specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 1 of 7 march 2008 ecg002 ingap hbt gain block product features ? dc ? 6 ghz ? 20 db gain @ 1 ghz ? +15.5 dbm p1db @ 1 ghz ? +29 dbm oip3 @ 1 ghz ? 3.8 db noise figure ? internally matched to 50 ? robust 1000v esd, class 1c ? lead-free/green/rohs-compliant sot-86, sot-363, & sot-89 package applications ? mobile infrastructure ? catv / fttx ? wlan / ism ? rfid ? wimax / wibro product description the ecg002 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. at 1000 mhz, the ecg002 typically provides 20 db of gain, +29 dbm output ip3, and +15.5 dbm p1db. the ecg002 consists of a darl ington-pair amplifier using the high reliability ingap/ga as hbt process technology and only requires dc-blocking capacitors, a bias resistor, and an inductive rf choke for operation. the device is ideal for wireless applications and is available in low-cost, surface-mountable plastic lead-free/green/rohs-compliant sot-363, sot-86 and sot-89 packages. all devices are 100% rf and dc tested. the broadband mmic amplifier ca n be directly applied to various current and next ge neration wireless technologies such as gprs, gsm, cdma, and w-cdma. in addition, the ecg002 will work for other various applications within the dc to 6 ghz frequency range such as catv and mobile wireless. functional diagram rf in gnd rf out gnd 1 23 4 ecg002b-g rf out rf in gnd gnd 1 2 3 4 ecg002c-g rf in gnd rf out gnd gnd gnd 1 2 3 4 6 5 ECG002F-G specifications (1) parameter units min typ max operational bandwidth mhz dc 6000 test frequency mhz 1000 gain db 20 output p1db dbm +15.5 output ip3 (2) dbm +29 test frequency mhz 2000 gain db 17 19 large-signal gain (3) db 16 18 output p1db dbm +13 +15 output ip3 (2) dbm +29 noise figure db 3.8 device voltage v 3.5 3.9 4.3 device current ma 45 1. test conditions unless otherwise noted: 25 oc, supply voltage = +5 v, rbias = 24 , 50 system. 2. 3oip measured with two tones at an output power of +2 dbm/tone separated by 1 mhz. the suppression on the largest im3 product is used to calculate the 3oip using a 2:1 rule. 3. large-signal gain is tested with an input power level of -3 dbm. absolute maximum rating parameter rating device current 150 ma rf input power (continuous) +12 dbm thermal resistance - ecg002b-g 131 c/w thermal resistance - ecg002c-g 233 c/w thermal resistance - ECG002F-G 233 c/w junction temperature +160 c operation of this device above any of th ese parameters may cause permanent damage. typical performance (1) parameter units typical frequency mhz 500 900 1900 2140 s21 db 20.6 20 19.5 18.7 s11 db -17 -17 -15 -15 s22 db -18 -18 -21 -21 output p1db dbm + 15.8 +15.5 +15 +14.9 output ip3 dbm +28 +29 +29 +29 noise figure db 3.8 3.7 3.8 3.8 ordering information part no. description ecg002b-g ingap hbt gain block (lead-free/green/rohs-co mpliant sot-89 package) ecg002c-g ingap hbt gain block (lead-free/green/rohs-co mpliant sot-86 package) ECG002F-G ingap hbt gain block (lead-free/green/rohs-co mpliant sot-363 package) ecg002b-pcb 700 ? 2400 mhz fully assembled eval. board ecg002c-pcb 700 ? 2400 mhz fully assembled eval. board ecg002f-pcb 700 ? 2400 mhz fully assembled eval. board standard t/r size = 1000 pieces on a 7? reel for ecg002b-g. standard t/r size = 1000 pieces on a 7? reel for ecg002c-g. standard t/r size = 3000 pieces on a 7? reel for ECG002F-G.
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 2 of 7 march 2008 ecg002 ingap hbt gain block typical device rf performance supply bias = +5 v, r bias = 24 , i cc = 45 ma frequency mhz 100 500 900 1900 2140 2400 3500 5800 s21 db 21 20.6 20 19.5 18.7 18.2 16.4 13.3 s11 db -18 -17 -17 -15 -15 -15 -16 -19 s22 db -17 -17 -18 -20 -21 -22 -35 -16 output p1db dbm +15.4 +15.6 +15.5 +15 +15 +15 +14.5 +11 output ip3 dbm +28 +28 +29 +29 +29 +29 noise figure db 3.9 3.8 3.8 3.8 3.8 3.9 1. test conditions: t = 25o c, supply voltage = +5 v, device voltage = +3.9 v, rbias = 24 , icc = 45 ma typical, 50 system. 2. 3oip measured with two tones at an output power of -1 db m/tone separated by 1 mhz. the suppression on the largest im3 produ ct is used to calculate the 3oip using a 2:1 rule. 3. data is shown as device performance only. actual implementation for the desired frequency band will be determined by exter nal components shown in the application circuit. gain vs. frequency 12 14 16 18 20 22 500 1000 1500 2000 2500 3000 frequency (mhz) gain ( db ) +25c -40c +85c s11, s22 vs. frequency -40 -35 -30 -25 -20 -15 -10 -5 0 0123456 frequency (ghz) s11, s22 ( db ) s22 s11 vde vs. icc 0 20 40 60 80 100 120 3.00 3.20 3.40 3.60 3.80 4.00 4.20 4.40 vde (v) icc (ma) +25c oip3 vs. frequency 24 26 28 30 32 500 1000 1500 2000 2500 3000 frequency (mhz) oip3 ( dbm ) +25c -40c +85c noise figure vs. frequency 2 2.5 3 3.5 4 4.5 500 1000 1500 2000 frequency (mhz) nf ( db ) p1db vs. frequency 10 12 14 16 18 20 500 1000 1500 2000 2500 3000 frequency (mhz) p1db ( dbm ) +25c -40c +85c
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 3 of 7 march 2008 ecg002 ingap hbt gain block recommended application circuit ecg002b-pcb ecg002c-pcb ecg002f-pcb recommended component values reference frequency (mhz) designator 50 500 900 1900 2200 2500 3500 l1 820 nh 220 nh 68 nh 27 nh 22 nh 18 nh 15 nh c1, c2, c4 .018 f 1000 pf 100 pf 68 pf 68 pf 56 pf 39 pf 1. the proper values for the components are dependent upon the intended frequency of operation. 2. the following values are contained on the evaluation board to achieve optimal broadband performance: ref. desig. value / type size l1 39 nh wirewound inductor 0603 c1, c2 56 pf chip capacitor 0603 c3 0.018 f chip capacitor 0603 c4 do not place r4 24 1% tolerance 0805 recommended bias resistor values supply voltage r1 value size 5 v 24.4 ohms 0805 6 v 46.7 ohms 0805 8 v 91 ohms 1210 9 v 113 ohms 1210 10 v 136 ohms 2010 12 v 180 ohms 2010 the proper value for r1 is dependent upon the supply voltage and allows for bias stability over temperature. wj recommends a minimum supply bias of +5 v. a 1% tolerance resistor is recommended. c1 blocking capacitor rf out l1 rf choke c3 0.018 f r4 bias resisto r rf in c4 bypass capacito r c2 blocking ca p acito r vcc icc = 45 m a ecg002
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 4 of 7 march 2008 ecg002 ingap hbt gain block ecg002b-g mechanical information this package is lead-free/green/ro hs-compliant. the plating material on the leads is nipdau. it is compatible with both lead- free (maximum 260 c reflow temperature) and leaded (maximum 245 c reflow temperature) soldering processes. outline drawing land pattern product marking the component will be marked with an ?e002g? designator with an alphanumeric lot code on the top surface of the package. the obsolete tin-lead package is marked with an ?e002? designator followed by an alphanumeric lot code; it may also have been marked with a ?c? designator followed by a 3-digit numeric lot code. tape and reel specifications for this part are located on the website in the ?application notes? section. msl / esd rating esd rating: class 1a value: passes between 250 and 500v test: human body model (hbm) standard: jedec standard jesd22-a114 msl rating: level 3 at +260 c convection reflow standard: jedec standard j-std-020 mounting config. notes 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated th ru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via region contacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the board contacts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angles are in degrees. e002g xxxx-x
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 5 of 7 march 2008 ecg002 ingap hbt gain block ecg002c-g mechanical information this package is lead-free/green/ro hs-compliant. the plating material on the pins is annealed matte tin over copper. it is com patible with both lead-free (maximum 260 c reflow temperature) and leaded (maximum 245 c reflow temperature) soldering processes. outline drawing land pattern product marking the component will be marked with a two- digit numeric lot code (shown as ?xx?) followed with a ?k? designator on the top surface of the package. the obsolete tin-lead package is marked with a two-digit numeric lot code followed with a ?j? designator; it may also have been marked with a ?j? designator followed by a two-digit lot code. tape and reel specifications for this part are located on the website in the ?application notes? section. msl / esd rating esd rating: class 1a value: passes between 250 and 500v test: human body model (hbm) standard: jedec standard jesd22-a114 msl rating: level 3 at +260 c convection reflow standard: jedec standard j-std-020 mounting config. notes 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated th ru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via region contacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the board contacts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angles are in degrees.
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 6 of 7 march 2008 ecg002 ingap hbt gain block ECG002F-G mechanical information this package is lead-free/green/ro hs-compliant. the plating material on the lead s is annealed ma tte tin over copper. it is co mpatible with both lead-free (maximum 260 c reflow temperature) and leaded (maximum 245 c reflow temperature) soldering processes. outline drawing land pattern product marking the component will be marked with a two- digit numeric lot code (shown as ?xx?) followed with a ?5? designator on the top surface of the package. the obsolete tin-lead package is marked with a two-digit numeric lot code followed with a ?1? designator; it may also have been marked with a ?10? designator followed by a letter lot code. tape and reel specifications for this part are located on the website in the ?application notes? section. msl / esd rating esd rating: class 1a value: passes between 250 and 500v test: human body model (hbm) standard: jedec standard jesd22-a114 msl rating: level 3 at +260 c convection reflow standard: jedec standard j-std-020 mounting config. notes 1. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135?) diameter drill and have a final plated th ru diameter of .25 mm (.010?). 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via region contacts the heatsink. 4. do not put solder mask on the backside of the pc board in the region where the board contacts the heatsink. 5. rf trace width depends upon the pc board material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters (inches). angles are in degrees.
specifications and information are subject to change without notice wj communications, inc ? phone 1-800-wj1-4401 ? fax: 408-577-6621 ? e-mail: sales@wj.com ? web site: www.wj.com, www.triquint.com page 7 of 7 march 2008 ecg002 ingap hbt gain block typical device s-parameters ? ecg002b-g s-parameters (v device = +3.9 v, i cc = 45 ma, t = 25 c, calibrated to device leads) freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -17.15 0.33 21.23 177.70 -23.14 -0.19 -15.62 -1.52 500 -16.04 0.38 20.84 156.45 -23.06 -1.64 -15.69 -20.22 1000 -14.81 -8.39 20.03 135.90 -22.83 -2.70 -15.79 -38.56 1500 -13.59 -21.57 19.11 118.25 -22.47 -4.36 -15.62 -58.17 2000 -13.14 -38.98 18.50 103.23 -21.81 -7.40 -15.49 -81.71 2500 -13.40 -54.87 18.01 87.48 -21.28 -11.83 -15.86 -107.96 3000 -13.96 -68.82 17.49 71.83 -20.73 -17.30 -16.64 -139.16 3500 -15.15 -79.85 16.95 56.22 -20.34 -22.68 -17.60 -171.00 4000 -17.07 -85.86 16.36 41.14 -19.95 -28.74 -17.11 151.84 4500 -19.43 -86.07 15.78 26.53 -19.57 -34.89 -15.61 119.05 5000 -24.29 -76.56 15.19 12.27 -19.34 -42.28 -13.30 94.72 5500 -26.31 -15.89 14.64 -1.79 -19.04 -49.74 -10.79 76.65 6000 -21.31 17.01 14.08 -16.11 -18.87 -57.89 -8.79 61.13 typical device s-parameters ? ecg002c-g s-parameters (v device = +3.9 v, i cc = 45 ma, t = 25 c, calibrated to device leads) freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -37.42 134.67 22.11 177.84 -23.75 0.04 -36.75 -5.01 500 -22.95 51.84 21.83 159.38 -23.57 1.76 -24.35 -54.15 1000 -20.13 57.46 21.21 140.39 -23.62 1.39 -22.33 -124.91 1500 -19.79 55.23 20.35 123.69 -23.56 2.36 -17.57 -159.03 2000 -19.82 31.10 19.41 108.29 -23.07 2.45 -15.79 -172.54 2500 -16.54 -1.82 18.63 95.93 -23.05 1.89 -17.22 -173.92 3000 -15.67 -7.79 17.69 83.59 -22.20 3.83 -15.86 168.33 3500 -15.94 -8.76 16.88 71.85 -21.97 1.75 -14.21 145.59 4000 -17.24 -5.83 15.94 60.22 -21.37 -2.61 -12.04 128.60 4500 -19.29 -2.21 15.15 49.25 -20.84 -5.08 -10.26 120.09 5000 -23.85 -16.76 14.45 39.80 -20.62 -6.52 -9.57 116.71 5500 -28.00 -81.95 13.89 30.92 -19.77 -7.93 -9.86 118.09 6000 -22.34 -134.50 13.34 21.26 -19.58 -13.03 -10.90 119.18 typical device s-parameters ? ECG002F-G s-parameters (v device = +3.9 v, i cc = 45 ma, t = 25 c, calibrated to device leads) freq (mhz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s12 (ang) s22 (db) s22 (ang) 50 -35.58 153.00 22.09 177.80 -23.58 1.09 -41.45 -0.41 500 -25.34 51.37 21.86 159.87 -23.60 0.02 -25.01 -55.13 1000 -22.93 66.15 21.29 141.06 -23.30 2.10 -22.43 -134.17 1500 -21.74 76.98 20.47 124.48 -23.66 2.66 -16.71 -168.31 2000 -22.60 53.21 19.58 108.93 -23.31 1.22 -14.43 179.01 2500 -19.67 6.41 18.83 96.29 -22.86 -0.98 -15.12 176.50 3000 -18.00 3.61 17.93 83.64 -22.60 1.33 -13.82 164.54 3500 -17.76 4.44 17.12 71.47 -22.02 -1.64 -12.58 145.98 4000 -18.59 7.79 16.21 59.28 -21.64 -1.94 -10.90 130.27 4500 -20.60 19.66 15.42 48.02 -21.30 -4.58 -9.39 117.60 5000 -27.53 28.83 14.71 38.32 -20.52 -9.65 -8.57 112.39 5500 -37.18 -144.72 14.08 29.10 -20.32 -9.39 -8.88 113.57 6000 -24.38 -146.24 13.53 19.53 -19.40 -14.12 -9.58 114.73 device s-parameters are available for download from the website at: http://www.wj.com
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