tc1264 telcom semiconductor reserves the right to make changes in the circuitry and specifications of its devices. tc1264-4 3/28/00 800ma fixed output cmos ldo general description the tc1264 is a fixed output, high accuracy (typically 0.5%) cmos low dropout regulator. designed specifically for battery-operated systems, the tc1264? cmos con- struction eliminates wasted ground current, significantly extending battery life. total supply current is typically 80 a at full load (20 to 60 times lower than in bipolar regulators !). tc1264 key features include ultra low noise, very low dropout voltage (typically 450mv at full load), and fast response to step changes in load. the tc1264 incorporates both over-temperature and over-current protection. the tc1264 is stable with an output capacitor of only 1 f and has a maximum output current of 800ma. it is available in 3- pin sot-223, 3-pin to-220, and 3-pin ddpak packages. features very low dropout voltage guaranteed 800ma output high output voltage accuracy standard or custom output voltages over-current and over-temperature protection applications battery-operated systems portable computers medical instruments instrumentation cellular / gsm / phs phones linear post-regulator for smps pagers ordering information junction part temperature number package range tc1264-xxvdb 3-pin sot-223 ?40 c to +125 c tc1264-xxvab 3-pin to-220 ?40 c to +125 c tc1264-xxveb 3-pin ddpak ?40 c to +125 c typical application pin configuration v in v in v out gnd gnd v out tab is gnd front view front view 1 12 3 3 2 tab is gnd tc1264 tc1264 v in v out tc1264 3-pin to-220 tab is gnd 3-pin sot-223 3-pin ddpak 12 3 gnd tc1264 v in v out c1 1 f gnd v out v in available output voltages: 1.8, 2.5, 3.0, 3.3 xx indicates ouput voltages other output voltages are available. please contact telcom semiconductor for details.
2 tc1264 800ma fixed output cmos ldo tc1264-4 3/28/00 electrical characteristics: v in = v r + 1.5v (note 1) , i l = 100 a, c l = 3.3 f, t a = 25 c, unless otherwise specified. boldface type specifications apply for junction temperatures of 40 c to +125 c. symbol parameter test conditions min typ max units v in input operating voltage (note 2) 2.7 6.0 v i out max maximum output current 800 ma v out output voltage v r > 2.5v v r ?2.5% v r 0.5% v r + 2.5% v v r = 1.8v v r ?2% v r 0.5% v r + 3% ? v out / ? tv out temperature coefficient note 3 40 ppm/ c ? v out / ? v in line regulation (v r + 1v) < v in < 6v 0.007 0.35 % ? v out /v out load regulation i l = 0.1ma to i out max (note 4) -0.01 0.002 0 %/ma v in ?v out dropout voltage v r > 2.5v, i l = 100 a 20 30 mv i l = 100ma 50 160 i l = 300ma 150 480 i l = 500ma 260 800 i l = 800ma 450 1300 v r = 1.8v, i l = 500ma 700 1000 i l = 800ma 890 1400 (note 5) i dd supply current i l = 0 80 130 a psrr power supply rejection ratio f 1khz 64 db i out sc output short circuit current v out = 0v 1200 ma ? v out / ? p d thermal regulation note 6 0.04 v/w en output noise i l = i out max , f = 10khz 260 nv/ hz notes: 1. v r is the regulator output voltage setting. 2. the minimum v in has to justify the conditions: v in > v r + v dropout and v in > 2.7v for i l = 0.1ma to i outmax . 3. t c v out = (v out max v out min ) x 10 6 v out x ? t 4. regulation is measured at a constant junction temperature using low duty cycle pulse testing. load regulation is tested over a load range from 0.1ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the t hermal regulation specification. 5. dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value m easured at a 1.5v differential. 6. thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, exc luding load or line regulation effects. specifications are for a current pulse equal to i lmax at v in = 6v for t = 10msec. 7. the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction-to-air (i.e. t a , t j , ja ). exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. please see thermal considerations section of this data sheet for more details. absolute maximum ratings* input voltage .............................................................. 6.5v output voltage ........................... (v ss ?0.3) to (v in + 0.3) power dissipation .................... internally limited (note 7) operating temperature .................... ?40 c < t j < 125 c storage temperature ............................ ?65 c to +150 c maximum voltage on any pin ........... v in + 0.3v to ?0.3v lead temperature (soldering, 10 sec.) ................ +260 c *absolute maximum ratings indicate device operation limits beyond dam- age may occur. device operation beyond the limits listed in electrical characteristics is not recommended.
3 800ma fixed output cmos ldo tc1264 tc1264-4 3/28/00 figure 1: typical application circuit output capacitor a 1 f (min) capacitor from v out to ground is required. the output capacitor should have an effective series resis- tance of 5 ? or less. a 1 f capacitor should be connected from v in to gnd if there is more than 10 inches of wire between the regulator and the ac filter capacitor, or if a battery is used as the power source. aluminum electrolytic or tantalum capacitor types can be used. (since many aluminum electrolytic capacitors freeze at approximately 30 c, solid tantalums are recommended for applications operating below ?5 c.) when operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. thermal considerations thermal shutdown integrated thermal protection circuitry shuts the regula- tor off when die temperature exceeds 160 c. the regulator remains off until the die temperature drops to approximately 150 c. power dissipation the amount of power the regulator dissipates is prima- rily a function of input and output voltage, and output current. the following equation is used to calculate worst case actual power dissipation: detailed description the tc1264 is a precision, fixed output ldo. unlike bipolar regulators, the tc1264 supply current does not increase with load current. in addition, v out remains stable and within regulation at very low load currents (an important consideration in rtc and cmos ram battery backup applications). figure 1 shows a typical application circuit. c1 1 f battery tc1264 v in v out c2 1 f gnd v out p d (v in max ?v out min )i load max where: p d = worst case actual power dissipation v in max = maximum voltage on v in v out min = minimum regulator output voltage i load max = maximum output (load) current equation 1. the maximum allowable power dissipation (equation 2) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (125 c) and the thermal resistance from junction-to-air ( ja ). p d max = (t j max ?t a max ) ja where all terms are previously defined. equation 2. table 1 shows various values of ja for the tc1264 mounted on a 1/16 inch, 2-layer pcb with 1 oz. copper foil. table 1. thermal resistance guidelines for tc1264 in 3-pin sot-223 package copper copper thermal area area board resistance (topside)* (backside) area ( ja ) 2500 sq mm 2500 sq mm 2500 sq mm 45 c/w 1000 sq mm 2500 sq mm 2500 sq mm 45 c/w 225 sq mm 2500 sq mm 2500 sq mm 53 c/w 100 sq mm 2500 sq mm 2500 sq mm 59 c/w 1000 sq mm 1000 sq mm 1000 sq mm 52 c/w 1000 sq mm 0 sq mm 1000 sq mm 55 c/w notes: *tab of device attached to topside copper table 2. thermal resistance guidelines for tc1264 in 3-pin ddpak/to-220 package copper copper thermal area area board resistance (topside)* (backside) area ( ja ) 2500 sq mm 2500 sq mm 2500 sq mm 25 c/w 1000 sq mm 2500 sq mm 2500 sq mm 27 c/w 125 sq mm 2500 sq mm 2500 sq mm 35 c/w notes: *tab of device attached to topside copper
4 tc1264 800ma fixed output cmos ldo tc1264-4 3/28/00 equation 1 can be used in conjunction with equation 2 to ensure regulator thermal operation is within limits. for example: given: v in max = 3.3v 10% v out min = 2.7v 0.5% i loadmax = 275ma t j max = 125 c t a max =95 c ja =59 c/w (sot-223) find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: p d (v in max ?v out min )i load max = [(3.3 x 1.1) ?(2.7 x .995)]275 x 10 -3 = 260mw maximum allowable power dissipation: p d max = (t j max ?t a max ) ja = (125 ?95) 59 = 508mw in this example, the tc1264 dissipates a maximum of only 260mw; far below the allowable limit of 508mw. in a similar manner, equation 1 and equation 2 can be used to calculate maximum current and/or input voltage limits. for example, the maximum allowable v in is found by substitut- ing the maximum allowable power dissipation of 508mw into equation 1, from which v in max = 4.6v.
5 800ma fixed output cmos ldo tc1264 tc1264-4 3/28/00 typical characteristics output noise vs. frequency frequency (khz) noise ( v/ / hz) 10.0 1.0 0.01 0.01 1 10 100 1000 0.1 0.0 r load = 50 ? c out = 1 f 0.020 0.018 0.016 0.012 0.010 0.008 0.006 0.004 0.002 0.000 0.014 temperature ( c) line regulation vs. temperature line regulation (%) 0.600 0.550 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000 0 100 200 300 400 500 600 700 800 i load (ma) 3.0v dropout voltage vs. i load dropout voltage (v) power supply rejection ratio frequency (hz) 10 100 1k 10k 1m 100k v out = 3v r load = 50 ? v in ac = 50mv p-p c out = 1 f temperature ( c) i dd ( a) psrr (db) 3.030 3.020 3.010 3.000 2.990 2.980 2.970 2.960 2.950 2.940 2.930 2.920 temperature ( c) 3.0v v out vs. temperature v out (v) 150 135 120 105 90 75 60 45 30 15 0 i dd vs. temperature 40 c0 c25 c70 c85 c 125 c 40 c0 c25 c70 c85 c 125 c 30db 35db 40db 45db 50db 55db 60db 65db 80db 70db 75db 85 c 125 c 40 c 0 c 25 c 70 c i load = 0.1ma i load = 300ma i load = 500ma i load = 800ma temperature ( c) 40 c0 c25 c70 c85 c 125 c 40 c 0 c25 c70 c85 c 125 c 0.0100 0.0090 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 temperature ( c) load regulation vs. temperature load regulation %/ma 1ma to 800ma v out = 3v v out = 3v
6 tc1264 800ma fixed output cmos ldo tc1264-4 3/28/00 taping forms user direction of feed user direction of feed device marking component taping orientation for 3-pin sot-223 devices device marking pin 1 pin 1 standard reel component orientation for tr suffix device (mark right side up) reverse reel component orientation for rt suffix device (mark upside down) w p package carrier width (w) pitch (p) part per full reel reel size 3-pin sot-223 12 mm 8 mm 4000 13 in carrier tape, number of components per reel and reel size w user direction of feed user direction of feed device marking component taping orientation for 3-pin ddpak devices p pin 1 pin 1 standard reel component orientation for tr suffix device (mark right side up) reverse reel component orientation for rt suffix device (mark upside down) device marking package carrier width (w) pitch (p) part per full reel reel size 3-pin ddpak 24 mm 16 mm 750 13 in carrier tape, number of components per reel and reel size
7 800ma fixed output cmos ldo tc1264 tc1264-4 3/28/00 dimensions: inches (mm) package dimensions 3-pin to-220 .205 (5.21) .195 (4.95) pin 1 .113 (2.87) .103 (2.62) .410 (10.41) .357 (9.06) .156 (3.96) .146 (3.71) dia. .258 (6.55) .230 (5.84) .560 (14.22) .518 (13.16) .105 (2.67) .095 (2.41) .037 (0.94) .027 (0.69) .055 (1.40) .045 (1.14) .244 (6.20) .234 (5.94) .185 (4.70) .165 (4.19) .055 (1.40) .045 (1.14) .594 (15.09) .569 (14.45) .115 (2.92) .095 (2.41) .020 (0.51) .012 (0.30) 3 - 7.5 5 plcs. .100 (2.54) typ. 3-pin ddpak .037 (0.94) .026 (0.66) .370 (9.40) .329 (8.38) .067 (1.70) .045 (1.14) .605 (15.37) .549 (13.95) .410 (10.41) .385 (9.78) .183 (4.65) .170 (4.32) .055 (1.40) .045 (1.14) .010 (0.25) .000 (0.00) .110 (2.79) .068 (1.72) 0.26 (0.66) 0.14 (0.36) .051 (1.30) .049 (1.24) 0 - 8 3 - 7 (5x)
8 tc1264 800ma fixed output cmos ldo tc1264-4 3/28/00 telcom semiconductor h.k. ltd. 10 sam chuk street, ground floor san po kong, kowloon hong kong tel: (011) 852-2350-7380 fax: (011) 852-2354-9957 sales offices telcom semiconductor, inc. 1300 terra bella avenue p.o. box 7267 mountain view, ca 94039-7267 tel: 650-968-9241 fax: 650-967-1590 e-mail: liter@telcom-semi.com telcom semiconductor, gmbh lochhamer strasse 13 d-82152 martinsried germany tel: (011) 49 89 895 6500 fax: (011) 49 89 895 6502 2 package dimensions dimensions: inches (mm) .264 (6.70) .248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30) .264 (6.70) .146 (3.70) .130 (3.30) .091 (2.30) typ. .071 (1.80) max. .181 (4.60) typ. .036 (0.91) min. .041 (1.04) .033 (0.84) pin 1 .013 (0.33) .009 (0.24) .033 (0.84) .024 (0.60) .004 (0.10) .001 (0.02) 10? max. 3-pin sot-223
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