light sensors light sensor (ams1, 3, 4) types standard packing: tape and reel package smd type: carton: 3,000 pcs.; case: 3,000 pcs. tape and reel package through-hole type: carton: 2,000 pcs.; case: 2,000 pcs. baggage package through-hole type: carton: 500 pcs.; case: 1,000 pcs. tape and reel package chip type: carton: 3,000 pcs.; case: 3,000 pcs. notes: *ev = 100 lx (ev: brightness, fluorescent lamp is used as light source) tape and reel package is standard packaging style for smd and chip types. (? and ? at end of part number indicate packaging type.) ratings 1. absolute maximum ratings (measuring condition: ambient temperature: 25 c 77f) 2. recommended operating condition photo ic type high sensitive light sensor sensor type (shape) photo current part no. tape and reel package baggage package smd type 260 a* ams104y through-hole type AMS302T ams302 chip type 20 a* ams402y item symbol ams104/ams302 ams402 remarks reverse voltage v r ?.5 to 8 v ?.5 to 6 v photocurrent i l 5 ma 1 ma pow er dissipation p 40 mw 6 mw operating temperature t opr ?0 to +85 c ?2 to +185 f ?0 to +85 c ?2 to +185 f non-condensing at low temperatures storage temperature t stg ?0 to +100 c ?0 to +176 f ?0 to +100 c ?0 to +176 f non-condensing at low temperatures item symbol ams104/ams302 ams402 remarks reverse voltage minimum v r 1.5 v 1.5 v maximum 6 v 5.5 v features 1. built-in optical ?ter for spectral response similar to that of the human eye. 2. photocurrent is proportional to illumination. (linear output) 3. uses environmentally friendly silicon chips. typical applications 1. brightness detection for lcd backlight control for lcd devices (lcd tvs, car navigation systems, and mobile pcs). 2. brightness detection for circuits in residential lighting, lighting for security, and automatic lighting for bicycle. 3. household applicances (day/night energy savings for air conditioners and electric hot water pots, etc.) 4. brightness detection for wall clocks (radio clocks). 1. brightness detection for lcd backlight control for compact mobile devices (mobile phones and pdas). 2. brightness detection for controlling the keypad backlight in mobile phones. smd type through-hole type chip type (2.0 1.25 0.55 mm) (.079 .049 .022 inch) smd and through-hole types chip type asctb242e 201209-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e rohs compliant
light sensors light sensor (ams1, 3, 4) 3. electrical and optical characteristics (measuring condition: ambient temperature: 25 c 77f) notes: *1. fluorescent lamp is used as light source. ev = brightness *2. cie standard illuminant ? is used as light source. *3. measuring method for switching time. reference data item symbol ams104/ams302 ams402 condition peak sensitivity wavelength p 580 nm 560 nm photocurrent 1 minimum i l1 9.1 a 0.7 a ams104/ams302: v r = 5 v, e v = 5 lx* 1 ams402: v r = 3 v, e v = 5 lx* 1 typical 13 a1 a maximum 16.9 a 1.3 a photocurrent 2 minimum i l2 182 a 14 a ams104/ams302: v r = 5 v, e v = 100 lx* 1 ams402: v r = 3 v, e v = 100 lx* 1 typical 260 a 20 a maximum 338 a 26 a photocurrent 3 typical i l3 500 a 35 a ams104/ams302: v r = 5 v, e v = 100 lx* 2 ams402: v r = 3 v, e v = 100 lx* 2 dark current maximum i d 0.3 a 0.05 a ams104/ams302: v r = 5 v, e v = 0 lx ams402: v r = 3 v, e v = 0 lx switching time rise time typical t r 8.5 ms 1.2 ms ams104/ams302: v cc = 5.0 v, v o = 2.5 v, r l = 5 k ? ams104/ams302: v cc = 3.0 v, v o = 1.5 v, r l = 5 k ? fall time typical t f 8.5 ms 1.2 ms i f v o tf tr 90% 10% white led v cc ams??? i f r l v o v r ams104/ams302: 2.5v ams402: 1.5v anode cathode 1. power dissipation vs. ambient temperature characteristics 2. relative sensitivity vs. wavelength characteristics reverse voltage: 3v (ams402), 5v (ams104, ams302) ambient temperature: 25 c 77f 3. dark current vs. ambient temperature characteristics reverse voltage: 3v (ams402), 5v (ams104, ams302) 0204 06080100 0 10 15 5 20 25 30 35 40 45 50 ams402 ams104?ms302 ambient temperature, c pow er dissipation, mw 500 600 700 800 900 1000 1100 400300 0 0.2 0.1 0.4 0.6 0.8 0.3 0.5 0.7 0.9 1.0 ams402 ams104?ms302 human spectral relative sensitivity wav elength, nm 40 60 100 80 20 0.01 0.1 1 10 0.001 0.0001 ams402 ams104?ms302 ambient temperature, c dark current, a 4. photocurrent vs. brightness characteristics light source: fluorescent lamp reverse voltage: 3v (ams402), 5v (ams104, ams302) ambient temperature: 25 c 77f 5. relative photocurrent vs. ambient temperature characteristics light source: fluorescent lamp, brightness: 100 lx reverse voltage: 3v (ams402), 5v (ams104, ams302) 6. relative photocurrent vs. reverse voltage characteristics light source: fluorescent lamp, brightness: 100 lx ambient temperature: 25 c 77f 10 100 10000 1000 1 10 1 100 1000 10000 0.1 ams402 ams104?ms302 brightness, lx photocurrent, a 0-20-40 20 40 60 80 100 0.6 0.8 1.0 1.2 1.4 ams402 ams104?ms302 ambient temperature, c relative photocurrent 32 01 45678 0 0.2 0.4 0.6 0.8 1.0 1.2 ams402 ams104?ms302 reverse voltage, v relative photocurrent asctb242e 201209-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e
light sensors light sensor (ams1, 3, 4) dimensions (mm inch) 7. switching time vs. resistive load characteristics light source: white led pow er voltage: 3v (ams402), 5v (ams104, ams302) resistive load voltage: 1.5v (ams402), 2.5v (ams104, ams302) ambient temperature: 25 c 77f 100 10 1 0.1 1000 0.1 1 10 100 ams402 tr ams402 tf ams104?ms302 tr ams104?ms302 tf switching time, ms resistive load, k ? 1. smd type amplifier 14 23 34 cathode 12 anode 12 3 4 2.0 1.27 0.3 0.3 1.0 0.05 2.2 3.2 0.25 0.25 (0.1) (0.2) 1 anode: 2 anode: 3 cathode: + 4 cathode: + detection area (.008) (.004) .087 .010 .126 .010 .079 .039 .002 .012 .012 .050 te r minal thickness: t=0.125 general tolerance: 0.1 .004 recommended mounting pad (top view) 2.8 0.8 0.6 1.27 .031 .110 .024 .050 cad data 2. through-hole type 1 amplifier 2 2 cathode 1 anode 2 1 1 anode: 2 cathode: + detection area 5.00.2 dia. 5.8 dia. (0.17) (1.0) (2.5) 2-0.5 (2.54) (1.0) 4.30.2 343 9.1 max. 1.5 max. 1.0 1.0 (.007) .197.008 dia. .228 dia. (.039) .169.008 max. .059 .358 .039 max. .039 1.339.118 (.039) (.098) 2-.020 (.100) general tolerance: 0.5 .020 cad data asctb242e 201209-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e the cad data of the products with a cad data mark can be downloaded from: http://industrial.panasonic.com/ac/e
light sensors light sensor (ams1, 3, 4) safety precautions cautions for use 3. chip type 2 cathode (+) 1 anode (? 2 1 amplifier 1.45 mark for indicating orientation (0.30) 2.0 .057 .079 1.2 .047 (0.23) (.012) (.009) 1 2 1.25 .049 (0.58) (.023) 0.55 .022 (0.17) (.007) 1 anode 2 cathode detection area general tolerance: 0.1 .004 recommended mounting pad (top view) (.024) (.024) (0.6) (0.6) (2.4) (.094) (1.2) (.047) cad data be sure to obey the following in order to prevent injuries and accidents. do not use the sensors under conditions that exceed the range of its speci?ations. it may cause ov erheating, smoke, or ?e. connect terminals correctly by verifying the pin layout with the speci?ations diagram or other instructions. erroneous connections may lead to unexpected operating errors, ov erheating, smoke, or ?e. ? or an impotant and serious application in terms of safety, add protection circuit or any other protection method. 1. applying stress that exceeds the absolute maximum rating if the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the excessive voltage or current. in extreme cases, wiring may melt, or silicon p/n junctions may be destroyed. therefore the design should ensure that the absolute maximum ratings will never be exceeded, even momentarily. 2. deterioration and destruction caused by discharge of static electricity this phenomenon is generally called static electricity destruction. static electricity generated by various factors ?ws through the terminal and occurs to destroy internal elements. to prevent problems from static electricity, the following precautions and measures should be taken when using your device. 1) person handling sensor should wear anti-static clothing and should be grounded through protective resistance of 500 k ? to 1 m ?. 2) a conductive metal sheet should be placed over the work table. measuring instruments and jigs should be grounded. 3) when using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (use of low- voltage soldering irons is also recommended.) 4) devices and equipment used in assembly should also be grounded. 5) when packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. 6) when storing or transporting sensor, the environment should not be generated static electricity (for instance, the humidity should be between 45 and 60%), and sensor should be protected using conductive packing materials. 3. just after supplying voltage, please note that current in the sensor will be not constant until internal circuit stability. 4. storage the sensors are transparent plastic packages. they are sensitive to moisture and come in moisture-proof packages. observe the following cautions when storing. 1) after the moisture-proof package is unsealed, take the sensors out of storage as soon as possible (within 1 week 30c 86f/60% r.h.). 2) if the devices are to be left in storage for a considerable period after the moisture-proof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within 3 months at the most). 3) storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. the following storage conditions are recommended: ? emperature: 0 to 30 c 32 to 86 f humidity: less than 60% r.h. (avoid freezing and condensing) atomosphere: no harmful gasses such as sulfurous acid gas, minimal dust. *when mounting with solder, if thermal stress is applied to sensors that have absorbed moisture, the moisture will vaporize, swelling will occur, and the inside of the package will become stressed. this may cause the package surface to blister or crack. therefore, please take caution and observe the soldering conditions in the following section. asctb242e 201209-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e
light sensors light sensor (ams1, 3, 4) 11. the following shows the packaging format 1) smd type tape and reel (mm inch) type tape dimensions dimensions of tape reel light sensor napica smd type ams104y note) when picked from 1 and 4-pin side (please inquire for tape and reel packaging with 2-pin and 3-pin on the pull-out side.) 5. recommended soldering conditions 1) recommended condition (1) ir (infrared re?w) soldering method t 1 = 150 to 180 c 302 to 356 f t 2 = 230 c 446 f t 3 = 250 c 482 f or less t 1 = 60 to 120 s or less t 2 = 30 s or less (2) soldering iron method tip temperature: 350 to 400 c 662 to 752f wattage: 30 to 60 w soldering time: within 3 s *we don? recommend soldering iron method for chip type. 2) do not do ?w soldering. 1) recommended condition (1) double wave soldering method t 1 = 120 c 248 f t 2 = 260 c 500 f or less t 1 = 120 s or less t 2 +t 3 = 6 s or less (2) soldering iron method tip temperature: 350 to 400 c 662 to 752f wattage: 30 to 60 w soldering time: within 3 s 2) the soldered position on leads should not be closer than 3mm .118inch to the molding resin of this sensor. 6. notes for mounting 1) temperature rise in the lead portion is highly dependent on package size. if multiple different packages are mounted on the same board, please check your board beforehand in an actual product, ensuring that the temperature of the solder area of the sensor terminals falls within the temperature conditions of item 5. 2) if the mounting conditions exceed the recommended solder conditions in item 5, resin strength will fall and the mismatching of the heat expansion coef?ient of each constituent material will increase markedly, possibly causing cracks in the package, disconnections of bonding wires, and the like. for this reason, please inquire with us about whether this use is possible. 7. cleaning solvents compatibility we recommend dip cleaning with an organic solvent for removal of solder ?x etc. if you cannot avoid using ultrasonic cleansing, please ensure that the following conditions are met, and check beforehand for defects. ? requency: 27 to 29 khz ultrasonic power: no greater than 0.25w/cm 2 cleaning time: no longer than 30 s cleanser used: asahiklin ak-225 other: submerge in solvent in order to prevent the pcb and sensors from being contacted directly by the ultrasonic vibrations. note: applies to unit area ultrasonic power for ultrasonic baths. 8. transportation extreme vibration during transport will wa rp the lead or damage the sensor. handle the outer and inner boxes with care. 9. avoid using the sensor in environments containing excessive amounts of steam, dust, corrosive gas, or where organic solvents are present. 10. lead forming and cutting of through-hole type 1) lead forming must be done at normal temperature before soldering 2) the bent and cut position on leads should not be closer than 3mm .118inch to the base of leads. 3) lead forming and cutting must be done while ?ing the base of leads. 4) avoid mounting with stress at the base of leads. t 1 t 2 t 3 t 1 t 2 t 1 t 2 t 1 t 2 t 3 device mounted on tape direction of picking 8.0 0.2 1.0 0.1 dia. 1.5 dia. 4.0 0.1 2.0 0.1 2.4 0.1 4.0 0.1 1.75 0.1 3.5 0.1 3.6 0.1 1.5 0.3 0.2 0.05 +0.1 ?0 .059 dia. +.004 ?0 cathode side anode side .008 .002 .059 .012 .142 .004 .094 .004 .157 .004 .157 .004 .079 .004 .039 .004 dia. .069 .004 .315 .008 .138 .004 60 0.5 dia. 2.0 0.5 178 2 dia. 11.4 1.0 9.0 0.3 21.0 0.8 dia. 13.0 0.5 dia. .079 .020 .827 .031 dia. .512 .020 dia. .449 .039 7.008 .079 dia. 2.362 .020 dia. .354 .012 asctb242e 201209-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e
light sensors light sensor (ams1, 3, 4) 2) through-hole type tape and reel (mm inch) 3) chip type tape and reel (mm inch) light sensor napica terminology type tape dimensions light sensor napica through-hole type AMS302T note: zigzag tape style is used. symbol symbol dimensions remarks feed hole pitch p 0 12.70.3 .500.012 product interval pitch p 12.71.0 .500.039 product distance p 2 6.351.3 .250.051 product bottom distance h 20.51.0 .807.039 lead interval f 2.540.5 .100.020 product slant ?h 01.0 0.039 product tilt ?p 01.0 0.039 tape width w 18.0 .709 holding tape width w 0 13.00.3 .512.012 feed hole position w 1 9.0 .354 holding tape distance w 2 0 to 0.5 0 to .020 feed hole diameter d 0 3.80.2 .150.008 tape thickness t 0.50.2 .020.008 included holding tape thickness defective product cutoff position l max.: 11.0 .433 type tape dimensions dimensions of tape reel light sensor napica chip type ams402y te rm symbol explanation reverse voltage v r the applied voltage between the cathode and anode. photocurrent i l the current that ?ws between the cathode and anode when light is applied. pow er dissipation p the electric power loss that occurs between the cathode and anode. operating temperature t opr the workable ambient temperature range at which normal operation is possible under the condition of a prescribed allowable loss. storage temperature t stg the ambient temperature range at which the sensor can be left or stored without applying voltage. peak sensitivity wavelength p the wavelength of light at which sensitivity is at its maximum. dark current i d the current between the cathode and anode when reverse voltage is applied during darkness. rise time t r time required for the output waveform to rise from 10% to 90% when light is applied. fall time t f time required for the output waveform to fall from 90% to 10% when light is cut. d 0 ?p ?h h l f p 2 p p 0 w w 1 w 0 w 2 anode side cathode side + 1.0 ? 0.5 + .039 ? .020 + 0.75 ? 0.5 + .030 ? .020 device mounted on tape cathode side anode side direction of picking 0.2 0.05 .008 .002 0.9 0.3 .035 .012 2.25 0.1 .089 .004 4.0 0.1 .157 .004 1.5 0.1 .059 .004 4.0 0.1 .157 .004 2.0 0.1 .079 .004 1.5 dia. +0.1 ?0 .059 dia. +.004 ?0 1.75 0.1 .069 .004 3.5 0.1 .138 .004 0.8 0.1 dia. .031 .004 dia. 8.0 0.2 .315 .008 2.0 0.5 .079 .020 11.4 1.0 .449 .039 178 2 dia. 7.008 .079 dia. 60 0.5 dia. 2.362 .020 dia. 9.0 0.3 .354 .012 21.0 0.8 dia. .827 .031 dia. 13.0 0.5 dia. .512 .020 dia. asctb242e 201209-t panasonic corporation automation controls business unit industrial.panasonic.com/ac/e
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