this is information on a product in full production. november 2013 docid024889 rev 1 1/10 ferd40m45c field effect rectifier datasheet - production data features ? st advanced rectifier process ? stable leakage current over reverse voltage ? low forward voltage drop ? high frequency operation description this dual rectifier is based on a proprietary technology that achieves the best in class v f /i r for a given silicon surface. packaged in to-220ab, and d 2 pak, this device is intended to be used in switch mode power supplies, or automo tive applications k a2 a1 a1 a2 k k a1 k a2 d 2 pak ferd40m45cg to-220ab ferd40m45ct table 1. device summary i f(av) 2 x 20 a v rrm 45 v v f (typ) 0.34 v www.st.com
characteristics ferd40m45c 2/10 docid024889 rev 1 1 characteristics when the diodes 1 and 2 are used simultaneously: ? t j (diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode2) x r th(c) . to evaluate the conduction loss es use the following equation: p = 0.31 x i f(av) + 0.0095 i f 2 (rms) table 2. absolute ratings (limiting values, per diode at 25 c, unless otherwise stated) symbol parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) forward rms current 40 a i f(av) average forward current, ? = 0.5 t c =150 c t c =140 c per diode per device 20 40 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 275 a t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) to-220ab, d 2 pak 175 c d 2 pak (dc forward current without reverse bias, t = 1 hour) 200 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? ?? ------------------------- - ? table 3. thermal resistances symbol parameter value unit r th (j-c) junction to case per diode to ta l 1.6 1.1 c/w r th(c) coupling 0.5 c/w table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 650 a t j = 125 c 25 50 ma v f (2) forward voltage drop t j = 25 c i f = 10 a 0.38 0.415 v t j = 125 c 0.34 0.37 t j = 25 c i f = 20 a 0.46 0.50 t j = 125 c 0.46 0.50 1. pulse test: t p = 5 ms, ? < 2% 2. pulse test: t p = 380 s, ? < 2%
docid024889 rev 1 3/10 ferd40m45c characteristics 10 figure 1. average forward power dissipation versus average forward current (per diode) figure 2. average forward current versus ambient temperature ( ? = 0.5, per diode) 0 2 4 6 8 10 12 14 16 0 5 10 15 20 25 30 = 1 = 0.5 = 0.2 = 0.1 = 0.05 t =tp/t tp p f(av) (w) i f(av) (a) 0 5 10 15 20 25 0 25 50 75 100 125 150 175 r th(j-a) =r th(j-c) t =tp/t tp i f(av) (a) t amb (c) figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. reverse leakage current versus reverse voltage applied (typical values, per diode) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t p (s) z th(j-c) /r th(j-c) 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 45 t j =125c t j =25c i r (ma) v r (v) figure 5. junction capacitance versus reverse voltage applied (typical values, per diode) figure 6. forward voltage drop versus forward current (typical values, per diode) c (pf) 100 1000 10000 1 10 100 f=1mhz v osc =30mv rms t j =25c v r (v) 0.1 1.0 10.0 100.0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 t j =25c t j =125c i f (a) v f (v)
characteristics ferd40m45c 4/10 docid024889 rev 1 figure 7. thermal resistance junction to ambient versus copper surface under tab (typical values) r th(j-a) (c/w) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 d2pak epoxy printed circuit board fr4, copper thickness: 35 m s (cu) (cm2)
docid024889 rev 1 5/10 ferd40m45c package information 10 2 package information ? epoxy meets ul94,v0 ? cooling method: by conduction (c) ? recommended torque value: 0.4 to 0.6 nm (to-220ab) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. to-220ab dimension definitions a f d1 j1 h1 ? p q d l1 l b e e1 e l20 l30 b1 c resin gate 0.5 mm max. protrusion (1) resin gate 0.5 mm max. protrusion (1) (1) resin gate position accepted in each of the two position shown as well as the symmetrical opposites
package information ferd40m45c 6/10 docid024889 rev 1 table 5. to-220ab dimension values ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.17 0.18 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.027 d 15.25 15.75 0.60 0.62 d1 1.27 typ. 0.05 typ. e 10 10.40 0.39 0.41 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.19 0.20 f 1.23 1.32 0.048 0.052 h1 6.20 6.60 0.24 0.26 j1 2.40 2.72 0.094 0.107 l13 14 0.510.55 l1 3.50 3.93 0.137 0.154 l20 16.40 typ. 0.64 typ. l30 28.90 typ. 1.13 typ. ? p 3.75 3.85 0.147 0.151 q 2.65 2.95 0.104 0.116
docid024889 rev 1 7/10 ferd40m45c package information 10 figure 9. d 2 pak dimension definitions table 6. d 2 pak dimension values ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.30 1.75 0.051 0.069 m 2.29 2.79 0.090 0.110 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2mm a c2 d r a2 m v2 c a1 *
package information ferd40m45c 8/10 docid024889 rev 1 figure 10. d 2 pak footprint (dimensions in mm) 16.90 12.2 9.75 3.50 5.08 1.60 2.54
docid024889 rev 1 9/10 ferd40m45c ordering information 10 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode ferd40m45ct ferd40m45ct to-220ab 2.2 g 50 tube FERD40M45CG-TR ferd40m45cg d 2 pak 1.8 g 500 tape and reel table 8. document revision history date revision description of changes 13-nov-2013 1 initial release
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