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- 1 - e06242 * super had ccd is a trademark of sony corporation. the s uper had ccd is a version of sony's high performance ccd had (hole-accumulation diode) sensor with s harply improved sensitivity by the incor poration of a new semiconductor technology developed by sony corporation. sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illu strating the operation of the devices. sony cannot as sume responsibility for any problems aris ing out of the use of these circuits. ICX614ALA diagonal 4.5mm (type 1/ 4) progressive scan ccd image sensor with square pixel for b/w cameras description the ICX614ALA is a diagonal 4.5mm (type 1/4) interli ne ccd solid-state image sensor with a square pixel array which supports vga format. progressive scan enabl es all pixel signals to be output separately within approximately 1/60 second. this chip features an electr onic shutter with variable charge-storage time which makes it possible to realize full-frame still images without a mechanical shutter. high sensitivity and low dark current are achieved through the adoption of had (hole-accumulation diode) sensors. this chip is suitable for applications such as security cameras and network cameras. features ? high sensitivity ? high saturation signal ? progressive scan enables individual readout of the image signals from all pixels. ? square pixel ? supports vga format ? horizontal drive frequency: supports 24.54mhz ? no voltage adjustments (reset gate and substrate bias need no adjustment.) ? high resolution, high sensitivity, low dark current ? continuous variable-speed shutter ? low smear ? excellent anti-blooming characteristics ? horizontal register: 3.3v drive ? 14-pin high accuracy plastic package (dual-surface reference available)
ICX614ALA - 2 - element structure ? interline ccd image sensor ? image size diagonal 4.5mm (type 1/4) ? number of effective pixels 659 (h) 494 (v) approx. 330k pixels ? total number of pixels 692 (h) 504 (v) approx. 350k pixels ? chip size 4.46mm (h) 3.80mm (v) ? unit cell size 5.6 m (h) 5.6 m (v) ? optical black horizontal (h) direction: front 2 pixels, rear 31 pixels vertical (v) direction: front 8 pixels, rear 2 pixels ? number of dummy bits horizontal: 16 vertical: 4 ? substrate material silicon optical black position (top view) 2 8 v h pin 1 pin 8 31 2
ICX614ALA - 3 - use restriction notice this use restriction notice (?notic e?) is for customers who are considering or currently using the ccd products (?products?) set forth in this specifications b ook. sony corporation (?sony?) may, at any time, modify this notice which will be available to you in the latest specifications book for the products. you should abide by the latest version of this notice. if a sony subsidiary or distributor has its own use restriction notice on the products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. you should consult a sales representative of the subsidiary or distributor of sony on such a use restriction notice when you consider using the products. use restrictions ? the products are intended for incorporation into such general electronic equipment as office products, communication products, measurement products, and hom e electronics products in accordance with the terms and conditions set forth in this specifications book and otherwise notified by sony from time to time. ? you should not use the products for critical applications which may pose a life- or injury- threatening risk or are highly likely to cause significant property damage in the event of failure of the products. you should consult your sony sales representative beforehand when y ou consider using the products for such critical applications. in addition, you should not use the products in weapon or military equipment. ? sony disclaims and does not assume any liability and damages arising out of misuse, improper use, modification, use of the products for the above-mentioned critical applications, weapon and military equipment, or any deviation from the requirements set forth in this specifications book. design for safety ? sony is making continuous efforts to further improv e the quality and reliability of the products; however, failure of a certain percentage of the products is inevitable. therefore, you should take sufficient care to ensure the safe design of your products such as component redundancy, anti-conflagration features, and features to prevent mis-operation in order to avoid accident s resulting in injury or death, fire or other social damage as a result of such failure. export control ? if the products are controlled items under the export control laws or regulations of various countries, approval may be required for the export of the products under the said laws or regulations. you should be responsible for compliance with the said laws or regulations. no license implied ? the technical information shown in this specifications book is for your reference purposes only. the availability of this specifications book shall not be construed as giving any indication that sony and its licensors will license any intellectual property rights in su ch information by any implication or otherwise. sony will not assume responsibility for any problems in conn ection with your use of such information or for any infringement of third-party rights due to the same. it is therefore your sole legal and financial responsibility to resolve any such problems and infringement. governing law ? this notice shall be governed by and construed in accordance with the laws of japan, without reference to principles of conflict of laws or choice of laws. all controversies and disputes arising out of or relating to this notice shall be submitted to the exclusive jurisdiction of the tokyo district court in japan as the court of first instance. other applicable terms and conditions ? the terms and conditions in the sony additional specif ications, which will be made available to you when you order the products, shall also be applicable to your use of the products as well as to this specifications book. you should review those terms and conditions w hen you consider purchasing and/or using the products.
ICX614ALA - 4 - block diagram and pin configuration (top view) pin description note) note) : photo sensor vertical register horizontal register v l v 1 v 3b v 2a v 2b v 4 7 6 5 4 2 1 v 3a 3 v out gnd sub h 1 h 2 v dd 8 9 10 11 13 14 rg 12 pin no. symbol description 1v 2b vertical register transfer clock 2v 2a vertical register transfer clock 3v 3a vertical register transfer clock 4v 3b vertical register transfer clock 5v 1 vertical register transfer clock 6v 4 vertical register transfer clock 7v l protective transistor bias 8v out signal output 9v dd supply voltage 10 gnd gnd 11 sub substrate clock 12 rg reset gate clock 13 h 1 horizontal register transfer clock 14 h 2 horizontal register transfer clock
ICX614ALA - 5 - absolute maximum ratings *1 +24v (max.) is guaranteed when clock width < 10 s, clock duty factor < 0.1%. bias conditions *1 v l setting is the v vl voltage of the vertical clock waveform, or the same voltage as the v l power supply for the v driver should be used. *2 do not apply a dc bias to the substrate clock and reset gate clock pins, because a dc bias is generated internally. dc characteristics item ratings unit remarks against sub v dd , v out , rg ? sub ?40 to +13 v v 2a , v 2b , v 3a , v 3b ? sub ?50 to +15 v v 1 , v 4 ? sub ?50 to +0.3 v h 1 , h 2 , gnd ? sub ?40 to +0.3 v against gnd v dd , v out , rg ? gnd ?0.3 to +18 v v 1 , v 2a , v 2b , v 3a , v 3b , v 4 ? gnd ?10 to +18 v h 1 , h 2 ? gnd ?10 to +5 v against v l v 2a , v 2b , v 3a , v 3b ? v l ?0.3 to +28 v v 1 , v 4 , h 1 , h 2 ? v l ?0.3 to +15 v between input clock pins potential difference between vertical clock input pins to +15 v *1 h 1 ? h 2 ?5 to +5 v h 1 , h 2 ? v 3 ?13 to +13 v storage temperature ?30 to +80 c operating temperature ?10 to +60 c item symbol min. typ. max. unit remarks supply voltage v dd 14.55 15.0 15.45 v protective transistor bias v l *1 substrate clock sub *2 reset gate clock rg *2 item symbol min. typ. max. unit remarks supply current i dd 6.0 ma
ICX614ALA - 6 - clock voltage conditions item symbol min. typ. max. unit waveform diagram remarks readout clock voltage v vt 14.55 15.0 15.45 v 1 vertical transfer clock voltage v vh02a ?0.05 0 0.05 v 2 v vh = v vh02a v vh1 , v vh2 (a, b) , v vh3 (a, b ), v vh4 ?0.2 0 0.05 v 2 v vl1 , v vl2 (a, b) , v vl3 (a, b) , v vl4 ?5.8 ?5.5 ?5.2 v 2 v vl = (v vl1 + v vl3 (a, b) )/2 v 1 , v 2 (a, b) , v 3 (a, b) , v 4 5.0 5.5 5.85 v 2 | v vl3 (a, b ), v vl4 ? v vl | 0.1 v 2 v vhh 0.3 v 2 high-level coupling v vhl 1.0 v 2 high-level coupling v vlh 0.5 v 2 low-level coupling v vll 0.5 v 2 low-level coupling horizontal transfer clock voltage v h 3.0 3.3 5.25 v 3 v hl ?0.05 0 0.05 v 3 reset gate clock voltage v rg 3.0 3.3 5.5 v 4 v rglh ? v rgll 0.4 v 4 low-level coupling v rgl ? v rglm 0.5 v 4 low-level coupling substrate clock voltage v sub 19.75 20.5 21.25 v 5
ICX614ALA - 7 - clock equivalent circuit constants item symbol min. typ. max. unit remarks capacitance between vertical transfer clock and gnd c v1 1000 pf c v2a , c v2b 820 pf c v3a , c v3b 390 pf c v4 1500 pf capacitance between vertical transfer clocks c v12a , c v12b 56 pf c v13a , c v13b 2pf c v14 180 pf c v2a3a , c v2b3b 220 pf c v2a4 , c v2b4 270 pf c v3a4 , c v3b4 180 pf capacitance between horizontal transfer clock and gnd c h1 15 pf c h2 15 pf capacitance between horizontal transfer clocks c hh 47 pf capacitance between reset gate clock and gnd c rg 5pf capacitance between substrate clock and gnd c sub 270 pf vertical transfer clock series resistor r 1 47 r 2a , r 2b 91 r 3a , r 3b 68 r 4 24 vertical transfer clock ground resistor r gnd 47 horizontal transfer clock series resistor r h1 , r h2 15 reset gate clock series resistor r rg 56 r 3a v 3a r 2b v 2b v 2a r 2a r 1 v 1 c v2a c v1 c v2b c v3b c v3a c v4 r 4 v 4 v 3b r 3b r gnd h 1 h 2 c h1 c h2 c hh r h r h r rg rg c rg vertical transfer clock equivalent circuit horizontal transfer clock equivalent circuit reset gate clock equivalent circuit
ICX614ALA - 8 - drive clock waveform conditions 1. readout clock waveform 2. vertical transfer clock waveform v vh = (v vh1 + v vh2 (a, b) )/2 v vl = (v vl3 (a, b) + v vl4 )/2 v v = v vh n ? v vl n (n = 1 to 4) 100% 90% 10% 0% tr tf 0v twh m 2 m v vt v vh1 v vhh v vhl v vh v vlh v vl1 v vll v vhl v vhh v vl v vhh v vh v vlh v vll v vl v vhl v vl3 (a, b) v vhl v vh3 (a, b) v vhh v vh2 (a, b) v vhh v vhh v vhl v vhl v vh v vlh v vl2 (a, b) v vll v vl v vh v vl v vhl v vlh v vll v vhl v vh4 v vhh v vhh v vl4 v 1 v 3a , v 3b v 2a , v 2b v 4
ICX614ALA - 9 - 3. horizontal transfer clock waveform cross-point voltage for the h 1 rising side of the horizontal transfer clocks h 1 and h 2 waveforms is v cr . the overlap period for twh and twl of horizontal transfer clocks h 1 and h 2 is ?two?. 4. reset gate clock waveform v rglh is the maximum value and v rgll is the minimum value of the coupl ing waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v rg = v rgh ? v rgl negative overshoot level during the falling edge of rg is v rglm . 5. substrate clock waveform h 1 h 2 10% 90% twh tf tr twl v hl v h two v cr v h 2 rg waveform v rglh v rgh v rgl v rgll v rglm tr twh twl tf v rg point a 100% 90% 10% 0% v sub (a bias generated internally) tr tf twh m 2 m v sub
ICX614ALA - 10 - clock switching characteristics *1 when vertical transfer clock driver cxd1267an is used. *2 tf tr ? 2ns, and the cross-point voltage (v cr ) for the h 1 rising side of the h 1 and h 2 waveforms must be at least v h /2[v]. spectral sensitivity characteristics (excludes lens characteristics and light source characteristics) item symbol twh twl tr tf unit remarks min. typ. max. min. typ. max. min. typ. max. min. typ. max. readout clock v t 1.8 2.0 0.5 0.5 s during readout vertical transfer clock v 1 , v 2 (a, b) , v 3 (a, b) , v 4 15 250 ns *1 horizontal transfer clock during imaging h 1 10.5 14.6 10.5 14.6 6.4 10.5 6.4 10.5 ns *2 h 2 10.5 14.6 10.5 14.6 6.4 10.5 6.4 10.5 during parallel- serial conversion h 1 0.001 s h 2 0.001 reset gate clock rg 6 8 25.8 43ns substrate clock sub 0.63 0.73 0.5 0.5 s when draining charge item symbol two unit remarks min. typ. max. horizontal transfer clock h 1 , h 2 10.5 14.6 ns 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 400 500 600 700 800 900 1000 wavelength [nm] relative response
ICX614ALA - 11 - image sensor characteristics (ta = 25 c) zone definition of video signal shading measurement system note) adjust the amplifier gain so that the gain between [ * a] and [ * b] equals 1. item symbol min. typ. max. unit measurement method remarks sensitivity s 640 800 mv 1 1/30s accumulation saturation signal vsat 650 mv 2 ta = 60 c smear sm ?92 ?102 db 3 video signal shading sh 20 % 4 zone 0 and i 25 % 4 zone 0 to ii ? dark signal vdt 4 mv 5 ta = 60 c, 1/30s accumulation dark signal shading vdt 1 mv 6 ta = 60 c, 1/30s accumulation lag lag 0.5 % 7 12 v 10 12 12 10 ignored region effective pixel region zone 0, i zone ii , ii' v 10 h 8 h 8 659 (h) 494 (v) ccd c.d.s s/h amp ccd signal output [ ? a] test point [ ? b]
ICX614ALA - 12 - image sensor characteristics measurement method measurement conditions 1. in the following measurements, the device drive condit ions are at the typical values of the bias and clock voltage conditions. 2. in the following measurements, spot pixels are excluded and, unless otherwise specified, the optical black level (ob) is used as the reference for the signal output, which is taken as the value measured at point [ * b] of the measurement system. definition of standard imaging conditions ? standard imaging condition i : use a pattern box (luminance: 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard l ens with cm500s (t = 1.0mm) as an ir cut filter and image at f8. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. ? standard imaging condition ii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity set to the standard imaging condition i . after setting the electronic shutter mode with a shutter speed of 1/100s, measure the signal output (v s ) at the center of the screen and substitute the value into the following formula. s = v s (100/30) [mv] 2. saturation signal set to the standard imaging condition ii . after adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 150mv, measure the minimum value of the signal output. 3. smear set to the standard imaging condition ii . with the lens diaphragm at f5.6 to f8, first adjust the average value of the signal output to 150mv. after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blank ings, measure the maximum value (vsm [mv]) of the signal output and substitute the value into the following formula. sm = 20 log {(vsm/150) (1/500) (1/10)} [db] (1/10v method conversion value) 4. video signal shading set to the standard imaging condition iii . with the lens diaphragm at f5.6 to f8, adjusting the luminous intensity so that the average value of the signal out put is 150mv. then measure the maximum value (vmax [mv]) and minimum value (vmin [mv]) of the signal and substitute the values into the following formula. sh = (vmax ? vmin)/150 100 [%] 5. dark signal measure the average value of the signal output (v dt [mv]) with the device ambient temperature of 60 c and the device in the light-obstructed state, using t he horizontal idle transfer level as a reference. 6. dark signal shading after the measurement item 5, measure the maximum (vdmax [mv]) and minimum (vdmin [mv]) values of the dark signal output and substitute the values into the following formula. vdt = vdmax ? vdmin [mv]
ICX614ALA - 13 - 7. lag adjust the signal output value generated by strobe light to 150mv. after setting the strobe light so that it strobes with the following timing, measure the residual si gnal (vlag). substitute the value into the following formula. lag = (vlag/150) 100 [%] light signal output 150mv vlag (lag) vd v2a strobe light timing output
ICX614ALA - 14 - drive circuit 22/16v 0.1 ?5.5v 3.3/16v 1/35v 1m h 1 h 2 rg sub v dd v out v 2b v 2a v 3a v 3b v 4 22/20v 15v xsub xv1 xv2 xsg1 xv3 xsg2 xv4 h 1 h 2 rg 3.3/20v 0.01 100 v l icx614 (bottom view) cxd1267an 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 1 2 3 4 6 7 14 13 12 11 9 gnd v 1 5 10 8 2200p 100k 0.1 ccd out 2.2k 2sc4250
ICX614ALA - 15 - drive timing chart readout portion v1 v2a/v2b v3a/v3b v4 62 107 89 71 h1 44 780 1 44 116 780 1 44 116 #1 #3 #4 780 1 44 116 80 98 520 530 521 570 580 40.7ns (1 bit) 2.04s (50 bits)
ICX614ALA - 16 - drive timing chart vertical sync vd hd 1 2 3 10 4 7 5 6 8 9 v1 v2a/v2b v4 ccd out 1 2 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10 493 494 525 v3a/v3b 1 2 3 10 4 7 5 6 8 9 525 510 520 500
ICX614ALA - 17 - drive timing chart horizontal sync v1 clk clk v2a/v2b v3a/v3b v4 sub blk hd 1 78 780 (0) 140 13 31 9 9 9 9 9 9 9 9 16 h1 h2 h2 6 44 53 62 71 80 89 89 98 107 107 2
ICX614ALA - 18 - notes on handling 1. static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. (1) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. (2) use a wrist strap when handling directly. (3) install grounded conductive mats on the floor and working table to prevent the generation of static electricity. (4) ionized air is recommended for discharge when handling ccd image sensors. (5) for the shipment of mounted boards, use boxes treated for the prevention of static charges. 2. soldering (1) make sure the package temperature does not exceed 80 c. (2) solder dipping in a mounting furnace causes damage to the glass and other defects. use a 30w soldering iron with a ground wire and solder each pi n in 2 seconds or less. for repairs and remount, cool sufficiently. (3) to dismount an image sensor, do not use solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero-cross on/off type and connect it to ground. 3. protection from dust and dirt image sensors are packed and delivered with care tak en to protect the element glass surfaces from harmful dust and dirt. clean glass surfaces with the following operations as required before use. (1) perform all lens assembly and other work in a clean room (class 1000 or less). (2) do not touch the glass surface with hand and make any object contact with it. if dust or other is stuck to a glass surface, blow it off with an air blower. (f or dust stuck through static electricity, ionized air is recommended.) (3) clean with a cotton bud and ethyl alcohol if grease stained. be careful not to scratch the glass. (4) keep in a dedicated case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. (5) when a protective tape is applied before shipping, remove the tape applied for electrostatic protection just before use. do not reuse the tape. 4. installing (attaching) (1) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) (2) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. (3) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear su rface. therefore, the adhesive should not be applied to this area, and indicated values should be tr ansferred to the other locations as a precaution. (4) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. cover glass 50n compressive strength 50n torsional strength 1.2nm plastic package
ICX614ALA - 19 - (5) if the lead bend repeatedly and the metal, etc., clash or rub against the package, dust may be generated by the fragments of resin. (6) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5. others (1) do not expose to strong light (sun rays) for long periods, as color filters will be discolored. when high luminance objects are imaged with the exposure level controlled by electronic-iris, the luminance of the image-plane may become excessive and discoloration of the color filters may be accelerated. in such a case, arrangements such as using an automatic iris with the imaging lens or automatically closing the shutter during power-off are advisable. for continuous use under harsh conditions exceeding the normal conditions of use, consult your sony representative. (2) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or use in such conditions. (3) brown stains may be seen on the bottom or side of the package. but this does not affect the ccd characteristics. (4) this package has 2 kinds of internal structure. however, their package outline, optical size, and strength are the same. the cross section of lead frame can be seen on the side of the package for structure a. structure a structure b chip metal plate (lead frame) package cross section of lead frame
ICX614ALA - 20 - sony corporation package outline (unit: mm) 2.5 7.0 2.5 1.0 0.5 5.0 14 5.0 1 8.9 7 10.0 0.1 8.9 10.0 0.1 8 10.16 0.25 8 14 7 1 1.7 1.7 7.0 2.5 1.0 3.35 0.15 2.6 3.5 0.3 1.27 0.3 0.46 1.27 14 pin dip (400mil) 0.3 v h 1. ?a? is the center of the effective image area. 2. the two points ?b? of the package are the horizontal reference. the point ?b'? of the package is the vertical reference. 3. the bottom ?c? of the package, and the top of the cover glass ?d? are the height reference. 4. the center of the effective image area relative to ?b? and ?b'? is (h, v) = (5.0, 5.0) ?0.15mm. 5. the rotation angle of the effective image area relative to h and v is ?1?. 6. the height from the bottom ?c? to the effective image area is 1.41 ?0.10mm. the height from the top of the cover glass ?d? to the effective image area is 1.94 ?0.15mm. 7. the tilt of the effective image area relative to the bottom ?c? is less than 25?. the tilt of the effective image area relative to the top ?d? of the cover glass is less than 25?. 8. the thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. the notch of the package is used only for directional index, that must not be used for reference of fixing. 10. cover glass defect edge part length : no matter, width : less than 0.5mm, depth : less than the thickness of the glass. corner part length : less than 1.5mm, depth : less than the thickness of the glass. c d b a b' ~ ~ ~ m package structure package material lead treatment lead material package mass plastic gold plating 42 alloy 0.60g drawing number as-d3-02(e) 0? to 9?

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