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| USPQ-4B04 ? / packaging information ?` / reference pattern layout ? packaging information / ?` reference pattern layout dimensions unit: mm
uspq4b-04 ` /reel ?`?? /taping specifications unit: mm ?`?? / ta p in g s p ecifications 3,000pcs/reel direction of feed r type :[device orientation : right] standard feed USPQ-4B04 power dissipation power dissipation data for the USPQ-4B04 is shown in this page. the value of power dissipation varies with the mount board conditions. please use this data as the referenc e data taken in the following condition. board mount (tj max = 125 ) ambient temperature power dissipation pd mw thermal resistance ( /w) 25 550 85 220 181.82 1. measurement condition condition : mount on a board a mbient : natural convection soldering : lead (pb) free board dimensions : 40 x 40 mm (1600mm 2 ) board structure : 4 copper layers each layer is connected to the package heat-sink and terminal pin no.1. each layer has approximately 800mm 2 coppe r area. material : glass epoxy (fr-4) thickness : 1.6 mm through-hole : 4 x 0.8 diameter 2. power dissi p ation vs. ambient tem p erature pd vs ta 0 100 200 300 400 500 600 25 45 65 85 105 125 ampient temperature ta power dissipation pdmw evaluation board ( unit: mm ) |
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