4 pad plastic package, 1.4 mm x 7 mm il3r series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 08/18/11_b specifications subject to change without notice page 1 0.58 0.55 6.3 0.9 1.2 7.0 max. 0.8 1.4 connection diagram dimension units: mm recommended pad layout 1.50 max. product features: applications: low cost smd package fibre channel low esr server & storage compatible with leadfree processing sonet /sdh 802.11 / wifi t1/e1, t3/e3 typical x cut tem perature coefficient -180 -150 -120 -90 -60 -30 0 -40-30-20-100 1020304050607080 temperature ppm frequency 32.768 khz esr (equivalent series resistance) 65 k ? max. shunt capacitance (c0) 1.2 pf typical frequency tolerance @ 25 ? c ? 20 ppm standard frequency stability over temperature parabolic -0.034 ppm / ? c 2 typical. inflection point approx. 27 ? c. see graph below. crystal cut x cut load capacitance 12.5 pf standard drive level 1 uw max. aging ? 5 ppm max. / year standard temperature operating -40 ? c to +85 ? c standard storage -40 ? c to +85 ? c standard part number guide sample part number: il3r - hx5f12.5 - 32.768 khz package tolerance (ppm) at room temperature stability (ppm) over operating temperature operating temperature range mode (overtone) load capacitance (pf) frequenc y il3r - h = 20 ppm x = x cut 5 = -40c to +85c f = fundamental 12.5 pf standard. 6 pf available - 32.768 khz
4 pad plastic package, 1.4 mm x 7 mm il3r series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 08/18/11_b specifications subject to change without notice page 2 pb free solder reflow profile: typical circuit: *units are backward compatible with 240c reflow processes package information: msl = 2a termination = e1 (sn/cu/ag over ni over kovar base metal) tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: date code(yww), factory code quantity per reel 3000 a 16 +/-.3 b 8 +/-.2 c 7.5 +/-.2 d 17.5 +/-1.5 e 50 / 60 / 80 f 180 / 250
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