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revision: e 6/18/2013 sheet 1 of 13 ?2013 knowles electronics sp k0 4 15 hm4h - b digital high-snr sisonic tm microphone the SPK0415HM4H-B is a miniature, high- performance, low power, top port silicon digital microphone with a single bit pdm output. using knowles proven high performance sisonic tm mems technology, the SPK0415HM4H-B consists of an acoustic sensor, a low noise input buffer, and a sigma-delta modulator. these devices are suitable for applications such as cellphones, smart phones, laptop computers, sensors, digital still cameras, portable music recorders, and other portable electronic devices where excellent audio performance and rf immunity are required. the high signal-to-noise-ratio (snr) of the SPK0415HM4H-B enhances the performance of far-field applications and many complex, multi-microphone algorithms. features: ? low noise ? low current ? rf shielded ? pdm output ? supports dual multiplexed channels ? ultra-stable performance ? standard smd reflow ? omnidirectional
revision: e 6/18/2013 sheet 2 of 13 ?2013 knowles electronics spk0415hm4h - b 1. absolute maximum ratings parameter absolute maximum rating units v dd , data to ground -0.3, +5.0 v clock to ground -0.3, +5.0 v select to ground -0.3, +5.0 v input current 5 ma short circuit current to/from data indefinite to ground or v dd sec temperature range -40 to +100 c stresses exceeding these absolute maximum ratings may cause permanent damage to the device. these ar e stress ratings only. functional operation at these or any other conditions beyond those indicated unde r acoustic & electrical specifications is not implied. exposu re beyond those indicated under acoustic & electri cal specifications for extended periods may affect dev ice reliability. 2. acoustic & electrical specifications test conditions: 23 2c, 5520% r.h., v dd =1.8 v, f clock =2.4 mhz, select pin grounded, no load, unless otherwise indicated parameter symbol conditions min typ max units supply voltage 1 v dd 1.6 - 3.6 v supply current 1,2,3 i dd - - 650 a sleep current 3 i sleep f clock < 1 khz - 25 50 a sensitivity 1 s 94 db spl @ 1 khz -29 -26 -23 dbfs signal to noise ratio snr 94 db spl @ 1 khz, a-weighted - 61 - db(a) total harmonic distortion thd 94 db spl @ 1 khz, s = typ - .10 .35 % acoustic overload point aop 10% thd @ 1 khz, s = typ 119 122 - db spl power supply rejection ratio psrr 200 mvpp sinewave @ 1 khz - 39 - dbv /fs power supply rejection psr 100 mvpp square wave @ 217 hz, a-weighted - -71 - dbfs (a) dc output fullscale = 100 - -4 - % fs directivity omnidirectional polarity increasing sound pressure increasing density of 1s data format ? cycle pdm logic input high v ih 0.65xv dd - 3.6 v
revision: e 6/18/2013 sheet 3 of 13 ?2013 knowles electronics spk0415hm4h - b parameter symbol conditions min typ max units logic input low v il -0.3 - 0.35xv dd v logic output high v oh i out = 1 ma 0.65xv dd - v dd v logic output low v ol i out = 1 ma 0 - 0.35xv dd v select (high) v dd -0.2 - 3.6 v select (low) -0.3 - 0.2 v short circuit current i sc grounded data pin - 1 10 ma output load c load - - 100 pf clock frequency f clock 1.0 - 3.25 mhz clock duty cycle 40 - 60 % clock rise/fall time t edge - - 10 ns fall-asleep time 4,5 f clock < 1 khz - - 10 ms wake-up time 4,6 f clock 1 mhz - - 10 ms delay time for valid data t dv c load = 13pf 18 - 60 ns delay time for high z t dz 0 - 16 ns 1 100% tested. 2 i dd varies with c load according to: i dd = 0.5*v dd *c load *f clock . 3 maximum specifications are measured at maximum v dd . typical specifications are measured at standard t est conditions. 4 valid microphones states are: powered down mode (mi c off), sleep mode (low current, data = high-z, fas t startup), and active mode (normal operation). 5 time from f clock < 1 khz to i sleep specification is met when transitioning from active mode to sleep mode. 6 time from f clock 1 mhz to all applicable specifications are met wh en transitioning from sleep mode to active mode.
revision: e 6/18/2013 sheet 4 of 13 ?2013 knowles electronics spk0415hm4h - b 3. microphone state diagram powered down mode active mode sleep mode
revision: e 6/18/2013 sheet 5 of 13 ?2013 knowles electronics spk0415hm4h - b 4. frequency response curve -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 16 18 20 100 1,000 10,000 sensitivity (db) frequency (hz) typical free field response normalized to 1khz
revision: e 6/18/2013 sheet 6 of 13 ?2013 knowles electronics spk0415hm4h - b 5. interface circuit microphone select asserts data on latch data on mic (high) v dd rising clock edge falling clock edge mic (low) gnd falling clock edge rising clock edge note: all ground pins must be connected to ground. capacitors near the microphone should not contain c lass 2 dielectrics. detailed information on acoustic, mechanical, and s ystem integration can be found in the latest sisonic tm design guide application note. 6. timing diagram t dv t dz c lock data (select = v dd ) data (select = gnd) v ih v il t dv t dz t edge high z mic (low) data high z mic (high) data v oh v ol t edge v oh v ol 1/f clock v dd v dd select mic (high) data clock .1 f .1 f mic (low) select
revision: e 6/18/2013 sheet 7 of 13 ?2013 knowles electronics spk0415hm4h - b 7. mechanical specifications item dimension tolerance units length (l) 4.00 0.10 mm width (w) 3.00 0.10 mm height (h) 1.06 0.10 mm acoustic port (ap) ?0.65 0.05 mm pin # pin name type description 1 v dd power power supply 2 select non - digital input lo/hi (l/r) select this pin is internally pulled low. 3 clock digital i clock input 4 data digital o pdm output 5 ground power ground 6 ground power ground 7 ground power ground 8 ground power ground notes: pick area only extends to 0.25 mm of any edg e or hole unless otherwise specified. dimensions are in millimeters unless otherwise spec ified. tolerance is 0.15mm unless otherwise specified
revision: e 6/18/2013 sheet 8 of 13 ?2013 knowles electronics spk0415hm4h - b 8. example land pattern 9. example solder stencil pattern notes: dimensions are in millimeters unless otherwi se specified. further optimizations based on application should b e performed.
revision: e 6/18/2013 sheet 9 of 13 ?2013 knowles electronics spk0415hm4h - b 10. packaging & marketing detail model n umber suffix reel diameter quantity per reel SPK0415HM4H-B -7 13 5,700 alpha character a: s: knowles sisonic tm production e: knowles engineering samples p: knowles prototype samples jin number: unique job identification number for product traceability notes: dimensions are in millimeters unless otherwi se specified. vacuum pickup only in the pick area indicated in me chanical specifications. tape & reel per eia-481. labels applied directly to reel and external packag e. shelf life: twelve (12) months when devices are to be stored in factory supplied, unopened esd moisture sensitive bag under maximum e nvironmental conditions of 30c, 70% r.h. pin 1
revision: e 6/18/2013 sheet 10 of 13 ?2013 knowles electronics spk0415hm4h - b 11. recommended reflow profile profile feature pb-free average ramp-up rate (t smax to t p ) 3c/second max. preheat ? temperature min (t smin ) ? temperature max (t smax ) ? time (t s min to t smax ) (t s ) 150c 200c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 217c 60-150 seconds peak temperature (t p ) 260c time within 5c of actual peak temperature (t p ) 20-40 seconds ramp-down rate (t p to t smax ) 6c/second max time 25c to peak temperature 8 minutes max notes: based on ipc/jdec j-std-020 revision c. all temperatures refer to topside of the package, m easured on the package body surface. temperature time 25c to peak ramp - down ramp - up t smin t smax t l t p t l t p t s preheat time 25c
revision: e 6/18/2013 sheet 11 of 13 ?2013 knowles electronics spk0415hm4h - b 12. additional notes (a) msl (moisture sensitivity level) class 1. (b) maximum of 3 reflow cycles is recommended. (c) in order to minimize device damage: ? do not board wash or clean after the reflow process . ? do not brush board with or without solvents after t he reflow process. ? do not directly expose to ultrasonic processing, we lding, or cleaning. ? do not insert any object in port hole of device at any time. ? do not apply over 30 psi of air pressure into the p ort hole. ? do not pull a vacuum over port hole of the micropho ne. ? do not apply a vacuum when repacking into sealed ba gs at a rate faster than 0.5 atm/sec. 13. materials statement meets the requirements of the european rohs directi ve, 2011/65/ec as amended. meets the requirements of the industry-standard iec 61249-2-21:2003 for halogenated substances and knowles green materials standards po licy section on halogen-free. ozone depleting substances are not used in the prod uct or the processes used to make the product including compounds listed in annex a, b, a nd c of the montreal protocol on substances that deplete the ozone layer.
revision: e 6/18/2013 sheet 12 of 13 ?2013 knowles electronics spk0415hm4h - b 14. reliability specifications test description thermal shock 100 cycles air-to-air thermal shock from -40 o c to +125 o c with 15 minute soaks. (iec 68-2-4) high temperature storage 1,000 hours at +105 o c environment (iec 68-2-2 test ba) low temperature storage 1,000 hours at -40 o c environment (iec 68-2-2 test aa) high temperature bias 1,000 hours at +105 o c under bias (iec 68-2-2 test ba) low temperature bias 1,000 hours at -40 o c under bias (iec 68-2-2 test aa) temperature / humidity bias 1,000 hours at +85 o c/85% r.h. under bias. (jesd22-a101a-b) vibration 4 cycles of 20 to 2,000 hz s inusoidal sweep with 20 g peak acceleration lasting 12 minutes in x, y, and z direc tions. (mil-std-883e, method 2007.2 a) esd-hbm 3 discharges of 2 kv direct contact to i/o pins. (mil 883e, method 3015.7) esd-lid/gnd 3 discharges of 8 kv direct contact to lid while u nit is grounded. (iec 61000-4-2) esd-mm 3 discharges of 200 v direct contact to i/o pins. (esd stm5.2) reflow 5 reflow cycles with peak temperature of +260 o c mechanical shock 3 pulses of 10,000 g in the x, y, and z direction (i ec 68-2-27, test ea) note: after reliability tests are performed, the se nsitivity of the microphones shall not deviate more than 3 db from its initial value.
revision: e 6/18/2013 sheet 13 of 13 ?2013 knowles electronics spk0415hm4h - b 15. specifications revisions revision specification changes date a initial release (c10113326) 2/17/12 b remove sleep current footnote; update state diagram 4/02/12 c release in new format ; u pdate psr, aop, thd , sleep current , base thickness; correct carrier tape pin 1 location (c10 114279) 11/02/12 d updated snr , thd, aop, psrr, and psr ; new jin designation; new rohs statement (c10114438); updated humidity conditions and esd descriptions (c10114466); move shelf life statement to section 10; fixed typos in reliability section 14 (c10114690) 3/25/13 e corrected psrr units, update c load value for t dv (c10114972) 06/18/13 information contained herein is subject to change w ithout notice. it may be used by a party at their o wn discretion and risk. we do not guarantee any results or assume any liability in connection with its use. this pub lication is not to be taken as a license to operate under any exist ing patents.

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