, i f 5ma) g h j k l m n p q r s t u v w 0.9 to 1.4 1.4 to 2.2 2.2 to 3.6 3.6 to 5.6 5.6 to 9.0 9 to 14 14 to 22 22 to 36 36 to 56 56 to 90 90 to 140 140 to 220 220 to 360 360 to 560 560 to 900 blue(b) (ta=25oc, i f 5ma) g h j k l m n p q r s t u v w 0.9 to 1.4 1.4 to 2.2 2.2 to 3.6 3.6 to 5.6 5.6 to 9.0 9 to 14 14 to 22 22 to 36 36 to 56 56 to 90 90 to 140 140 to 220 220 to 360 360 to 560 560 to 900 white(wb) (ta=25oc, i f 5ma) n p q r s t u v w 14 to 22 22 to 36 36 to 56 56 to 90 90 to 140 140 to 220 220 to 360 360 to 560 560 to 900 l chromaticity diagram [chromaticity coordimates] (ta=25oc, i f 5ma) measurement tolerance : ? 0.02 rank iv (mcd) rank smlp13bc8t rank iv (mcd) smlp13ec8t rank iv (mcd) iv (mcd) rank iv (mcd) iv (mcd) rank scmp13wbc8w rank iv (mcd) cie y cie x a h f k 7/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet x y x y x y x y 0.28 0.248 0.283 0.305 0.287 0.295 0.304 0.33 0.296 0.276 0.304 0.33 0.307 0.315 0.33 0.36 0.283 0.305 0.307 0.315 0.311 0.294 0.33 0.318 0.264 0.267 0.287 0.295 0.296 0.276 0.311 0.294 a f h k
sml-p1 series l taping l part no. construction l packing specification rohm led products are being shipped with desiccant (silica gel) concluded in moisture-proof bags. pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request.
please contact the nearest sales office or distributer if necessary. (unit : mm) pulling direction packaging quantity enlarged drawing of ? a (note ) tolerance is ? 0.1mm, unless otherwise specified. 8/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet a 4? 0 (y - 1 . 5 + 0 . 1 0 2 . 0 0 s 0 . 0 5 - 1 3 1 1 . 4 s 1 3 . 5 0 s 0 . 0 5 0 >| 0 . 5 0 8 . 0 0 5 . 5 0 4 . 0 0 s 0 . 1 a 1 . 1 0 s 0 . 0 5 1 . 7 5 s 0 . 1 - 1 8 0 0 - 3 s 0 . 0 5 0 . 7 0 - 6 0 + 1 0 0 . 2 8 + 0 . 0 5 - 0 . 0 3
sml-p1 series l attention points in handling this product was developed as a surface mount led especially suitable for reflow soldering. please take care of following points when using this device. 1.designing of pcb as for a recommendable solder pattern, please refer to fig recommended solder pattern. the size and direction of the pad pattern depend on the condition of the pcb. this product of structured with rear/bottom electrode to be soldered. the formation of solder fillet is not guaranteed due to its electrode shape additional notification of mounting : we recommend additional facility of mounting machine due to small size package
which might be haven electrification, and product might be moved in the taping pocket.
and the mounting production efficiency will be decreased. ex) magnet facility etc. 2.soldering (sn-cu, sn-ag-cu, sn-ag-bi-cu) led products do not contain reinforcement materials such as glass fillers. therefore, thermal stress by soldering greatly influences its reliability. the temperature conditions for reflow soldering should therefore be set up according to the characteristic of this product. (see fig-1) number of reflow process shall be max 2 times and these processes shall be performed in a row. cooling process to normal temperature shall be required between the first and the second soldering process. soldering operation 1) solder used
sn-cu, sn-ag-cu, sn-ag-bi-cu 2) soldering condition led products do not contain reinforcement material such as a glass fillers. so thermal stress by soldering greatly influence its reliability. please keep following points for manual soldering. a) less than 30w, top of iron less than 3mm. condition) temp. of iron top less than 400oc within 3 sec. heating on pcb pattern, not direct to the led. (fig-2) please handle after the part temp. goes down to room temp. 3.handling after mounting (fig.-3) as shown in the drawing on the right, in case outside force of about 700g is given to the device, stress is concentrated to the jointed part between mold resin and substrate. therefore there is a possibility to breath the device or pcb. careful handing is needed as rohm cannot guarantee the falling of the device by outside force after mounting. handling after soldering c) recommended condition item soldering iron b) heating method soldering iron soldering land (fig - 2) 0 50 100 150 200 250 300 mask open area ratio 80% mask thickness 80 to 100 m m reference min.1 min max. max.260 oc, within 140 to 180 oc 23 0 to 260 oc (fig - 1) 9/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
sml-p1 series 4.washing please note the following points when washing is required after soldering. 4-1) washing solvent isopropyl alcohol or other alcohol solvent is recommendable. 4-2) temperature below 30oc, immersion time ; within 3 minutes. 4-3) ultra sonic washing below 15w/1 litter of solvent tub or less. 4-4) cooling below 100oc within 3 minutes. 5.erosion gas utilization in erosion gas atmosphere may degenerate the plating surface which might cause deterioration of solder strength, optical characteristics, or functions. please take precautions against occurrence of gas from the surrounding parts on the occasion of custody, and also after mounted on circuit board. 6.storage at reflow soldering, the reliability of this product is often influenced by moisture absorption so we apply the packaging with moisture proof for better condition is use, please also note that 6-1) not to be opened before using. 6-2) to be kept in our moisture proof packaging with some desiccant (silica gel) after opening it. to be baked in case the silica gel indicator its color from either blue to clear or green to pink. 6-3) please use within 168 hours after the package was opened. (condition at 30oc, max.70%rh.) in case it is not used within 168 hours, please put it back into our packaging. 6-4) baking please bake under reel condition at 60oc, 1 to 224 hours (max.20%rh) after un-sealing. while baking is done, the reel and emboss tape may be easily deformed. please be careful not to give any stress. 7.life time blue led die used in this product will cause reduction of luminous intensity due to epoxy resin discoloration depending on the using conditions and environmental. please inquire our sales contact if long life time is required on your application. 10/10 2014.07 - rev.e www.rohm.com ? 2014 rohm co., ltd. all rights reserved. data sheet
r1 102 a www .rohm.com ? 2014 rohm co., ltd. all rights reserved. notice rohm c u stomer support sys tem h ttp://w w w . r ohm .com/con tact/ thank you for your accessing to rohm pr oduct informations. mor e detail pr oduct informations and catalogs ar e available, please contact us. notes the inf or mation contained herein is subject to change without notic e . bef ore y ou use our p r o d u c t s , ple a s e c o n t a c t o u r s a l e s r e p r e s e n t a t i v e and v e r i f y the l a test specifica- tions : althoug h r o h m is c o n t i n uousl y w o r king t o impro ve p roduct r elia bility and quality , semicon- duc tors c an brea k do w n and mal f unction due to va r ious f actor s . the ref o r e , i n ord e r to p r e ve n t per sonal i n jur y or fire a r isin g f rom f a ilure , please tak e saf ety meas ure s suc h a s c o m plying wit h the der ating cha r a cte r istics , imple menting redundant and f ire p r e ve nti o n d e s i g n s , and u tilizing bac k ups a nd f ail- saf e p rocedures . r o hm shall h a ve no responsibility f or an y damages ar ising out of the use of our p oducts beyond the r ating specified b y r ohm. examples of application circuits , circuit constants and an y other inf or mation contained herein are pro vided only to illustr ate the standard usage and oper ations of the products . the per iphe r al conditions m ust be tak en into account when designing circuits f or mass production. the technical inf or mation specified herein is intended only to sho w the typical functions of and e xamples of application circuits f or the products . r ohm does not grant y ou, e xplicitly or implicitl y , an y license to use or e x ercise intellectual prope r ty or other r ights held b y r ohm or an y other par ties . r ohm shall ha v e no responsibility whatsoe v er f or an y dispute ar ising out of the use of such technical in f or mation. the products are intended f or use in gene r al electronic equipment (i.e . a v/o a de vices , comm uni- cation, consumer systems , gaming/ente r tainment sets) as w ell as the applications indicated in this document. the products specified in this document are not designed to be r adiation tole r ant. f or use of our products in applications requi r ing a high deg ree of reliability (as exemplified bel o w), please contact and consult with a r ohm representati v e : tr anspo r tation equipment (i.e . cars , ships , tr ains), pr imar y comm unication equipment, tr affic lights , fire/cr ime pre v ention, saf ety equipment, medical system s , ser v ers , solar cells , and po w er tr ansmission system s . do not use our products in applications requir ing e xtremely high reliabilit y , such as aerospace equipment, n uclear p o w er control systems , and submar ine repeater s . r ohm shall ha v e no responsibility f or an y damages or inju r y ar ising from non-compliance with the recommended usage conditions and specifications contained herein. r ohm has used reasona b le care to ensur the accur acy of the inf or mation contained in this document . ho w e v er , r ohm does not w arr ants that such inf or mation is error-free , and r ohm shall ha v e no responsibility f or an y damages ar ising from an y inaccu r acy or mispr int of such inf or mation. please use the products in accordance with an y applica b le en vironmental la ws and regulation s , such as the rohs directiv e . f or more details , including rohs compatibilit y , please contact a r ohm sales office . r ohm shall ha v e no responsibility f or an y damages or losses resulting non-compliance with a n y applica b le la ws or regulation s . when pro viding our products and technologies contained in this document to other countr ies , y ou m ust abide b y the procedures and pro visions stipulated in all applica b le e xpor t la ws and regulation s , including without limitation the us expor t administr ation regulations and the f oreign exchange and f oreign t r ade act. this document, in par t or in whol e , ma y not be repr inted or reproduced without pr ior consent of r ohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14)

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