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| i u u q x x x d j u j [ f o d p k q f o h m j t i d s z t u b m j o e f y i u n m 15 dimension [mm] solder pad layout [mm] g g g g g 5 0 1 3 5 4 5 3 3 $ - $ % - * 3 g g . ) [? . ) [ ' v o e b n f o u b m . ) [? g ? . ) [ / f f e u p d p o u b d u v t g p s u i f b w b j m b c m f g s f r v f o d z . b y . ) [? g ? . ) [ . b y . ) [? g ? . ) [ . b y . ) [? g ? . ) [ . b y at 25?c ?? ? at 25?c / f f e u p t q f d j g z z p v s s f r v j s f n f o u % $ 7? 7 ?? ? ? q q n ? q q n ?? ? ?? ? 3 f g f s u p u i f g p m m p x j o h u b c m f q ' q ' q ' . b y 8 8 . b y . . j o ? q q n . b y * o u f s o b m d p o o f d u j p o (top view) ? ? ? 1.15 0.45 1.15 1.4 0.8 1.4 motional (series) resistance (r 1 ) standard specifications CS325H life-size features 7 wide range high frequency stability. 7 high-density smd type. 7 ultra-light weight and ultraminiature size. 7 reliable ceramic package and excellent environmental characteristics. 7 suitable for high stabillity applications such as communication devices and wireless lan. CS325H at-cut crystal unit (smd ?ceramic package) nominal frequency frequency tolerance frequency tolerance over operating temperature range operating temperature range storage temperature range motional (series) resistance load capacitance shunt capacitance level of drive insulation resistance aging (first year) item model conditions frequency range esr 3000pcs/reel |
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