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TB6594FLG 2008-04-22 1 toshiba bicd integrated circuit silicon monolithic TB6594FLG dual dc motor driver with boost dc-dc converter the TB6594FLG is a dual dc motor driver ic using ldmos output transistors with low on-resistance. four operation modes are selectable via in1 and in2: forward, reverse, short brake and stop. the TB6594FLG incorporates boost dc-dc converter with a 5-v output, which can be used as a power supply for other ics. features ? power supply voltage: v m = 2.2 v to 5.5 v ? output current: i out = 0.8 a (max) (h-bridge output) ? output on-resistance: 15 (upper and lower sum (typ.) @v m = 5 v) ? dedicated standby (power-save) pin ? forward, reverse, sh ort brake and stop ? boost dc-dc converter: v out = 5.0 v (typ.) ? boost dc-dc converter efficiency: 80% (typ.) ? thermal shutdown (tsd) ? small surface-mount package (qon24) *: this product has a mos structure and is sensitive to electrostatic discharge. when handling this product, ensure that the environment is prot ected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. weight: 0.05 g (typ.)
TB6594FLG 2008-04-22 2 block diagram pin functions pin no. symbol function remarks 1 pgnd dc-dc converter ground pin 2 (nc) no connect 3 cont dc-dc converter switching pin an exte rnal inductor is connected to this pin. 4 v m motor power supply pin v m = 2.2 to 5 v 5 (nc) no connect 6 ao1 channel-a motor output 1 7 (nc) no connect 8 ao2 channel-a motor output 2 9 mgnd motor ground 10 (nc) no connect 11 bo1 channel-b motor output 1 12 (nc) no connect 13 bo2 channel-b motor output 2 14 bin2 channel-b motor control input 2 15 bin1 channel-b motor control input 1 16 gnd small signal ground 17 ain2 channel-a motor control input 2 18 ain1 channel-a motor control input 1 19 (nc) no connect 20 stby standby control input l = standby (output: off) 21 (nc) no connect 22 (nc) no connect 23 v cc small-signal power supply v cc = 2.7 to 5 v 24 v out dc-dc converter output 24 3 pwm control f osc = 100 khz h-bridge channel a soft start v ref v out cont 1 4 6 8 11 13 9 h-bridge channel b pgnd v m a o1 a o2 standby bo1 bo2 mgnd control logic channel a tsd control logic channel b 23 20 18 17 15 14 16 v cc stby ain1 ain2 bin1 bin2 gnd
TB6594FLG 2008-04-22 3 function table for h-bridge control input output in1 in2 stby out1 out2 drive mode h h h l l short brake l h h l h reverse/forward h l h h l forward/reverse l l h off (high-impedance) stop h/l h/l l off (high-impedance) standby functional description of h-bridge driver to eliminate shoot-through current, a dead time (t2, t4) of 300 ns (design target only) is inserted when the pwm is turned on and off. gnd v m out1 voltage wave t1 t2 t3 t5 t4 t5 v m m gnd out1 out2 v m m gnd t4 out1 out2 m gnd t1 out1 out2 v m m gnd t3 out1 out2 v m m gnd out1 out2 v m t2
TB6594FLG 2008-04-22 4 functional description of dc-dc converter stby v out (dc-dc converter output) remarks l standby (off) h-bridge transistors: off h on (constant voltage) v out reaches 5 v after the soft-start time. control input sequence note: if the v out output voltage falls below the undervoltage lockout (uvlo) trip threshold due to an overload condition or a short-circuit, uvlo circuitry is activat ed to prevent large inrush currents. as a result, the TB6594FLG operates in the following sequence: 1. resets the internal logic. 2. soft-start operation. 3. v out reaches 5 v. (1) turn on v m . (2) release stby (from low to high). (3) the internal logic is reset. (4) a soft-start operation is started. (5) v out reaches 5 v. v m (1) stby internal reset v out (3) (4) soft start (a few ms) (2) release stby (5) 5-v regulation 5 v
TB6594FLG 2008-04-22 5 absolute maximum ratings (ta = 25c) characteristics symbol rating unit remarks v m 5.5 supply voltage v cc 5.5 v input voltage v in ? 0.2 to 5.5 v ain1, ain2, bin1, bin2 and stby pins v out 5.5 ao1, ao2, bo1 and bo2 pins output voltage v cont 5.5 v cont pin i out 0.8 ao1, ao2, bo1 and bo2 pins output current i cont 0.5 a cont pin power dissipation p d 0.78 w operating temperature t opr ? 20 to 85 c storage temperature t stg ? 55 to 150 c operating ranges (ta = ? 20 to 85c) characteristics symbol min typ. max unit v cc 2.7 3 5 v supply voltage v m 2.2 3 5 v output current (h-bridge) i out ? ? 0.6 a
TB6594FLG 2008-04-22 6 electrical characteristics (unless otherwise specified, v cc = 3 v, v m = 5 v, ta = 25c) section characteristics symbol test condition min typ. max unit output voltage v out 4.75 5 5.25 input voltage v in ? ? 5 turn-on voltage v st1 i out = 1 ma ? ? 2.2 oscillation start voltage v st2 no load, v out = variable ? ? 2 undervoltage lockout (uvlo) threshold v ld i out = 1 ma, v in = variable ? ? 1.9 v i out1 no load, v out = 4.75 v ? 420 600 output current i out (stb) stby = 0 v ? 0 0.5 a h-bridge transistor on-resistance rsw (on) v cont = 0.4 v ? 1 2 h-bridge transistor leakage current ilcont v out = v cont = 5.5 v ? 0 1 a line regulation v out v m = 2.2 v to 3 v ? 10 60 load regulation vo load i out = 10 a to 50 ma ? 150 250 mv oscillation frequency f osc 70 100 130 khz maximum duty cycle maxduty obtained by monitoring the v cont waveform. 78 87 92 efficiency effi ? 80 ? % dc-dc converters soft-start time t ss rl = 5 k v m = 2.4 v 2.5 5 7.5 ms i cc stby = v cc ? 0.23 0.5 ma i cc (stb) ? 0 1 supply current i m (stb) stby = 0 v ? 0 1 a v ih 2 ? v cc + 0.2 v il ?0.2 ? 0.8 control input voltage v in (his) (design target only) ? 0.2 ? v i ih v in = 3 v 5 15 25 control input voltage i il v in = 0 v ? 0 1 a v ih (stb) 2 ? v cc + 0.2 standby input voltage v il (stb) ?0.2 ? 0.8 v i ih (stb) v in = 3 v 15 40 80 standby input current i il (stb) v in = 0 v ? 0 1 a i o = 0.2 a ? 0.2 0.4 output saturation voltage v sat (u + l) i o = 0.6 a ? 0.6 1.2 v i l (u) v m = ao1, ao2, bo1, bo2 = 5.5 v ? 0 1 output leakage current i l (l) v m = 5.5 v, ao1, ao2, bo1, bo2 = 0 v ?1 0 ? a v f (u) ? 0.9 1.2 h-bridge drivers diode forward voltage v f (l) i f = 0.6 a ? 0.9 1.2 v thermal shutdown threshold tsd ? 170 ? tsd thermal shutdown hysteresis tsd (design target only) ? 20 ? c
TB6594FLG 2008-04-22 7 application circuit example note: bypass capacitors should be places as close to the ic as possible. usage considerations ? though the TB6594FLG has thermal shutdown (tsd) circuitry, a large current might abruptly flow through the ic in case of a short-circuit across its outputs, a short-ci rcuit to power supply or a short-circuit to ground, leading to a permanent damage of the ic. these possibilities should be fully cons idered in the design of the output, v cc and ground lines. ? the ic should be installed correctly. otherwise, the ic or peripheral parts and de vices may be degraded or permanently damaged. 24 3 pwm control f osc = 100 khz h-bridge channel a soft start v ref cont 1 4 6 8 11 13 9 h-bridge channel b pgnd v m a o1 a o2 standby bo1 bo2 mgnd control logic channel a tsd control logic channel b 23 20 18 17 15 14 16 stby ain1 ain2 bin1 bin2 gnd v out m m mcu v cc c3 0.1 f +5 v c2 47 f sbd c4 0.1 f l = 100 h c1 220 f + 2.2 v to 5 v l: cd54 inductor with an inductance of 100 h from sumida corporation (or its equivalent) sbd: ma720 from matsushita electric i ndustrial co., ltd. (or its equivalent) c2: tantalum electrol y tic ca p acitor with a ca p acitance of 47 f from nichicon cor p oration ( or its e q uivalent )
TB6594FLG 2008-04-22 8 package dimensions weight: 0.05 g (typ.)
TB6594FLG 2008-04-22 9 qon package considerations package appearances please follow the following guid elines for the qon package. guidelines: (1) the solder plated pads at the four corners of the package (shaded ar eas in the bottom view) should not be soldered for the purpose of improving th e mechanical strength of solder joints. (2) when using the TB6594FLG, it should be ensured that the therma l pad and solder plated pads (shaded areas in the top and bottom view s) are electrically insulated (note). note: care should be taken in the board design to prevent solder for through-hole joints from flowing to the solder plated pads on the bottom of the package (shaded areas in the bottom view). ? when mounting or soldering this package, care mu st be taken to avoid electrostatic discharge or electrical overstress to the ic. (t his is to avoid electrical leakag e and a buildup of electrostatic charge in the end product.) ? it should be ensured that no voltage is directly applied to the solder plated pads when designing the pc board. (top view) (bottom view)
TB6594FLG 2008-04-22 10 notes on contents 1. block diagrams some of the functional blocks, circ uits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document ar e provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial property rights by prov iding these examples of application circuits. 5. test circuits components in the test circuits are used only to obtain and confirm the devi ce characteristics. these components and circuits are not guaranteed to prev ent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics (1) the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large cu rrent to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current re sulting from the inrush current at power on or the negative current result ing from the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protec tion functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. (4) do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative terminals of power supplies are connected properly. otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied th e current with inserting in the wrong orientation or incorrectly even just one time.
TB6594FLG 2008-04-22 11 points to remember on handling of ics (1) thermal shutdown circuit thermal shutdown circuits do not necessarily prot ect ics under all circumst ances. if the thermal shutdown circuits operate against th e over temperature, clear the heat generation status immediately. depending on the method of use and usage condit ions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not oper ate properly or ic breakdown before operation. (2) heat radiation design in using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiat ed, not to exceed the specified junc tion temperature (tj) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characteristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat radiation with peripheral components. (3) back-emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back-emf. if the current sink capability of the power supply is small, the device?s motor power supply and outp ut pins might be exposed to conditions beyond maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design.
TB6594FLG 2008-04-22 12 about solderability, following conditions were confirmed ? solderability (1) use of sn-37pb solder bath solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0 .5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux restrictions on product use 070122eba_r6 ? the information contained herein is subject to change without notice. 021023_d ? toshiba is continually working to improve the quality a nd reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their i nherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of t he buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within s pecified operating ranges as set forth in the most recent toshiba products specific ations. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semico nductor devices,? or ?toshiba semiconductor reliability handbook? etc. 021023_a ? the toshiba products listed in this document are in tended for usage in general electronics applications (computer, personal equipment, office equipment, measuri ng equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunc tion or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage incl ude atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffi c signal instruments, comb ustion control instruments, medical instruments, all types of safety devices, et c. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. 021023_b ? the products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_q ? the information contained herein is presented only as a gu ide for the applications of our products. no responsibility is assumed by toshiba for any infringements of patents or other rights of the third parties which may result from its use. no license is granted by imp lication or otherwise under any patents or other rights of toshiba or the third parties. 070122_c ? please use this product in compliance with all applicable la ws and regulations that regulate the inclusion or use of controlled substances. toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_af ? the products described in this document are subject to foreign exchange and foreign trade control laws. 060925_e

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