protection products 1 www.semtech.com protection products sd05 and sd12 single line tvs diode for esd protection in portable electronics description features schematic & pin configuration revision 01/19/03 applications mechanical characteristics the sdxx tvs diodes are designed to replace multilayer varistors (mlvs) in portable applications such as cell phones, notebook computers, and pda?s. they offer superior electrical characteristics such as lower clamp- ing voltage and no device degradation when compared to mlvs. the sdxx series tvs diodes are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (esd) and other voltage induced transient events. the sdxx is in a sod-323 package and will protect one unidirectional line. they are available with working voltages of 5 volts (sd05) and 12 volts (sd12). these devices will fit on the same pcb pad area as an 0805 mlv device. they give the designer the flexibility to protect one line in applications where arrays are not practical. additionally, it may be ?sprinkled? around the board in applications where board space is at a pre- mium. they may be used to meet the esd immunity require- ments of iec 61000-4-2, level 4 (15kv air, 8kv contact discharge). ? 350 watts peak pulse power (t p = 8/20s) ? transient protection for data lines to iec 61000-4-2 (esd) 25kv (air), 10kv (contact) iec 61000-4-4 (eft) 40a (5/50ns) iec 61000-4-5 (lightning) 24a (8/20s) ? small package for use in portable electronics ? suitable replacement for mlv?s in esd protection applications ? protects one i/o or power line ? low clamping voltage ? working voltages: 5v and 12v ? low leakage current ? solid-state silicon-avalanche technology ? eiaj sod-323 package ? molding compound flammability rating: ul 94v-0 ? marking : marking code, cathode band ? packaging : tape and reel per eia 481 ? cell phone handsets and accessories ? microprocessor based equipment ? personal digital assistants (pda?s) ? notebooks, desktops, and servers ? portable instrumentation ? pagers peripherals sod-323 (top view)
2 ? 2003 semtech corp. www.semtech.com protection products protection products sd05 and sd12 absolute maximum rating electrical characteristics g n i t a rl o b m y se u l a vs t i n u t ( r e w o p e s l u p k a e p p ) s 0 2 / 8 =p k p 0 5 3s t t a w ) 2 - 4 - 0 0 0 1 6 c e i r e p m r o f e v a w m b h ( e g a t l o v d s ev d s e 0 3v k e r u t a r e p m e t g n i r e d l o s d a e lt l ) . c e s 0 1 ( 0 6 2c e r u t a r e p m e t g n i t a r e p ot j 5 2 1 + o t 5 5 -c e r u t a r e p m e t e g a r o t st g t s 0 5 1 + o t 5 5 -c 5 0 d s r e t e m a r a pl o b m y ss n o i t i d n o cm u m i n i ml a c i p y tm u m i x a ms t i n u e g a t l o v f f o - d n a t s e s r e v e rv m w r 5v e g a t l o v n w o d k a e r b e s r e v e rv r b i t a m 1 =6 v t n e r r u c e g a k a e l e s r e v e ri r v m w r c 5 2 = t , v 5 =0 1a e g a t l o v g n i p m a l cv c i p p t , a 5 = p s 0 2 / 8 =8 . 9v e g a t l o v g n i p m a l cv c i p p t , a 4 2 = p s 0 2 / 8 =5 . 4 1v t n e r r u c e s l u p k a e pi p p t p s 0 2 / 8 =4 2a e c n a t i c a p a c n o i t c n u jc j v r z h m 1 = f , v 0 =0 5 3f p 2 1 d s r e t e m a r a pl o b m y ss n o i t i d n o cm u m i n i ml a c i p y tm u m i x a ms t i n u e g a t l o v f f o - d n a t s e s r e v e rv m w r 2 1v e g a t l o v n w o d k a e r b e s r e v e rv r b i t a m 1 =3 . 3 1v t n e r r u c e g a k a e l e s r e v e ri r v m w r c 5 2 = t , v 2 1 =1a e g a t l o v g n i p m a l cv c i p p t , a 5 = p s 0 2 / 8 =9 1v e g a t l o v g n i p m a l cv c i p p t , a 5 1 = p s 0 2 / 8 =5 2v t n e r r u c e s l u p k a e pi p p t p s 0 2 / 8 =5 1a e c n a t i c a p a c n o i t c n u jc j v r z h m 1 = f , v 0 =0 5 1f p
3 ? 2003 semtech corp. www.semtech.com protection products protection products sd05 and sd12 typical characteristics non-repetitive peak pulse power vs. pulse time power derating curve 0 10 20 30 40 50 60 70 80 90 100 110 0 25 50 75 100 125 150 ambient temperature - t a ( o c) % of rated power or i pp clamping voltage vs. peak pulse current pulse waveform 0 5 10 15 20 25 30 0 5 10 15 20 25 30 peak pulse current - i pp (a) clamping voltage - v c (v) sd12 sd05 waveform parameter s tr = 8s td = 20 s 0.01 0.1 1 10 0.1 1 10 100 1000 pulse duration - t p (s) peak pulse power - p pk (kw) forward voltage vs. forward current capacitance vs. reverse voltage 0 10 20 30 40 50 60 70 80 90 100 110 0 5 10 15 20 25 30 time (s) percent of i pp e -t td = i pp /2 wavefor m parameter s tr = 8s t d = 20s 0 50 100 150 200 250 300 350 02468101214 r everse v oltage - v r (v ) ca p acitance - c j (p f ) sd 05 s d 12 f = 1m h z 0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 0 5 10 15 20 25 30 35 40 45 forward current - i f (a) forward voltage -v f (v) sd12 sd05 waveform parameters: tr = 8s td = 10s
4 ? 2003 semtech corp. www.semtech.com protection products protection products sd05 and sd12 device connection options the sdxx tvs diodes are designed to protect one data, i/o, or power supply line. the device is designed to replace multi-layer varistors (mlvs) in portable applications. it is easily implemented on existing 0805 mlv pads and is only slightly larger than 0603 mlv pads. the device is unidirectional and may be used on lines where the signal polarity is above ground. the cathode band should be placed towards the line that is to be protected. circuit board layout recommendations for suppres- sion of esd. good circuit board layout is critical for the suppression of fast rise-time transients such as esd. the following guidelines are recommended (refer to application note si99-01 for more detailed information): z place the tvs near the input terminals or connectors to restrict transient coupling. z minimize the path length between the tvs and the protected line. z the esd transient return path to ground should be kept as short as possible. z place a tvs and decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. z minimize all conductive loops including power and ground loops. z use multilayer boards when possible. z minimize interconnecting line lengths z never run critical signals near board edges. z fill unused portions of the pcb with ground plane. device schematic and pin configuration size comparison to 0805 mlv sod-323 0805 mlv note: nominal dimensions in inches component placement comparison 0805 mlv on sod-323 on 0805 mlv pad sod-323 on recommended (sod-323) solder pad 0805 solder pad applications information
5 ? 2003 semtech corp. www.semtech.com protection products protection products sd05 and sd12 land pattern outline drawing
6 ? 2003 semtech corp. www.semtech.com protection products protection products sd05 and sd12 contact information semtech corporation protection products division 200 flynn rd., camarillo, ca 93012 phone: (805)498-2111 fax (805)498-3804 t r a p r e b m u n g n i k r o w e g a t l o v r e p y t q l e e r e z i s l e e r c t . 5 0 d sv 50 0 0 , 3? 7 g t . 5 0 d sv 50 0 0 , 0 1? 3 1 c t . 2 1 d sv 2 10 0 0 , 3? 7 g t . 2 1 d sv 2 10 0 0 , 0 1? 3 1 marking codes r e b m u n t r a p g n i k r a m e d o c 5 0 d su 5 2 1 d su 6 ordering information
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