microwave 1-12 sales offices: visit our web site at http://www.temex-components.com square ceramic surface mountable pin diodes description these pin diodes are manufactured in a square package (smd) for surface mount applications. these packages utilize ceramic package technology with low inductance and axial terminations. this design simpli es automatic pick and place indexing and assembly. the termination contacts are tin lead plated for vapor or re ow circuit board soldering on printed circuit boards. these diodes are particularly suited for applications in frequency hopping radios, low loss, low distortion, and lters in hf, vhf and uhf frequencies. packages packages smd4 smd4am smd6 smd8 dh50107 -06 -20 dh50205 -06 -20 dh50206 -06 -20 dh50209 -06 -20 dh80050 -06 -40 -20 dh80051 -06 -40 -20 dh80052 -06 -40 -20 dh80053 -06 -40 -20 -24 dh80054 -06 -40 -20 -24 dh80055 -22 -24 dh80082 -06 -40 -20 -24 dh80100 -24 dh80102 -06 -24 dh80106 -24 how to order dh50103 - 06 t3 diode type package conditioning information -06: smd4 t1: 1000 pieces -40: smd4am tape & reel -20: sdm6 t3: 3000 pieces (except for dh80055:-22) tape & reel -24: smd8 blank: bulk silicon pin diodes square ceramic surface mountable pin diodes
microwave 1-13 electrical characteristics low voltage pin diodes breakdown total forward minority max. power v br capacitance series resistance carrier dissipation (v) ct (pf) r sf ( ? ) t l (?) 25? test ir = 10 ? vr = 6 v if = 10 ma if = 10 ma contact free conditions f = 1 mhz f = 120 mhz ir = 6 ma surface air type min. typ. max. max. min. w (2) w (3) dh50107 100 0.64 0.84 0.60 0.50 tbd tbd dh50205 200 0.41 0.47 1.00 0.80 tbd tbd dh50206 200 0.47 0.64 0.80 0.95 tbd tbd dh50207 200 0.64 0.84 0.70 1.00 tbd tbd dh50209 200 1.00 1.20 0.25 (1) 2.00 tbd tbd (1) rsf at if = 50 ma (2) diode brazed on in nite copper heat sink (3) diode brazed on epoxy circuit (pcb) medium voltage pin diodes applicable breakdown total capacitance forward series minority max. power voltage v vbr ct resistance rsf carrier dissipation (v) (v) (pf) ( ? ) l (s) 25 c test i < 10 a ir = 10 a vr = 50 v i= 100ma i= 200 ma if= 10ma contact free conditions f = 1mhz f= 120mhz f= 120 mhz ir= 6ma surface air type max. typ. typ. max. max. min. w (1) w (2) dh80050 500 550 0.40 0.45 0.70 0.65 1.1 3.0 1.2 dh80051 500 550 0.55 0.65 0.60 0.55 1.5 3.5 1.2 dh80052 500 550 0.85 1.05 0.40 0.35 2.0 4.0 1.2 dh80053 500 550 1.05 1.20 0.35 0.30 2.5 4.0 1.5 dh80054 500 550 1.25 1.35 0.30 0.27 3.0 4.5 1.5 dh80055 500 550 1.45 1.55 0.25 0.22 3.5 4.5 1.5 (1) diode brazed on in nite copper heat sink (2) diode brazed on epoxy circuit (pcb) silicon pin diodes square ceramic surface mountable pin diodes sales offices: visit our web site at http://www.temex-components.com
microwave 1-14 sales offices: visit our web site at http://www.temex-components.com medium voltage pin diodes applicable breakdown total capacitance forward series minority max. power voltage v vbr ct resistance rsf carrier dissipation (v) (v) (pf) ( ? ) t l (?) 25 c test i < 10 a ir = 10 a vr = 50 v i=100ma i=200 ma if=10ma contact free conditions f = 1mhz f=120mhz f=120 mhz ir=6ma surface air type max. typ. typ. max. max. min. w (1) w (2) dh80082 800 850 0.90 1.00 0.40 0.35 3.00 tbd tbd dh80100 1000 1100 0.55 0.65 0.70 0.60 3.00 tbd tbd dh80102 1000 1100 0.85 1.30 0.50 0.35 4.00 tbd tbd dh8 0 1 06 1 0 0 0 1 1 0 0 1 .25 2. 0 0 0.35 0.30 7 . 0 0 tbd tbd (1) diode brazed on intnite copper heat sink (2) diode brazed on epoxy circuit (pcb) temperature ranges operating junction (t j ) : -55 ? c to +150 ? c storage : -65 ? c to +150 ? c silicon pin diodes square ceramic surface mountable pin diodes series resistance vs. forward current series resistance vs. forward current 0.1 10 100 1000 i (ma) 1 10 100 r sf ( ? ) 0 dh80052 dh80050 0.1 10 100 1000 i (ma)0 1 10 100 r sf ( ? ) dh80053 dh80051
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