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  Datasheet File OCR Text:
  USPN-6 packaging information reference pattern layout dimension note : reference metal mask design unit: mm packaging information / reference pattern layout dimensions
USPN-6 reel taping specifications taping specifications unit: mm 5000pcs/reel direction of feed direction of feed r type :[device orientation : right] standard feed l type :[device orientation : left] reverse feed
USPN-6 power dissipation power dissipation data for the USPN-6 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as one of reference data taken in the described condition. 1. measurement condition (reference data) condition : mount on a board ambient : natural convection soldering : lead (pb) free board : dimensions 40mm x 40 mm (1600mm2) copper (cu) traces occupy 50% of the front and 50% of the back. vss pin is tied to the copper traces material : glass epoxy fr-4 thickness : 1.6mm through-hole : 4 x 0.8 diameter 2. power dissipation vs. ambient temperature board mount ( tjmax=125) ambient temperature ( ) power dissipation pd (mw) thermal resistance ( /w 25 600 85 240 166.67 evaluation board (unit: mm)
USPN-6 USPN-6 perspective rohs ? rohs com p liance ? ? item material note ?? ?? y?` /flammability rating resin epoxy resin ul94v-0 `??? ?? lead pad nickel ?I au ? outer pad plating gold plating ? ?? die attach die attach film ???? au bonding wire ?? si silicon chip ?? `` marking laser marking ??? resin ?`??? lead pad ?? die attach ????? bonding wire ??? silicon chip ver.00


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