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amis-30663 high speed can transcei ver data sheet 1.0 introduction t he amis-30663 can tra n sc eiver is the inte rf ace bet w e en a control l er ar e a net w o rk (ca n ) protoco l con t roller a nd the ph ysic al bu s an d may be used in both 12v and 24v s y stems . t he digital int e rface lev e l is po w e red from a 3.3v supply providing true i/o voltage l eve l s for 3.3v can control l ers. t he transceive r provi des d i fferentia l transmit capa bil i t y to t he b u s a nd d i fferentia l rece iv e cap abi lit y to the can c ontr o ller. d ue to t h e w i de c o mmon- mode vo ltag e rang e of the receiv er inp u ts, the amis-306 63 is a b le to reac h o u tstand ing l e vels of electroma gne t i c suscepti b il it y ( e ms). similarl y, e x tremel y l o w e l ectroma g n e tic emissio n (eme) is achi e v ed b y th e e xcelle nt matchi ng of the outp ut signals. 2.0 key features ? f u ll y c o mp atibl e w i t h the ?iso 1189 8-2? stan dard ? certifie d ?authenticati on o n c a n t r ansceive r conforma nce (d1.1)? ? high s pee d (up to 1mbit/s) ? ideal l y s u ite d for 12v an d 24 v i ndustri a l an d automotiv e a pplic atio ns ? lo w eme com m on-mo de-ch o k e is no lo ng er requ ired ? differenti a l rec e iver w i t h w i d e common-mo d e rang e (+ /- 35v) for high em s ? no distur banc e of the bus lin e s w i th an un- po w e re d nod e ? t r ansmit data (t xd) domin ant time-out functi on ? t hermal protec tion ? bus pins pr ote c ted aga inst trans i ents in a n automotiv e env ironme n t ? short circuit pr oof to supp l y v o ltag e an d gro und ? log ic leve l in p u ts compatib le w i t h 3.3v dev ic es ? esd protectio n level for can bus up to 8kv 3.0 technical characteristics table 1: technic a l characteristics sy mbo l parameter con d iti ons min max unit v ca nh dc voltage at pin canh 0 < vcc < 5.25v ; no time limit -45 +45 v v ca nl dc voltage at pin canl 0 < vcc < 5.25v ; no time limit -45 +45 v vi(dif)(bus_dom) differential bus output voltage in dominant state 42.5 ? < rlt < 6 0 ? 1 . 5 3 v tpd(rec- dom) propagation dela y t x d to rxd figure 7 100 230 ns t p d (do m -re c) propagation dela y t x d to rxd figure 7 100 245 ns cm-ran ge input common-m ode range for comparator guar anteed diffe rential receiver threshold and lea k age current -35 +35 v v c m - peak common-mo de peak figure 8 an d figure 9 n o te) - 5 0 0 5 0 0 m v v cm-st e p common-mo de step figure 8 an d figure 9 n o te) -150 150 mv note: the p a rameters vcm-peak and vcm-step guar ante e low eme. 4.0 ordering information marketin g na m e package tem p . ra nge amis 30663n ga soic- 8 green -40c ? 125 c 1 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.amis.com speci f i c atio ns subj ect to chang e w i tho u t n o ti ce
amis-30663 high speed can transcei ver data sheet 5.0 block dia g ram f i gure 1: b l ock diagram can h can l a m i s - 3 0 663 gn d rx d v cc 2 7 6 5 ti m e r 1 driver co nt r o l th e r m a l sh ut d o w n 8 4 p c 200 4101 2.1 tx d 3 v re f co m p v cc / 2 + r i( c m ) r i( c m ) v 33 v cc v 33 's' 6.0 typical application 6.1 a p p licatio n sch e matic f i gure 2: a pplication diagram am i s - 3 0663 canh canl gnd rx d tx d vref 2 1 3 4 5 6 7 8 p c 200 40 919 .1 v cc ca n co nt ro ller vbat 5 v -re g in o u t 47 n f 60 ? 60 ? can bus 47 nf 60 ? 60 ? 3.3v- re g in ou t v 33 v cc gn d 2 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.amis.com speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet 6.2 pin descrip tio n 6.2.1. pin out (top view ) f i gure 3: p i n configuratio n 5 6 7 8 1 2 3 4 tx d rx d v 33 v ref gnd canl canh v cc amis- 30663 p c 20040918.8 6.2.2. pin descri p tio n table 2: pin out pin name descrip tion 1 txd transmit data in put; low input dominant driver; i n ternal pull-up cu rrent 2 gnd grou nd 3 v cc s u p p l y v o l t a g e 4 rxd receive data out put; dominant tr a n smitter lo w o u tput 5 v ref reference voltag e output 6 canl low-level can bus line (low in d o minant mode) 7 canh high -level can bus li ne (high in dominant mode) 8 v 33 3.3v suppl y for d i gital i/o 7.0 functional description 7.1 general t he amis-306 63 is the interf ace bet w e en the c a n protoc ol co ntrol l er an d the ph ys ical bus. it is i n ten ded for us e i n automotiv e and ind u strial a ppl i c ations re quir i ng ba ud rates up to 1mba ud. it pr ovides differenti a l transm i t capab ilit y t o the bus a nd diff eren ti al rece iv er capa bil i t y to th e can protoc ol controll er. it is full y c o mp atibl e to the ?iso 1 189 8-2? stan da rd. 7.2 op eratin g mod es amis-3066 3 o n l y op erates i n hig h -spe ed mo de as il lustrate d in t able 3. t he transceive r is abl e to co mmunicat e via the bus l i nes. t he signals ar e transmitted a nd rece ive d to the can co ntroller v i a th e pi n s t x d and r x d. t he slopes on the bus li nes o u tputs are o p ti mised to giv e e x treme l y lo w e m e. 3 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.amis.com speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet tabl e 3: fu ncti on tabl e (x = don ' t care) 4.75v < vcc < 5.25v pin bus mode txd rxd state ca n h ca n l 0 0 domi nant hi gh lo w hi gh speed 1 1 r e cessive 0.5 vcc 0.5 vcc vcc < porl pin bus mode txd rxd state ca n h ca n l - x 1 r e cessive 0 < v canh < v cc 0 < vcanl < vcc porl < vcc < 4.75v pin bus mode txd rxd state ca n h ca n l - > v ih 1 r e cessive 0 < vcanh < vcc 0 < vcanl < vcc 7.3 o v e r -te mp era t u r e dete ctio n a thermal prot ection circ uit pr otects the ic from dama ge b y s w itch in g off the transmitter i f the junction t e mper ature e xceeds a va lue of appr o x imate l y 160 c. beca u s e the tra n smi tter di ssip a tes most of the po w e r, the p o w e r d i ssip a tio n an d temp er ature of th e i c is reduc ed. all other ic functio n s contin ue to o perate. t he transmitter off-state re sets w h e n pin t x d g oes high. t he thermal prote ction circuit is partic u larl y nee de d w h e n a bus l i n e short circuits. 7 . 4 tx d domina nt time -out fu n c tion a t x d d o min a n t time-o ut tim e r circu i t pr eve n ts the bus li n e s from bei ng drive n to a per mane nt d o min ant state ( b l o c k ing al l n e t w or k communic a tio n ) if pin t x d is forced p e rman entl y low b y a har d w ar e an d/or soft w a re a pplic atio n fail ur e. t he timer is triggere d b y a neg ative e dge on pi n t x d. if the dur at io n of the low - leve l on pi n t x d exc eeds the i n tern al timer val ue t dom , the transmitter is disabled, drivin g the b u s into a recess iv e state. t he ti mer is reset b y a positive e d g e on pi n t x d. 7.5 f a il-safe f eat u r es a curre nt-limiti ng c i rcuit prot ects the tra n s m itter outp u t s t age from da mage caus ed b y acc i de ntal short-circuit t o eith er p o sit iv e or neg ative su ppl y volt age - alth oug h po w e r dis s ipat i on incr ea ses duri ng this fault cond itio n. t he pins can h and ca nl ar e protected fr o m automotive electric al transi ents (a ccord in g to ?iso 7637 ?; see f i gure 4) . shou ld t x d be come disc onn e c ted, this pin is pull ed hi gh i n terna l l y . w hen the vcc supp l y is remo ved, pins t x d and r x d w i ll b e floatin g. t h is prevents the amis-3066 3 from bei ng sup p lied b y th e ca n controller through the i/o pins. 7.6 3.3v in terface amis-3066 3 m a y be us ed to interface w i th 3. 3v or 5v co ntroll ers b y us e of the v 33 pi n. t h is pin m a y be s u p p li ed w i t h 3.3 v or 5 v to have the c o rre spon din g di gita l interface vo lta ge lev e ls. w hen th e v 33 pin is su ppl ie d at 2.5v, ev en i n terfacin g w i t h 2.5v can cont rollers is p o ssi ble. se e a l so digita l outp ut char acteristics @ v 33 = 2.5v, t a ble 7. in this ca se a pul l resist or from t x d to v 33 is necessar y . 4 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet 8.0 electrical characteristics 8 . 1 de finitions all volta ges ar e referenc ed to gnd (pin 2). positive curr en ts fl o w i n to the ic. sinking cu rrent means th at the current i s flo w i ng i n to the pin. sourc i n g current mea n s that the curre nt is flo w in g out o f the pin. 8.2 a b so lu te maxi mu m ratin g s stresses a bov e thos e l i sted in t able 4 m a y c aus e p e rm ane nt d e vi ce failure. ex posure to abso l ute ma ximum rati ngs for e x te nd ed peri ods ma y ef fect device rel i abil i t y . tabl e 4: absol u t e maxi mum rati ngs sy mbo l parameter con d iti ons min. max. unit v cc suppl y vol t age -0.3 +7 v v 33 i/o i n terface vol t age -0.3 +7 v v ca nh dc vol t age at pi n canh 0 < v cc < 5.25v; no ti me l i m i t -45 +45 v v ca nl dc vol t age at pi n canl 0 < v cc < 5.25v; no ti me l i m i t -45 +45 v v tx d dc vol t age at pi n txd -0.3 v cc + 0.3 v v rx d dc vol t age at pi n rxd -0.3 v cc + 0.3 v vref dc vol t age at pi n vref -0.3 vcc + 0.3 v v tra n ( ca nh) transi ent vol t age at pi n canh note 1 -150 +150 v v tra n ( ca nl ) transi ent vol t age at pi n canl note 1 -150 +150 v v tr an( vr ef) transi ent vol t age at pi n vref note 1 -150 +150 v v e s d ( ca nl /ca nh) el ectrostati c di scharge vol t age at canh and can l pi n note 2 note 5 -8 -500 +8 +500 kv v v esd el ectrostati c di scharge vol t age at al l other pi ns note 3 note 5 -4 -250 + 4 +250 kv v latch-up stati c l a tch-up at al l pi ns note 4 100 ma t st g storage temp era t ure -55 +155 c t am b ambi ent tempera t ure -40 +125 c t j unc maxi mum j uncti on temperatu r e -40 +150 c not e s: 1) appli ed tran sien t w a v e forms in a c co rdance w i th ? i so 7 637 par t 3?, test pul ses 1 , 2 , 3a, and 3 b ( s ee figu re 4 ) . 2) s t andardi zed hu man body model system esd pulses in accord ance to iec 1000 .4.2 . 3) s t andardi zed hu man body model e s d pul ses in accor dance to mil883 m e thod 3015 . s upply pin 8 i s 4kv . 4) s t ati c latch- up i m munity : stati c latch-up pro t e c tion l e vel w hen te sted a ccording to eia/jesd 78. 5) s t andardi zed ch arged dev ice model esd p u lse s w hen teste d a c cording to eos/e s d ds5 . 3-1 993. 8.3 t h e rmal ch ar acte r istics tabl e 5: th ermal characteri sti cs sy mbo l parameter con d iti ons value unit r th( v j - a) thermal r e si stance from j uncti on to ambi ent i n so8 package in free ai r 145 k/w r th( v j - s ) thermal r e si stance from j uncti on to substrate of ba re di e in free air 45 k/w 5 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet 8.4 dc ch ara c te ristics tabl e 6: cha r act e ri sti cs v cc = 4.75 to 5.25v; v 33 = 2.9v to 3.6v; t jun c = -40 to + 150 c; r lt = 6 0 ? unless sp ecifie d other w i s e . sy mbo l parameter con d iti ons min. ty p . max. unit suppl y (pi n v cc and pin v 33 ) i cc suppl y curre nt domi nant; v tx d = 0v r e cessive; v tx d = v cc 45 4 65 8 ma ma i 33 i/o i n terface cur r ent v 33 = 3.3v; c l = 20pf; recessive 1 a i 33 i/o i n terface cur r ent (1 ) v 33 = 3.3v; c l = 20pf; 1mbps 1 7 0 a trans m itter data inp u t (pin txd ) v ih hig h -l evel i nput vol t age o u tput recessi ve 2.0 - v cc v v il lo w-l e vel i nput vol t age o u tput d o mi nant -0.3 - +0.8 v i ih hig h -l evel i nput current v tx d = v 33 - 1 0 + 1 a i il lo w-l e vel i nput current v tx d = 0v -50 -200 -300 a c i input capaci t ance (1 ) - 5 1 0 p f recei v e r da ta outp ut (pin rxd ) v oh hig h -l evel outpu t vol t age i rxd = - 10 ma 0.7 x v 33 0.75 x v 33 v v ol lo w-l e vel outpu t vol t age i rxd = 5ma 0.18 0.35 v i oh hig h -l evel outpu t current (1 ) v rx d = 0. 7 x v 33 - 1 0 - 1 5 - 2 0 m a i ol lo w-l e vel outpu t current (1 ) v rx d = 0. 45v 5 10 15 ma referen ce vol t a g e out put (pi n v ref ) v re f reference ou tput vol t age -50 a < i vr ef < +50 a 0.45 x v cc 0.50 x v cc 0.55 x v cc v v re f_ cm reference ou tput vol t age for ful l common- mode rang e -35v < v ca nh < +35v; -35v < v ca nl < +35v 0.40 x v cc 0.50 x v cc 0.60 x v cc v bus li nes (pi n s c a n h a nd c a n l ) v o (re ce s)(ca nh) recessi ve bus vol t age at pi n ca nh v tx d = v cc ; no l o ad 2 . 0 2 . 5 3 . 0 v v o (re ce s)(ca n l ) recessi ve bus vol t age at pi n ca nl v tx d = v cc ; no l o ad 2.0 2.5 3.0 v i o (re ce s) (ca nh) recessi ve output current at pi n c a nh -35v < v ca nh < +35v; 0v < v cc < 5.25 v - 2 . 5 - + 2 . 5 m a i o (re ce s) (ca n l ) recessi ve output current at pi n c a nl -35v < v ca nl < +35v; 0v < v cc < 5.25 v -2.5 - +2.5 ma v o( do m) ( c an h ) domi nant output vol t age at pi n canh v tx d = 0v 3 . 0 3 . 6 4 . 2 5 v v o( do m) ( c an l) domi nant output vol t age at pi n canl v tx d = 0v 0. 5 1.4 1.75 v v tx d = 0v; domi nant; 42.5 ? < r lt < 60 ? 1 . 5 2 . 2 5 3 . 0 v v i ( di f ) ( bus) di fferenti a l bus i nput vol t age ( v can h - v ca nl ) v tx d = v cc ; recessive; no l oad - 1 2 0 0 + 5 0 m v i o(sc) (canh) short ci rcui t output current at pi n canh v ca nh = 0v; v tx d = 0v -45 -70 -95 ma i o(sc) (canl) short ci rcui t output current at pi n canl v ca nl = 36v; v tx d = 0v 4 5 7 0 1 2 0 m a v i ( di f ) ( t h) di fferenti a l recei v er threshol d vol t age -5v < v ca nl < +12v; -5v < v ca nh < + 12v; see fi gure 5 0.5 0.7 0.9 v v ih cm (d i f ) (t h ) di fferenti a l recei v er threshol d vol t age for hi gh common-m ode -35v < v ca nl < +35v; -35v < v ca nh < +35v; see fi gure 5 0 . 2 5 0 . 7 1 . 0 5 v v i(d i f ) (h y s ) di fferenti a l recei v er i nput vol t age h y steresi s -35v < v ca nl < +35v; -35v < v ca nh < +35v; see fi gure 5 50 70 100 mv 6 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet tabl e 6: cha r act e ri sti cs (cont.) sy mbo l parameter con d iti ons min. ty p . max. unit bus li nes (pi n s c a n h a nd c a n l ) r i(cm )(ca nh) common-mo de i nput resi stance at pi n canh 1 5 2 5 3 7 k ? r i(cm ) (ca n l ) common-mo de i nput resi stance at pi n canl 15 25 37 k ? r i(cm )(m ) matchi ng bet w e e n pi n canh and pi n canl common-mode i nput resi stance v ca nh = v ca nl - 3 0 + 3 % r i(d i f ) di fferenti a l i nput resi stance 25 50 75 k ? c i(ca nh) input capaci t ance at pi n canh v tx d = v cc ; not t e sted 7 . 5 2 0 p f c i(ca nl ) input capaci t ance at pi n canl v tx d = v cc ; not t e sted 7.5 20 pf c i(d i f ) di fferenti a l i nput capaci t ance v tx d = v cc ; not t e sted 3 . 7 5 1 0 p f i l i (ca nh) input l eakage cur r ent at pi n can h v cc = 0v; v ca nh = 5v 10 170 250 a i li( c an l) input l eakage cur r ent at pi n can l v cc = 0v; v ca nl = 5v 1 0 1 7 0 2 5 0 a v c m - peak common-mo de peak duri ng tra n s i t i on from dom rec or rec dom fi gure 8 an d fi gure 9 -500 500 mv v cm-st e p di fference i n common-mode bet w e en domi nant and r e cessive state fi gure 8 an d fi gure 9 - 1 5 0 1 5 0 m v sy mbo l parameter con d iti ons min. ty p . max. unit po w e r on reset po r l p o r l e v e l canh, can l , v re f in tri- state bel ow p o r l e vel 2 . 2 3 . 5 4 . 7 v therm al sh utd o w n t j(sd) shutdo w n j uncti on temperatu r e 150 160 180 c timi ng c h aract eristics ( see fi g u res 6 an d 7) t d( t x d - bu son) del a y t x d t o bus acti ve 40 85 110 ns t d( t x d - bu so ff ) del a y t x d t o bus i nacti ve 30 60 110 ns t d( bu so n- r x d ) del a y bus acti ve to rxd 25 55 110 ns t d( bu so ff - r x d ) dela y bus inactive to rxd 65 100 135 ns t p d (re c-d o m ) propagati on del a y t x d to rxd fro m recessi ve to domi nant 1 0 0 2 3 0 n s t d ( d o m -re c) propagati on del a y t x d to rxd fro m domi nant to rece ssi ve 100 245 ns t do m( t x d ) txd domi nant ti me for ti me out v tx d = 0v 2 5 0 4 5 0 7 5 0 s n o te: 1) not test ed on ate. tabl e 7: di gi tal o u tput characte r i sti c s @ v33 = 2.5v v cc = 4.75 to 5.25v; v 33 = 2.5v 5%; t ju n c = -40 to + 150 c; r lt = 6 0 ? unl ess specifi ed o t her w i se. sy mbo l parameter con d iti ons min. ty p . max. unit recei v e r da ta outp ut (pin rxd ) i oh hig h -l evel outpu t current v oh > 0.9 x v 33 - 2 . 6 m a i ol lo w-l e vel outpu t current v ol < 0.1 x v 33 4 ma 7 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet 8.5 measu r e men t set-u p s an d d e fin i tion s figure 4: test cir c uit for automotive transients am i s - 3 066 3 gn d 2 canh ca n l v re f 5 6 7 p c 2 0040 918.9 rx d 4 tx d 1 1 nf 20 pf 1 nf t r an s i en t generator 100 n f v cc 1 00 nf +5 v +3 .3 v v 33 3 8 figure 5: hysteres is of the rece iver v rx d v i ( di f )(h ys ) hi g h low 0,5 0,9 p c 2 004 0829 .7 hyst er e s i s 8 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet f i gure 6: test cir c uit for timing characteristics am i s - 3 0663 gn d 2 canh canl v ref 5 6 7 r lt c lt p c 200409 18.10 rx d 4 tx d 1 60 ? 100 pf 20 pf 10 0 nf v cc 100 nf +5 v +3. 3 v v 33 3 8 f i gure 7: timing diagram for a c characteristics ca n h can l tx d rx d dom i n ant 0, 9 v 0, 5v re c e ss iv e 0, 7 x v 33 v i(dif ) = v canh - v canl t d( t x d- buson ) t d( buson - rx d) t pd (re c- do m ) t d( t x d- busof f ) t d( busof f - rx d) t pd( d o m - re c) pc2 0 0 408 29 . 6 0, 3 x v 33 hi g h lo w 9 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet f i gure 8: b a sic test set- up for e l ectr o magnetic measur ement 10 nf am i s - 30663 gnd 2 canh canl v ref 5 6 7 p c 20040918.11 rx d 4 txd 1 30 ? ac tiv e probe 20 pf g enerator 30 ? 6.2 k ? 47 nf 6.2 k ? spectrum anay z e r v cc 100 nf +5 v +3.3 v v 33 3 8 f i gure 9: common- mode v o ltage p e a k s ( s ee measurement set- up f i gure 8) canh canl r e ce ssi v e v i( c o m ) = v canh + v canl v cm - p e a k p c 20040829.7 v cm- p e a k v cm - s te p 10 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet 9.0 pack age outline soic-8: plastic small outl i ne; 8 leads; b o d y w i dth 1 50 mil; jedec: ms-01 2 amis referenc e: soic150 8 150 g 11 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet 10.0 soldering 10.1 introduction t o sold ering s u rface mount packages t h is text g i ves a v e r y brief in sight to a com p le x tech nol og y. a more i n -d epth acco unt o f sold erin g ics can b e fo und i n the amis ?dat a han dbo ok ic 2 6 ; integrat ed c i rcuit p a ckag e s ? (doc ument or der numb e r 9 3 98 652 9 001 1). t here is no s o lderi n g meth od that is id eal for all surface mo unt ic pack a g e s. w a ve s o l d erin g is n o t a l w a ys s u it ab le for surfac e m o unt ics, or for printe d-circu i t boar ds (pcb) wi t h hig h po pul atio n densiti e s. in these situat i ons r e -flo w so lder in g is often use d . 10.2 re-flo w so ld erin g reflo w sol der i ng re qu ires s o l der p a ste (a su spens ion of fin e sol der particl es, flu x a nd bi n d in g a gent) to be a p p lie d to t he pcb by scr een printi ng, ste n ci llin g or pressu re-s y r ing e disp ensi ng befor e packa ge pl ace m ent. sever a l metho d s e x is t for re-flo w i n g ; for e x ampl e, infrare d /conve c tion he atin g in a conve y or t y p e oven. t h roughp ut times (pre heati n g, sold erin g a n d coo lin g) var y bet w e en 100 and 20 0 seco n d s de pe ndi ng on h eati ng met hod. t y pic a l re - flo w pe ak temp eratures ra ng e from 215 to 25 0c. t he top-surface temper a t ure of the pac kages sh ou ld p r eferab l y be ke pt belo w 23 0 c. 10.3 w a v e so ld erin g conv entio na l singl e w a v e sol deri ng is not re commen ded fo r surface m oun t devices (smd s) or pcbs w i t h a hig h comp one nt dens it y , a s sold er brid gi ng and n on- w e tti ng can prese n t major prob le ms. t o ov ercome these pr ob lems the d oub l e - w av e sold eri ng metho d w a s specific all y d e v e lo ped. if w a ve solder ing is us ed the foll o w i n g cond itio ns must be obs erve d for optimal re sults: ? use a do ub le- w a v e so lder in g method compr i sing a turbul en t w a v e w i t h hi g h up w a rd pr essure foll o w e d b y a smo o th lam i nar w a ve. ? f o r packag e s w i t h le ads o n tw o s i d e s an d a pitch (e): o larg e r than or equ al to 1.27m m, the foot print long itudi na l a x is is preferre d to be par all e l to the transport d i rectio n of the pcb; o smaller th an 1. 27mm, the footprint lo ngitu di n a l a x is must be paral lel to the transport dir e ction of the pcb. t he footprint must i n corp orate sol der thiev e s at the do w n stre a m end. ? f o r packag e s w i t h le ads o n four sid e s, the footpri n t must be plac ed at a 4 5 o angl e to the trans port dir e ction of the pcb. t he footprint must incorp ora t e solder thi e ve s do w n stre am and at the si de corners. durin g pl acem ent and b e fore solderi ng, t he packa ge must be fixed w i t h a dropl et of adh esive. t he adh esive ca n be a ppli ed b y scr een printi ng, p i n tra n sfer or s y rin g e d i spe n si ng. t he pack age ca n b e s o ld ered after the ad hes ive is cur ed. t y pical d w e l l tim e is fo ur sec o n d s at 250c. a mil d l y -activ ated fl ux w i ll e limi nat e the ne ed for remova l of corrosive res i du es in most app lica t ions. 1 0 . 4 ma nua l sol d e r ing f i x the com p o nent b y first sol deri ng t w o d i ag ona ll y-o p p o site end le ads. us e a lo w vo ltag e (24v or less) s o ld erin g iro n a ppli ed to the flat part of the lea d . contact time must be limite d to 10 secon d s at up to 300 c. w hen usi ng a ded icate d tool, all oth e r lea d s can be so ld ere d in on e op erat ion w i t h in t w o t o five secon d s bet w e en 2 70 a nd 32 0c. 12 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce amis-30663 high speed can transcei ver data sheet tabl e 8: sol deri n g process solderin g met h od package wav e re-fl o w (1 ) bga, sqfp not sui t abl e sui t abl e hlqfp, hs q f p, hso p , htssop, sms not sui t abl e (2 ) sui t abl e plcc (3 ) , so , s o j sui t abl e sui t abl e lqfp, qfp, t q fp n o t r e co m m e n ded (3 )(4 ) sui t abl e sso p, tss o p, vso n o t r e co m m e n ded (5 ) sui t abl e not e s 1. all surface moun t ( s md) package s ar e mo isture sen s itiv e. depe nding upon the moi s tu re co nte n t, the max i mum te mperature (w ith re spect to time) and b ody size of the package , there i s a risk tha t in terna l or ex ternal package cr ac ks may occu r du e to v aporiza t ion of the moi s ture in the m (the so calle d po pcorn effe ct). f o r d e tail s, re fer to the dry pack info rmation in the ?dat a h andbook ic26; in te grated circuit pa ckages; s e ction : p a cking method s.? 2. these p a ckage s ar e no t sui t able for w a v e soldering as a so lder join t betw een th e pcb and hea tsin k (a t bottom v e rsion) can n ot be a c hi ev ed, and a s sol der may sti c k to the heatsin k (on to p v e rsion). 3. if w a v e solderin g i s con s ide r ed, then the pa ckage mu st b e pl a c ed at a 45 a ngle to the solder wav e directio n. the package f oo tprin t must in corpora t e solder thiev e s dow nstream an d a t the side co rner s. 4. w a v e solde r ing is o n ly suitable for l q fp, tqfp and qfp package s w i th a pi tch (e) e qual to or la rger than 0.8mm ; i t is d e fin i t ely not suitable for package s w i th a pi tch (e) equa l to or smal ler than 0.65mm . 5. w a v e solde r ing is o n ly suitable for ss op and tsso p pa cka ges w i th a pi tch (e) equa l to or la rge r th an 0 . 65mm; i t i s defi n ite ly no t sui t a b le f o r p a c k age s w i th a pi tc h (e ) equal to or smaller than 0.5mm . 11.0 company or product inquiries for more infor m ation ab o u t ami semicond u c tor?s can t r a n sceiv ers, ema il auto _ass p s @ amis.com . for more infor m ation ab o u t ami semicond u c tor?s prod ucts or services visi t our w eb site at http:// w w w . amis.com . dev i ces sold by amis are cov e red b y the w a rranty and paten t ind e mn ifi c a t ion pr ov isions ap p earing in its term s of s a le only . am is ma kes no w a rranty , ex press, s t at ut o r y, implied o r by descrip tion , re garding the in forma t ion set fo rth herein or regard i ng the fr eedom of the descr ibed dev ices from pa ten t in fringemen t. am is ma kes no w a rranty of merchan tabili ty or fitness for any purposes. amis re serv es the ri gh t to discon tinue production an d change sp eci fi ca tion s and price s at any time and w i thout no tice . a m i semi condu cto r 's pro ducts are intended for u s e i n commerci al appl ication s . appl ica t io ns re quiring ex tended tempe r atu r e r ange, unusua l env ironmental requ irements, or h i gh r e liability appli c ati o n s , su ch as mili tary , medical li fe- s uppo rt or li fe- s ustainin g equipme nt, ar e spe c ifi c ally not re com m ended w i thout additiona l pr oce s si ng by amis for such appli c a t io n s . co py right ?2007 am i semicondu ctor, inc. 13 a m i se m i co nd uc t o r ? jun. 07 , m- 20681-003 www.ami s .c om speci f i c atio ns subj ect to chang e w i tho u t n o ti ce |
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