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data sheet part no.: L-C192WZDT-JD rev: a / 2 customer?s approval : _______________ dcc : ____________ drawing no. : ds-75-12-0004 date : 2012-07-27 page 1 of 15 para-for-065
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z features ? extra thin 0.4mm, top view, wide view angle, white color smd chip led . ? special for cellular phone keypad / lcd backli ghting or thin touch button led backlighting. ? packing in 8mm tape on 7" diameter reels. ? compatible with automatic pick & place equipment. ? compatible with reflow solderi ng and wave soldering processes. ? eia std package.(ansi/eia-481-b-2001) ? i.c. compatible, low current application ? pb free product and acceptab le lead-free process!. ? meet rohs green product. z package outline dimensions notes: 1. all dimensions are in millimeters. 2. tolerance is ? 0.1mm (.004") unless otherwise noted. drawing no. : ds-75-12-0004 date : 2012-07-27 page 2 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z chip materials ? dice material : ingan ? light color : white ? lens color : light yellow diffused. z absolute maximum ratings(ta=25 ?? ) symbol parameter rating unit pd power dissipation 75 mw ipf peak forward current (1/10 duty cycle, 0.1ms pulse width) 80 ma if continuous forward current 20 ma - de-rating linear from 25 ?? 0.25 ma/ ?? esd electrostatic discharge threshold(hbm)note a 2000 v topr operating temperature range -30 + 80 ?? tstg storage temperature range -40 ~ + 85 ?? note a : hbm : human body model. seller gives no othe r assurances regarding the ability of to withstand esd. z electro-optical characteristics (ta=25 ?? ) parameter symbol min. typ. max. unit test condition luminous intensity iv 280 320 mcd if=20ma viewing angle 2 1/2 130 deg note 2 cie chromaticity x 0.30 cie chromaticity y 0.30 if=20ma forward voltage vf 3.1 3.4 v if =20ma drawing no. : ds-75-12-0004 date : 2012-07-27 page 3 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 notes: 1. luminous intensity is measured with a lig ht sensor and filter combination that proximities the cie eye-response curve. 2. | 1/2 is the off-axis angle at which the lu minous intensity is half the axial luminous intensity. 3. caution in esd : static electricity and surge damages the led. it is recommended use a wrist band or anti-electrostatic glove when handling the led. all devices, equipment and machinery must be properly grounded. 4. major standard testing equipment by ?ins trument system? model : cas140b compact array spectrometer and ?keith ley? source meter model : 2400. z typical electro-optical characteristics curves fig.1 relative intensity vs. wavelength drawing no. : ds-75-12-0004 date : 2012-07-27 page 4 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z typical electro-optical characteristics curve s (25 j ambient temperature unless otherwise noted) drawing no. : ds-75-12-0004 date : 2012-07-27 page 5 of 15 para-for-068 relative luminous intensity(%) fig.3luminous intensity vs.ambient temperature ambient temperature ta( ?? ) 20 - 4 0 -60 1 -20 -0 4 060 100 80 fig.4 forward current derating curve ambient temperature ta( ?? ) 0 0 20 40 80 60 100 fig.1 forward current vs.forward voltage 10 100 1000 forward current if(ma) 25 10 20 30 40 50 fig. 1 relative luminous intensity vs.forward current relative luminous lntensity normalized of 20ma 0.7 0.1 0.5 0.3 0.4 0.2 0.6 90 80 1.0 0.8 0.9 70 60 50 40 30 0 10 20 fig.5 relative intensity vs.angle 0.7 0.1 0.5 0.3 0.4 0.2 0.6 90 80 1.0 0.8 0.9 70 60 50 40 30 0 10 20 fig.6 relative intensity vs.angle
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z label explanation cus. part no: to be denominated. customer: to be denominated. part no: refer to p15 iv --- luminous intensity code vf --- forward voltage code wd --- dominant wavelength code lot no: e l s 6 8 0001 a---e: for series number b---l: local f: foreign c---s:smd d---year e---month f---spec. packing quantity of bag : 3000pcs for 150 ? 170 ? 110 ? 115 series 4000pcs for 191 series 5000pcs for 192 series date code o 2006 06 08 g h i g--- ye ar h--- month i --- day drawing no. : ds-75-12-0004 date : 2012-07-27 page 6 of 15 para-for-068 a b c d e f
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z reel dimensions notes: 1. taping quantity : 3000pcs , (minimum packing quantity will be 500 pcs for remainders) 2. the tolerances unless mentioned is ? 0.1mm, angle ? 0.5 ?? , unit : mm. drawing no. : ds-75-12-0004 date : 2012-07-27 page 7 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z package dimensions of tape and reel polarity progressive direction cathode notes:all dimensions are in millimeters. moisture resistant packaging label aluminum moistue-proof bag desiccant label h:\smd\smd\smd \ ? ? .jpg h:\smd\smd\smd \ ? ? .jpg h : \ s m d \ s m d \ s m d \ ? ? . j p g h : \ s m d \ s m d \ s m d \ ? ? . j p g 2 5 5 435 145 2 4 0 2 1 0 label box carton reel notes : one reel in a bag, one bag in a i nner box, ten inner boxes in a carton. unit : mm. drawing no. : ds-75-12-0004 date : 2012-07-27 page 8 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z cleaning ? if cleaning is required , use the following solutions for less than 1 minute and less than 40 ?? . ? appropriate chemicals: ethyl al cohol and isopro pyl alcohol. ? effect of ultrasonic cleaning on the led resi n body differs depending on such factors as the oscillator output, size of pcb and led mounting method. the use of ultrasonic cleaning should be enforced at proper out put after confirming there is no problem. z suggest soldering pad dimensions direction of pwb camber and go to reflow furnace notes : suggest stencil pr int screen thickness are 0.10mm maximum. drawing no. : ds-75-12-0004 date : 2012-07-27 page 9 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 ?? suggest sn/pb ir reflow soldering profile condition: ?? suggest pb-free ir reflow soldering profile condition: drawing no. : ds-75-12-0004 date : 2012-07-27 page 10 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z bin code list luminous intensit y( iv ) , unit:mcd @ 20ma forward volta g e ( vf ) , unit:v @ 20ma bin code min max bin code min max t 280 450 14 2.9 3.0 u 450 710 15 3.0 3.1 16 3.1 3.2 17 3.2 3.3 18 3.3 3.4 tolerance of each bin are ? 15% tolerance of each bin are ? 0.1volt color rank (cie chromaticity x , y) @ 20ma rank w1 rank w2 x 0.280 0.264 0.283 0.296 x 0.287 0.283 0.330 0.330 y 0.248 0.267 0.305 0.276 y 0.295 0.305 0.360 0.339 rank w3 rank w4 x 0.296 0.287 0.330 0.330 x 0.330 0.330 0.361 0.356 y 0.276 0.295 0.339 0.318 y 0.318 0.360 0.385 0.351 ? measurement of color coordinates : +/- 0.02 drawing no. : ds-75-12-0004 date : 2012-07-27 page 11 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z cautions 1.application limitation : the led ? s described here are intended to be used for ordinary electronic equipment(such as office equipment, communication equipment and house hold application).consult para?s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the led?s may directly jeopard ize life or health (such as airplanes, automobiles, traffic control equi pment, life support system and safety devices). 2.storage : before opening the package : the leds should be kept at 5c to 30c or less and 85%rh or less. the leds should be used within a year. after opening the package : the leds should be kept at 5c to 30c or less and 70%rh or less. the leds should be soldered within 168 hours(7 days) af ter opening the package. please avoid rapid transitions in ambient temp erature in high humidity environments where condensation may occur. 3.soldering do not apply any stress to the lead frame during soldering while the led is at high temperature. recommended soldering condition. reflow soldering : pre-heat 120~150c, 120sec. max., peak temper ature : 240c max. solder ing time : 10 sec max. soldering iron : (not recommended) temperature 300c max., soldering time : 3 sec. max.(one time only), power dissipation of iron : 20w max. use sn60 solder of solder with silver content and don?t to touch led lens when soldering. wave soldering : pre-heat 100c max, pre-heat tim e 60 sec. max, solder wave 260c max, soldering time 5 sec. max. performed consecutively cooling process is required between 1 st and 2 nd soldering processes. drawing no. : ds-75-12-0004 date : 2012-07-27 page 12 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 4. lead-free soldering for reflow soldering : 1 ?b pre-heat temp: 150-180 j ,120sec.max. 2 ?b soldering temp: temperature of soldering pot over 230 j ,40sec.max. 3 ?b peak temperature: 260 j?a 5sec. 4 ?b reflow repetition: 2 times max. 5 ?b suggest solder paste formul a : 93.3 sn/3.1 ag/3.1 bi/0.5 cu for soldering iron (not recommended) : 1 ?b iron tip temp: 350 j max. 2 ?b soldering iron: 30w max. 3 ?b soldering time: 3 sec. max. one time. for dip soldering : 1 ?b pre-heat temp: 150 j max. 120 sec. max. 2 ?b bath temp: 265 j max. 3 ?b dip time: 5 sec. max. 5. drive method circuit model a circuit model b (a)recommended circuit. (b)the difference of brightness be tween led`s could be found due to the vf-if characteristics of led. drawing no. : ds-75-12-0004 date : 2012-07-27 page 13 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 6.reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs)*@5ma. mil-std-750d:1026 (1995) mil-std-883d:1005 (1991) jis c 7021:b-1 (1982) high temperature high humidity storage ir-reflow in-board, 2 times ta= 655 ?? ,rh= 90 ?? 95% *test time= 1000hrs2hrs mil-std-202f:103b(1980) jis c 7021:b-11(1982) high temperature storage ta= 1055 ?? test time= 1000hrs (-24hrs,72hrs) mil-std-883d:1008 (1991) jis c 7021:b-10 (1982) endurance test low temperature storage ta= -555 ?? * test time=1000hrs (-24hrs,72h rs) jis c 7021:b-12 (1982) temperature cycling 1055 ?? -555 ?? 10mins 10mins 100 cycles mil-std-202f:107d (1980) mil-std-750d:1051(1995) mil-std-883d:1010 (1991) jis c 7021:a-4(1982) thermal shock ir-reflow in-board, 2 times 1055 ?? -55 ?? 5 ?? 10mins 10mins 100 cycles mil-std-202f:107d(1980) mil-std-750d:1051(1995) mil-std-883d:1011 (1991) solder resistance tsol= 260 5 ?? dwell time= 10 1sec mil-std-202f:210a(1980) mil-std-750d:2031(1995) jis c 7021:a-1(1982) environmental test solder ability tsol= 235 5 j immersion time 20.5 sec immersion rate 252.5 mm/sec coverage ? 95% of the dipped surface mil-std-202f:208d(1980) mil-std-750d:2026(1995) mil-std-883d:2003(1991) iec 68 part 2-20 jis c 7021:a-2(1982) 7.others: the appearance and specifications of the product may be modified for improvement without notice. drawing no. : ds-75-12-0004 date : 2012-07-27 page 14 of 15 para-for-068
surface mount device led part no. : L-C192WZDT-JD rev: a / 2 z part no. system : l ? c 1 9 2 x c x x - x x x x drawing no. : ds-75-12-0004 date : 2012-07-27 page 15 of 15 para-for-068 xxxx : special specification for customer t : taping for 7 inch reel tc : taping for 13 inch reel th : iv half binning tp : wavelength binning lens color c : water clear w : white diffused t : color transparent d : color diffused kg : alingap 570nm super green ky : alingap 590nm super yellow kf : alingap 605nm super amber kr : alingap 630 nm super red lb : ingan 470nm blue lg : ingan 525nm green w : ingan + yag white?? 0 : single chip 1/2 : super thin single chip 5/6 : dual chip f : three chip(full color) 150 : 1206 1.1t type 170 : 0805 0.8t type 191 : 0603 0.6t type 192 : 0603 0.4t type 110 : 1206 1.0t type c : top view type s : side view type

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