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data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 1 general description the AUR9716 is a high efficiency step-down dc-dc voltage converter. the chip operation is optimized by peak-current mode architecture with built-in synchronous power mos switchers. it is automatically switching between the normal pwm mode and ldo mode to offer improved system power efficiency covering a wide range of loading conditions. switching frequency during 1.0mhz to 1.4mhz is set by an external resistor and integrated soft-start (ss), under-voltage-lock-out (uvlo), thermal shutdown detection (tsd) and shor t circuit protection are designed to provide reliable product applications. the device is available in adjustable output voltage versions ranging from 0.8v to v in when input voltage range is from 2.5v to 5.5v , and is able to deliver up to 2a. the AUR9716 is available in dfn-33-8 package. features ? high efficiency buck power converter ? low quiescent current ? 2a output current ? low r ds(on) internal switches: 110m ? ? adjustable output voltage from 0.8v to v in ? wide operating voltage range: 2.5v to 5.5v ? built-in power switches for synchronous rectification with high efficiency ? 800mv feedback voltage allows output ? programmable frequency: 1.0mhz to 1.4mhz ? thermal shutdown protection ? low drop-out operation at 100% duty cycle ? no schottky diode required applications ? lcd tv ? post dc-dc voltage regulation ? pda and notebook computers figure 1. package type of AUR9716 dfn-33-8
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 2 pin configuration d package (dfn-33-8) figure 2. pin configuration of AUR9716 (top view) pin description pin number pin name function 1 comp compensation point. comp is used to compensate the regulation control loop. connect r and c from comp and gnd to compensate the regulation control loop 2 gnd ground. the exposed pad is soldered to pcb and connected to gnd plant for good power dissipation 3 en enable input. en is an input when the regulator on or off. when left unconnected, en pin is pulled to vdd by the internal pull up resistor 4 vdd power input v in provides the input power to the regulator. connecting a ceramic bypass capacitor between vdd and gnd to eliminate input noise and ripple voltage 5 6 sw switch output. sw is the switching point which supplies voltage and current to output 7 f_adj oscillator resistor input. connecting a resistor to ground from this pin sets the switching frequency 8 fb feedback input. receives the feedb ack voltage from a resistive divider connected across the output. the fee dback reference voltage is 0.8v typically
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 3 functional block diagram over-current comparator bias generator saw-tooth generator oscillator soft start bandgap reference current sensing control logic buffer & dead time control logic + reverse inductor current comparator over voltage comparator modulator error amplifier - + - + - + - + vdd gnd en fb sw comp f_adj 1 2 3 4 5, 6 7 8 figure 3. functional block diagram of AUR9716 ordering information AUR9716 circuit type a: adjustable output package temperature range part number marking id packing type dfn-33-8 -40 to 80c AUR9716agd 9716a tape & reel bcd semiconductor's pb-free products, as designated with "g" in the part number, are rohs compliant and green. package d: dfn-33-8 g: green
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 4 absolute maximum ratings (note 1) parameter symbol value unit supply input voltage v in -0.3 to 6.0 v sw pin switch voltage v sw -0.3 to v in +0.3 v output voltage v en -0.3 to v in +0.3 v p-mosfet switch source current i sw-p 3.5 a n-mosfet switch sink current i sw-n 3.5 a power dissipation (on pcb, t a =25c) p d 2.56 w package thermal resistance (junction to ambient) ja 39.13 c/w package thermal resistance (junction to case) jc 3.39 c/w lead temperature (soldering, 5sec) t lead 260 c junction temperature t j 150 c operating temperature range t op -40 to 85 c storage temperature range t stg -55 to 150 c esd (human body model) v hbm 2000 v esd (machine model) v mm 200 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. recommended operating conditions parameter symbol min max unit supply input voltage v in 2.5 5.5 v junction temperature range t j -20 125 c operating temperature range t a -40 80 c
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 5 electrical characteristics v in =5v, v fb =0.8v, f osc =1.4mhz, l=1.5h, c in =10f, c out =10f, t a =25c, unless otherwise specified. parameter symbol test condition min typ max unit input voltage range v in 2.5 5.5 v shutdown current i off v en =0v 0.1 1 a active current i on v fb =0.95v 460 a regulated feedback voltage v fb for adjustable output voltage 0.784 0.8 0.816 v regulated output voltage ? v out /v out v in =2.5v to 5.5v, i out =0a to 2a -3 3 % peak induct or current i pk v fb =0.7v 2.2 3.2 3.7 a r osc =5.1m ? 1.12 1.4 1.68 oscillator frequency f osc adjustable switching frequency 1.0 1.4 mhz p_mosfet r on r dson(p) i sw =0.5a 90 110 130 m ? n_mosfet r on r dson(n) i sw =0.5a 90 110 130 m ? en input high-threshold voltage v enh enable threshold 1.5 v en input low-threshold voltage v enl shutdown threshold 0.4 v en input current i en 2 a soft-start time t ss 800 s maximum duty cycle d max 100 % v in rising 2.4 v in falling 2.3 under voltage lock out threshold v uvlo hysteresis 0.1 v thermal shutdown t sd hysteresis=30c 150 c error amplifier trans conductance g m 3000 s current sense trans resistance r t 5 ?
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 6 output voltage vs. output current (vout=3.3v, sw=1.4mhz) 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 0.02 0.05 0.10 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 output current (a) output voltage (v) vin=5.5v vin=5.0v vin=4.5v typical performance characteristics output current vs. efficiency (vout=3.3v, sw=1.4mhz) 40 50 60 70 80 90 100 0.02 0.05 0.10 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 output current (a) efficiency (%) vin=5.5v vin=5.0v vin=4.5v figure 4. output current vs.efficiency figure 5. output voltage vs. output current output current vs. efficiency (vout=3.3v, sw=1.2mhz) 40 50 60 70 80 90 100 0.02 0.05 0.10 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 output current (a) efficiency (%) vin=5.5v vin=5.0v vin=4.5v figure 6. output current vs.efficiency figure 7. output voltage vs. output current output current vs. efficiency (vout=3.3v, sw=1.0mhz) 50 55 60 65 70 75 80 85 90 95 100 0.02 0.05 0.10 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 output current (a) efficiency (%) vin=5.5v vin=5.0v vin=4.5v figure 8. output current vs.efficiency figure 9. output voltage vs. output current output voltage vs. output current (vout=3.3v, sw=1.2mhz) 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 0.02 0.05 0.10 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 output current (a) output voltage (v) vin=5.5v vin=5.0v vin=4.5v output voltage vs. output current (vout=3.3v, sw=1.0mhz) 3.20 3.22 3.24 3.26 3.28 3.30 3.32 3.34 3.36 3.38 3.40 0.02 0.05 0.10 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 output current (a) output voltage (v) vin=5.5v vin=5.0v vin=4.5v
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 7 typical performance characteristics (continued) input voltage vs. shut down current (vout=3.3v, sw=1.4mhz) 3.60 3.80 4.00 4.20 4.40 4.60 4.80 5.00 5.20 5.40 5.60 5.80 6.00 5.5 5.0 4.5 input voltage (v) shut down current (ua ) figure 10. input voltage vs. shutdown current figure 11. input voltage vs. quiescent current figure 12. input voltage vs. p_mosfet r ds figure 13. input voltage vs. n_mosfet r ds figure 14. load regulation (v in =5v, v out =1.1v, f osc =1.4mhz, i out =0.1a to 2a) input voltage vs. quiescent current (sw=1.4mhz) 300 350 400 450 500 550 600 650 700 5.55.04.54.03.63.53.02.5 input voltage (v) quiescent current (ua) input voltage vs. p_mosfet rds 100 110 120 130 140 150 5.5 5.0 4.5 4.0 3.5 3.0 2.5 input voltage (v) p_mosfet rds (m ohm) input voltage vs. n_mosfet rds 80 90 100 110 120 130 5.5 5.0 4.5 4.0 3.5 3.0 2.5 input voltage (v) n_mosfet rds (m ohm) figure 15. load regulation (v in =5v, v out =1.1v, f osc =1.2mhz, i out =0.1a to 2a)
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) figure 16. load regulation (v in =5v, v out =1.1v, f osc =1.0mhz, i out =0.1a to 2a) figure 17. power start-up (v in =0v to 5v, v out =3.3v, f osc =1.4mhz, i out =2a) figure 18. power start-up (v in =0v to 5v, v out =3.3v, f osc =1.2mhz, i out =2a) figure 19. power start-up (v in =0v to 5v, v out =3.3v, f osc =1.0mhz, i out =2a) figure 20. power turn-off (v in =5v to 0v, v out =3.3v, f osc =1.4mhz, i out =2a) figure 21. power turn-off (v in =5v to 0v, v out =3.3v, f osc =1.2mhz, i out =2a)
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 9 typical performance characteristics (continued) figure 22. power turn-off (v in =5v to 0v, v out =3.3v, f osc =1.0mhz, i out =2a)
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 10 application information the AUR9716 is a synchronous buck converter which can support switching frequency range from 1.0mhz to 1.4mhz and the output current can be up to 2a. the basic AUR9716 application circuits are shown as figure 27, external components selection is determined by the load current and is critical with the selection of inductor and capacitor values. 1. inductor selection for most applications, the value of inductor is chosen based on the required ripple current with the range of 1.5h to 4.7h. ) 1 ( 1 in out out l v v v l f i ? = ? the largest ripple current occurs at the highest input voltage. having a small ripple current reduces the esr loss in the output capacitor and improves the efficiency. the highest efficiency is realized at low operating frequency with small ripple current. however, the larger value inductors will be required. a reasonable starting point for ripple current setting is max l i % i 40 = ? ? ? . for a maximum ripple current stays below a specified value, the inductor should be chosen according to the following equation: ] ) ( 1 ][ ) ( [ max v v max i f v l in out l out ? ? = the dc current rating of the inductor should be at least equal to the maximum output current plus half of the highest ripple current to prevent inductor core saturation. for better efficiency, the lower dc-resistance inductor should be selected. 2. capacitor selection the input capacitance, c in , is needed to filer the trapezoidal current at the source of the top mosfet. to prevent the large ripple voltage, a low esr input capacitor sized for the maximum rms current must be used. the maximum rm s capacitor current is given by: in out in out omax rms v v v v i i 2 1 )] ( [ ? = it indicates a maximum value at out in v 2 v = , where 2 out rms i i = . this simple worse-case condi- tion is commonly used for design because even significant deviations do not much relief. the selection of c out is determined by the equivalent series resistance (esr) that is required to minimize output voltage ripple and load step transients, as well as the amount of bulk capacitor that is necessary to ensure the control loop is stable. loop stability can be also checked by viewing the load step transient response as described in a latter section. the output ripple, out v ? , is determined by: ] 8 1 [ out l out c f esr i v + ? ? the output ripple is the highest at the maximum input voltage since l i ? increases with input voltage. 3. load transient a switching regulator typically takes several cycles to respond to the load curren t step. when a load step occurs, v out immediately shifts by an amount equal to ) esr i ( load ? , where esr is the equivalent series resistance of output capacitor. load i ? also begins to charge or discharge c out generating a feedback error signal used by the regulator to return v out to its steady-state value. during the recovery time, v out can be monitored for overshoot or ringing that would indicate a stability problem. 4. output voltage setting the output voltage of AUR9716 can be adjusted by a resistive divider according to the following formula: ) 1 ( 8 . 0 ) 1 ( 2 1 2 1 r r v r r v v fb out + = + = when v fb is the 0.8v feedback reference voltage, the resistive divider senses the fraction of the output voltage as shown in figure 23. figure 23. setting the output voltage
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 11 application information (continued) 5. slope compensation the slope compensation of AUR9716 provides stability in constant frequency construction by preventing oscillations at duty cycle more than 50%. it?s accomplished externally by adding a series of capacitor and resistor, as shown in figure 24. figure 24. stability compensation components the dc loop gain of the system is determined by the following equation: cs v out fb vdc g a i v a = , where a v is error amplifier voltage gain and g cs is current sense transconductance. the dominant pole p1 is due to c comp : comp v ea p c a g f 2 1 = , where ea g is error amplifier transconductance. the output pole p2 is due to c out : out out out p c v i f = 2 2 the zero z1 is due to c comp and r comp : comp comp z c r f 2 1 1 = if c comp2 is used, the third pole is due to r comp and c comp2 : 2 3 2 1 comp comp p c r f = then the cross over frequency often sets at 1/5 to 1/10 of the switching frequency. table 1 shows some calculated results based on stability compensation equations above. switching frequency (mhz) 1.4 1.2 1.0 r comp (k ? ) 4.3 4.3 3.6 c comp (nf) 1 1 1.5 l (h) 1.5 1.5 2.2 c out (f) 10 10 10 table 1. stability compensation components to optimize the components for stability compensation listed in table 1, we will introduce the selection value of r comp and c comp as detail as possible. 1. r comp : determine this resistor value according to the desired crossover frequency is f c , default as 1.4mhz. fb out cs ea c out comp v v g g f c r 2 = 2. c comp : determine this capacitor value according to the desired phase margin. we often choose this compensation. zero point below one forth of the crossover frequency to ensure the loop stability. c comp comp f r c 2 4 > 6. short-circuit protection when AUR9716 output node is shorted to gnd, as v fb drops under 0.4v, chip will enter soft-start to protect itself, when short circuit is removed, and v fb rises over 0.4v, the AUR9716 enters normal operation again. if AUR9716 reaches ocp threshold while short circuit, it will enter soft-start cycle until the current under ocp threshold. when AUR9716 is used to transfer v in =5v to v out =2.5v, shorting v out to gnd makes big current which enables scp protection. the waveform is shown in figure 25.
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 12 application information (continued) figure 25. scp protection 7. f_adj : r osc selection the AUR9716 can change switching frequency by choose different r osc , please refer to table 2. switching frequency (mhz) 1.4 1.2 1.0 r osc (k ? ) 5100 976 536 table 2. r osc setting due to get the better performance of AUR9716, f_adj pin pin 7 could parallel 47pf capacitor with r osc , shown in figure 26. figure 26. f_adj components 8. thermal characteristics the max power dissipation depends on the thermal resistance of ic package, pcb layout, the rate of temperature between junction to ambient. the max power dissipation can be calculated by following formula: ? ? ? ? ? ? ? ? ? = ja a max j max d t t p ) ( ) ( where t j(max) is the maximum operation junction temperature, t a is the ambient temperature and ja is the junction to ambient thermal resistance. 9. pc board layout considerations when laying out the printed circuit board, the following checklist should be used to optimize the performance of AUR9716. 1. the power traces, including the gnd trace, the sw trace and the vdd trace should be ke pt direct, short and wide. 2. to put the input capacitor as close as possible to the vdd and gnd pins. 3. the fb pin should be connected directly to the feedback resistor divider. 4. keep the switching node, sw, away from the sensitive fb pin and the node should be kept small area.
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 13 typical application figure 27. typical application circuit of AUR9716 (switching frequency=1.0mhz to 1.4mhz) v out (v) r1 (k ? ) r2 (k ? ) 3.3 6.25 2 2.5 4.25 2 1.8 2.5 2 1.1 0.75 2 switching frequency (mhz) r osc (k ? ) r comp (k ? ) c comp (nf) l (h) c out (f) 1.0 536 3.6 1.5 2.2 10 1.2 976 4.3 1.0 1.5 10 1.4 5100 4.3 1.0 1.5 10
data sheet 1.0mhz to 1.4mhz, 2a, step down dc-dc converter AUR9716 apr. 2012 rev. 1. 0 bcd semiconductor manufacturing limited 14 mechanical dimensions dfn-33-8 unit:mm(inch)
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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