description this evolutionary package design allows the optical designer flexibility to minimize the quantity of leds required without trading off the ultimate optical perfor- mance. this slim package can be easily coupled with secondary optics to efficiently distribute light, providing a total low-profile structure. these leds have a very low package thermal resistance that efficiently dissipates heat out of the led package to its surrounding, e.g., a circuit board. agilent hsmz-c430-xxxxx high performance surface mount leds data sheet features ? very low thermal impedance ? smooth, consistent spatial radiation pattern ? viewing angle: 30 ? 3.2 x 2.8 mm footprint ? high luminous output ? compatible with ir solder reflow ? colors available: red, amber, and red orange ? available in 8 mm tape on 7" (178 mm) diameter reels ? tinted, nondiffused epoxy applications ? variable message sign ? traffic/rail signal ? emergency/warning signs ? decorative devices ? backlighting ? automotive benefits ? high package thermal dissipation capability ? lens design capability to efficiently distribute light into desirable angle ? small footprint to overcome space count ? high flux output in surface mount package high-efficiency led dice are used in these led components. alingap (aluminium indium gallium phosphide) for red, red orange, and amber, is capable of producing high light output. these solid-state surface mount leds are designed with a reflector cup and dome, which provide directional lighting. the reflector cup focuses the light more efficiently to provide a higher intensity compared to a nonreflector cup equivalent part. all packages are compatible with ir soldering processes and are shipped in tape and reel with 2000 units per reel. device selection guide total flux f v (mlm) [1] @ 70 ma part number min. typ. max. color parts per reel HSMZ-C430-TW001 2100 3800 8300 ts alingap red 2000 hsmv-c430-ux001 2700 4500 10700 ts alingap red orange 2000 hsmu-c430-sv001 1600 3100 6300 ts alingap amber 2000 note: 1. f v is the total luminous flux output as measured with an integrating sphere after the device has stabilized.
2 package dimensions 2.8
(0.111) 0.5 (0.02) 0.7 (0.028) 3.210 (0.126) anode pad 2.8 (0.111) 1.4 (0.055) cathode line (gold trace) polarity 2.1 (0.080) 0.9 (0.036) 0.5 (0.02) heat sink pad 0.6 (0.024) cathode pad green
cathode
marking notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified.
3. heat sink pad is connected to cathode pad by product design.
4. do not use heat sink pad as cathode.
5. heat sink pad needs to be independent for each unit (if arranged in-line or in matrix form).
6. do not connect all the heat sinks together as this will lead to short circuit.
7. illustration on heat sink design for matrix and in-line arrangement design shown in application notes.
3 hsm x-c4 xx - x x x xx packaging option 01: tape and reel on 8 mm tape, 7 inch reel color bin selection 0: full color distribution max. flux bin (refer to flux bin table) min. flux bin (refer to flux bin table) viewing angle dice color u: ts alingap amber v: ts alingap red orange z: ts alingap red absolute maximum ratings at t a = 25?c parameter alingap units dc forward current [1] 70 ma peak pulsing current [2] 200 ma power dissipation 230 mw reverse voltage 5 v led junction temperature 110 ?c operating temperature range C40 to +100 ?c storage temperature range C55 to +100 ?c soldering temperature see ir reflow profile (figure 7) notes: 1. derate linearly as shown in figure 4. 2. pulse condition of 1/100 duty factor and 1 msec width.
4 380 1.0 0 630 780 0.2 relative intensity wavelength ?nm 530 0.6 0.4 0.8 430 580 680 amber red 480 730 red-
orange figure 1. relative intensity vs. wavelength. figure 2. forward current vs. forward voltage. figure 3. relative luminous flux vs. forward current. electrical characteristics at t a = 25?c forward voltage reverse voltage capacitance c thermal v f (volts) v r (volts) (pf), v f = 0, resistance @ i f = 70 ma @ i r = 100 m a f = 1 mhz r q j-pin (?c/w) device typ. max. min. typ. typ. hsmz-c430 2.7 3.2 5 30 90 hsmv-c430 2.6 3.2 5 30 90 hsmu-c430 2.7 3.2 5 30 90 optical characteristics at t a = 25?c luminous color, intensity/total flux peak dominant luminous luminous i v (mcd) wavelength wavelength viewing angle efficacy efficiency / f v (mlm) [2] l peak (nm) l d (nm) [3] 2 q 1/2 degrees [4] h v (lm/w) (lm/w) part number typ. typ. typ. typ. typ. typ. hsmz-c430 1.2 642 629 30 150 20 hsmv-c430 1.2 634 621 30 210 25 hsmu-c430 1.2 597 593 30 500 16 notes: 2. f v is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 3. the dominant wavelength is derived from the cie chromatically diagram and represents the perceived color of the device. 4. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 0 2.5 forward voltage ?v 0 20 70 80 forward current ?ma 40 10 50 1.5 30 60 0.5 1.0 2.0 3.0 amber red-
orange red 040 forward current ?ma 0 0.4 1.6 relative luminous flux
(normalized at 50 ma) 80 0.8 0.2 1.0 20 0.6 1.4 60 1.2
5 figure 4. maximum dc forward current vs. ambient temperature. figure 5. radiation pattern. figure 6. percent total luminous flux vs. total included angle. figure 7. recommended reflow soldering profile (jedec j-std-020-a). 0 90 0 20 60 80 110 20 maximum dc forward current ?ma ambient temperature ?? 40 50 70 40 10 30 50 70 90 r q j-a = 200?/w r q j-a = 400?/w 10 30 60 80 100 r q j-a = 300?/w relative intensity 1.0 0 off axis angle ?degrees 0.8 0.6 0.5 0.7 0.2 0.1 0.3 0.4 0.9 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 0 100 0 20 60 80 180 20 % total luminous flux total included angle ?degrees 40 40 60 80 100 120 140 160 240? max. 20 sec. max. 3?/sec.
max. 120 sec. max. time temperature 183? 100-150? ??/sec.
max. 60-150 sec. 3?/sec. max.
6 figure 9. reel orientation. figure 8. recommended soldering pad pattern. 1.50 x 4 8.50 min. 1.50 x 2 3.56 solder resist 8.50 min. plated through hole
as heat pipe connecting
bottom heat sink
d0.35 mm x 8 min. metal heat sink
under solder mask 0.90 4.26 2.80 0.60 0.73 top view bottom view note: all dimensions in mm. cathode side printed label user feed direction
7 figure 10. reel dimensions. figure 11. tape dimensions. figure 12. tape leader and trailer dimensions. 8.0 ?0.3 user direction of feed 3.50 ?0.05 1.75 ?0.1 4.0 ?0.1 2.00 ?0.05 4.0 ?0.1 1.50 carrier tape cover tape + 0.1
0 2.0
(0.08) 21.0
(0.83) 13.0
(0.51) 1.5
(0.06) typ. 13.0
(0.51) 10.0
(0.39) 60.0
(2.36) label 180
(7.08) end start there shall be a
minimum of 160 mm
(6.3 inches) of empty
component pockets
sealed with cover
tape. mounted with
components. there shall be a
minimum of 160 mm
(6.3 inches) of empty
component pockets
sealed with cover
tape. minimum of
230 mm
(9.05 inches)
may consist
of carrier
and/or
cover tape.
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6271 2451 india, australia, new zealand: (+65) 6271 2394 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6271 2194 malaysia, singapore: (+65) 6271 2054 taiwan: (+65) 6271 2654 data subject to change. copyright ? 2002 agilent technologies, inc. may 14, 2002 5988-6494en convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components . for more information on using hsmx-c4xx series smt leds, refer to application note 1266. flux bin category bin id min. max. q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 tolerance = 15% color bin category amber bin id min. max. 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 7 594.5 597.0 red orange bin id min. max. 1 610.5 613.5 2 613.5 616.5 3 616.5 619.5 4 619.5 623.5 5 623.5 626.5 red full distribution tolerance = 0.5 nm storage condition: 5 to 30?c @ 60% rh max. baking is required under the condition: a) the pack has been opened for more than 1 week. baking recommended condition: 60 5?c for 20 hours. this product is qualified as moisture sensitive jedec level 2a. tolerance = 0.5% tolerance = 0.5%
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