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features description/ordering information sn54lvc541a, sn74lvc541a octal buffers/drivers with 3-state outputs scas298m ? january 1993 ? revised may 2005 i off supports partial-power-down mode operation operate from 1.65 v to 3.6 v latch-up performance exceeds 250 ma per inputs accept voltages to 5.5 v jesd 17 max t pd of 5.1 ns at 3.3 v esd protection exceeds jesd 22 typical v olp (output ground bounce) < 0.8 v ? 2000-v human-body model (a114-a) at v cc = 3.3 v, t a = 25c ? 200-v machine model (a115-a) typical v ohv (output v oh undershoot) > 2 v at v cc = 3.3 v, t a = 25c ? 1000-v charged-device model (c101) abc support mixed-mode signal operation on all ports (5-v input/output voltage with 3.3-v v cc ) the sn54lvc541a octal buffer/driver is designed for 2.7-v to 3.6-v v cc operation, and the sn74lvc541a octal buffer/driver is designed for 1.65-v to 3.6-v v cc operation. ordering information t a package (1) orderable part number top-side marking qfn ? rgy reel of 1000 sn74lvc541argyr lc541a tube of 25 sn74lvc541adw soic ? dw lvc541a reel of 2000 sn74lvc541adwr sop ? ns reel of 2000 sn74lvc541ansr lvc541a ?40c to 85c ssop ? db reel of 2000 sn74lvc541adbr lc541a tube of 70 sn74lvc541apw tssop ? pw reel of 2000 sn74lvc541apwr lc541a reel of 250 sN74LVC541APWT tvsop ? dgv reel of 2000 sn74lvc541adgvr lc541a cdip ? j tube of 20 snj54lvc541aj snj54lvc541aj ?55c to 125c cfp ? w tube of 85 snj54lvc541aw snj54lvc541aw lccc ? fk tube of 55 snj54lvc541afk snj54lvc541afk (1) package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. production data information is current as of publication date. copyright ? 1993?2005, texas instruments incorporated products conform to specifications per the terms of the texas on products compliant to mil-prf-38535, all parameters are instruments standard warranty. production processing does not tested unless otherwise noted. on all other products, production necessarily include testing of all parameters. processing does not necessarily include testing of all parameters. 12 3 4 5 6 7 8 9 10 2019 18 17 16 15 14 13 12 1 1 oe1 a1a2 a3 a4 a5 a6 a7 a8 gnd v c c oe2 y1y2 y3 y4 y5 y6 y7 y8 sn54l vc541a . . . j or w p ackage sn74l vc541a . . . db, dgv , dw , ns, or pw p ackage (t op view) 3 2 1 20 19 9 10 1 1 12 13 45 6 7 8 1817 16 15 14 y1y2 y3 y4 y5 a3a4 a5 a6 a7 sn54l vc541a . . . fk p ackage (t op view) a2a1 oe1 y7y6 oe2 a8 gnd y8 v cc sn74l vc541a . . . rgy p ackage (t op view) 1 20 10 1 1 23 4 5 6 7 8 9 1918 17 16 15 14 13 12 oe2 y1y2 y3 y4 y5 y6 y7 a1a2 a3 a4 a5 a6 a7 a8 oe1 y8 v gnd cc www .ti.com
description/ordering information (continued) sn54lvc541a, sn74lvc541a octal buffers/drivers with 3-state outputs scas298m ? january 1993 ? revised may 2005 the 'lvc541a devices are ideal for driving bus lines or buffering memory address registers. these devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout. the 3-state control gate is a 2-input and gate with active-low inputs so that, if either output enable ( oe1 or oe2) input is high, all eight outputs are in the high-impedance state. inputs can be driven from either 3.3-v or 5-v devices. this feature allows the use of these devices as translators in a mixed 3.3-v/5-v system environment. these devices are fully specified for partial-power-down applications using i off . the i off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. to ensure the high-impedance state during power up or power down, oe should be tied to v cc through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. function table inputs output y oe1 oe2 a l l l l l l h h h x x z x h x z logic diagram (positive logic) 2 oe1 oe2 t o seven other channels a1 y1 119 2 18 www .ti.com
absolute maximum ratings (1) sn54lvc541a, sn74lvc541a octal buffers/drivers with 3-state outputs scas298m ? january 1993 ? revised may 2005 over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range ?0.5 6.5 v v i input voltage range (2) ?0.5 6.5 v v o voltage range applied to any output in the high-impedance or power-off state (2) ?0.5 6.5 v v o voltage range applied to any output in the high or low state (2) (3) ?0.5 v cc + 0.5 v i ik input clamp current v i < 0 ?50 ma i ok output clamp current v o < 0 ?50 ma i o continuous output current 50 ma continuous current through v cc or gnd 100 ma db package (4) 70 dgv package (4) 92 dw package (4) 58 q ja package thermal impedance c/w ns package (4) 60 pw package (4) 83 rgy package (5) 37 t stg storage temperature range ?65 150 c (1) stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) the value of v cc is provided in the recommended operating conditions table. (4) the package thermal impedance is calculated in accordance with jesd 51-7. (5) the package thermal impedance is calculated in accordance with jesd 51-5. 3 www .ti.com
recommended operating conditions (1) sn54lvc541a, sn74lvc541a octal buffers/drivers with 3-state outputs scas298m ? january 1993 ? revised may 2005 sn54lvc541a sn74lvc541a unit min max min max operating 2 3.6 1.65 3.6 v cc supply voltage v data retention only 1.5 1.5 v cc = 1.65 v to 1.95 v 0.65 v cc v ih high-level input voltage v cc = 2.3 v to 2.7 v 1.7 v v cc = 2.7 v to 3.6 v 2 2 v cc = 1.65 v to 1.95 v 0.35 v cc v il low-level input voltage v cc = 2.3 v to 2.7 v 0.7 v v cc = 2.7 v to 3.6 v 0.8 0.8 v i input voltage 0 5.5 0 5.5 v high or low state 0 v cc 0 v cc v o output voltage v 3-state 0 5.5 0 5.5 v cc = 1.65 v ?4 v cc = 2.3 v ?8 i oh high-level output current ma v cc = 2.7 v ?12 ?12 v cc = 3 v ?24 ?24 v cc = 1.65 v 4 v cc = 2.3 v 8 i ol low-level output current ma v cc = 2.7 v 12 12 v cc = 3 v 24 24 t a operating free-air temperature ?55 125 ?40 85 c (1) all unused inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs, literature number scba004. 4 www .ti.com
electrical characteristics switching characteristics sn54lvc541a, sn74lvc541a octal buffers/drivers with 3-state outputs scas298m ? january 1993 ? revised may 2005 over recommended operating free-air temperature range (unless otherwise noted) sn54lvc541a sn74lvc541a parameter test conditions v cc unit min typ (1) max min typ (1) max 1.65 v to 3.6 v v cc ? 0.2 i oh = ?100 m a 2.7 v to 3.6 v v cc ? 0.2 i oh = ?4 ma 1.65 v 1.2 v oh i oh = ?8 ma 2.3 v 1.7 v 2.7 v 2.2 2.2 i oh = ?12 ma 3 v 2.4 2.4 i oh = ?24 ma 3 v 2.2 2.2 1.65 v to 3.6 v 0.2 i ol = 100 m a 2.7 v to 3.6 v 0.2 i ol = 4 ma 1.65 v 0.45 v ol v i ol = 8 ma 2.3 v 0.7 i ol = 12 ma 2.7 v 0.4 0.4 i ol = 24 ma 3 v 0.55 0.55 i i v i = 0 to 5.5 v 3.6 v 5 5 m a i off v i or v o = 5.5 v 0 10 m a i oz v o = 0 to 5.5 v 3.6 v 15 10 m a v i = v cc or gnd 10 10 i cc i o = 0 3.6 v m a 3.6 v v i 5.5 v (2) 10 10 one input at v cc ? 0.6 v, d i cc 2.7 v to 3.6 v 500 500 m a other inputs at v cc or gnd c i v i = v cc or gnd 3.3 v 4 4 pf c o v o = v cc or gnd 3.3 v 5.5 5.5 pf (1) all typical values are at v cc = 3.3 v, t a = 25c. (2) this applies in the disabled state only. over recommended operating free-air temperature range (unless otherwise noted) (see figure 1 ) sn54lvc541a from to v cc = 3.3 v parameter v cc = 2.7 v unit (input) (output) 0.3 v min max min max t pd a y 5.6 1 5.1 ns t en oe y 7.5 1 7 ns t dis oe y 7.7 1 7 ns 5 www .ti.com
switching characteristics operating characteristics sn54lvc541a, sn74lvc541a octal buffers/drivers with 3-state outputs scas298m ? january 1993 ? revised may 2005 over recommended operating free-air temperature range (unless otherwise noted) (see figure 1 ) sn74lvc541a from to v cc = 1.8 v v cc = 2.5 v v cc = 3.3 v parameter v cc = 2.7 v unit (input) (output) 0.15 v 0.2 v 0.3 v min max min max min max min max t pd a y 1 15.7 1 7.8 1 5.6 1.5 5.1 ns t en oe y 1 17.5 1 10.5 1 7.5 1.5 7 ns t dis oe y 1 16.5 1 9 1 7.7 1.5 7 ns t sk(o) 1 ns t a = 25c v cc = 1.8 v v cc = 2.5 v v cc = 3.3 v test parameter unit conditions typ typ typ outputs enabled 65 58 33 power dissipation capacitance c pd f = 10 mhz pf per buffer/driver outputs disabled 2 2 2 6 www .ti.com
parameter measurement information sn54lvc541a, sn74lvc541a octal buffers/drivers with 3-state outputs scas298m ? january 1993 ? revised may 2005 figure 1. load circuit and voltage waveforms 7 www .ti.com v m t h t s u from output under t est c l (see note a) load circuit s1 v l o a d open gnd r l r l data input t iming input v i 0 vv i 0 v 0 v t w input vol t age w a veforms setup and hold times vol t age w a veforms prop aga tion dela y times inverting and noninverting outputs vol t age w a veforms pulse dura tion t p l h t p h l t p h l t p l h v o h v o h v o l v o l v i 0 v input output w aveform 1 s1 at v l o a d (see note b) output w aveform 2 s1 at gnd (see note b) v o l v o h t p z l t p z h t p l z t p h z v l o a d /2 0 v v o l + v d v o h ? v d 0 v v i vol t age w a veforms enable and disable times low - and high-level enabling outputoutput t p l h /t p h l t p l z /t p z l t p h z /t p z h open v l o a d gnd test s1 notes: a. c l includes probe and jig capacitance. b. w aveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. w aveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 w . d. the outputs are measured one at a time, with one transition per measurement. e. t p l z and t p h z are the same as t d i s . f. t p z l and t p z h are the same as t e n . g. t p l h and t p h l are the same as t p d . h. all parameters and waveforms are not applicable to all devices. output control v m v m v m v m v m v m v m v m v m v m v m v m v i v m v m 1.8 v 0.15 v 2.5 v 0.2 v 2.7 v 3.3 v 0.3 v 1 k w 500 w 500 w 500 w v c c r l 2 v c c 2 v c c 6 v6 v v l o a d c l 30 pf30 pf 50 pf 50 pf 0.15 v0.15 v 0.3 v0.3 v v d v c c v c c 2.7 v2.7 v v i v c c /2 v c c /2 1.5 v1.5 v v m t r /t f 2 ns 2 ns 2.5 ns 2.5 ns inputs
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-9759501q2a active lccc fk 20 1 tbd post-plate n / a for pkg type 5962-9759501qra active cdip j 20 1 tbd a42 n / a for pkg type 5962-9759501qsa active cfp w 20 1 tbd call ti n / a for pkg type sn74lvc541adble obsolete ssop db 20 tbd call ti call ti sn74lvc541adbr active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adbrg4 active ssop db 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adgvr active tvsop dgv 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adgvre4 active tvsop dgv 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adgvrg4 active tvsop dgv 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adw active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adwe4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adwg4 active soic dw 20 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adwr active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adwre4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541adwrg4 active soic dw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541ansr active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541ansre4 active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541ansrg4 active so ns 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541apw active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541apwe4 active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541apwg4 active tssop pw 20 70 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541apwle obsolete tssop pw 20 tbd call ti call ti sn74lvc541apwr active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541apwre4 active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541apwrg3 preview tssop pw 20 2000 tbd call ti call ti sn74lvc541apwrg4 active tssop pw 20 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sN74LVC541APWT active tssop pw 20 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim package option addendum www.ti.com 15-mar-2010 addendum-page 1
orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) sN74LVC541APWTe4 active tssop pw 20 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sN74LVC541APWTg4 active tssop pw 20 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvc541argyr active vqfn rgy 20 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year sn74lvc541argyrg4 active vqfn rgy 20 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year snj54lvc541afk active lccc fk 20 1 tbd post-plate n / a for pkg type snj54lvc541aj active cdip j 20 1 tbd a42 n / a for pkg type snj54lvc541aw active cfp w 20 1 tbd call ti n / a for pkg type (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of sn54lvc541a, sn74lvc541a : ? automotive: sn74lvc541a-q1 ? enhanced product: sn74lvc541a-ep note: qualified version definitions: ? automotive - q100 devices qualified for high-reliability automotive applications targeting zero defects ? enhanced product - supports defense, aerospace and medical applications package option addendum www.ti.com 15-mar-2010 addendum-page 2
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant sn74lvc541adbr ssop db 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 q1 sn74lvc541adgvr tvsop dgv 20 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 sn74lvc541adwr soic dw 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 q1 sn74lvc541ansr so ns 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 q1 sn74lvc541apwr tssop pw 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 q1 sn74lvc541apwr tssop pw 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 q1 sN74LVC541APWT tssop pw 20 250 330.0 16.4 6.95 7.1 1.6 8.0 16.0 q1 sn74lvc541argyr vqfn rgy 20 3000 330.0 12.4 3.8 4.8 1.6 8.0 12.0 q1 package materials information www.ti.com 5-may-2011 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) sn74lvc541adbr ssop db 20 2000 346.0 346.0 33.0 sn74lvc541adgvr tvsop dgv 20 2000 346.0 346.0 29.0 sn74lvc541adwr soic dw 20 2000 346.0 346.0 41.0 sn74lvc541ansr so ns 20 2000 346.0 346.0 41.0 sn74lvc541apwr tssop pw 20 2000 364.0 364.0 27.0 sn74lvc541apwr tssop pw 20 2000 346.0 346.0 33.0 sN74LVC541APWT tssop pw 20 250 346.0 346.0 33.0 sn74lvc541argyr vqfn rgy 20 3000 346.0 346.0 29.0 package materials information www.ti.com 5-may-2011 pack materials-page 2

mechanical data mpds006c february 1996 revised august 2000 post office box 655303 ? dallas, texas 75265 dgv (r-pdso-g**) plastic small-outline 24 pins shown 14 3,70 3,50 4,90 5,10 20 dim pins ** 4073251/e 08/00 1,20 max seating plane 0,05 0,15 0,25 0,50 0,75 0,23 0,13 112 24 13 4,30 4,50 0,16 nom gage plane a 7,90 7,70 38 24 16 4,90 5,10 3,70 3,50 a max a min 6,60 6,20 11,20 11,40 56 9,60 9,80 48 0,08 m 0,07 0,40 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. d. falls within jedec: 24/48 pins mo-153 14/16/20/56 pins mo-194

mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti ? s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or " enhanced plastic. " only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer ' s risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications audio www.ti.com/audio communications and telecom www.ti.com/communications amplifiers amplifier.ti.com computers and peripherals www.ti.com/computers data converters dataconverter.ti.com consumer electronics www.ti.com/consumer-apps dlp ? products www.dlp.com energy and lighting www.ti.com/energy dsp dsp.ti.com industrial www.ti.com/industrial clocks and timers www.ti.com/clocks medical www.ti.com/medical interface interface.ti.com security www.ti.com/security logic logic.ti.com space, avionics and defense www.ti.com/space-avionics-defense power mgmt power.ti.com transportation and www.ti.com/automotive automotive microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com wireless www.ti.com/wireless-apps rf/if and zigbee ? solutions www.ti.com/lprf ti e2e community home page e2e.ti.com mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2011, texas instruments incorporated

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