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? 2007 microchip technology inc. ds21998b-page 1 tc4423a/tc4424a/tc4425a features ? high peak output current: 4.5a (typical) ? wide input supply voltage operating range: - 4.5v to 18v ? high capacitive load drive capability: - 1800 pf in 12 ns ? short delay times: 40 ns (typical) ? matched rise/fall times ? low supply current: - with logic ? 1 ? input ? 1.0 ma (maximum) - with logic ? 0 ? input ? 150 a (maximum) ? low output impedance: 2.5 (typical) ? latch-up protected: will withstand 1.5a reverse current ? logic input will withstand negative swing up to 5v ? pin compatible with the tc4423/tc4424/tc4425 and tc4426a/tc4427a/tc4428a devices ? space-saving 8-pin 150 mil body soic and 8-pin 6x5 dfn packages applications ? switch mode power supplies ? pulse transformer drive ? line drivers ? direct drive of small dc motors general description the tc4423a/tc4424a/tc4425a devices are a family of dual-output 3a buffers/ mosfet drivers. these devices are improved versions of the earlier tc4423/ tc4424/tc4425 dual-output 3a driver family. this improved version features higher peak output current drive capability, lower shoot-throught current, matched rise/fall times and propagation delay times. the tc4423a/tc4424a/tc4425a devices are pin- compatible with the existing tc4423/tc4424/tc4425 family. an 8-pin soic package option has been added to the family. the 8-pin dfn package option offers increased power dissipation capability for driving heavier capacitive or resistive loads. the tc4423a/tc4424a/tc4425a mosfet drivers can easily charge and discharge 1800 pf gate capacitance in under 20 ns, provide low enough impedances in both the on and off states to ensure the mosfet?s intended state will not be affected, even by large transients. the tc4423a/tc4424a/tc4425a inputs may be driven directly from either ttl or cmos (2.4v to 18v). in addition, the 300 mv of built-in hysteresis provides noise immunity and allows the device to be driven from slow rising or falling waveforms. the tc4423a/tc4424a/tc4425a dual-output 3a mosfet driver family is offerd with a -40 o c to +125 o c temperature rating, making it useful in any wide temperature range application. package types nc in a gnd in b 2 3 4 5 6 7 8 1 1 2 3 4 nc 5 6 7 8 out a out b nc in a gnd in b v dd tc4423a tc4424a note 1: exposed pad of the dfn package is electrically isolated. 2: duplicate pins must both be connected for proper operation . tc4423a tc4424a nc out a out b v dd tc4423a tc4424a tc4425a nc out a out b v dd tc4425a tc4425a nc out a out b v dd tc4423a tc4424a nc out a out b v dd tc4425a nc out a out b v dd 8-pin pdip/soic 8-pin 6x5 dfn (1 ) 1 2 3 4 5 6 7 8 16 13 12 11 10 9 nc in a nc gnd gnd nc in b nc nc out a v dd v dd out b out b nc out a 15 14 tc4423a tc4424a tc4425a 16-pin soic (wide ) nc out a v dd v dd out b out b nc out a out a v dd v dd out b out b nc out a tc4423a tc4424a tc4425a nc 3a dual high-speed power mosfet drivers
tc4423a/tc4424a/tc4425a ds21998b-page 2 ? 2007 microchip technology inc. functional block diagram (1) effective input c = 20 pf (each input) tc4423a dual inverting tc4424a dual non-inverting tc4425a inverting / non-inverting output input gnd v dd 300 mv 4.7v inverting non-inverting note 1: unused inputs should be grounded. 750 a
? 2007 microchip technology inc. ds21998b-page 3 tc4423a/tc4424a/tc4425a 1.0 electrical characteristics absolute maximum ratings ? supply voltage ................................................................+20v input voltage, in a or in b .......... (v dd + 0.3v) to (gnd ? 5v) package power dissipation (t a =50c) 8l pdip .......................................................................1.2w 8l soic.................................................................... 0.61w 16l soic.....................................................................1.1w 8l dfn .................................................................... note 3 ? notice: stresses above those listed under "maximum ratings" may cause permanent dam age to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. exposure to maximum rating conditions for extended periods may affect device reliability. dc characteristics (note 2) electrical specifications: unless otherwise indicated, t a = +25c, with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 1.5 ? v logic ? 0 ?, low input voltage v il ?1.30.8v input current i in ?1 ? 1 a 0v v in v dd input voltage v in -5 ? v dd +0.3 v output high output voltage v oh v dd ? 0.025 ? ? v dc test low output voltage v ol ? ? 0.025 v dc test output resistance, high r oh ?2.23.0 i out = 10 ma, v dd = 18v output resistance, low r ol ?2.83.5 i out = 10 ma, v dd = 18v peak output current i pk ? 4.5 ? a 10v v dd 18v (note 2) latch-up protection with- stand reverse current i rev ? >1.5 ? a duty cycle 2%, t 300 sec. switching time (note 1) rise time t r ? 12 21 ns figure 4-1, figure 4-2, c l = 1800 pf fall time t f ? 12 21 ns figure 4-1, figure 4-2, c l = 1800 pf delay time t d1 ? 40 48 ns figure 4-1, figure 4-2, c l = 1800 pf delay time t d2 ? 41 48 ns figure 4-1, figure 4-2, c l = 1800 pf power supply supply voltage v dd 4.5 ? 18 v power supply current i s ?1.02.0mav in = 3v (both inputs) i s ? 0.15 0.25 ma v in = 0v (both inputs) note 1: switching times ensured by design. 2: tested during characterization, not production tested. 3: package power dissipation is dependent on the copper pad area on the pcb.
tc4423a/tc4424a/tc4425a ds21998b-page 4 ? 2007 microchip technology inc. dc characteristics (over ope rating temperature range) temperature characteristics electrical specifications: unless otherwise indicated, operat ing temperature range with 4.5v v dd 18v. parameters sym min typ max units conditions input logic ? 1 ?, high input voltage v ih 2.4 ? ? v logic ? 0 ?, low input voltage v il ??0.8v input current i in ?10 ? +10 a 0v v in v dd output high output voltage v oh v dd ? 0.025 ? ? v low output voltage v ol ? ? 0.025 v output resistance, high r oh ?3.16 i out = 10 ma, v dd = 18v output resistance, low r ol ?3.77 i out = 10 ma, v dd = 18v switching time (note 1) rise time t r ? 20 31 ns figure4-1, figure4-2, c l = 1800 pf fall time t f ? 22 31 ns figure4-1, figure4-2, c l = 1800 pf delay time t d1 ? 50 66 ns figure4-1, figure4-2, c l = 1800 pf delay time t d2 ? 50 66 ns figure4-1, figure4-2, c l = 1800 pf power supply power supply current i s ? ? 2.0 0.2 3.0 0.3 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. electrical specifications: unless otherwise noted, all parameters apply with 4.5v v dd 18v. parameters sym min typ max units conditions temperature ranges specified temperature range (v) t a ?40 ? +125 c maximum junction temperature t j ? ? +150 c storage temperature range t a ?65 ? +150 c package thermal resistances thermal resistance, 8l-6x5 dfn ja ? 33.2 ? c/w typical four-layer board with vias to ground plane thermal resistance, 8l-pdip ja ?84.6 ?c/w thermal resistance, 8l-soic ja ?163 ?c/w thermal resistance, 16l-soic ja ?90 ?c/w
? 2007 microchip technology inc. ds21998b-page 5 tc4423a/tc4424a/tc4425a 2.0 typical performance curves note: unless otherwise indicated, t a = +25c with 4.5v <= v dd <= 18v. figure 2-1: rise time vs. supply voltage. figure 2-2: rise time vs. capacitive load. figure 2-3: rise and fall times vs. temperature. figure 2-4: fall time vs. supply voltage. figure 2-5: fall time vs. capacitive load. figure 2-6: propagation delay vs. input amplitude. note: the graphs and tables provided following this note ar e a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or t ables, the data presented ma y be outside the specified operating range (e.g., outside specified power suppl y range) and therefore outs ide the warranted range. 0 10 20 30 40 50 60 70 80 4 6 8 1012141618 supply voltage (v) rise time (ns) 4,700 pf 3,300 pf 1,800 pf 1,000 pf 470 pf 0 10 20 30 40 50 60 100 1000 10000 capacitive load (pf) rise time (ns) 5v 10v 15v 10 12 14 16 18 20 22 24 -40 -25 -10 5 20 35 50 65 80 95 110 125 temperature ( o c) time (ns) t fall t rise c load = 1800 pf 0 10 20 30 40 50 60 70 80 4 6 8 10 12 14 16 18 supply voltage (v) fall time (ns) 4700 pf 3300 pf 1800 pf 470 pf 1000 pf 0 10 20 30 40 50 60 70 100 1000 10000 capacitive load (pf) fall time (ns) 5v 10v 15v 25 45 65 85 105 125 145 2345678910 input amplitude (v) propagation delay (ns) t d1 t d2 v dd = 12v c load = 1800 pf
tc4423a/tc4424a/tc4425a ds21998b-page 6 ? 2007 microchip technology inc. typical performance curves (continued) note: unless otherwise indicated, t a = +25c with 4.5v <= v dd <= 18v. figure 2-7: propagation delay time vs. supply voltage. figure 2-8: quiescent current vs. supply voltage. figure 2-9: output resistance (output low) vs. supply voltage. figure 2-10: propagation delay time vs. temperature. figure 2-11: quiescent current vs. temperature. figure 2-12: output resistance (output high) vs. supply voltage. 30 40 50 60 70 80 90 100 4 6 8 1012141618 supply voltage (v) propagation delay (ns) t d1 t d2 c load = 1800 pf 0 0.1 0.2 0.3 0.4 0.5 4 6 8 1012141618 supply voltage (v) quiescent current (ma) both inputs = 1 both inputs = 0 v dd = 18v 1 2 3 4 5 6 7 4 6 8 10 12 14 16 18 supply voltage (v) r out-lo ( : : ) t j = 150 o c t j = 25 o c v in = 5v (tc4424a) v in = 0v (tc4423a) 30 35 40 45 50 55 60 65 70 -40 -25 -10 5 20 35 50 65 80 95 110 125 temperature ( o c) propagation delay (ns) t d1 t d2 c load = 1800 pf v dd = 18v v in = 5v 0 0.1 0.2 0.3 0.4 0.5 -40 -25 -10 5 20 35 50 65 80 95 110 125 temperature ( o c) quiescent current (ma) both inputs = 1 both inputs = 0 v dd = 18v 2 3 4 5 6 7 8 4 6 8 1012141618 supply voltage (v) r out-hi ( : : ) t j = 150 o c t j = 25 o c v in = 0v (tc4424a) v in = 5v (tc4423a)
? 2007 microchip technology inc. ds21998b-page 7 tc4423a/tc4424a/tc4425a typical performance curves (continued) note: unless otherwise indicated, t a = +25c with 4.5v <= v dd <= 18v. figure 2-13: supply current vs. capacitive load. figure 2-14: supply current vs. capacitive load. figure 2-15: supply current vs. capacitive load. figure 2-16: supply current vs. frequency. figure 2-17: supply current vs. frequency. figure 2-18: supply current vs. frequency. 0 20 40 60 80 100 120 100 1000 10000 capacitive load (pf) supply current (ma) 400 khz 100 khz 50 khz 650 khz 200 khz v dd = 18v 0 20 40 60 80 100 120 140 100 1000 10000 capacitive load (pf) supply current (ma) 500 khz 200 khz 1 mhz 2 mhz 100 khz v dd = 12v 0 20 40 60 80 100 120 100 1000 10000 capacitive load (pf) supply current (ma) 500 khz 2 mhz 1 mhz 3.5 mhz 100 khz v dd = 6v 200 khz 0 10 20 30 40 50 60 70 80 90 100 10 100 1000 frequency (khz) supply current (ma) 4,700 pf 1,000 pf 470 pf 100 pf 1,800 pf v dd = 18v 10,000 pf 0 20 40 60 80 100 120 140 10 100 1000 10000 frequency (khz) supply current (ma) 4,700 pf 1,000 pf 470 pf 100 pf 1,800 pf v dd = 12v 10,000 pf 0 20 40 60 80 100 120 140 10 100 1000 10000 100000 frequency (khz) supply current (ma) 4,700 pf 1,000 pf 470 pf 100 pf 1,800 pf v dd = 6v 10,000 pf
tc4423a/tc4424a/tc4425a ds21998b-page 8 ? 2007 microchip technology inc. typical performance curves (continued) note: unless otherwise indicated, t a = +25c with 4.5v <= v dd <= 18v. figure 2-19: crossover energy vs. supply voltage. 1.00e-09 1.00e-08 1.00e-07 1.00e-06 4 6 8 1012141618 supply voltage (v) crossover energy (a*sec) 10 -6 10 -7 10 -8 10 -9 note: the values on this graph represents the loss seen by both drivers in a package during one complete cycle. for a single driver, divide the stated values by 2. for a single transition of a single driver, divide the stated value by 4.
? 2007 microchip technology inc. ds21998b-page 9 tc4423a/tc4424a/tc4425a 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table (1) 3.1 inputs a and b inputs a and b are ttl/cmos compatible inputs that control outputs a and b, respectively. these inputs have 300 mv of hysteresis between the high and low input levels, allowing them to be driven from slow rising and falling signals, and to provide noise immunity. 3.2 outputs a and b outputs a and b are cmos push-pull outputs that are capable of sourcing and sinking 3a peaks of current (v dd = 18v). the low output impedance ensures the gate of the external mosfet will stay in the intended state even during large transients. these outputs also have a reverse current latch-up rating of 1.5a. 3.3 supply input (v dd ) v dd is the bias supply input for the mosfet driver and has a voltage range of 4.5v to 18v. this input must be decoupled to ground with a local ceramic capacitor. this bypass capacitor provides a localized low- impedance path for the peak currents that are to be provided to the load. 3.4 ground (gnd) ground is the device return pin. the ground pin should have a low-impedance connection to the bias supply source return. high peak currents will flow out the ground pin when the capacitive load is being discharged. 3.5 exposed metal pad the exposed metal pad of the dfn package is not internally connected to any potential. therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board to aid in heat removal from the package. 8-pin pdip 8-pin dfn 16-pin soic (wide) symbol description 1 1 1 nc no connection 2 2 2 in a input a ? ? 3 nc no connection 3 3 4 gnd ground ? ? 5 gnd ground ? ? 6 nc no connection 4 4 7 in b input b ? ? 8 nc no connection ? ? 9 nc no connection 5 5 10 out b output b ? ? 11 out b output b 6612v dd supply input ??13v dd supply input 7 7 14 out a output a ? ? 15 out a output a 8 8 16 nc no connection ? pad ? nc exposed metal pad note 1: duplicate pins must be connected for proper operation.
tc4423a/tc4424a/tc4425a ds21998b-page 10 ? 2007 microchip technology inc. 4.0 applications information figure 4-1: inverting driver switching time. figure 4-2: non-inverting driver switching time. 0.1 f +5v 10% 90% 10% 90% 10% 90% 18v 1f wima mks-2 0v 0v tc4423a (1/2 tc4425a) 1 2 c l = 1800 pf input input output t d1 t f t d2 input: 100 khz, square wave, output t r v dd = 18v t rise = t fall 10 ns ceramic 90% input t d1 t f t d2 output t r 10% 10% 10% +5v 18v 0v 0v 90% 90% input: 100 khz, square wave, t rise = t fall 10 ns 0.1 f 1f wima mks-2 tc4424a (1/2 tc4425a) 1 2 c l = 1800 pf input output v dd = 18v ceramic
? 2007 microchip technology inc. ds21998b-page 11 tc4423a/tc4424a/tc4425a 5.0 packaging information 5.1 package marking information (not to scale) legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part nu mber cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: tc4423a v pa^^256 0520 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn 256 tc4423a v 8-lead dfn (6x5) example : xxxxxxx xxxxxxx xxyyww nnn tc4423a vmf^^ 0520 256 oa^^0520 3 e 3 e 3 e 16-lead soic (300 mil) example: xxxxxxxxxxx xxxxxxxxxxx yywwnnn xxxxxxxxxxx 0420256 tc4423a voe^^ 3 e
tc4423a/tc4424a/tc4425a ds21998b-page 12 ? 2007 microchip technology inc. 8-lead plastic dual flat, no lead package (mf) ? 6x5 mm body [dfn-s] punch singulated notes: 1. pin 1 visual index feature may vary, but must be located within the hatched area. 2. package may have one or more exposed tie bars at ends. 3. dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units millimeters dimension limits min nom max number of pins n 8 pitch e 1.27 bsc overall height a ? 0.85 1.00 molded package thickness a2 ? 0.65 0.80 standoff a1 0.00 0.01 0.05 base thickness a3 0.20 ref overall length d 4.92 bsc molded package length d1 4.67 bsc exposed pad length d2 3.85 4.00 4.15 overall width e 5.99 bsc molded package width e1 5.74 bsc exposed pad width e2 2.16 2.31 2.46 contact width b 0.35 0.40 0.47 contact length l 0.50 0.60 0.75 contact-to-exposed pad k 0.20 ? ? model draft angle top ? ? 12 note 2 a 3 a2 a1 a note 1 note 1 exposed pad bottom view 1 2 d2 2 1 e2 k l n e b e e1 d d1 n top view microchip technology drawing c04-113b
? 2007 microchip technology inc. ds21998b-page 13 tc4423a/tc4424a/tc4425a 8-lead plastic dual in-line (pa) ? 300 mil body [pdip] notes: 1. pin 1 visual index feature may vary, but must be located with the hatched area. 2. significant characteristic. 3. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010" per side. 4. dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units inches dimension limits min nom max number of pins n 8 pitch e .100 bsc top to seating plane a ? ? .210 molded package thickness a2 .115 .130 .195 base to seating plane a1 .015 ? ? shoulder to shoulder width e .290 .310 .325 molded package width e1 .240 .250 .280 overall length d .348 .365 .400 tip to seating plane l .115 .130 .150 lead thickness c .008 .010 .015 upper lead width b1 .040 .060 .070 lower lead width b .014 .018 .022 overall row spacing eb ? ? .430 n e1 note 1 d 12 3 a a1 a2 l b1 b e e e b c microchip technology drawing c04-018b
tc4423a/tc4424a/tc4425a ds21998b-page 14 ? 2007 microchip technology inc. 8-lead plastic small outline (oa) ? narrow, 3.90 mm body [soic] notes: 1. pin 1 visual index feature may vary, but must be located within the hatched area. 2. significant characteristic. 3. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15 mm per side. 4. dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units millimeters dimension limits min nom max number of pins n 8 pitch e 1.27 bsc overall height a ? ? 1.75 molded package thickness a2 1.25 ? ? standoff a1 0.10 ? 0.25 overall width e 6.00 bsc molded package width e1 3.90 bsc overall length d 4.90 bsc chamfer (optional) h 0.25 ? 0.50 foot length l 0.40 ? 1.27 footprint l1 1.04 ref foot angle 0 ? 8 lead thickness c 0.17 ? 0.25 lead width b 0.31 ? 0.51 mold draft angle top 5 ? 15 mold draft angle bottom 5 ? 15 d n e e e1 note 1 12 3 b a a1 a2 l l1 c h h microchip technology drawing c04-057b
? 2007 microchip technology inc. ds21998b-page 15 tc4423a/tc4424a/tc4425a 16-lead plastic small outline (oe) ? wide, 7.50 mm body [soic] notes: 1. pin 1 visual index feature may vary, but must be located within the hatched area. 2. significant characteristic. 3. dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.15 mm per side. 4. dimensioning and tolerancing per asme y14.5m. bsc: basic dimension. theoretically exact value shown without tolerances. ref: reference dimension, usually without tolerance, for information purposes only. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging units millimeters dimension limits min nom max number of pins n 16 pitch e 1.27 bsc overall height a ? ? 2.65 molded package thickness a2 2.05 ? ? standoff a1 0.10 ? 0.30 overall width e 10.30 bsc molded package width e1 7.50 bsc overall length d 10.30 bsc chamfer (optional) h 0.25 ? 0.75 foot length l 0.40 ? 1.27 footprint l1 1.40 ref foot angle 0 ? 8 lead thickness c 0.20 ? 0.33 lead width b 0.31 ? 0.51 mold draft angle top 5 ? 15 mold draft angle bottom 5 ? 15 d n e e1 note 1 12 3 b e a a1 a2 l l1 c h h microchip technology drawing c04-102b
tc4423a/tc4424a/tc4425a ds21998b-page 16 ? 2007 microchip technology inc. notes:
? 2007 microchip technology inc. ds21998b-page 17 tc4423a/tc4424a/tc4425a appendix a: revision history revision b (april 2007) ? correct numerous errors throughout document. ? page 3: added package power dissipation information about dc characteristic table. ? page 3: added note 3 to dc characteristic table. ? page 4: changed thermal resistance for 8l-pdip device from 125 to 84.6. changed thermal resistance for 8l-soic from 155 to 163. ? page 12: updated package outline drawing. ? page 13: updated package outline drawing. ? page 14: updated package outline drawing. ? page 15: added 16-lead soic package outline drawing ? page 17: updated revision history. revision a (june 2006) ? original release of this document.
tc4423a/tc4424a/tc4425a ds21998b-page 18 ? 2007 microchip technology inc. notes:
? 2007 microchip technology inc. ds21998b-page 19 tc4423a/tc4424a/tc4425a product identification system to order or obtain information, e.g., on pricing or de livery, refer to the factory or the listed sales office . device: tc4423a: 3a dual mosfet driver, inverting tc4424a: 3a dual mosfet driver, non-inverting tc4425a: 3a dual mosfet driver, complementary temperature range: v = -40c to +125c package: * mf = dual, flat, no-lead (6x5 mm body), 8-lead mf713 = dual, flat, no-lead (6x5 mm body), 8-lead (tape and reel) oa = plastic soic (150 mil body), 8-lead oa713 = plastic soic (150 mil body), 8-lead (tape and reel) oe = plastic soic (wide body), 16-lead oe713 = plastic soic (wide body), 16-lead (tape and reel) pa = plastic dip, (300 mil body), 8-lead * all package offerings are pb free (lead free) examples: a) tc4423avoa: 3a dual inverting mosfet driver, 8ld soic package. b) tc4423avpa: 3a dual inverting mosfet driver, 8ld pdip package . c) tc4423avmf: 3a dual inverting mosfet driver, 8ld dfn package . d) tc4423avoe: 3a dual inverting mosfet driver, 16ld soic package. a) TC4424AVOA713: 3a dual non-inverting, mosfet driver, 8ld soic package, tape and reel. b) tc4424avpa: 3a dual non-inverting, mosfet driver, 8ld pdip package. a) tc4425avoa: 3a dual complementary, mosfet driver, 8ld soic package . b) tc4425avpa: 3a dual complementary, mosfet driver, 8ld pdip package . c) tc4425avoe713: 3a dual complementary, mosfet driver, 16ld soic package, tape and reel. part no. x xx package temperature range device xxx tape & reel
tc4423a/tc4424a/tc4425a ds21998b-page 20 ? 2007 microchip technology inc. notes:
? 2007 microchip technology inc. ds21998b-page 21 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting fr om such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, accuron, dspic, k ee l oq , k ee l oq logo, micro id , mplab, pic, picmicro, picstart, pro mate, powersmart, rfpic, and smartshunt are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. amplab, filterlab, linear active thermistor, migratable memory, mxdev, mxlab, ps logo, seeval, smartsensor and the embedded control solutions company are registered trademarks of microc hip technology incorporated in the u.s.a. analog-for-the-digital age, a pplication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, ecan, economonitor, fansense, flexrom, fuzzylab, in-circuit serial programming, icsp, icepic, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, pickit, picdem, picdem.net, piclab, pictail, powercal, powerinfo, powermate, powertool, real ice, rflab, rfpicdem, select mode, smart serial, smarttel, total endurance, uni/o, wiperlock and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2007, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection fe ature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwar e or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona, gresham, oregon and mountain view, california. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development syst ems is iso 9001:2000 certified.
ds21998b-page 22 ? 2007 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway habour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - fuzhou tel: 86-591-8750-3506 fax: 86-591-8750-3521 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - shunde tel: 86-757-2839-5507 fax: 86-757-2839-5571 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7250 fax: 86-29-8833-7256 asia/pacific india - bangalore tel: 91-80-4182-8400 fax: 91-80-4182-8422 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - gumi tel: 82-54-473-4301 fax: 82-54-473-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - penang tel: 60-4-646-8870 fax: 60-4-646-5086 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-572-9526 fax: 886-3-572-6459 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 12/08/06

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