ta - i technology inc. approval specification sheet for ta - i light bar document no tai01 2 a issued date 2012/ 08 / 22 page 1 / 4 ta - i technology co., ltd led circuit board approval specification sheet for ta - i light bar ta - i technology part number: l c b 0 8 aptai01 2 a customer approval: valid date release date version aug 22 , 2012 aug 22 , 2012 tai 0 1 2 a approved by checked by produced by n0.26, lane 470, nan - shan rd., sec.2,lu - chu hsiang, taoyuan, taiwan, r. o. c. tel
ta - i technology inc. approval specification sheet for ta - i light bar document no tai01 2 a issued date 2012/ 08 / 22 page 2 / 4 ta - i technology co., ltd 1. specification 1.1 substrate dimension as shown in table 1. table 1: the spec of panel and single unit item spec single unit length 90 0. 1 width 6 0.0 5 thickness of substrate 1 0. 1 the total thickness 1.0 3 0.0 6 unit: mm 1 .2 specification of panel:
ta - i technology inc. approval specification sheet for ta - i light bar document no tai01 2 a issued date 2012/ 08 / 22 page 3 / 4 ta - i technology co., ltd 2 . criteria of visual inspection: 2 .1 visual inspection 2 . 2 test items are shown as below table. 2 . 3 tool: ccd om 15x 2 .4 definition of test areas: 3. coating thickness test specification: 3 .1 using tools conductive paste thickness : 3 axis microscope solder mask thickness : 3 axis microscope 3 .2 measurement position: conductive paste thickness : position 1 solder mask thickness : position 2 3 .3 inspect spec: (t h ree times average of measurement) conductive paste thickness : >10 u m solder mask thickness : 20 10 um no. item examine area specification schematic diagram 1 a)depression b)silver point c)protrusion d)foreign materials e)contaminants single unit of front side ng if >/= 2 mm 2 pattern inspection pattern of front side the finish pattern shall per original drawing (above 95%). 1 2
ta - i technology inc. approval specification sheet for ta - i light bar document no tai01 2 a issued date 2012/ 08 / 22 page 4 / 4 ta - i technology co., ltd 4 . reliability test no. item parameter specification 1 solderability 1. temp. 2 35 5 2. time 51sec 3. solder bath composition ( ag/sn/cu=3/96.5/ 0.5%) ? coverage 90% 2 adhesion test 1. temp. : rt 2. tool : 3m - 600 3. time : adhesive 30 seconds 4. angle : 180 ? the exterior must be no separate . 3 reflow 1. temp. 2 6 0 2. times 3 cycles ? no yellowing. 5 . notices (1)when inspection, packaging and handling: must wear gloves and masks when inspect products. must wear latex gloves before unpacking products must avoid vibration, shock and stress etc. when carry products. (2) storage conditions: store under 25 5 50%10rh when sealed. the expiration date is less than 3 months when sealed. store under 25 5 50%10rh when unsealed. please store unsealed package in airtight containers and used up within 3 days. (3)before wire bonding please clean and preheat before wire bonding.
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