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data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. photocoupler ps2533-1,-2,-4,ps2533l-1,-2,-4 high collector to emitter voltatge high isolation voltage multi photocoupler siries - nepoc series - the mark ? ? ? ? shows major revised points. document no. pn10233ej01v0ds (1st edition) (previous no. p11435ej6v0ds00) date published february 2003 cp(k) printed in japan ? ? ? ? nec compound semiconductor devices 1990, 2003 description the ps2533-1, -2, -4 and ps2533l-1, -2, -4 are optically coupled isolators containing a gaas light emitting diode and an npn silicon darlington connected phototransistor. the ps2533-1, -2, -4 are in a plastic dip (dual in-line package) and the ps2533l-1, -2, -4 are lead bending type (gull-wing) for surface mount. features ? high collector to emitter voltage (v ceo = 350 v) ? high isolation voltage (bv = 5 000 vr.m.s.) ? high current transfer ratio (ctr = 4 000 % typ.) ? high-speed switching (t r, t f = 100 m s typ.) ? ordering number of tape product: ps2533l-1-e3, e4, f3, f4, ps2533l-2-e3, e4 ? safety standards ? ul approved: file no. e72422 (s) ? bsi approved: no. 8221/8222 ? csa approved: no. ca 101391 ? nemko approved: no. p98101708 ? semko approved: no. 9824187/01-02 ? demko approved: no. 307863 ? fimko approved: no. f1 11397 ? vde0884 approved (option) applications ? telephone, exchange equipment ? fax/modem
data sheet pn10233ej01v0ds 2 ps2533-1,-2,-4,ps2533l-1,-2,-4 package dimensions (unit : mm) dip type (new package) ps2533-1 top view 3.50.3 4.150.4 3.20.4 2.54 1.250.15 0.500.10 0.25 m 4.60.35 6.50.5 0 to 15? 7.62 0.25 +0.1 C0.05 12 43 1. anode 2. cathode 3. emitter 4. collector caution new package 1-ch only dip type ps2533-4 ps2533-1 top view top view 9.70.5 6.50.5 3.50.3 4.150.4 3.30.5 2.54 1.250.15 0.500.10 0.25 m 0 to 15? 7.62 0.25 +0.1 C0.05 ps2533-2 4.60.5 6.50.5 3.50.3 4.150.4 3.30.5 2.54 1.250.15 0.500.10 0.25 m 0 to 15? 7.62 0.25 +0.1 C0.05 19.80.5 6.50.5 0 to 15? 7.62 0.25 +0.1 C0.05 3.50.3 4.150.4 3.30.5 2.54 1.250.15 0.500.10 0.25 m top view 12 43 12345678 16 15 14 13 12 11 10 9 1234 8765 1, 3. anode 2, 4. cathode 5, 7. emitter 6, 8. collector 1. anode 2. cathode 3. emitter 4. collector 1, 3, 5, 7. anode 2, 4, 6, 8. cathode 9, 11, 13, 15. emitter 10, 12, 14, 16. collector
data sheet pn10233ej01v0ds 3 ps2533-1,-2,-4,ps2533l-1,-2,-4 lead bending type (new package) ps2533l-1 top view 0.25 m 4.60.35 6.50.5 3.50.3 2.54 1.250.15 0.15 0.90.25 9.600.4 0.25 +0.1 C0.05 0.1 +0.1 C0.05 12 43 1. anode 2. cathode 3. emitter 4. collector caution new package 1-ch only lead bending type ps2533l-2 top view ps2533l-1 top view ps2533l-4 top view 4.60.5 6.50.5 0.25 m 3.50.3 2.54 1.250.15 0.15 0.90.25 9.600.4 0.25 +0.1 C0.05 0.1 +0.1 C0.05 9.70.5 6.50.5 2.54 1.250.15 0.25 m 0.15 3.50.3 0.90.25 9.600.4 0.25 +0.1 C0.05 0.1 +0.1 C0.05 19.80.5 6.50.5 2.54 1.250.15 0.25 m 3.50.3 0.15 0.90.25 9.600.4 0.25 +0.1 C0.05 0.1 +0.1 C0.05 12 43 12345678 16 15 14 13 12 11 10 9 1234 8765 1, 3. anode 2, 4. cathode 5, 7. emitter 6, 8. collector 1. anode 2. cathode 3. emitter 4. collector 1, 3, 5, 7. anode 2, 4, 6, 8. cathode 9, 11, 13, 15. emitter 10, 12, 14, 16. collector
data sheet pn10233ej01v0ds 4 ps2533-1,-2,-4,ps2533l-1,-2,-4 marking example 2533 m 003 ps2533-2 m 003 e f ps2533-1 ps2533-2, -4 assembly lot week assembled year assembled (last 1 digit) in-house code ctr rank code no. 1 pin mark package new pkg standard pkg made in japan made in taiwan no. 1 pin mark m f week assembled year assembled (last 1 digit) in-house code ctr rank code package new pkg standard pkg made in japan made in taiwan 0 03 m 0 03 blank blank country assembled type number assembly lot
data sheet pn10233ej01v0ds 5 ps2533-1,-2,-4,ps2533l-1,-2,-4 ordering information part number package packing style safety standard approval application part number *1 ps2533-1 4-pin dip magazine case 100 pcs standard products ps2533-1 ps2533l-1 (ul, csa, bsi, ps2533l-1-e3 embossed tape 1 000 pcs/reel nemko, semko, ps2533l-1-e4 demko, fimko ps2533l-1-f3 embossed tape 2 000 pcs/reel approved) ps2533l-1-f4 ps2533-2 8-pin dip magazine case 45 pcs ps2533-2 ps2533l-2 ps2533l-2-e3 embossed tape 1 000 pcs/reel ps2533l-2-e4 ps2533-4 16-pin dip magazine case 20 pcs ps2533-4 ps2533l-4 ps2533-1-v 4-pin dip magazine case 100 pcs vde0884 approved ps2533-1 ps2533l-1-v products (option) ps2533l-1-v-e3 embossed tape 1 000 pcs/reel ps2533l-1-v-e4 ps2533l-1-v-f3 embossed tape 2 000 pcs/reel ps2533l-1-v-f4 ps2533l-2-v 8-pin dip magazine case 45 pcs ps2533-2 ps2533l-2-v ps253l-2-v-e3 embossed tape 1 000 pcs/reel ps2533l-2-v-e4 ps2533-4-v 16-pin dip magazine case 20 pcs ps2533-4 PS2533L-4-V *1 for the application of the safety standard, following part number should be used.
data sheet pn10233ej01v0ds 6 ps2533-1,-2,-4,ps2533l-1,-2,-4 absolute maximum ratings (t a = 25 c, unless otherwise specified) ratings parameter symbol ps2533-1, ps2533l-1 ps2533-2, -4, ps2533l-2, -4 unit diode forward current (dc) i f 80 ma reverse voltage v r 6v power dissipation derating d p d / c1.5 1.2 mw c power dissipation p d 150 120 mw/ch peak forward current *1 i fp 1a transistor collector to emitter voltage v ceo 350 v emitter to collector voltage v eco 0.6 v collector current i c 150 ma/ch power dissipation derating d p c / c 3.0 2.4 mw/ c power dissipation p c 300 240 mw/ch isolation voltage *2 bv 5 000 vr.m.s. operating ambient temperature t a - 55 to +100 c storage temperature t stg - 55 to +150 c *1 pw = 100 m s, duty cycle = 1 % *2 ac voltage for 1 minute at t a = 25 c, rh = 60 % between input and output
data sheet pn10233ej01v0ds 7 ps2533-1,-2,-4,ps2533l-1,-2,-4 electrical characteristics (t a = 25 c) parameter symbol conditions min. typ. max. unit diode forward voltage v f i f = 10 ma 1.15 1.40 v reverse current i r v r = 5 v 5 m a terminal capacitance c t v = 0 v, f = 1.0 mhz 30 pf transistor collector to emitter dark current i ceo v ce = 350 v, i f = 0 ma 400 na coupled current transfer ratio (i c /i f ) ctr i f = 1 ma, v ce = 2 v 1 500 4 000 6 500 % collector saturation voltage v ce(sat) i f = 1 ma, i c = 2 ma 1.0 v isolation resistance r i-o v i-o = 1.0 kv dc 10 11 w isolation capacitance c i-o v = 0 v, f = 1.0 mhz 0.6 pf rise time *1 t r v cc = 5 v, i c = 10 ma, r l = 100 w 100 m s fall time *1 t f 100 *1 test circuit for switching time (pw = 1 ms, duty cycle = 1/10) pulse input v cc v out r l = 100 w 50 w i f
data sheet pn10233ej01v0ds 8 ps2533-1,-2,-4,ps2533l-1,-2,-4 typical characteristics (t a = 25 c, unless otherwise specified) ps2533-1 ps2533l-1 1.5 mw/?c ps2533-2, -4 ps2533l-2, -4 1.2 mw/?c 150 100 50 0 25 50 75 100 125 150 ambient temperature t a (?c) diode power dissipation p d (mw) diode power dissipation vs. ambient temperature ps2533-1 ps2533l-1 3.0 mw/?c ps2533-2, -4 ps2533l-2, -4 2.4 mw/?c 400 300 200 100 0 25 50 75 100 125 150 ambient temperature t a (?c) transistor power dissipation p c (mw) transistor power dissipation vs. ambient temperature +25 ?c 0 ?c C25 ?c C55 ?c t a = +100 ?c +75 ?c +50 ?c 100 10 1 0.1 0.01 0.6 0.8 1.0 1.2 1.4 1.6 forward voltage v f (v) forward current i f (ma) forward current vs. forward voltage i f = 0.5 ma 1.0 ma 1.5 ma 2.0 ma 2.5 ma 3.0 ma 3.5 ma 4.0 ma 5.0 ma 4.5 ma 160 140 120 100 80 60 40 20 02 1 3456 8 7 collector to emitter voltage v ce (v) collector current i c (ma) collector current vs. collector to emitter voltage v ce = 350 v C50 C25 0 25 50 75 100 100 n 10 n 1 n 100 p 10 m 1 m ambient temperature t a (?c) collector to emitter dark current i ceo (a) collector to emitter dark current vs. ambient temperature i f = 5.0 ma 2.0 ma 1.0 ma 0.5 ma 500 100 10 50 1 5 0.1 0.5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 collector saturation voltage v ce(sat) (v) collector current i c (ma) collector current vs. collector saturation voltage
data sheet pn10233ej01v0ds 9 ps2533-1,-2,-4,ps2533l-1,-2,-4 long term ctr degradation time (hr) ctr (relative value) 1.2 1.0 0.8 0.6 0.4 0.2 0.0 10 10 2 10 3 10 4 10 5 10 6 i f = 1 ma, t a = 25 ?c i f = 1 ma, t a = 60 ?c frequency response frequency f (khz) normalized gain gv 5 0 C10 C5 C15 C20 C25 C30 0.01 0.1 1 10 100 r l = 1 k w 100 w 10 w v ce = 4 v, v in = 0.1 v p-p r l v in v out 1 k w 47 w 1 f m normalized to 1.0 at t a = 25 ?c, i f = 1 ma, v ce = 2 v 1.2 0.8 0.4 0.0 1.0 0.6 0.2 C50 C25 25 50 75 100 0 ambient temperature t a (?c) normalized current transfer ratio ctr normalized current transfer ratio vs. ambient temperature v ce = 2 v sample a b 5 000 4 000 3 000 1 000 0 2 000 1510 0.1 0.5 15 forward current i f (ma) current transfer ratio ctr (%) current transfer ratio vs. forward current v cc = 10 v, i c = 10 ma t r t d t s t f 500 100 50 10 1 5 20 100 200 500 1 k 2 k 50 load resistance r l ( w ) switching time t ( s) m switching time vs. load resistance remark the graphs indicate nominal characteristics.
data sheet pn10233ej01v0ds 10 ps2533-1,-2,-4,ps2533l-1,-2,-4 taping specifications (unit : mm) tape direction outline and dimensions (tape) outline and dimensions (reel) ps2533l-1-e3 ps2533l-1-e4 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 4.00.1 0.4 5.30.1 8.00.1 7.50.1 16.00.3 10.30.1 1.5 +0.1 C0 f packing: 1 000 pcs/reel 2.00.5 r 1.0 13.00.2 f 21.00.8 f 2542.0 80.01.0 2.00.5 f f 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0
data sheet pn10233ej01v0ds 11 ps2533-1,-2,-4,ps2533l-1,-2,-4 tape direction ps2533l-1-f3 ps2533l-1-f4 outline and dimensions (tape) 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 4.00.1 0.4 5.30.1 8.00.1 7.50.1 16.00.3 10.30.1 1.5 +0.1 C0 outline and dimensions (reel) packing: 2 000 pcs/reel 2.00.5 r 1.0 13.00.2 f 21.00.8 f 3302.0 1001.0 2.00.5 f f 15.9 to 19.4 outer edge of flange 21.51.0 17.51.0
data sheet pn10233ej01v0ds 12 ps2533-1,-2,-4,ps2533l-1,-2,-4 tape direction ps2533l-2-e3 ps2533l-2-e4 outline and dimensions (tape) 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 10.40.1 12.00.1 outline and dimensions (reel) packing: 1 000 pcs/reel 3302.0 1001.0 2.00.5 13.00.2 r 1.0 21.00.8 2.00.5 1.5 +0.1 C0 7.50.1 10.30.1 16.00.3 4.00.1 0.3 15.9 to 19.4 outer edge of flange 17.51.0 21.51.0
data sheet pn10233ej01v0ds 13 ps2533-1,-2,-4,ps2533l-1,-2,-4 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering ? peak reflow temperature 260 c or below (package surface temperature) ? time of peak reflow temperature 10 seconds or less ? time of temperature higher than 220 c 60 seconds or less ? time to preheat temperature from 120 to 180 c 120 30 s ? number of reflows three ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) 12030 s (preheating) 220?c 180?c package surface temperature t (?c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260?c max. 120?c (2) wave soldering ? temperature 260 c or below (molten solder temperature) ? time 10 seconds or less ? preheating conditions 120 c or below (package surface temperature) ? number of times one (allowed to be dipped in solder including plastic mold portion.) ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (3) cautions ?fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly between the photocouplers input and output or between collector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute maximum ratings.
data sheet pn10233ej01v0ds 14 ps2533-1,-2,-4,ps2533l-1,-2,-4 usage cautions 1. protect against static electricity when handling. 2. avoid storage at a high temperature and high humidity.
data sheet pn10233ej01v0ds 15 ps2533-1,-2,-4,ps2533l-1,-2,-4 specification of vde marks license document (vde0884) parameter symbol speck unit application classification (din vde 0109) for rated line voltages 300 vr.m.s. for rated line voltages 600 vr.m.s. iv iii climatic test class (din iec 68 teil 1/09.80) 55/100/21 dielectric strength maximum operating isolation voltage test voltage (partial discharge test, procedure a for type test and random test) u pr = 1.2 u iorm , p d < 5 pc u iorm u pr 890 1 068 v peak v peak test voltage (partial discharge test, procedure b for all devices test) u pr = 1.6 u iorm , p d < 5 pc u pr 1 424 v peak highest permissible overvoltage u tr 6 000 v peak degree of pollution (din vde 0109) 2 clearance distance > 7.0 mm creepage distance > 7.0 mm comparative tracking index (din iec 112/vde 0303 part 1) cti 175 material group (din vde 0109) iii a storage temperature range t stg - 55 to +150 c operating temperature range t a C55 to +100 c isolation resistance, minimum value v io = 500 v dc at t a = 25 c v io = 500 v dc at t a max. at least 100 c ris min. ris min. 10 12 10 11 w w safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) package temperature current (input current i f , psi = 0) power (output or total power dissipation) isolation resistance v io = 500 v dc at t a = 175 c (tsi) tsi isi psi ris min. 175 400 700 10 9 c ma mw w
data sheet pn10233ej01v0ds 16 ps2533-1,-2,-4,ps2533l-1,-2,-4 application for telephone (example) line bell ringing signal (75 vr.m.s., 16 hz) ps2505/ps2506 ps2705/ps2707 ps2805 etc. bell ringing detect v cc v cc line observe dial pulse ps2532/ps2533 generator ps2732/ps2733 ps2832/ps2833 ps2521 ps2525 dialer circuit in out cpu ocmos fet ps7xxx speech circuit
data sheet pn10233ej01v0ds 17 ps2533-1,-2,-4,ps2533l-1,-2,-4 m8e 00. 4 - 0110 the information in this document is current as of february, 2003. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above).
nec compound semiconductor devices hong kong limited hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-01 fax: +49-211-6503-487 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0302 nec compound semiconductor devices, ltd. 5th sales group, sales division tel: +81-44-435-1588 fax: +81-44-435-1579 e-mail: salesinfo@csd-nec.com for further information, please contact ps2532-1,-2,-4,ps2532l-1,-2,-4 safety information on this product caution gaas products the product contains gallium arsenide, gaas. gaas vapor and powder are hazardous to human health if inhaled or ingested. ? do not destroy or burn the product. ? do not cut or cleave off any part of the product. ? do not crush or chemically dissolve the product. ? do not put the product in the mouth. follow related laws and ordinances for disposal. the product should be excluded from general industrial waste or household garbage.

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