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para light electronics co., ltd. 4f, no.1, lane 93, chien yi road, chung ho city, taipei, taiwan, r.o.c. tel: 886-2-2225-3733 fax: 886-2-2225-4800 e-mail: para@para.com.tw http://www.para.com.tw data sheet part no.: L-C192JGCT rev: a/1 customer?s approval : _______________ dcc : ____________ drawing no. : ds-75-08-0012 date : 2013-04-23 page 1 of 14 para-for-065
surface mount device led part no. : L-C192JGCT rev: a/1 z package outline dimensions notes: 1. all dimensions are in millimeters. 2. tolerance is ? 0.1mm (.004") unless otherwise noted. z features ? extra thin 0.4mm, top view, wide view angle, white color smd chip led . ? special for cellular phone keypad / lcd backli ghting or thin touch button led backlighting. ? packing in 8mm tape on 7" diameter reels. ? compatible with automatic pick & place equipment. ? compatible with reflow solderi ng and wave soldering processes. ? eia std package.(ansi/eia-481-b-2001) ? i.c. compatible, low current application ? pb free product . ? meet rohs green product. drawing no. : ds-75-08-0012 date : 2013-04-23 page 2 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 z chip materials ? dice material : alingap ? light color : super green ? lens color : water clear z absolute maximum ratings(ta=25 ?? ) symbol parameter rating unit pd power dissipation 60 mw ipf peak forward current (1/10 duty cycle, 0.1ms pulse width) 60 ma if continuous forward current 25 ma - de-rating linear from 25 ?? 0.25 ma/ ?? vr reverse voltage 5 v esd electrostatic discharge threshold(hbm)note a 2000 v topr operating temperature range -40 ~ +85 ?? tstg storage temperature range -40 ~ +85 ?? note a : hbm : human body model. seller gives no othe r assurances regarding the ability of to withstand esd. z electro-optical characteristics (ta=25 ?? ) parameter symbol min. typ. max. unit test condition luminous intensity iv 18 30 mcd if=20ma viewing angle 2 | 1/2 130 deg note 2 peak emission wavelength |? p 571 nm measurement @peak dominant wavelength |? d 570 nm if=20ma spectral line half-width ||? 15 nm forward voltage vf 2.05 2.3 v if =20ma reverse current ir 10 | a vr = 5v drawing no. : ds-75-08-0012 date : 2013-04-23 page 3 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 z bin code list luminous intensity(iv), unit:mcd@20m a forward voltage(vf), unit:v@20ma bin code min max bin code min max m 18.0 28.0 4 1.90 2.00 n 28.0 45.0 5 2.00 2.10 p 45.0 71.0 6 2.10 2.20 7 2.20 2.30 tolerance of each bin are ? 15% tolerance of each bin are ? 0.1volt dominant wavelength (hue),unit: nm@20ma bin code min max ga 567.0 570.0 gb 570.0 573.0 gc 573 576 including ? 1nm test tolerance notes: 1. luminous intensity is measured with a lig ht sensor and filter combination that proximities the cie eye-response curve. 2. | 1/2 is the off-axis angle at which the lu minous intensity is half the axial luminous intensity. 3. caution in esd : static electricity and surge damages the led. it is recommended use a wrist band or anti-electrostatic glove when handling the led. all devices, equipment and machinery must be properly grounded. 4. major standard testing equipment by ?ins trument system? model : cas140b compact array spectrometer and ?keith ley? source meter model : 2400. drawing no. : ds-75-08-0012 date : 2013-04-23 page 4 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 z typical electro-optical characteristics curve s (25 j ambient temperature unless otherwise noted) drawing no. : ds-75-08-0012 date : 2013-04-23 page 5 of 14 para-for-068 fig.7 relative intensity vs.angle relative luminous lntensity normalized of 20ma fig. 4 relative luminous intensity vs.forward current 50 40 30 20 10 forward current if(ma) 1000 100 10 fig.2 forward current vs.forward voltage luminous lntensity(mcd) fig.3 luminous intensity vs.forward current 100 60 80 40 20 0 0 ambient temperature ta( ?? ) fig.6 forward current derating curve 80 100 60 4 0 20 10 0 30 40 50 60 70 -0 -20 1 -60 - 4 0 0.9 0.8 1.0 20 ambient temperature ta( ?? ) fig.5 luminous intensity vs.ambient temperature 80 90 0.6 0.2 0.4 0.3 0.5 0.1 0.7 relative luminous intensity(%)
surface mount device led part no. : L-C192JGCT rev: a/1 z label explanation item code:parra light part no: L-C192JGCT iv --- luminous intensity code lot no: em s l 12 09 0110 a---em: emos code b---s:smd l---local d---year e---month f---spec. packing quantity of bag : 3000pcs for 150 ? 170 ? 110 ? 155 ? 115 series 4000pcs for 191 series 5000pcs for 192 series date code o 2012 09 10 g h i g--- ye ar h--- month i --- day drawing no. : ds-75-08-0012 date : 2013-04-23 page 6 of 14 para-for-068 a b c d e f
surface mount device led part no. : L-C192JGCT rev: a/1 z reel dimensions notes: 1. taping quantity : 3000pcs , (minimum packing quantity will be 500 pcs for remainders) 2. the tolerances unless mentioned is ? 0.1mm, angle ? 0.5 ?? , unit : mm. drawing no. : ds-75-08-0012 date : 2013-04-23 page 7 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 z package dimensions of tape and reel polarity progressive direction cathode notes:all dimensions are in millimeters. moisture resistant packaging + notes : one reel in a bag, six bag in a i nner box, six inner boxes in a carton. unit : mm. drawing no. : ds-75-08-0012 date : 2013-04-23 page 8 of 14 para-for-068 label aluminum moistue-proof bag desiccant label h:\smd\smd\smd \ ? ? .jpg h:\smd\smd\smd \ ? ? .jpg h : \ s m d \ s m d \ s m d \ ? ? . j p g h : \ s m d \ s m d \ s m d \ ? ? . j p g 2 8 0 550 300 2 4 0 2 1 0 label box carton reel
surface mount device led part no. : L-C192JGCT rev: a/1 z cleaning ? if cleaning is required , use the following solutions for less than 1 minute and less than 40 ?? . ? appropriate chemicals: ethyl al cohol and isopro pyl alcohol. ? effect of ultrasonic cleaning on the led resi n body differs depending on such factors as the oscillator output, size of pcb and led mounting method. the use of ultrasonic cleaning should be enforced at proper out put after confirming there is no problem. z suggest soldering pad dimensions direction of pwb camber and go to reflow furnace notes : suggest stencil pr int screen thickness are 0.10mm maximum. drawing no. : ds-75-08-0012 date : 2013-04-23 page 9 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 ?? suggest sn/pb ir reflow soldering profile condition: ?? suggest pb-free ir reflow soldering profile condition: drawing no. : ds-75-08-0012 date : 2013-04-23 page 10 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 z cautions 1.application limitation : the led ? s described here are intended to be used for ordinary electronic equipment(such as office equipment, communication equipment and house hold application).consult para?s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the led?s may directly jeopard ize life or health (such as airplanes, automobiles, traffic control equi pment, life support system and safety devices). 2.storage : before opening the package : the leds should be kept at 5c to 30c or less and 85%rh or less. the leds should be used within a year. after opening the package : the leds should be kept at 5c to 30c or less and 70%rh or less. the leds should be soldered within 168 hours(7 days) af ter opening the package. please avoid rapid transitions in ambient temp erature in high humidity environments where condensation may occur. 3.soldering do not apply any stress to the lead frame during soldering while the led is at high temperature. recommended soldering condition. reflow soldering : pre-heat 120~150c, 120sec. max., peak temper ature : 240c max. solder ing time : 10 sec max. soldering iron : (not recommended) temperature 300c max., soldering time : 3 sec. max.(one time only), power dissipation of iron : 20w max. use sn60 solder of solder with silver content and don?t to touch led lens when soldering. wave soldering : pre-heat 100c max, pre-heat tim e 60 sec. max, solder wave 260c max, soldering time 5 sec. max. performed consecutively cooling process is required between 1 st and 2 nd soldering processes. drawing no. : ds-75-08-0012 date : 2013-04-23 page 11 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 4. lead-free soldering for reflow soldering : 1 ?b pre-heat temp: 150-180 j ,120sec.max. 2 ?b soldering temp: temperature of soldering pot over 230 j ,40sec.max. 3 ?b peak temperature: 260 j?a 5sec. 4 ?b reflow repetition: 2 times max. 5 ?b suggest solder paste formul a : 93.3 sn/3.1 ag/3.1 bi/0.5 cu for soldering iron (not recommended) : 1 ?b iron tip temp: 350 j max. 2 ?b soldering iron: 30w max. 3 ?b soldering time: 3 sec. max. one time. for dip soldering : 1 ?b pre-heat temp: 150 j max. 120 sec. max. 2 ?b bath temp: 265 j max. 3 ?b dip time: 5 sec. max. 5. drive method circuit model a circuit model b (a)recommended circuit. (b)the difference of brightness be tween led`s could be found due to the vf-if characteristics of led. drawing no. : ds-75-08-0012 date : 2013-04-23 page 12 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 6.reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs)*@20ma. mil-std-750d:1026 (1995) mil-std-883d:1005 (1991) jis c 7021:b-1 (1982) high temperature high humidity storage ir-reflow in-board, 2 times ta= 655 ?? ,rh= 90 ?? 95% *test time= 1000hrs2hrs mil-std-202f:103b(1980) jis c 7021:b-11(1982) high temperature storage ta= 1055 ?? test time= 1000hrs (-24hrs,72hrs) mil-std-883d:1008 (1991) jis c 7021:b-10 (1982) endurance test low temperature storage ta= -555 ?? * test time=1000hrs (-24hrs,72h rs) jis c 7021:b-12 (1982) temperature cycling 1055 ?? -555 ?? 10mins 10mins 100 cycles mil-std-202f:107d (1980) mil-std-750d:1051(1995) mil-std-883d:1010 (1991) jis c 7021:a-4(1982) thermal shock ir-reflow in-board, 2 times 1055 ?? -55 ?? 5 ?? 10mins 10mins 100 cycles mil-std-202f:107d(1980) mil-std-750d:1051(1995) mil-std-883d:1011 (1991) solder resistance tsol= 260 5 ?? dwell time= 10 1sec mil-std-202f:210a(1980) mil-std-750d:2031(1995) jis c 7021:a-1(1982) environmental test solder ability tsol= 235 5 j immersion time 20.5 sec immersion rate 252.5 mm/sec coverage ? 95% of the dipped surface mil-std-202f:208d(1980) mil-std-750d:2026(1995) mil-std-883d:2003(1991) iec 68 part 2-20 jis c 7021:a-2(1982) 7.others: the appearance and specifications of the product may be modified for improvement without notice. drawing no. : ds-75-08-0012 date : 2013-04-23 page 13 of 14 para-for-068
surface mount device led part no. : L-C192JGCT rev: a/1 z part no. system : l ? c 1 9 2 x c x x - x x x x drawing no. : ds-75-08-0012 date : 2013-04-23 page 14 of 14 para-for-068 xxxx : special specification for customer t : taping for 7 inch reel tc : taping for 13 inch reel th : iv half binning tp : wavelength binning lens color c : water clear w : white diffused t : color transparent d : color diffused kg : alingap 570nm super green ky : alingap 590nm super yellow kf : alingap 605nm super amber kr : alingap 630 nm super red lb : ingan 470nm blue lg : ingan 525nm green w : ingan + yag white 0 : single chip 1/2 : super thin single chip 5/6 : dual chip f : three chip(full color) 150 : 1206 1.1t type 170 : 0805 0.8t type 191 : 0603 0.6t type 192 : 0603 0.4t type 110 : 1206 1.0t type c : top view type s : side view type

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